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MML20242HT1 MML20242HT1 NXP USA Inc. MML20242H.pdf Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
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MC68HC908QT4CPE MC68HC908QT4CPE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1044DTK/0J TJA1044DTK/0J NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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100+0.74 EUR
250+0.68 EUR
500+0.65 EUR
1000+0.63 EUR
2500+0.62 EUR
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TJA1044BTK/0J TJA1044BTK/0J NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ET/0Z TJA1044ET/0Z NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ETK/0J TJA1044ETK/0J NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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1000+0.63 EUR
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TJA1044CT/0Z TJA1044CT/0Z NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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1000+0.8 EUR
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TJA1044CTK/0J TJA1044CTK/0J NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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1000+0.75 EUR
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TJA1044DT/0Z TJA1044DT/0Z NXP USA Inc. TJA1044.pdf Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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MMPF0100F3ANES MMPF0100F3ANES NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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KITFS4503CAEEVM NXP USA Inc. Description: EVAL BOARD FOR FS4500
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS4500
Produkt ist nicht verfügbar
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DSP56321VL220 DSP56321VL220 NXP USA Inc. DSP56321.pdf Description: IC DSP 24BIT 220MHZ 196MAPBGA
Packaging: Tray
Package / Case: 196-BGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 220MHz
Supplier Device Package: 196-MAPBGA (15x15)
Produkt ist nicht verfügbar
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PCA9420UK-EVM NXP USA Inc. PCA9420UK-EVM.pdf Description: EVAL BOARD FOR PCA9420
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9420
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RDW8987Q-R0 NXP USA Inc. Description: RDW8987Q-R0
Packaging: Bulk
Produkt ist nicht verfügbar
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AFV121KH-960MHZ NXP USA Inc. AFV121KH.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.215GHz
Configuration: 2 N-Channel
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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SPC5744BK1AVMH6 SPC5744BK1AVMH6 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN32W1VLC S9S08RN32W1VLC NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCXA146VLL MCXA146VLL NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
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10+9.53 EUR
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S912XEQ384BMAA S912XEQ384BMAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F10D,623 N74F10D,623 NXP USA Inc. 74F10%2C11.pdf Description: IC GATE NAND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
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2500+0.24 EUR
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S9S08DN16F2CLF S9S08DN16F2CLF NXP USA Inc. BRS08DFAMILY.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BYM359X-1500,127 BYM359X-1500,127 NXP USA Inc. BYM359X.pdf Description: DIODE ARRAY GP 800V 8A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 300 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 8A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A
Current - Reverse Leakage @ Vr: 100 µA @ 800 V
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MCXC244VFM MCXC244VFM NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
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MC35FS6518NAE MC35FS6518NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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1+22.62 EUR
10+17.75 EUR
25+16.54 EUR
100+15.21 EUR
250+14.91 EUR
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MPC8245LVV333D MPC8245LVV333D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 333MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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FS32K142HFT0MLLT FS32K142HFT0MLLT NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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S9S12GN32J1CLC NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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S9S12GN48J0VLF NXP USA Inc. Description: S12 CORE,48K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MFS2323BMBB7EP NXP USA Inc. FS23_SBC.pdf Description: MFS2323BMBB7EP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68332GCPV16 MC68332GCPV16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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TJA1462ATK/S3J TJA1462ATK/S3J NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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74HCT4040DB,118 74HCT4040DB,118 NXP USA Inc. 74HC_HCT4040.pdf Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
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PCAL9722HN/Q900MP PCAL9722HN/Q900MP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
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PCAL9722HN/Q900MP PCAL9722HN/Q900MP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
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PCAL9722HNMP PCAL9722HNMP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
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PCAL9722HNMP PCAL9722HNMP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
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S32K344EHT1VPBSR S32K344EHT1VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8245ARVV400D MPC8245ARVV400D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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88W8897PB0-NMJC/AK NXP USA Inc. Description: 88W8897PB0-NMJC/AK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34119D MC34119D NXP USA Inc. MC34119.pdf Description: IC AUDIO AMP AB 8-SOIC
Features: Shutdown
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
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MC56F81766MLF NXP USA Inc. MC56F81XXXL.pdf Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SAF776DEL/200Z100Y NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110Y NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110K NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tray
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SAF776DEL/200Z100K NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tray
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SAF776DEL/200ZK NXP USA Inc. Description: SAF776DEL
Packaging: Tray
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IP4352CX24/LF,135 IP4352CX24/LF,135 NXP USA Inc. IP4352CX24.pdf Description: TVS DIODE 24WLCSP
Packaging: Bulk
auf Bestellung 841500 Stücke:
Lieferzeit 10-14 Tag (e)
606+1 EUR
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MPC8541EVTAJD MPC8541EVTAJD NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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BB152,115 BB152,115 NXP USA Inc. BB152_Rev4.pdf Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Produkt ist nicht verfügbar
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MPC852TZT100A MPC852TZT100A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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K32L2A31VLL1A K32L2A31VLL1A NXP USA Inc. K32L2Ax.pdf Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
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NX5P1000UKZ NX5P1000UKZ NXP USA Inc. NX5P1000.pdf Description: NX5P1000 - LOGIC CONTROLLED HIGH
Packaging: Bulk
auf Bestellung 15974 Stücke:
Lieferzeit 10-14 Tag (e)
316+1.74 EUR
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S9KEAZN8ACFKR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SE052F2HN2/Z019HJ SE052F2HN2/Z019HJ NXP USA Inc. SE052.pdf Description: SE052F2HN2/Z019HJ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51JE128CMB MCF51JE128CMB NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RW610BUK/A2IZ RW610BUK/A2IZ NXP USA Inc. RW61XFS.pdf Description: RW610BUK/A2IZ
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IMP RW610BHN/A2IMP NXP USA Inc. RW61XFS.pdf Description: RW610BHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IK RW610BHN/A2IK NXP USA Inc. RW61XFS.pdf Description: RW610BHN/A2IK
Packaging: Bulk
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RW610BET/A2IY RW610BET/A2IY NXP USA Inc. RW61XFS.pdf Description: RW610BET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IK RW610BET/A2IK NXP USA Inc. RW61XFS.pdf Description: RW610BET/A2IK
Packaging: Bulk
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MML20242HT1 MML20242H.pdf
MML20242HT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
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AnzahlPrivatkunde
66+9.25 EUR
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MC68HC908QT4CPE MC68HC908QY4.pdf
MC68HC908QT4CPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1044DTK/0J TJA1044.pdf
TJA1044DTK/0J
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
17+1.3 EUR
23+0.93 EUR
26+0.83 EUR
100+0.74 EUR
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500+0.65 EUR
1000+0.63 EUR
2500+0.62 EUR
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TJA1044BTK/0J TJA1044.pdf
TJA1044BTK/0J
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5693 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
14+1.55 EUR
20+1.11 EUR
25+0.99 EUR
100+0.87 EUR
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500+0.77 EUR
1000+0.75 EUR
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TJA1044ET/0Z TJA1044.pdf
TJA1044ET/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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AnzahlPrivatkunde
17+1.3 EUR
23+0.93 EUR
26+0.83 EUR
100+0.74 EUR
250+0.68 EUR
500+0.65 EUR
1000+0.63 EUR
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TJA1044ETK/0J TJA1044.pdf
TJA1044ETK/0J
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
17+1.3 EUR
23+0.93 EUR
26+0.83 EUR
100+0.74 EUR
250+0.68 EUR
500+0.65 EUR
1000+0.63 EUR
2500+0.62 EUR
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TJA1044CT/0Z TJA1044.pdf
TJA1044CT/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5606 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
13+1.63 EUR
18+1.17 EUR
25+1.05 EUR
100+0.92 EUR
250+0.86 EUR
500+0.82 EUR
1000+0.8 EUR
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TJA1044CTK/0J TJA1044.pdf
TJA1044CTK/0J
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2975 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
14+1.55 EUR
20+1.11 EUR
25+0.99 EUR
100+0.87 EUR
250+0.81 EUR
500+0.77 EUR
1000+0.75 EUR
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TJA1044DT/0Z TJA1044.pdf
TJA1044DT/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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17+1.3 EUR
23+0.93 EUR
26+0.83 EUR
100+0.74 EUR
250+0.68 EUR
500+0.65 EUR
1000+0.63 EUR
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MMPF0100F3ANES MMPF0100.pdf
MMPF0100F3ANES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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KITFS4503CAEEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS4500
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS4500
Produkt ist nicht verfügbar
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DSP56321VL220 DSP56321.pdf
DSP56321VL220
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 220MHZ 196MAPBGA
Packaging: Tray
Package / Case: 196-BGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 220MHz
Supplier Device Package: 196-MAPBGA (15x15)
Produkt ist nicht verfügbar
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PCA9420UK-EVM PCA9420UK-EVM.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9420
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9420
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RDW8987Q-R0
Hersteller: NXP USA Inc.
Description: RDW8987Q-R0
Packaging: Bulk
Produkt ist nicht verfügbar
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AFV121KH-960MHZ AFV121KH.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.215GHz
Configuration: 2 N-Channel
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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SPC5744BK1AVMH6 MPC5746C-Datasheet.pdf
SPC5744BK1AVMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN32W1VLC S9S08RN60DS.pdf
S9S08RN32W1VLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCXA146VLL MCXAP100M96FS6.pdf
MCXA146VLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
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2+12.42 EUR
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S912XEQ384BMAA
S912XEQ384BMAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F10D,623 74F10%2C11.pdf
N74F10D,623
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
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2500+0.24 EUR
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S9S08DN16F2CLF BRS08DFAMILY.pdf
S9S08DN16F2CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BYM359X-1500,127 BYM359X.pdf
BYM359X-1500,127
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 800V 8A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 300 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 8A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A
Current - Reverse Leakage @ Vr: 100 µA @ 800 V
Produkt ist nicht verfügbar
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MCXC244VFM MCXC24XP64M48SF2.pdf
MCXC244VFM
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
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4+5.9 EUR
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MC35FS6518NAE FS6500-FS4500-ASILD.pdf
MC35FS6518NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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1+22.62 EUR
10+17.75 EUR
25+16.54 EUR
100+15.21 EUR
250+14.91 EUR
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MPC8245LVV333D MPC8245.pdf
MPC8245LVV333D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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FS32K142HFT0MLLT
FS32K142HFT0MLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN32J1CLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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S9S12GN48J0VLF
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MFS2323BMBB7EP FS23_SBC.pdf
Hersteller: NXP USA Inc.
Description: MFS2323BMBB7EP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68332GCPV16 MC68332TS.pdf
MC68332GCPV16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462ATK/S3J TJA1462.pdf
TJA1462ATK/S3J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74HCT4040DB,118 74HC_HCT4040.pdf
74HCT4040DB,118
Hersteller: NXP USA Inc.
Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
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PCAL9722HN/Q900MP PCAL9722.pdf
PCAL9722HN/Q900MP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
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PCAL9722HN/Q900MP PCAL9722.pdf
PCAL9722HN/Q900MP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
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7+3.42 EUR
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25+2.28 EUR
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500+1.84 EUR
1000+1.78 EUR
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PCAL9722HNMP PCAL9722.pdf
PCAL9722HNMP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
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PCAL9722HNMP PCAL9722.pdf
PCAL9722HNMP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
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8+2.92 EUR
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25+1.94 EUR
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250+1.62 EUR
500+1.56 EUR
1000+1.51 EUR
2500+1.45 EUR
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S32K344EHT1VPBSR S32K3xx.pdf
S32K344EHT1VPBSR
Hersteller: NXP USA Inc.
Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8245ARVV400D MPC8245.pdf
MPC8245ARVV400D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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88W8897PB0-NMJC/AK
Hersteller: NXP USA Inc.
Description: 88W8897PB0-NMJC/AK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34119D MC34119.pdf
MC34119D
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SOIC
Features: Shutdown
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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MC56F81766MLF MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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SAF776DEL/200Z100Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tray
Produkt ist nicht verfügbar
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SAF776DEL/200Z100K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tray
Produkt ist nicht verfügbar
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SAF776DEL/200ZK
Hersteller: NXP USA Inc.
Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
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IP4352CX24/LF,135 IP4352CX24.pdf
IP4352CX24/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 24WLCSP
Packaging: Bulk
auf Bestellung 841500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
606+1 EUR
Mindestbestellmenge: 606 Stücke
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MPC8541EVTAJD MPC8541EEC.pdf
MPC8541EVTAJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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BB152,115 BB152_Rev4.pdf
BB152,115
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Produkt ist nicht verfügbar
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MPC852TZT100A MPC852T.pdf
MPC852TZT100A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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K32L2A31VLL1A K32L2Ax.pdf
K32L2A31VLL1A
Hersteller: NXP USA Inc.
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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NX5P1000UKZ NX5P1000.pdf
NX5P1000UKZ
Hersteller: NXP USA Inc.
Description: NX5P1000 - LOGIC CONTROLLED HIGH
Packaging: Bulk
auf Bestellung 15974 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
316+1.74 EUR
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S9KEAZN8ACFKR S9KEA128P80M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SE052F2HN2/Z019HJ SE052.pdf
SE052F2HN2/Z019HJ
Hersteller: NXP USA Inc.
Description: SE052F2HN2/Z019HJ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51JE128CMB MCF51JE256.pdf
MCF51JE128CMB
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RW610BUK/A2IZ RW61XFS.pdf
RW610BUK/A2IZ
Hersteller: NXP USA Inc.
Description: RW610BUK/A2IZ
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IMP RW61XFS.pdf
RW610BHN/A2IMP
Hersteller: NXP USA Inc.
Description: RW610BHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IK RW61XFS.pdf
RW610BHN/A2IK
Hersteller: NXP USA Inc.
Description: RW610BHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IY RW61XFS.pdf
RW610BET/A2IY
Hersteller: NXP USA Inc.
Description: RW610BET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IK RW61XFS.pdf
RW610BET/A2IK
Hersteller: NXP USA Inc.
Description: RW610BET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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