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LPC54101J512BD64QL LPC54101J512BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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MIMXRT533SFAWCR MIMXRT533SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
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6000+19.53 EUR
Mindestbestellmenge: 6000
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MIMXRT533SFAWCR MIMXRT533SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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1+33.16 EUR
10+26.45 EUR
25+24.77 EUR
100+22.93 EUR
250+22.05 EUR
500+21.52 EUR
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MRF8S9100HSR3 MRF8S9100HSR3 NXP USA Inc. MRF8S9100HR3H%28S%29R3.pdf Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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74HCT173D,652 74HCT173D,652 NXP USA Inc. PHGL-S-A0002525035-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 4BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 6V, 50pF
Number of Bits per Element: 4
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PCA9646PW,118 PCA9646PW,118 NXP USA Inc. PCA9646.pdf Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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PCA9646PW,118 PCA9646PW,118 NXP USA Inc. PCA9646.pdf Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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S912ZVL64AMLF NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 64K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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A5M36SG239T2 NXP USA Inc. A5M36SG239.pdf Description: A5M36SG239T2
Packaging: Bulk
Package / Case: 34-LLGA Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.7dB
Current - Supply: 35mA ~ 38mA
Test Frequency: 3.8GHz
Supplier Device Package: 30-PLGA (12x8)
Produkt ist nicht verfügbar
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LPC5514JEV59E LPC5514JEV59E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.29 EUR
10+7.11 EUR
25+6.57 EUR
100+5.97 EUR
490+5.51 EUR
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MPF5030BMBA0ES MPF5030BMBA0ES NXP USA Inc. PF5030_SDS.pdf Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 243 Stücke:
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2+9.7 EUR
10+8.62 EUR
25+8.22 EUR
40+8.03 EUR
80+7.74 EUR
230+7.33 EUR
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MRF8S18120HSR3 MRF8S18120HSR3 NXP USA Inc. MRF8S18120H.pdf Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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S32K388CVB-Q289 NXP USA Inc. S32K3xx.pdf Description: S32K388CVB-Q289
Packaging: Box
Produkt ist nicht verfügbar
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T1023NSE7PQA T1023NSE7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 89 Stücke:
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3+179.66 EUR
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SAF7772EL/200Z10AY NXP USA Inc. Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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T1024NXN7MQA T1024NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1023NSN7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1013NSE7PQA T1013NSE7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1014NXN7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1024NXN7PQA T1024NXN7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1014NXN7KQA T1014NXN7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1020NSE7PQB T1020NSE7PQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1022NXE7PQB T1022NXE7PQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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KMI86/WHP NXP USA Inc. Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/PHP NXP USA Inc. Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/P NXP USA Inc. Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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S912ZVCA19AMLF S912ZVCA19AMLF NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96AMLF S912ZVC96AMLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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TEA8918BAT/2Y NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHR NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MKL02Z32VFK4R MKL02Z32VFK4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL02Z32VFK4R MKL02Z32VFK4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 3636 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.77 EUR
10+3.59 EUR
25+3.29 EUR
100+2.96 EUR
250+2.8 EUR
500+2.71 EUR
1000+2.63 EUR
2500+2.55 EUR
Mindestbestellmenge: 4
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LS1043AXN7MQB LS1043AXN7MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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BSC9132NXN7KNKB NXP USA Inc. BSC9132.pdf Description: BSC9132 - QORIQ QONVERGE SOC, 2X
Packaging: Bulk
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
3+236.01 EUR
Mindestbestellmenge: 3
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MC68340CAG16E MC68340CAG16E NXP USA Inc. MC68340UM.pdf Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Produkt ist nicht verfügbar
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MC33215BE MC33215BE NXP USA Inc. MC33215.pdf Description: IC TELECOM INTERFACE 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 70°C
Supplier Device Package: 42-PDIP
Number of Circuits: 1
Produkt ist nicht verfügbar
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T1024NSE7KNA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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MC33774ASP1AE MC33774ASP1AE NXP USA Inc. PB_MC33774A.pdf Description: MC33774ASP1AE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP1AE MC33771CTP1AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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1+21.89 EUR
10+17.28 EUR
25+16.14 EUR
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S9S12G96J0MLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12G96J0MLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC56F81748MLH MC56F81748MLH NXP USA Inc. MC56F81XXX.pdf Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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LPC1114JBD48/303QL LPC1114JBD48/303QL NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IW611UK/A1CAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW612UK/A1CAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW612UK/A1IAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IZ NXP USA Inc. IW611_PB.pdf Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1CZ NXP USA Inc. IW611_PB.pdf Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611HN/A1CMP NXP USA Inc. IW611_PB.pdf Description: IW611HN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW611HN/A1IMP NXP USA Inc. IW611_PB.pdf Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW611HN/A1CK NXP USA Inc. IW611_PB.pdf Description: IC RF BLE
Packaging: Tray
Frequency: 2.4GHz, 5GHz
RF Family/Standard: Bluetooth, WiFi
Produkt ist nicht verfügbar
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IW611HN/A1IK NXP USA Inc. IW611_PB.pdf Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612UK/A1CZ NXP USA Inc. IW612_PB.pdf Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612UK/A1IZ NXP USA Inc. IW612_PB.pdf Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612HN/A1CMP NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1IMP NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1IK NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1CK NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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LPC54101J512BD64QL LPC5410X.pdf
LPC54101J512BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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MIMXRT533SFAWCR IMXRT500EC.pdf
MIMXRT533SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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Anzahl Preis
6000+19.53 EUR
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MIMXRT533SFAWCR IMXRT500EC.pdf
MIMXRT533SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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Anzahl Preis
1+33.16 EUR
10+26.45 EUR
25+24.77 EUR
100+22.93 EUR
250+22.05 EUR
500+21.52 EUR
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MRF8S9100HSR3 MRF8S9100HR3H%28S%29R3.pdf
MRF8S9100HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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74HCT173D,652 PHGL-S-A0002525035-1.pdf?t.download=true&u=5oefqw
74HCT173D,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 6V, 50pF
Number of Bits per Element: 4
auf Bestellung 5648 Stücke:
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Anzahl Preis
1135+0.41 EUR
Mindestbestellmenge: 1135
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PCA9646PW,118 PCA9646.pdf
PCA9646PW,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
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PCA9646PW,118 PCA9646.pdf
PCA9646PW,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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S912ZVL64AMLF MC9S12ZVLRM.pdf
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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A5M36SG239T2 A5M36SG239.pdf
Hersteller: NXP USA Inc.
Description: A5M36SG239T2
Packaging: Bulk
Package / Case: 34-LLGA Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.7dB
Current - Supply: 35mA ~ 38mA
Test Frequency: 3.8GHz
Supplier Device Package: 30-PLGA (12x8)
Produkt ist nicht verfügbar
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LPC5514JEV59E LPC55S1x_LPC551x_DS.pdf
LPC5514JEV59E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.29 EUR
10+7.11 EUR
25+6.57 EUR
100+5.97 EUR
490+5.51 EUR
Mindestbestellmenge: 2
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MPF5030BMBA0ES PF5030_SDS.pdf
MPF5030BMBA0ES
Hersteller: NXP USA Inc.
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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Anzahl Preis
2+9.7 EUR
10+8.62 EUR
25+8.22 EUR
40+8.03 EUR
80+7.74 EUR
230+7.33 EUR
Mindestbestellmenge: 2
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MRF8S18120HSR3 MRF8S18120H.pdf
MRF8S18120HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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S32K388CVB-Q289 S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K388CVB-Q289
Packaging: Box
Produkt ist nicht verfügbar
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T1023NSE7PQA T1024FS.pdf
T1023NSE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+179.66 EUR
Mindestbestellmenge: 3
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SAF7772EL/200Z10AY
Hersteller: NXP USA Inc.
Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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T1024NXN7MQA T1024FS.pdf
T1024NXN7MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1023NSN7PQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1013NSE7PQA T1024FS.pdf
T1013NSE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1014NXN7PQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1024NXN7PQA T1024FS.pdf
T1024NXN7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1014NXN7KQA T1024FS.pdf
T1014NXN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1020NSE7PQB T1FAMILYFS.pdf
T1020NSE7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1022NXE7PQB T1FAMILYFS.pdf
T1022NXE7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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KMI86/WHP
Hersteller: NXP USA Inc.
Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/PHP
Hersteller: NXP USA Inc.
Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KMI86/P
Hersteller: NXP USA Inc.
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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S912ZVCA19AMLF
S912ZVCA19AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVC96AMLF
S912ZVC96AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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TEA8918BAT/2Y
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHR
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MKL02Z32VFK4R KL0xPB.pdf
MKL02Z32VFK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL02Z32VFK4R KL0xPB.pdf
MKL02Z32VFK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 3636 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.77 EUR
10+3.59 EUR
25+3.29 EUR
100+2.96 EUR
250+2.8 EUR
500+2.71 EUR
1000+2.63 EUR
2500+2.55 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
LS1043AXN7MQB LS1043AFS.pdf
LS1043AXN7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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BSC9132NXN7KNKB BSC9132.pdf
Hersteller: NXP USA Inc.
Description: BSC9132 - QORIQ QONVERGE SOC, 2X
Packaging: Bulk
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+236.01 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MC68340CAG16E MC68340UM.pdf
MC68340CAG16E
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Produkt ist nicht verfügbar
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MC33215BE MC33215.pdf
MC33215BE
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 70°C
Supplier Device Package: 42-PDIP
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
T1024NSE7KNA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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MC33774ASP1AE PB_MC33774A.pdf
MC33774ASP1AE
Hersteller: NXP USA Inc.
Description: MC33774ASP1AE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.86 EUR
10+12.39 EUR
25+11.52 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC33771CTP1AE MC33771C.pdf
MC33771CTP1AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.89 EUR
10+17.28 EUR
25+16.14 EUR
160+14.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96J0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G96J0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC56F81748MLH MC56F81XXX.pdf
MC56F81748MLH
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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LPC1114JBD48/303QL LPC111X.pdf
LPC1114JBD48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IW611UK/A1CAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW612UK/A1CAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW612UK/A1IAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW611UK/A1IZ IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW611UK/A1CZ IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611HN/A1CMP IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IW611HN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW611HN/A1IMP IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW611HN/A1CK IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF BLE
Packaging: Tray
Frequency: 2.4GHz, 5GHz
RF Family/Standard: Bluetooth, WiFi
Produkt ist nicht verfügbar
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IW611HN/A1IK IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612UK/A1CZ IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612UK/A1IZ IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW612HN/A1CMP IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW612HN/A1IMP IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW612HN/A1IK IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW612HN/A1CK IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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