Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36788) > Seite 558 nach 614
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S9S08DN16F2CLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BYM359X-1500,127 | NXP USA Inc. |
Description: DIODE ARRAY GP 800V 8A TO-220FPackaging: Tube Package / Case: TO-220-3 Full Pack, Isolated Tab Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 300 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 8A Supplier Device Package: TO-220F Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 800 V Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A Current - Reverse Leakage @ Vr: 100 µA @ 800 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MCXC244VFM | NXP USA Inc. |
Description: 48MHz, Cortex-M0+, USBPackaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 32-QFN (5x5) Number of I/O: 23 |
auf Bestellung 435 Stücke: Lieferzeit 10-14 Tag (e) |
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MC35FS6518NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC880CVR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPC8245LVV333D | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 352TBGAPackaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K142HFT0MLLT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S9S12GN32J1CLC | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S9S12GN48J0VLF | NXP USA Inc. |
Description: S12 CORE,48K FLASH,AU Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MFS2323BMBB7EP | NXP USA Inc. |
Description: MFS2323BMBB7EPPackaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MC68332GCPV16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPDigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 16MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TJA1462ATK/S3J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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74HCT4040DB,118 | NXP USA Inc. |
Description: IC 12STAGE BIANRY RIPPLE 16SSOPNumber of Bits per Element: 12 Count Rate: 79 MHz Voltage - Supply: 4.5 V ~ 5.5 V Supplier Device Package: 16-SSOP Trigger Type: Negative Edge Direction: Up Operating Temperature: -40°C ~ 125°C Reset: Asynchronous Logic Type: Binary Counter Number of Elements: 1 Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL9722HN/Q900MP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 22-BIT SCurrent - Output Source/Sink: 10mA, 25mA Supplier Device Package: 32-HVQFN (5x5) Interrupt Output: Yes Clock Frequency: 5 MHz Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Operating Temperature: -40°C ~ 125°C Number of I/O: 22 Interface: SPI Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 32-VFQFN Exposed Pad Features: POR Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCAL9722HN/Q900MP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 22-BIT SCurrent - Output Source/Sink: 10mA, 25mA Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 22 Interface: SPI Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 32-VFQFN Exposed Pad Features: POR Packaging: Cut Tape (CT) Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Operating Temperature: -40°C ~ 125°C Interrupt Output: Yes Clock Frequency: 5 MHz |
auf Bestellung 4049 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL9722HNMP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 22-BIT SCurrent - Output Source/Sink: 10mA, 25mA Supplier Device Package: 32-HVQFN (5x5) Interrupt Output: Yes Clock Frequency: 5 MHz Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 22 Interface: SPI Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 32-VFQFN Exposed Pad Features: POR Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCAL9722HNMP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 22-BIT SVoltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 22 Interface: SPI Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 32-VFQFN Exposed Pad Features: POR Packaging: Cut Tape (CT) Current - Output Source/Sink: 10mA, 25mA Supplier Device Package: 32-HVQFN (5x5) Interrupt Output: Yes Clock Frequency: 5 MHz |
auf Bestellung 5315 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K344EHT1VPBSR | NXP USA Inc. |
Description: S32K344EHT1VPBSRPackaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPC8245ARVV400D | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ 352TBGAAdditional Interfaces: I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: 0°C ~ 85°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| 88W8897PB0-NMJC/AK | NXP USA Inc. |
Description: 88W8897PB0-NMJC/AK Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MC34119D | NXP USA Inc. |
Description: IC AUDIO AMP AB 8-SOICFeatures: Shutdown Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -20°C ~ 70°C (TA) Voltage - Supply: 2V ~ 16V, ±1V ~ 8V Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm Supplier Device Package: 8-SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 98 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MC56F81766MLF | NXP USA Inc. |
Description: 32-BIT DSC, 56800EX CORE, 128KBPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: I2C, LINbus, QSCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 125°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF776DEL/200Z100Y | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1005 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF776DEL/200Z110Y | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1105 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF776DEL/200Z110K | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1105 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF776DEL/200Z100K | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1005 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF776DEL/200ZK | NXP USA Inc. |
Description: SAF776DEL Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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IP4352CX24/LF,135 | NXP USA Inc. |
Description: TVS DIODE 24WLCSPPackaging: Bulk |
auf Bestellung 841500 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8541EVTAJD | NXP USA Inc. |
Description: IC MPU MPC85XX 533MHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BB152,115 | NXP USA Inc. |
Description: DIODE VHF VAR CAP 32V SOD323Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 22.0 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPC852TZT100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGAPackaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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K32L2A31VLL1A | NXP USA Inc. |
Description: K32 L2A 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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NX5P1000UKZ | NXP USA Inc. |
Description: NX5P1000 - LOGIC CONTROLLED HIGHPackaging: Bulk |
auf Bestellung 17231 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9KEAZN8ACFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFNDigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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SE052F2HN2/Z019HJ | NXP USA Inc. |
Description: SE052F2HN2/Z019HJPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCF51JE128CMB | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGADigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 81-MAPBGA (10x10) Peripherals: LVD, PWM, WDT Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b; D/A 1x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 81-LBGA Packaging: Box |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW610BUK/A2IZ | NXP USA Inc. |
Description: RW610BUK/A2IZPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW610BHN/A2IMP | NXP USA Inc. |
Description: RW610BHN/A2IMPPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW610BHN/A2IK | NXP USA Inc. |
Description: RW610BHN/A2IKPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW610BET/A2IY | NXP USA Inc. |
Description: RW610BET/A2IYPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW610BET/A2IK | NXP USA Inc. |
Description: RW610BET/A2IKPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1740 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW612CHN/A2IMP | NXP USA Inc. |
Description: RW612CHN/A2IMPPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW612CHN/A2IK | NXP USA Inc. |
Description: RW612CHN/A2IKPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW612CET/A2IY | NXP USA Inc. |
Description: RW612CET/A2IYPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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RW612CET/A2IK | NXP USA Inc. |
Description: RW612CET/A2IKPackaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1740 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SE051C2HQ1/Z01XDZ | NXP USA Inc. |
Description: SE051C2HQ1Packaging: Cut Tape (CT) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: IoT Secure Element Supplier Device Package: 20-HX2QFN (3x3) |
auf Bestellung 41512 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8019X | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSONPackaging: Tape & Reel (TR) Supplier Device Package: 6-XSON (1.1x0.7) Test Frequency: 1.575GHz P1dB: -7dBm Noise Figure: 0.55dB Current - Supply: 4.6mA Gain: 18.5dB Voltage - Supply: 1.5V ~ 3.1V RF Type: Galileo, GLONASS, GPS Frequency: 1.559GHz ~ 1.61GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8019X | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSONSupplier Device Package: 6-XSON (1.1x0.7) Test Frequency: 1.575GHz P1dB: -7dBm Noise Figure: 0.55dB Current - Supply: 4.6mA Gain: 18.5dB Voltage - Supply: 1.5V ~ 3.1V RF Type: Galileo, GLONASS, GPS Frequency: 1.559GHz ~ 1.61GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Cut Tape (CT) |
auf Bestellung 45192 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU8.2B,115 | NXP USA Inc. |
Description: DIODE ZENER 8.2V 310MW SOD323FPackaging: Bulk |
auf Bestellung 25464 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08QD2J1MSC | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC68020CRC25E | NXP USA Inc. |
Description: IC MPU M680X0 25MHZ 114PGAPackaging: Tray Package / Case: 114-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68020 Voltage - I/O: 5.0V Supplier Device Package: 114-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 14 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S912ZVC64ACLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Grade: Automotive Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b SAR Core Processor: S12Z EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Number of I/O: 28 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S912ZVC64ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 28 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| FH32K144HAT0MLFT | NXP USA Inc. |
Description: S32K144, 512K FLASH, 64K RAM Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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LPC11U37HFBD64/4QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC7448HX1250ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGAPackaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P3A9606JK-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR P3A9606Embedded: No Primary Attributes: 2-Channel (Dual) Utilized IC / Part: P3A9606 Contents: Board(s) Type: Interface Function: Level Shifter Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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74AUP1G07GX,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 5X2SONPackaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 5-X2SON (0.80x0.80) |
auf Bestellung 9500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08LC36LH | NXP USA Inc. |
Description: IC MCU 8BIT 36KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 36KB (36K x 8) RAM Size: 2.5K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC9S08LC36LH | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 36KB (36K x 8) RAM Size: 2.5K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 700 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S08DN16F2CLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BYM359X-1500,127 |
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Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 800V 8A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 300 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 8A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A
Current - Reverse Leakage @ Vr: 100 µA @ 800 V
Description: DIODE ARRAY GP 800V 8A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 300 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 8A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A
Current - Reverse Leakage @ Vr: 100 µA @ 800 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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| MCXC244VFM |
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Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
auf Bestellung 435 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.18 EUR |
| 10+ | 5.19 EUR |
| 25+ | 4.88 EUR |
| 80+ | 4.26 EUR |
| 230+ | 3.93 EUR |
| MC35FS6518NAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.27 EUR |
| 10+ | 15.04 EUR |
| 25+ | 13.99 EUR |
| 100+ | 12.83 EUR |
| 250+ | 12.27 EUR |
| MPC880CVR66 |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8245LVV333D |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 333MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 237.38 EUR |
| FS32K142HFT0MLLT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| S9S12GN32J1CLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| S9S12GN48J0VLF |
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,48K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| MFS2323BMBB7EP |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC68332GCPV16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| TJA1462ATK/S3J |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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| 74HCT4040DB,118 |
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Hersteller: NXP USA Inc.
Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Number of Bits per Element: 12
Count Rate: 79 MHz
Voltage - Supply: 4.5 V ~ 5.5 V
Supplier Device Package: 16-SSOP
Trigger Type: Negative Edge
Direction: Up
Operating Temperature: -40°C ~ 125°C
Reset: Asynchronous
Logic Type: Binary Counter
Number of Elements: 1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Number of Bits per Element: 12
Count Rate: 79 MHz
Voltage - Supply: 4.5 V ~ 5.5 V
Supplier Device Package: 16-SSOP
Trigger Type: Negative Edge
Direction: Up
Operating Temperature: -40°C ~ 125°C
Reset: Asynchronous
Logic Type: Binary Counter
Number of Elements: 1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1121+ | 0.54 EUR |
| PCAL9722HN/Q900MP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Interrupt Output: Yes
Clock Frequency: 5 MHz
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Tape & Reel (TR)
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Interrupt Output: Yes
Clock Frequency: 5 MHz
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| PCAL9722HN/Q900MP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Cut Tape (CT)
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Interrupt Output: Yes
Clock Frequency: 5 MHz
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Cut Tape (CT)
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Interrupt Output: Yes
Clock Frequency: 5 MHz
auf Bestellung 4049 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.42 EUR |
| 10+ | 2.51 EUR |
| 25+ | 2.28 EUR |
| 100+ | 2.03 EUR |
| 250+ | 1.92 EUR |
| 500+ | 1.84 EUR |
| 1000+ | 1.78 EUR |
| 2500+ | 1.73 EUR |
| PCAL9722HNMP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Interrupt Output: Yes
Clock Frequency: 5 MHz
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Tape & Reel (TR)
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Interrupt Output: Yes
Clock Frequency: 5 MHz
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| PCAL9722HNMP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Cut Tape (CT)
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Interrupt Output: Yes
Clock Frequency: 5 MHz
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 22
Interface: SPI
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 32-VFQFN Exposed Pad
Features: POR
Packaging: Cut Tape (CT)
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 32-HVQFN (5x5)
Interrupt Output: Yes
Clock Frequency: 5 MHz
auf Bestellung 5315 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.92 EUR |
| 10+ | 2.13 EUR |
| 25+ | 1.94 EUR |
| 100+ | 1.73 EUR |
| 250+ | 1.62 EUR |
| 500+ | 1.56 EUR |
| 1000+ | 1.51 EUR |
| 2500+ | 1.45 EUR |
| S32K344EHT1VPBSR |
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Hersteller: NXP USA Inc.
Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MPC8245ARVV400D |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Description: IC MPU MPC82XX 400MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 88W8897PB0-NMJC/AK |
Produkt ist nicht verfügbar
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| MC34119D |
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Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SOIC
Features: Shutdown
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Description: IC AUDIO AMP AB 8-SOIC
Features: Shutdown
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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| MC56F81766MLF |
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Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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| SAF776DEL/200Z100Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAF776DEL/200Z110Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAF776DEL/200Z110K |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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| SAF776DEL/200Z100K |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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| SAF776DEL/200ZK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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| IP4352CX24/LF,135 |
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auf Bestellung 841500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 606+ | 1 EUR |
| MPC8541EVTAJD |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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| BB152,115 |
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Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Produkt ist nicht verfügbar
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| MPC852TZT100A |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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| K32L2A31VLL1A |
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Hersteller: NXP USA Inc.
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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| NX5P1000UKZ |
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auf Bestellung 17231 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 379+ | 1.43 EUR |
| S9KEAZN8ACFKR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SE052F2HN2/Z019HJ |
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Produkt ist nicht verfügbar
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| MCF51JE128CMB |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
Produkt ist nicht verfügbar
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| RW610BUK/A2IZ |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| RW610BHN/A2IMP |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| RW610BHN/A2IK |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
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| RW610BET/A2IY |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| RW610BET/A2IK |
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| RW612CHN/A2IMP |
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Mindestbestellmenge: 2000 Stücke
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| RW612CHN/A2IK |
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Mindestbestellmenge: 1300 Stücke
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| RW612CET/A2IY |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| RW612CET/A2IK |
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Produkt ist nicht verfügbar
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| SE051C2HQ1/Z01XDZ |
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Hersteller: NXP USA Inc.
Description: SE051C2HQ1
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
Description: SE051C2HQ1
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
auf Bestellung 41512 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.77 EUR |
| 10+ | 8.25 EUR |
| 25+ | 7.62 EUR |
| 100+ | 6.93 EUR |
| 250+ | 6.65 EUR |
| BGU8019X |
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Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5000+ | 0.36 EUR |
| 10000+ | 0.35 EUR |
| 15000+ | 0.33 EUR |
| 25000+ | 0.32 EUR |
| BGU8019X |
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Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
auf Bestellung 45192 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 35+ | 0.61 EUR |
| 40+ | 0.52 EUR |
| 43+ | 0.5 EUR |
| 100+ | 0.45 EUR |
| 250+ | 0.43 EUR |
| 500+ | 0.4 EUR |
| 1000+ | 0.39 EUR |
| PZU8.2B,115 |
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auf Bestellung 25464 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10804+ | 0.061 EUR |
| S9S08QD2J1MSC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
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| MC68020CRC25E |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
Mindestbestellmenge: 14 Stücke
Im Einkaufswagen
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| S912ZVC64ACLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 28
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 28
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| S912ZVC64ACLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
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| FH32K144HAT0MLFT |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U37HFBD64/4QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC7448HX1250ND |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
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| P3A9606JK-EVB |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AUP1G07GX,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 9500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4661+ | 0.12 EUR |
| MC9S08LC36LH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9S08LC36LH |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 49+ | 12.5 EUR |

























