Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36598) > Seite 558 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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| S9S12G64J1MLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BFU768F,115 | NXP USA Inc. |
Description: RF TRANS NPN 2.8V 70MA 4DFPPackaging: Tape & Reel (TR) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.1dB Power - Max: 220mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz Supplier Device Package: 4-DFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BFU768F,115 | NXP USA Inc. |
Description: RF TRANS NPN 2.8V 70MA 4DFPPackaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.1dB Power - Max: 220mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz Supplier Device Package: 4-DFP |
auf Bestellung 268 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU520XRR | NXP USA Inc. |
Description: RF TRANS NPN 12V 10.5GHZ SOT143RQualification: AEC-Q101 Grade: Automotive Supplier Device Package: SOT-143R Noise Figure (dB Typ @ f): 0.65dB @ 900MHz Frequency - Transition: 10.5GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Voltage - Collector Emitter Breakdown (Max): 12V Current - Collector (Ic) (Max): 30mA Power - Max: 450mW Gain: 20dB Operating Temperature: -40°C ~ 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SOT-143R Packaging: Tape & Reel (TR) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU520XRR | NXP USA Inc. |
Description: RF TRANS NPN 12V 10.5GHZ SOT143RPackaging: Cut Tape (CT) Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 20dB Power - Max: 450mW Current - Collector (Ic) (Max): 30mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Frequency - Transition: 10.5GHz Noise Figure (dB Typ @ f): 0.65dB @ 900MHz Supplier Device Package: SOT-143R Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 5924 Stücke: Lieferzeit 10-14 Tag (e) |
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SA56004AD,112 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SOSensing Temperature - Remote: -40°C ~ 125°C Sensing Temperature - Local: -40°C ~ 125°C Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Supplier Device Package: 8-SO Resolution: 10 b Sensor Type: Digital, Local/Remote Voltage - Supply: 3V ~ 5.5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Output Type: I2C/SMBus Package / Case: 8-SOIC (0.154", 3.90mm Width) Features: Output Switch, Programmable Limit Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PDTC144VM,315 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW SOT883Packaging: Bulk |
auf Bestellung 80000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6X1CVO08AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCIMX6X3CVO08AB | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGAAdditional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (17x17) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -40°C ~ 105°C (TA) Speed: 200MHz, 800MHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MMA2204KEGR2 | NXP USA Inc. |
Description: ACCEL 112.5G ANALOG 16SOICQualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 20 Supplier Device Package: 16-SOIC Bandwidth: 400Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±112.5g Axis: X Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74LVC2G02GD,125 | NXP USA Inc. |
Description: IC GATE NOR 2CH 2-INP 8-XSONPackaging: Bulk |
auf Bestellung 130528 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT4557UKAZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 9-WLCSPPackaging: Tape & Reel (TR) Package / Case: 9-XFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 10MHz Supplier Device Package: 9-WLCSP (0.92x0.92) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 20000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NVT4557UKAZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 9-WLCSPPackaging: Cut Tape (CT) Package / Case: 9-XFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 10MHz Supplier Device Package: 9-WLCSP (0.92x0.92) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Number of Circuits: 1 |
auf Bestellung 6370 Stücke: Lieferzeit 10-14 Tag (e) |
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S908QB4E0CDTE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 96 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SAF4000EL/102Z52AK | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4001EL/101Z305Y | NXP USA Inc. |
Description: SAF4001EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4001EL/101Z305K | NXP USA Inc. |
Description: SAF4001EL Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5302AMMA0ES | NXP USA Inc. |
Description: IC REG BUCK ADJ 15A 24HWQFNVoltage - Output (Min/Fixed): 0.5V Voltage - Input (Min): 2.7V Voltage - Output (Max): 1.2V Synchronous Rectifier: No Supplier Device Package: 24-HWQFN (4.5x3.5) Topology: Buck Voltage - Input (Max): 5.5V Frequency - Switching: 2MHz ~ 3MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 15A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount, Wettable Flank Output Type: Adjustable Package / Case: 24-PowerWFQFN Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC35FS6513NAE | NXP USA Inc. |
Description: FS6500Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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| J3R150P1U15/0ZA2AV | NXP USA Inc. |
Description: J3R150P1U15 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24109 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| J3R150P1U15/0ZA2BV | NXP USA Inc. |
Description: J3R150P1U15 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24109 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SCBGARBW1AO | NXP USA Inc. |
Description: SOCKET SUPPORTING VERTICAL AUTOM Packaging: Bulk Module/Board Type: Socket Module - BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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N74F51D,602 | NXP USA Inc. |
Description: IC GATE AND/OR/INVERT 2IN 14SOICNumber of Circuits: 2 Supplier Device Package: 14-SO Schmitt Trigger Input: No Number of Inputs: 10 Input (3, 3, 2, 2) Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: AND/OR/INVERT Gate Mounting Type: Surface Mount Output Type: Differential Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
auf Bestellung 3420 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2400AVMA0ESR2 | NXP USA Inc. |
Description: MFS2400AVMA0ESR2Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MFS2400AVMA1ESR2 | NXP USA Inc. |
Description: Safety Mini CAN FD SBCPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MFS2400AVMA0ES | NXP USA Inc. |
Description: MFS2400AVMA0ESPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MFS2400AVBA0ESR2 | NXP USA Inc. |
Description: MFS2400AVBA0ESR2Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MFS2400AVBA0ES | NXP USA Inc. |
Description: MFS2400AVBA0ESPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC44BS374T1EFR2 | NXP USA Inc. |
Description: IC NTSC/PAL MODULATOR 16-SOICPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: NTSC/PAL Modulator Applications: Audio/Video, VCR's, Set-Top Boxes Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MC20XS4200DFKR2 | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MOFault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO Supplier Device Package: 23-PQFN (12x12) Ratio - Input:Output: 1:1 Current - Output (Max): 4.4A Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Voltage - Load: 8V ~ 36V Input Type: Non-Inverting Rds On (Typ): 20mOhm (Max) Output Configuration: High Side Operating Temperature: -40°C ~ 125°C (TA) Switch Type: General Purpose Interface: SPI Number of Outputs: 2 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 23-PowerQFN Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1200 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MKE02Z32VLD2 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
auf Bestellung 788 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCXA146VPJ | NXP USA Inc. |
Description: IC MCUPackaging: Tray Package / Case: 112-BGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: D/A 1x12b Core Size: 32-Bit Connectivity: FlexIO, I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 112-VFBGA (7x7) Number of I/O: 82 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51AG128CLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 24x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 69 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SC16C852LIBS,151 | NXP USA Inc. |
Description: IC UART DUAL W/FIFO 32-HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 1.8V FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8UD3DVP08SC | NXP USA Inc. |
Description: I.MX8ULP, DUAL 800MHZPackaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Supplier Device Package: 485-LFBGA (15x15) |
auf Bestellung 610 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXA154VPJ | NXP USA Inc. |
Description: IC MCUPackaging: Tray Package / Case: 112-VFBGA Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: D/A 1x12b Core Size: 32-Bit Connectivity: FlexIO, I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 112-VFBGA (7x7) Number of I/O: 82 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCXA155VPJ | NXP USA Inc. |
Description: IC MCUPackaging: Tray Package / Case: 112-BGA Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: D/A 1x12b Core Size: 32-Bit Connectivity: FlexIO, I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 112-VFBGA (7x7) Number of I/O: 82 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2633AMDAHAD | NXP USA Inc. |
Description: MFS2633AMDAHADPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) |
auf Bestellung 249 Stücke: Lieferzeit 10-14 Tag (e) |
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| MBMI7014TA1AER2 | NXP USA Inc. |
Description: MBMI7014TA1AER2Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MBMI7014TA1AE | NXP USA Inc. |
Description: MBMI7014TA1AEPackaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4000EL/103Q200Y | NXP USA Inc. |
Description: SAF4000EL/103Q200Y Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4000EL/103Q200K | NXP USA Inc. |
Description: SAF4000EL/103Q200K Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFDBGVCALS50R | NXP USA Inc. |
Description: 156 PIN VERTICAL RING TO ROTATED Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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FRWY-LS1012A-PB | NXP USA Inc. |
Description: LAYERSCAPE LS1012A FREEWAY BRDPackaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: LS1012A Platform: Layerscape LS1012A Freeway |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806CX4/33P,315 | NXP USA Inc. |
Description: IC REG LINEAR 3.3V 200MA 4WLCSPCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.1V @ 200mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 3.3V Supplier Device Package: 4-WLCSP (0.76x0.76) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-XFBGA, WLCSP Packaging: Bulk |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPX2053DP | NXP USA Inc. |
Description: SENSOR 7.25PSID 0.19" .04VPackaging: Tray Features: Temperature Compensated Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Port Size: Male - 0.19" (4.93mm) Tube, Dual Applications: Board Mount Port Style: Barbed Maximum Pressure: 29.01PSI (200kPa) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S908AB32AH3VFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP DigiKey Programmable: Not Verified Number of I/O: 51 Supplier Device Package: 64-QFP (14x14) Peripherals: POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32K348GHT1MJBST | NXP USA Inc. |
Description: S32K348GHT1MJBSTPackaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 218 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PCA9430HKZ | NXP USA Inc. |
Description: IC BATT CHG 16XQFN Supplier Device Package: 16-XQFN (2.2x2.8) Mounting Type: Surface Mount Package / Case: 16-XFQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7755HV/N208WK | NXP USA Inc. |
Description: MULTI-TUNER CAR RADIO & AUDIO ON Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF775CHN/N208W/AK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC33FS6508NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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| MKE04Z64VLH4R | NXP USA Inc. |
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5Number of I/O: 58 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Cut Tape (CT) |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE04Z64VLK4R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80LQFPDigiKey Programmable: Not Verified Number of I/O: 71 Supplier Device Package: 80-LQFP (14x14) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tape & Reel (TR) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE04Z64VLK4R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80LQFPDigiKey Programmable: Not Verified Number of I/O: 71 Supplier Device Package: 80-LQFP (14x14) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Cut Tape (CT) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLS90220AESR2 | NXP USA Inc. |
Description: X SINGLE-AXIS MEDIUM-G INERTIALPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SPC5602BACLH4R | NXP USA Inc. |
Description: IC MCU 32BIT Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PHP18NQ11T,127 | NXP USA Inc. |
Description: MOSFET N-CH 110V 18A TO220ABPackaging: Bulk |
auf Bestellung 663 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA144TMB,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A 3DFNResistor - Base (R1): 47 kOhms Frequency - Transition: 180 MHz Power - Max: 250 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 100 mA Supplier Device Package: DFN1006B-3 DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Current - Collector Cutoff (Max): 1µA Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Transistor Type: PNP - Pre-Biased Mounting Type: Surface Mount Package / Case: SC-101, SOT-883 Packaging: Bulk Resistors Included: R1 Only |
auf Bestellung 169326 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA144WMB,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A 3DFNPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 22 kOhms Resistors Included: R1 and R2 |
auf Bestellung 149782 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S12G64J1MLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BFU768F,115 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BFU768F,115 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
auf Bestellung 268 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 14+ | 1.55 EUR |
| 22+ | 0.96 EUR |
| 100+ | 0.62 EUR |
| BFU520XRR |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Frequency - Transition: 10.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 30mA
Power - Max: 450mW
Gain: 20dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Frequency - Transition: 10.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 30mA
Power - Max: 450mW
Gain: 20dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 0.21 EUR |
| BFU520XRR |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5924 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 40+ | 0.52 EUR |
| 58+ | 0.36 EUR |
| 66+ | 0.32 EUR |
| 100+ | 0.27 EUR |
| 250+ | 0.25 EUR |
| 500+ | 0.24 EUR |
| 1000+ | 0.23 EUR |
| SA56004AD,112 |
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Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
Description: SENSOR DIGITAL -40C-125C 8SO
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTC144VM,315 |
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auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11871+ | 0.061 EUR |
| MCIMX6X1CVO08AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6X3CVO08AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA2204KEGR2 |
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Hersteller: NXP USA Inc.
Description: ACCEL 112.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCEL 112.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC2G02GD,125 |
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auf Bestellung 130528 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2049+ | 0.3 EUR |
| NVT4557UKAZ |
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Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
Mindestbestellmenge: 20000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NVT4557UKAZ |
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Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
auf Bestellung 6370 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.68 EUR |
| 18+ | 1.19 EUR |
| 25+ | 1.08 EUR |
| 100+ | 0.95 EUR |
| 250+ | 0.88 EUR |
| 500+ | 0.84 EUR |
| 1000+ | 0.82 EUR |
| S908QB4E0CDTE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SAF4000EL/102Z52AK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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| SAF4001EL/101Z305Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAF4001EL/101Z305K |
Produkt ist nicht verfügbar
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| MPF5302AMMA0ES |
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Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 15A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tray
Description: IC REG BUCK ADJ 15A 24HWQFN
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 15A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tray
Produkt ist nicht verfügbar
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| MC35FS6513NAE |
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Hersteller: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.25 EUR |
| 10+ | 15.86 EUR |
| 25+ | 14.77 EUR |
| 100+ | 13.57 EUR |
| 250+ | 12.98 EUR |
| J3R150P1U15/0ZA2AV |
Produkt ist nicht verfügbar
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| J3R150P1U15/0ZA2BV |
Produkt ist nicht verfügbar
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| SCBGARBW1AO |
Hersteller: NXP USA Inc.
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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| N74F51D,602 |
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Hersteller: NXP USA Inc.
Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Number of Circuits: 2
Supplier Device Package: 14-SO
Schmitt Trigger Input: No
Number of Inputs: 10 Input (3, 3, 2, 2)
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: AND/OR/INVERT Gate
Mounting Type: Surface Mount
Output Type: Differential
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Number of Circuits: 2
Supplier Device Package: 14-SO
Schmitt Trigger Input: No
Number of Inputs: 10 Input (3, 3, 2, 2)
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: AND/OR/INVERT Gate
Mounting Type: Surface Mount
Output Type: Differential
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 3420 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1902+ | 0.32 EUR |
| MFS2400AVMA0ESR2 |
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Hersteller: NXP USA Inc.
Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| MFS2400AVMA1ESR2 |
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Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| MFS2400AVMA0ES |
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Hersteller: NXP USA Inc.
Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MFS2400AVBA0ESR2 |
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Hersteller: NXP USA Inc.
Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MFS2400AVBA0ES |
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Hersteller: NXP USA Inc.
Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
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| MC44BS374T1EFR2 |
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Hersteller: NXP USA Inc.
Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| MC20XS4200DFKR2 |
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Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1200 Stücke
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| MKE02Z32VLD2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 788 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.97 EUR |
| 10+ | 5.26 EUR |
| 25+ | 4.83 EUR |
| 160+ | 4.24 EUR |
| 320+ | 4.08 EUR |
| 640+ | 3.95 EUR |
| MCXA146VPJ |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.73 EUR |
| 10+ | 9.79 EUR |
| 25+ | 9.06 EUR |
| 100+ | 8.26 EUR |
| 260+ | 7.85 EUR |
| MCF51AG128CLK |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| SC16C852LIBS,151 |
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Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
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| MIMX8UD3DVP08SC |
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Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 610 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 52.91 EUR |
| 10+ | 42.69 EUR |
| 25+ | 40.13 EUR |
| 100+ | 37.32 EUR |
| 250+ | 35.99 EUR |
| MCXA154VPJ |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.33 EUR |
| 10+ | 5.52 EUR |
| 25+ | 5.08 EUR |
| 100+ | 4.58 EUR |
| 260+ | 4.34 EUR |
| MCXA155VPJ |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.81 EUR |
| 10+ | 6.75 EUR |
| 25+ | 6.3 EUR |
| 100+ | 5.62 EUR |
| 260+ | 5.45 EUR |
| MFS2633AMDAHAD |
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Hersteller: NXP USA Inc.
Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.04 EUR |
| 10+ | 12.47 EUR |
| 25+ | 11.58 EUR |
| 100+ | 10.6 EUR |
| MBMI7014TA1AER2 |
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Produkt ist nicht verfügbar
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| MBMI7014TA1AE |
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Produkt ist nicht verfügbar
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| SAF4000EL/103Q200Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAF4000EL/103Q200K |
Produkt ist nicht verfügbar
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| LFDBGVCALS50R |
Hersteller: NXP USA Inc.
Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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| FRWY-LS1012A-PB |
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Hersteller: NXP USA Inc.
Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
auf Bestellung 1 Stücke:
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| Anzahl | Privatkunde |
|---|---|
| 1+ | 740.83 EUR |
| LD6806CX4/33P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3328+ | 0.18 EUR |
| MPX2053DP |
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Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Description: SENSOR 7.25PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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| S908AB32AH3VFUE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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| S32K348GHT1MJBST |
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Hersteller: NXP USA Inc.
Description: S32K348GHT1MJBST
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Description: S32K348GHT1MJBST
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| PCA9430HKZ |
Hersteller: NXP USA Inc.
Description: IC BATT CHG 16XQFN
Supplier Device Package: 16-XQFN (2.2x2.8)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Description: IC BATT CHG 16XQFN
Supplier Device Package: 16-XQFN (2.2x2.8)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SAF7755HV/N208WK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
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| SAF775CHN/N208W/AK |
Produkt ist nicht verfügbar
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| MC33FS6508NAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.48 EUR |
| 10+ | 14.63 EUR |
| 25+ | 13.95 EUR |
| 40+ | 13.61 EUR |
| 80+ | 13.13 EUR |
| 250+ | 12.38 EUR |
| MKE04Z64VLH4R |
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Hersteller: NXP USA Inc.
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.16 EUR |
| 10+ | 7.25 EUR |
| 25+ | 6.91 EUR |
| 50+ | 6.66 EUR |
| 100+ | 6.44 EUR |
| 250+ | 6.14 EUR |
| 500+ | 5.91 EUR |
| MKE04Z64VLK4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 5.26 EUR |
| MKE04Z64VLK4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.25 EUR |
| 10+ | 7.82 EUR |
| 25+ | 7.21 EUR |
| 100+ | 6.54 EUR |
| 250+ | 6.22 EUR |
| 500+ | 6.03 EUR |
| FXLS90220AESR2 |
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Hersteller: NXP USA Inc.
Description: X SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: X SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5602BACLH4R |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| PHP18NQ11T,127 |
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auf Bestellung 663 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 454+ | 1.32 EUR |
| PDTA144TMB,315 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 180 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Resistors Included: R1 Only
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 180 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Resistors Included: R1 Only
auf Bestellung 169326 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11225+ | 0.061 EUR |
| PDTA144WMB,315 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
Resistors Included: R1 and R2
auf Bestellung 149782 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11225+ | 0.061 EUR |



























