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MKE04Z8VWJ4R MKE04Z8VWJ4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-SOIC
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 10x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE04Z8VWJ4R MKE04Z8VWJ4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-SOIC
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 10x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 500 Stücke:
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6+3.31 EUR
10+1.91 EUR
25+1.88 EUR
100+1.85 EUR
500+1.84 EUR
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SAF7770EL/200Z13BY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
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SAF7770EL/200Z13BK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
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MIMXRT1187XVM8B NXP USA Inc. Description: IC MCU
Packaging: Tray
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MR-B3RB-M NXP USA Inc. Description: MR-B3RB-M MAIN VERSION OF BUGGY3
Packaging: Bulk
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LS1043AXE8MQB LS1043AXE8MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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LS1043AXE8PQB LS1043AXE8PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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LS1043AXN8KQB LS1043AXN8KQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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LS1043AXN8MQB LS1043AXN8MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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LS1043AXN8QQB LS1043AXN8QQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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S9KEAZN16ACLC S9KEAZN16ACLC NXP USA Inc. AN4942.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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KIT-TJA1104-SDBR NXP USA Inc. Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
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TJA1104-SDBR NXP USA Inc. Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104-SDBS NXP USA Inc. Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBS NXP USA Inc. Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104CHN/0J NXP USA Inc. Description: TJA1104CHN/0J
Packaging: Tape & Reel (TR)
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TJA1104BHN/0J NXP USA Inc. Description: TJA1104BHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08GT8AMFDE MC9S08GT8AMFDE NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MVR5510AMMALES MVR5510AMMALES NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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FG32K144HRT0VLLT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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SPC5747CSK0AVMJ2 SPC5747CSK0AVMJ2 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 48x10b, 16x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz, 120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1043ASN8KNLB LS1043ASN8KNLB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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SPC5514GBMLQ66 SPC5514GBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5516GBMLQ66 SPC5516GBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5516EACMG48 SPC5516EACMG48 NXP USA Inc. MPC5510.pdf Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC7SH04GV,125 XC7SH04GV,125 NXP USA Inc. XC7SH04.pdf Description: IC INVERTER SIGATE CMOS 5TSOP
Packaging: Bulk
auf Bestellung 113950 Stücke:
Lieferzeit 10-14 Tag (e)
1679+0.3 EUR
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MRFG35010AR5 MRFG35010AR5 NXP USA Inc. FSCLS02783-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET PHEMT FET 12V NI360
Current - Test: 140 mA
Voltage - Test: 12 V
Voltage - Rated: 15 V
Supplier Device Package: NI-360HF
Technology: pHEMT FET
Gain: 10dB
Power - Output: 1W
Frequency: 3.55GHz
Mounting Type: Chassis Mount
Package / Case: NI-360HF
Packaging: Tape & Reel (TR)
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MRFG35010R5 MRFG35010R5 NXP USA Inc. FSCLS02935-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET PHEMT FET 12V NI360
Current - Test: 180 mA
Voltage - Test: 12 V
Voltage - Rated: 15 V
Supplier Device Package: NI-360HF
Technology: pHEMT FET
Gain: 10dB
Power - Output: 10W
Frequency: 3.55GHz
Mounting Type: Chassis Mount
Package / Case: NI-360HF
Packaging: Tape & Reel (TR)
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MCXC443VMP MCXC443VMP NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 50
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
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MCXC443VLH MCXC443VLH NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
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Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
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MMRF1006HR5 MMRF1006HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MCIMX7D3DVK10SD MCIMX7D3DVK10SD NXP USA Inc. Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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IMX91LP4EVK-11CM IMX91LP4EVK-11CM NXP USA Inc. IMX91LP4EVK-11CM.pdf Description: I.MX 91 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
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1+848.21 EUR
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LPC55S16JEV59E LPC55S16JEV59E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.24 EUR
10+7.88 EUR
25+7.29 EUR
100+6.64 EUR
490+6.15 EUR
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LPC5514JEV59Y LPC5514JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC5514JEV59Y LPC5514JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.82 EUR
10+6.74 EUR
25+6.22 EUR
100+5.65 EUR
250+5.38 EUR
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LPC5516JEV59Y LPC5516JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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LPC5516JEV59Y LPC5516JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2940 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.1 EUR
10+7.76 EUR
25+7.18 EUR
100+6.54 EUR
250+6.26 EUR
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LPC5516JEV59E LPC5516JEV59E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 455 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.19 EUR
10+7.84 EUR
25+7.25 EUR
100+6.6 EUR
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LPC55S16JEV59Y LPC55S16JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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LPC55S16JEV59Y LPC55S16JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2991 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.16 EUR
10+7.81 EUR
25+7.22 EUR
100+6.57 EUR
250+6.3 EUR
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S9S08SG32E1MTJR S9S08SG32E1MTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI8QFN/BYP,132 PEMI8QFN/BYP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) ESD SMD
Number of Channels: 8
ESD Protection: Yes
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Height: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 56000 Stücke:
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MCIMX6D4AVT10AC MCIMX6D4AVT10AC NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9S08DZ60F2CLHR S9S08DZ60F2CLHR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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LFTAS32K3NMQA NXP USA Inc. Description: LFTAS32K3NMQA
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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MMW9004KCAZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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MMW9002KCAZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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MMW9002KCZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MMW9004KCZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MCXA145VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 512KB FLASH
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Packaging: Tray
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.03 EUR
10+5.84 EUR
90+4.74 EUR
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MC56F83786VLK MC56F83786VLK NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8US5CVP08SC MIMX8US5CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 606 Stücke:
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1+30.45 EUR
10+24.3 EUR
25+22.77 EUR
100+21.08 EUR
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MIMX8UD5CVP08SC MIMX8UD5CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 478 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.91 EUR
10+25.51 EUR
25+23.91 EUR
100+22.15 EUR
250+21.31 EUR
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MIMX8UD3CVP08SC MIMX8UD3CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 447 Stücke:
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1+35.02 EUR
10+28.07 EUR
25+26.34 EUR
100+24.43 EUR
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MC33GD3100BEK MC33GD3100BEK NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 42 Stücke:
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2+14.57 EUR
10+11.36 EUR
42+10.18 EUR
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MC33GD3100B3EK MC33GD3100B3EK NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 42 Stücke:
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2+14.57 EUR
10+11.36 EUR
42+10.18 EUR
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MFS5600AVMADEPR2 NXP USA Inc. FS5600.pdf Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MFS5600AVMABEPR2 NXP USA Inc. FS5600.pdf Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MKE04Z8VWJ4R MKE04P24M48SF0.pdf
MKE04Z8VWJ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-SOIC
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 10x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE04Z8VWJ4R MKE04P24M48SF0.pdf
MKE04Z8VWJ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-SOIC
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 10x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 500 Stücke:
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AnzahlPreis
6+3.31 EUR
10+1.91 EUR
25+1.88 EUR
100+1.85 EUR
500+1.84 EUR
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SAF7770EL/200Z13BY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13BK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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MIMXRT1187XVM8B
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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MR-B3RB-M
Hersteller: NXP USA Inc.
Description: MR-B3RB-M MAIN VERSION OF BUGGY3
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1043AXE8MQB LS1043AFS.pdf
LS1043AXE8MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXE8PQB LS1043AFS.pdf
LS1043AXE8PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8KQB LS1043AFS.pdf
LS1043AXN8KQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1043AXN8MQB LS1043AFS.pdf
LS1043AXN8MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1043AXN8QQB LS1043AFS.pdf
LS1043AXN8QQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN16ACLC AN4942.pdf
S9KEAZN16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBR
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
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AnzahlPreis
1+720.63 EUR
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TJA1104-SDBR
Hersteller: NXP USA Inc.
Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104-SDBS
Hersteller: NXP USA Inc.
Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBS
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104CHN/0J
Hersteller: NXP USA Inc.
Description: TJA1104CHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1104BHN/0J
Hersteller: NXP USA Inc.
Description: TJA1104BHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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MC9S08GT8AMFDE MC9S08GB60A.pdf
MC9S08GT8AMFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MVR5510AMMALES VR5510.pdf
MVR5510AMMALES
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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FG32K144HRT0VLLT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5747CSK0AVMJ2 MPC5748G.pdf
SPC5747CSK0AVMJ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 48x10b, 16x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz, 120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1043ASN8KNLB LS1043AFS.pdf
LS1043ASN8KNLB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5514GBMLQ66 MPC5510PB.pdf
SPC5514GBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5516GBMLQ66 MPC5510PB.pdf
SPC5516GBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5516EACMG48 MPC5510.pdf
SPC5516EACMG48
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC7SH04GV,125 XC7SH04.pdf
XC7SH04GV,125
Hersteller: NXP USA Inc.
Description: IC INVERTER SIGATE CMOS 5TSOP
Packaging: Bulk
auf Bestellung 113950 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1679+0.3 EUR
Mindestbestellmenge: 1679 Stücke
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MRFG35010AR5 FSCLS02783-1.pdf?t.download=true&u=5oefqw
MRFG35010AR5
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V NI360
Current - Test: 140 mA
Voltage - Test: 12 V
Voltage - Rated: 15 V
Supplier Device Package: NI-360HF
Technology: pHEMT FET
Gain: 10dB
Power - Output: 1W
Frequency: 3.55GHz
Mounting Type: Chassis Mount
Package / Case: NI-360HF
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRFG35010R5 FSCLS02935-1.pdf?t.download=true&u=5oefqw
MRFG35010R5
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V NI360
Current - Test: 180 mA
Voltage - Test: 12 V
Voltage - Rated: 15 V
Supplier Device Package: NI-360HF
Technology: pHEMT FET
Gain: 10dB
Power - Output: 10W
Frequency: 3.55GHz
Mounting Type: Chassis Mount
Package / Case: NI-360HF
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXC443VMP MCXCFS.pdf
MCXC443VMP
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 50
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
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MCXC443VLH MCXCFS.pdf
MCXC443VLH
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
auf Bestellung 300 Stücke:
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AnzahlPreis
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
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MMRF1006HR5
MMRF1006HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MCIMX7D3DVK10SD
MCIMX7D3DVK10SD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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IMX91LP4EVK-11CM IMX91LP4EVK-11CM.pdf
IMX91LP4EVK-11CM
Hersteller: NXP USA Inc.
Description: I.MX 91 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
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AnzahlPreis
1+848.21 EUR
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LPC55S16JEV59E LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.24 EUR
10+7.88 EUR
25+7.29 EUR
100+6.64 EUR
490+6.15 EUR
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LPC5514JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5514JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+4.97 EUR
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LPC5514JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5514JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+8.82 EUR
10+6.74 EUR
25+6.22 EUR
100+5.65 EUR
250+5.38 EUR
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LPC5516JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5516JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC5516JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5516JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2940 Stücke:
Lieferzeit 10-14 Tag (e)
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2+10.1 EUR
10+7.76 EUR
25+7.18 EUR
100+6.54 EUR
250+6.26 EUR
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LPC5516JEV59E LPC55S1x_LPC551x_DS.pdf
LPC5516JEV59E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 455 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.19 EUR
10+7.84 EUR
25+7.25 EUR
100+6.6 EUR
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LPC55S16JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S16JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2991 Stücke:
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AnzahlPreis
2+10.16 EUR
10+7.81 EUR
25+7.22 EUR
100+6.57 EUR
250+6.3 EUR
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S9S08SG32E1MTJR MC9S08SG32.pdf
S9S08SG32E1MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI8QFN/BYP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/BYP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Number of Channels: 8
ESD Protection: Yes
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Height: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 56000 Stücke:
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AnzahlPreis
1567+0.32 EUR
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MCIMX6D4AVT10AC IMX6DQAEC.pdf
MCIMX6D4AVT10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9S08DZ60F2CLHR
S9S08DZ60F2CLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LFTAS32K3NMQA
Hersteller: NXP USA Inc.
Description: LFTAS32K3NMQA
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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MMW9004KCAZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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MMW9002KCAZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMW9002KCZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Produkt ist nicht verfügbar
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MMW9004KCZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXA145VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Packaging: Tray
auf Bestellung 90 Stücke:
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AnzahlPreis
3+8.03 EUR
10+5.84 EUR
90+4.74 EUR
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MC56F83786VLK MC56F83XXXFS.pdf
MC56F83786VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8US5CVP08SC IMX8ULPIEC.pdf
MIMX8US5CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 606 Stücke:
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AnzahlPreis
1+30.45 EUR
10+24.3 EUR
25+22.77 EUR
100+21.08 EUR
250+20.28 EUR
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MIMX8UD5CVP08SC IMX8ULPIEC.pdf
MIMX8UD5CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 478 Stücke:
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AnzahlPreis
1+31.91 EUR
10+25.51 EUR
25+23.91 EUR
100+22.15 EUR
250+21.31 EUR
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MIMX8UD3CVP08SC IMX8ULPIEC.pdf
MIMX8UD3CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 447 Stücke:
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AnzahlPreis
1+35.02 EUR
10+28.07 EUR
25+26.34 EUR
100+24.43 EUR
250+23.52 EUR
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MC33GD3100BEK MC33GD3100_SDS.pdf
MC33GD3100BEK
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 42 Stücke:
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AnzahlPreis
2+14.57 EUR
10+11.36 EUR
42+10.18 EUR
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MC33GD3100B3EK MC33GD3100_SDS.pdf
MC33GD3100B3EK
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+14.57 EUR
10+11.36 EUR
42+10.18 EUR
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MFS5600AVMADEPR2 FS5600.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS5600AVMABEPR2 FS5600.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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