Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36152) > Seite 554 nach 603
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MC9S08PL8SCTJR | NXP USA Inc. |
 Description: PL16S, 20TSSOPPackaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 12x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 18 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
LPC11E68JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 790 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MCF52221CVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA Packaging: Tray Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Number of I/O: 56 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| 88W8782-B0-NAPC/DZ | NXP USA Inc. |
Description: IC RF 68HVQFN Packaging: Tape & Reel (TR) Package / Case: 68-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 68-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| P3T2030DUKAZ | NXP USA Inc. |
Description: P3T2030DUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3500 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
| P3T2030DUKAZ | NXP USA Inc. |
Description: P3T2030DUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3500 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
 |
P3T2030EUKAZ | NXP USA Inc. |
Description: P3T2030EUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
P3T2030EUKAZ | NXP USA Inc. |
Description: P3T2030EUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
P3T2030BUKAZ | NXP USA Inc. |
Description: P3T2030BUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
P3T2030FUKAZ | NXP USA Inc. |
Description: P3T2030FUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
P3T2030FUKAZ | NXP USA Inc. |
Description: P3T2030FUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3497 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
P3T1035AUKAZ | NXP USA Inc. |
Description: P3T1035AUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5% Sensing Temperature - Local: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
P3T1035AUKAZ | NXP USA Inc. |
Description: P3T1035AUKAZ Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 3328 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MC68360ZQ25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| P1017NSE5CFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA Packaging: Tray Package / Case: 457-FBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 457-TEPBGA-1 (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
SPC5606SF2CLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 136 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| NT2H1511G0DUDZ | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 75°C Standards: ISO 14443 Supplier Device Package: Die |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NT2H1511G0DUDV | NXP USA Inc. |
Description: NFC FORUM TYPE 2 TAG COMPLIANT I Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
ON5088,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 55GHZ 4DFP Packaging: Tape & Reel (TR) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13dB Power - Max: 136mW Current - Collector (Ic) (Max): 40mA Voltage - Collector Emitter Breakdown (Max): 10V DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V Frequency - Transition: 55GHz Noise Figure (dB Typ @ f): 1.1dB @ 12GHz Supplier Device Package: 4-DFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
ON5088,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 55GHZ 4DFP Packaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13dB Power - Max: 136mW Current - Collector (Ic) (Max): 40mA Voltage - Collector Emitter Breakdown (Max): 10V DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V Frequency - Transition: 55GHz Noise Figure (dB Typ @ f): 1.1dB @ 12GHz Supplier Device Package: 4-DFP |
auf Bestellung 1704 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
LPC11U14FET48/201, | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48TFBGA Packaging: Tray Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| FS32R294HFK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| FS32R294HFK0MJDR | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
PR5331C3HN/C350,55 | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, UART Type: RFID Reader Operating Temperature: -30°C ~ 85°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MCF51EM128CLL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
auf Bestellung 2324 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
MCF51EM128CLL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| FX32K118LAT0MLHT | NXP USA Inc. |
Description: S32K118 ARM CORTEX-M0+, 48 MHZ, Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MVR5510AVMANEP | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| FC32K116LAT0MLFT | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MCXC144VFT | NXP USA Inc. |
Description: 48MHz, Cortex-M0+ Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 40 |
auf Bestellung 1150 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| SAF775CHN/N208W/DK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MPC8245LZU350D | NXP USA Inc. |
Description: IC MPU MPC82XX 350MHZ 352TBGA Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 350MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
S9S08SL16F1VTL | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOP Packaging: Tube Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MC9S08AC8MFDE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
MC33FS8510A0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S912ZVL96AVFM | NXP USA Inc. |
Description: S12Z CPU, 96K FLASH Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MFS2630AMBA0AD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32K310NHT0MLFSR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
S32K310NHT0MLFST | NXP USA Inc. |
Description: S32K310NHT0MLFST Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
S32K310NHT0MPAST | NXP USA Inc. |
Description: S32K310NHT0MPAST Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MMA5224KW | NXP USA Inc. |
Description: ACCELEROMETER 240G PCM/SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±240g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 2 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MC9S08QE96CFT | NXP USA Inc. |
Description: IC MCU 8BIT 96KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
S32K314NHT1MPBSR | NXP USA Inc. |
Description: S32K314NHT1MPBSR Packaging: Bulk Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
S32K314NHT1VPBSR | NXP USA Inc. |
Description: S32K314 ARM CORTEX-M7, 160 MHZ, Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 218 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MCZ33903C5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MBMI7018TA1AER2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MBMI7018SA1AER2 | NXP USA Inc. |
Description: BMS1BCC18 100V Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NXLS95333AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NXLS95733AESR2 | NXP USA Inc. |
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NXLS96433AESR2 | NXP USA Inc. |
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NXLS95433AESR2 | NXP USA Inc. |
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NXLS96733AESR2 | NXP USA Inc. |
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| NXLS96333AESR2 | NXP USA Inc. |
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MMA1200KEG | NXP USA Inc. |
Description: ACCELEROMETER 281G ANALOG 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±281g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 8 |
auf Bestellung 7683 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
MMA1250EGR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 50Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 400 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MMA1270KEG | NXP USA Inc. |
Description: ACCELEROMETER 2.5G ANALOG 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±2.5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 50Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 750 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| TEA1999DB1504UL | NXP USA Inc. |
Description: TEA1999 DEMOBOARD 1504 Packaging: Box Function: Battery Charger Type: Power Management Contents: Board(s) Utilized IC / Part: TEA1999 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MPC860SRCZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MFS2613AMDHKAD | NXP USA Inc. |
Description: System Basis Chip ASIL-D LQFP-48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) Voltage - Supply: 3.2V ~ 36V |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MFS8416AMBP5ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN4 Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MC9S08PL8SCTJR |
|
Hersteller: NXP USA Inc.
Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E68JBD64K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 790 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.84 EUR |
| 10+ | 7.64 EUR |
| 25+ | 7.08 EUR |
| 100+ | 6.45 EUR |
| 250+ | 6.28 EUR |
| 500+ | 5.97 EUR |
| MCF52221CVM80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 88W8782-B0-NAPC/DZ |
Hersteller: NXP USA Inc.
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P3T2030DUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3500+ | 0.58 EUR |
| P3T2030DUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8+ | 2.2 EUR |
| 13+ | 1.39 EUR |
| 25+ | 1.17 EUR |
| 100+ | 0.93 EUR |
| 250+ | 0.81 EUR |
| 500+ | 0.73 EUR |
| 1000+ | 0.67 EUR |
| P3T2030EUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3500+ | 0.57 EUR |
| P3T2030EUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15+ | 1.25 EUR |
| 20+ | 0.89 EUR |
| 25+ | 0.8 EUR |
| 100+ | 0.7 EUR |
| 250+ | 0.66 EUR |
| 500+ | 0.63 EUR |
| 1000+ | 0.6 EUR |
| P3T2030BUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15+ | 1.23 EUR |
| 20+ | 0.89 EUR |
| 25+ | 0.8 EUR |
| 100+ | 0.7 EUR |
| 250+ | 0.65 EUR |
| 500+ | 0.62 EUR |
| 1000+ | 0.6 EUR |
| P3T2030FUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P3T2030FUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3497 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15+ | 1.25 EUR |
| 20+ | 0.89 EUR |
| 25+ | 0.8 EUR |
| 100+ | 0.7 EUR |
| 250+ | 0.66 EUR |
| 500+ | 0.63 EUR |
| 1000+ | 0.6 EUR |
| P3T1035AUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P3T1035AUKAZ |
|
Hersteller: NXP USA Inc.
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3328 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13+ | 1.41 EUR |
| 15+ | 1.23 EUR |
| 16+ | 1.17 EUR |
| 25+ | 1.09 EUR |
| 50+ | 1.04 EUR |
| 100+ | 0.99 EUR |
| 500+ | 0.9 EUR |
| 1000+ | 0.87 EUR |
| MC68360ZQ25VL |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P1017NSE5CFB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5606SF2CLU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NT2H1511G0DUDZ |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NT2H1511G0DUDV |
|
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ON5088,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ON5088,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
auf Bestellung 1704 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 27+ | 0.67 EUR |
| 36+ | 0.5 EUR |
| 40+ | 0.44 EUR |
| 100+ | 0.38 EUR |
| 250+ | 0.34 EUR |
| 500+ | 0.32 EUR |
| 1000+ | 0.3 EUR |
| LPC11U14FET48/201, |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PR5331C3HN/C350,55 |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Description: IC RFID READER 13.56MHZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51EM128CLL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2324 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 34+ | 14.53 EUR |
| MCF51EM128CLL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AVMANEP |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCXC144VFT |
|
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
auf Bestellung 1150 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.28 EUR |
| 10+ | 4.07 EUR |
| 25+ | 3.78 EUR |
| 100+ | 3.31 EUR |
| 250+ | 3.18 EUR |
| 500+ | 2.87 EUR |
| MPC8245LZU350D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08SL16F1VTL |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08AC8MFDE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS8510A0KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVL96AVFM |
Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS2630AMBA0AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K310NHT0MLFST |
|
Hersteller: NXP USA Inc.
Description: S32K310NHT0MLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S32K310NHT0MLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K310NHT0MPAST |
|
Hersteller: NXP USA Inc.
Description: S32K310NHT0MPAST
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K310NHT0MPAST
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA5224KW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±240g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 2
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±240g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08QE96CFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K314NHT1MPBSR |
|
Hersteller: NXP USA Inc.
Description: S32K314NHT1MPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: S32K314NHT1MPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K314NHT1VPBSR |
|
Hersteller: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33903C5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA1200KEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
auf Bestellung 7683 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 39+ | 11.36 EUR |
| MMA1250EGR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA1270KEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 750
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 750
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1999DB1504UL |
|
Hersteller: NXP USA Inc.
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC860SRCZQ50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS2613AMDHKAD |
|
Hersteller: NXP USA Inc.
Description: System Basis Chip ASIL-D LQFP-48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 36V
Description: System Basis Chip ASIL-D LQFP-48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 36V
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.71 EUR |
| 10+ | 10.64 EUR |
| 25+ | 9.87 EUR |
| MFS8416AMBP5ESR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH