Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36152) > Seite 549 nach 603

Wählen Sie Seite:   [  << Vorherige Seite ]  1 60 120 180 240 300 360 420 480 540 544 545 546 547 548 549 550 551 552 553 554 600 603  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
MCIMX6D6AVT08AC MCIMX6D6AVT08AC NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
P3T1755DP/Q900Z P3T1755DP/Q900Z NXP USA Inc. P3T1755.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.66 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
P3T1755DP/Q900Z P3T1755DP/Q900Z NXP USA Inc. P3T1755.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
auf Bestellung 3388 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.41 EUR
18+1 EUR
25+0.9 EUR
100+0.8 EUR
250+0.74 EUR
500+0.71 EUR
1000+0.69 EUR
Mindestbestellmenge: 13
Im Einkaufswagen  Stück im Wert von  UAH
WCT-15WAUTOS2 NXP USA Inc. Description: WCT-15WAUTOS2
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MF3DH8300DA4/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC16CFJER MC9S08AC16CFJER NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+6.35 EUR
Mindestbestellmenge: 2000
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC16CFJER MC9S08AC16CFJER NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.98 EUR
10+8.49 EUR
25+7.86 EUR
100+7.17 EUR
250+6.84 EUR
500+6.64 EUR
1000+6.48 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
TEA18361LT/2J TEA18361LT/2J NXP USA Inc. Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TEA18361T/2J TEA18361T/2J NXP USA Inc. Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Power (Watts): 75 W
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK40DX256VMC7 MK40DX256VMC7 NXP USA Inc. K40P100M72SF1.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSK NAFE13188B40BSK NXP USA Inc. NAFE13388.pdf Description: NAFE13188B40BSK
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.15 EUR
10+24.86 EUR
25+23.29 EUR
100+21.56 EUR
250+20.73 EUR
500+20.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSE NAFE13188B40BSE NXP USA Inc. NAFE13388.pdf Description: NAFE13188B40BSE
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.15 EUR
10+24.86 EUR
25+23.29 EUR
100+21.56 EUR
260+20.7 EUR
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSMP NAFE13188B40BSMP NXP USA Inc. NAFE13388.pdf Description: NAFE13188B40BSMP
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSMP NAFE13188B40BSMP NXP USA Inc. NAFE13388.pdf Description: NAFE13188B40BSMP
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.15 EUR
10+24.86 EUR
25+23.29 EUR
100+21.56 EUR
250+21.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PEMI2QFN/CK,115 PEMI2QFN/CK,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
3806+0.13 EUR
Mindestbestellmenge: 3806
Im Einkaufswagen  Stück im Wert von  UAH
AFSC5G35E37T2 NXP USA Inc. Description: 10X6 MODULE
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
RD9Z1-638BJBEVM NXP USA Inc. UM11396.pdf Description: RD9Z1-638BJBEVM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: MM9Z1_638
Supplied Contents: Board(s), Accessories
Primary Attributes: 5V ~ 12V Supply
Embedded: No
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1023NSE7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1088AXN7PTA LS1088AXN7PTA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 1273 Stücke:
Lieferzeit 10-14 Tag (e)
2+299.05 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MPC8377EVRALGA MPC8377EVRALGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MRFE6S9135HSR3 NXP USA Inc. MRFE6S9135H.pdf Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 39W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6X3EVO10AB MCIMX6X3EVO10AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MGD3160AM318EK MGD3160AM318EK NXP USA Inc. PB_GD3160.pdf Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVHL32F1CLQ S912ZVHL32F1CLQ NXP USA Inc. 17085_MC9S12ZVCRMV1_Rev_1.5.pdf Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101Z233K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FB32K148UJT0VMHT NXP USA Inc. Description: S32K148 100 MAPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKE17Z512VLH9 MKE17Z512VLH9 NXP USA Inc. KE1xZP100M96SF0.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.93 EUR
10+7.39 EUR
25+6.86 EUR
100+6.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKE17Z512VLL9 MKE17Z512VLL9 NXP USA Inc. KE1xZP100M96SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
auf Bestellung 398 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.22 EUR
10+6.65 EUR
25+6.43 EUR
100+6.25 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MCF52258VN80 MCF52258VN80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.22 EUR
10+28.22 EUR
25+26.47 EUR
100+24.55 EUR
250+23.63 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PCA9958HNY PCA9958HNY NXP USA Inc. PCA9958.pdf Description: PCA9958HNY
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 24
Frequency: 31.25kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Current - Output / Channel: 63mA
Internal Switch(s): No
Topology: Constant Current
Supplier Device Package: 40-HVQFN (6x6)
Dimming: PWM, SPI
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+2.21 EUR
Mindestbestellmenge: 4000
Im Einkaufswagen  Stück im Wert von  UAH
74LVT126DB,118 74LVT126DB,118 NXP USA Inc. 74LVT126.pdf Description: IC BUFF TRI-ST QD N-INV 14SSOP
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
1448+0.34 EUR
Mindestbestellmenge: 1448
Im Einkaufswagen  Stück im Wert von  UAH
74LVT16373ADGG,518 74LVT16373ADGG,518 NXP USA Inc. PHGLS16242-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-TSSOP
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
807+0.61 EUR
Mindestbestellmenge: 807
Im Einkaufswagen  Stück im Wert von  UAH
S9S12XS64J1VAE S9S12XS64J1VAE NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MF3DH2301DUD/00Z NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BY459X-1500,127 BY459X-1500,127 NXP USA Inc. BY459X-1500%28S%29.pdf Description: DIODE STANDARD 1500V 12A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BY459X-1500S,127 BY459X-1500S,127 NXP USA Inc. BY459X-1500%28S%29.pdf Description: DIODE STANDARD 1500V 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 220 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FS32K148UGT0VLQR FS32K148UGT0VLQR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SVF312R3K2CKU2 SVF312R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SVF321R3K2CKU2 SVF321R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MVF50NS151CMK40 MVF50NS151CMK40 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MVF30NN151CKU26 MVF30NN151CKU26 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+55.12 EUR
10+44.82 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SVF332R3K1CKU2 SVF332R3K1CKU2 NXP USA Inc. VF3xxR%2C_VF5xxR_WEB.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
10+50.97 EUR
Mindestbestellmenge: 10
Im Einkaufswagen  Stück im Wert von  UAH
SVF332R3K1CKU2 SVF332R3K1CKU2 NXP USA Inc. VF3xxR%2C_VF5xxR_WEB.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BGS8U5X BGS8U5X NXP USA Inc. RFSAS20EDRM.pdf Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.5mA
Noise Figure: 1dB
P1dB: 11dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74LVT273DB,118 74LVT273DB,118 NXP USA Inc. 74LVT273.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33PF8100EQES MC33PF8100EQES NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.4 EUR
10+12.02 EUR
25+11.18 EUR
100+10.25 EUR
260+9.79 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
BUK7E2R7-30B,127 BUK7E2R7-30B,127 NXP USA Inc. BUK7E2R7-30B.pdf Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BUK663R5-55C,118 NXP USA Inc. BUK663R5-55C.pdf Description: MOSFET N-CH 55V 120A D2PAK
Packaging: Bulk
auf Bestellung 1589 Stücke:
Lieferzeit 10-14 Tag (e)
417+1.18 EUR
Mindestbestellmenge: 417
Im Einkaufswagen  Stück im Wert von  UAH
MKL24Z32VLH4 MKL24Z32VLH4 NXP USA Inc. KL24P80M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCF51AC256BCLKE MCF51AC256BCLKE NXP USA Inc. MCF51AC256.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM6733J NXP USA Inc. Description: DUMMY MODULE
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM6736/NXD61P-FJAJ NXP USA Inc. Description: 6-PIN DIF MODULE NXD6.1
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34825EPR2 MC34825EPR2 NXP USA Inc. PHGL-S-A0002259932-1.pdf?t.download=true&u=5oefqw Description: MICRO-USB INTERFACE IC, UNIVERSA
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 4600 Stücke:
Lieferzeit 10-14 Tag (e)
124+3.6 EUR
Mindestbestellmenge: 124
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G240F0MLL S9S12G240F0MLL NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 240KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PNEV5190MB PNEV5190MB NXP USA Inc. RM00264.pdf Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6Z0DVM09ABR MCIMX6Z0DVM09ABR NXP USA Inc. IMX6ULZCEC.pdf Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SA56004ETK,118 SA56004ETK,118 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)
520+0.94 EUR
Mindestbestellmenge: 520
Im Einkaufswagen  Stück im Wert von  UAH
A3V07H600-2STG NXP USA Inc. Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PDTA143XM,315 PDTA143XM,315 NXP USA Inc. PDTA143X_SER.pdf Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
9713+0.049 EUR
Mindestbestellmenge: 9713
Im Einkaufswagen  Stück im Wert von  UAH
MK10DX64VMC7 MK10DX64VMC7 NXP USA Inc. K10P100M72SF1.pdf Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6D6AVT08AC IMX6DQIEC.pdf
MCIMX6D6AVT08AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
P3T1755DP/Q900Z P3T1755.pdf
P3T1755DP/Q900Z
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.66 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
P3T1755DP/Q900Z P3T1755.pdf
P3T1755DP/Q900Z
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
auf Bestellung 3388 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.41 EUR
18+1 EUR
25+0.9 EUR
100+0.8 EUR
250+0.74 EUR
500+0.71 EUR
1000+0.69 EUR
Mindestbestellmenge: 13
Im Einkaufswagen  Stück im Wert von  UAH
WCT-15WAUTOS2
Hersteller: NXP USA Inc.
Description: WCT-15WAUTOS2
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MF3DH8300DA4/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC16CFJER MC9S08AC60AD.pdf
MC9S08AC16CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+6.35 EUR
Mindestbestellmenge: 2000
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC16CFJER MC9S08AC60AD.pdf
MC9S08AC16CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.98 EUR
10+8.49 EUR
25+7.86 EUR
100+7.17 EUR
250+6.84 EUR
500+6.64 EUR
1000+6.48 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
TEA18361LT/2J
TEA18361LT/2J
Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TEA18361T/2J
TEA18361T/2J
Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Power (Watts): 75 W
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK40DX256VMC7 K40P100M72SF1.pdf
MK40DX256VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSK NAFE13388.pdf
NAFE13188B40BSK
Hersteller: NXP USA Inc.
Description: NAFE13188B40BSK
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.15 EUR
10+24.86 EUR
25+23.29 EUR
100+21.56 EUR
250+20.73 EUR
500+20.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSE NAFE13388.pdf
NAFE13188B40BSE
Hersteller: NXP USA Inc.
Description: NAFE13188B40BSE
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.15 EUR
10+24.86 EUR
25+23.29 EUR
100+21.56 EUR
260+20.7 EUR
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSMP NAFE13388.pdf
NAFE13188B40BSMP
Hersteller: NXP USA Inc.
Description: NAFE13188B40BSMP
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13188B40BSMP NAFE13388.pdf
NAFE13188B40BSMP
Hersteller: NXP USA Inc.
Description: NAFE13188B40BSMP
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.15 EUR
10+24.86 EUR
25+23.29 EUR
100+21.56 EUR
250+21.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PEMI2QFN/CK,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/CK,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.13 EUR
Mindestbestellmenge: 3806
Im Einkaufswagen  Stück im Wert von  UAH
AFSC5G35E37T2
Hersteller: NXP USA Inc.
Description: 10X6 MODULE
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
RD9Z1-638BJBEVM UM11396.pdf
Hersteller: NXP USA Inc.
Description: RD9Z1-638BJBEVM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: MM9Z1_638
Supplied Contents: Board(s), Accessories
Primary Attributes: 5V ~ 12V Supply
Embedded: No
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1023NSE7KQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1088AXN7PTA LS1088AFS.pdf
LS1088AXN7PTA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 1273 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+299.05 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MPC8377EVRALGA MPC8377E.pdf
MPC8377EVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MRFE6S9135HSR3 MRFE6S9135H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 39W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6X3EVO10AB DWF13_AMF_CON_T0060.pdf
MCIMX6X3EVO10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MGD3160AM318EK PB_GD3160.pdf
MGD3160AM318EK
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVHL32F1CLQ 17085_MC9S12ZVCRMV1_Rev_1.5.pdf
S912ZVHL32F1CLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101Z233K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FB32K148UJT0VMHT
Hersteller: NXP USA Inc.
Description: S32K148 100 MAPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKE17Z512VLH9 KE1xZP100M96SF0.pdf
MKE17Z512VLH9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.93 EUR
10+7.39 EUR
25+6.86 EUR
100+6.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKE17Z512VLL9 KE1xZP100M96SF0.pdf
MKE17Z512VLL9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
auf Bestellung 398 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.22 EUR
10+6.65 EUR
25+6.43 EUR
100+6.25 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MCF52258VN80 MCF52259.pdf
MCF52258VN80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.22 EUR
10+28.22 EUR
25+26.47 EUR
100+24.55 EUR
250+23.63 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PCA9958HNY PCA9958.pdf
PCA9958HNY
Hersteller: NXP USA Inc.
Description: PCA9958HNY
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 24
Frequency: 31.25kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Current - Output / Channel: 63mA
Internal Switch(s): No
Topology: Constant Current
Supplier Device Package: 40-HVQFN (6x6)
Dimming: PWM, SPI
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+2.21 EUR
Mindestbestellmenge: 4000
Im Einkaufswagen  Stück im Wert von  UAH
74LVT126DB,118 74LVT126.pdf
74LVT126DB,118
Hersteller: NXP USA Inc.
Description: IC BUFF TRI-ST QD N-INV 14SSOP
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1448+0.34 EUR
Mindestbestellmenge: 1448
Im Einkaufswagen  Stück im Wert von  UAH
74LVT16373ADGG,518 PHGLS16242-1.pdf?t.download=true&u=5oefqw
74LVT16373ADGG,518
Hersteller: NXP USA Inc.
Description: BUS DRIVER
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-TSSOP
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
807+0.61 EUR
Mindestbestellmenge: 807
Im Einkaufswagen  Stück im Wert von  UAH
S9S12XS64J1VAE MC9S12XS256RMV1.pdf
S9S12XS64J1VAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MF3DH2301DUD/00Z MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BY459X-1500,127 BY459X-1500%28S%29.pdf
BY459X-1500,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 1500V 12A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BY459X-1500S,127 BY459X-1500%28S%29.pdf
BY459X-1500S,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 1500V 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 220 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FS32K148UGT0VLQR S32K1xx.pdf
FS32K148UGT0VLQR
Hersteller: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SVF312R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF312R3K2CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SVF321R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF321R3K2CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MVF50NS151CMK40 VYBRIDFSERIESEC.pdf
MVF50NS151CMK40
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MVF30NN151CKU26 VYBRIDFSERIESEC.pdf
MVF30NN151CKU26
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+55.12 EUR
10+44.82 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SVF332R3K1CKU2 VF3xxR%2C_VF5xxR_WEB.pdf
SVF332R3K1CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+50.97 EUR
Mindestbestellmenge: 10
Im Einkaufswagen  Stück im Wert von  UAH
SVF332R3K1CKU2 VF3xxR%2C_VF5xxR_WEB.pdf
SVF332R3K1CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BGS8U5X RFSAS20EDRM.pdf
BGS8U5X
Hersteller: NXP USA Inc.
Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.5mA
Noise Figure: 1dB
P1dB: 11dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74LVT273DB,118 74LVT273.pdf
74LVT273DB,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33PF8100EQES PF8100_PF8200.pdf
MC33PF8100EQES
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.4 EUR
10+12.02 EUR
25+11.18 EUR
100+10.25 EUR
260+9.79 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
BUK7E2R7-30B,127 BUK7E2R7-30B.pdf
BUK7E2R7-30B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BUK663R5-55C,118 BUK663R5-55C.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 120A D2PAK
Packaging: Bulk
auf Bestellung 1589 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
417+1.18 EUR
Mindestbestellmenge: 417
Im Einkaufswagen  Stück im Wert von  UAH
MKL24Z32VLH4 KL24P80M48SF0.pdf
MKL24Z32VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCF51AC256BCLKE MCF51AC256.pdf
MCF51AC256BCLKE
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM6733J
Hersteller: NXP USA Inc.
Description: DUMMY MODULE
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM6736/NXD61P-FJAJ
Hersteller: NXP USA Inc.
Description: 6-PIN DIF MODULE NXD6.1
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34825EPR2 PHGL-S-A0002259932-1.pdf?t.download=true&u=5oefqw
MC34825EPR2
Hersteller: NXP USA Inc.
Description: MICRO-USB INTERFACE IC, UNIVERSA
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 4600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
124+3.6 EUR
Mindestbestellmenge: 124
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G240F0MLL MC9S12GRMV1.pdf
S9S12G240F0MLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PNEV5190MB RM00264.pdf
PNEV5190MB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6Z0DVM09ABR IMX6ULZCEC.pdf
MCIMX6Z0DVM09ABR
Hersteller: NXP USA Inc.
Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SA56004ETK,118 SA56004X.pdf
SA56004ETK,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
520+0.94 EUR
Mindestbestellmenge: 520
Im Einkaufswagen  Stück im Wert von  UAH
A3V07H600-2STG
Hersteller: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PDTA143XM,315 PDTA143X_SER.pdf
PDTA143XM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9713+0.049 EUR
Mindestbestellmenge: 9713
Im Einkaufswagen  Stück im Wert von  UAH
MK10DX64VMC7 K10P100M72SF1.pdf
MK10DX64VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 60 120 180 240 300 360 420 480 540 544 545 546 547 548 549 550 551 552 553 554 600 603  [ Nächste Seite >> ]