MCZ33903BS3EK NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
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Technische Details MCZ33903BS3EK NXP USA Inc.
Description: SYSTEM BASIS CHIP, POWER MANAGEM, Supplier Device Package: 32-SOIC-EP, Applications: System Basis Chip, Voltage - Supply: 5.5V ~ 28V, Interface: CAN, LIN, Mounting Type: Surface Mount, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Packaging: Bulk.
Weitere Produktangebote MCZ33903BS3EK
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MCZ33903BS3EK | Hersteller : Freescale Semiconductor |
Description: SYSTEM BASIS CHIP, POWER MANAGEM Supplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Bulk |
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