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SAF4000EL/102Z52AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33PF8200DEES MC33PF8200DEES NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.04 EUR
10+13.35 EUR
25+12.42 EUR
100+11.41 EUR
260+10.91 EUR
Mindestbestellmenge: 2
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MC33FS6515KAE MC33FS6515KAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UBA2081T/1,518 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Bulk
auf Bestellung 80681 Stücke:
Lieferzeit 10-14 Tag (e)
533+0.94 EUR
Mindestbestellmenge: 533
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MKE04Z8VWJ4R MKE04Z8VWJ4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z8VWJ4R MKE04Z8VWJ4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.31 EUR
10+1.91 EUR
25+1.88 EUR
100+1.85 EUR
500+1.84 EUR
Mindestbestellmenge: 6
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SAF7770EL/200Z13BY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13BK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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MIMXRT1187XVM8B NXP USA Inc. Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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MR-B3RB-M NXP USA Inc. Description: MR-B3RB-M MAIN VERSION OF BUGGY3
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1043AXE8MQB LS1043AXE8MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXE8PQB LS1043AXE8PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8KQB LS1043AXN8KQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8MQB LS1043AXN8MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8QQB LS1043AXN8QQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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S9KEAZN16ACLC S9KEAZN16ACLC NXP USA Inc. AN4942.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBR NXP USA Inc. Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+720.63 EUR
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TJA1104-SDBR NXP USA Inc. Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104-SDBS NXP USA Inc. Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBS NXP USA Inc. Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104CHN/0J NXP USA Inc. Description: TJA1104CHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1104BHN/0J NXP USA Inc. Description: TJA1104BHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08GT8AMFDE MC9S08GT8AMFDE NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MVR5510AMMALES MVR5510AMMALES NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FG32K144HRT0VLLT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5747CSK0AVMJ2 SPC5747CSK0AVMJ2 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043ASN8KNLB LS1043ASN8KNLB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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SPC5514GBMLQ66 SPC5514GBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5516GBMLQ66 SPC5516GBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5516EACMG48 SPC5516EACMG48 NXP USA Inc. MPC5510.pdf Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7SH04GV,125 XC7SH04GV,125 NXP USA Inc. XC7SH04.pdf Description: IC INVERTER SIGATE CMOS 5TSOP
Packaging: Bulk
auf Bestellung 113950 Stücke:
Lieferzeit 10-14 Tag (e)
1679+0.3 EUR
Mindestbestellmenge: 1679
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MRFG35010AR5 MRFG35010AR5 NXP USA Inc. FSCLS02783-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET PHEMT FET 12V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 140 mA
Produkt ist nicht verfügbar
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MRFG35010R5 MRFG35010R5 NXP USA Inc. FSCLS02935-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET PHEMT FET 12V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 10W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 180 mA
Produkt ist nicht verfügbar
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MCXC443VMP MCXC443VMP NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 50
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
Mindestbestellmenge: 4
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MCXC443VLH MCXC443VLH NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
Mindestbestellmenge: 4
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MMRF1006HR5 MMRF1006HR5 NXP USA Inc. FSCLS11594-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MCIMX7D3DVK10SD MCIMX7D3DVK10SD NXP USA Inc. Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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IMX91LP4EVK-11CM IMX91LP4EVK-11CM NXP USA Inc. IMX91LP4EVK-11CM.pdf Description: I.MX 91 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+733.13 EUR
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LPC55S16JEV59E LPC55S16JEV59E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 387 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.77 EUR
10+9.09 EUR
25+8.42 EUR
100+7.68 EUR
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LPC5514JEV59Y LPC5514JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+5.26 EUR
Mindestbestellmenge: 3000
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LPC5514JEV59Y LPC5514JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.29 EUR
10+7.11 EUR
25+6.57 EUR
100+5.97 EUR
250+5.68 EUR
500+5.51 EUR
1000+5.37 EUR
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LPC5516JEV59Y LPC5516JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC5516JEV59Y LPC5516JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2890 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.67 EUR
10+8.19 EUR
25+7.58 EUR
100+6.9 EUR
250+6.58 EUR
500+6.38 EUR
1000+6.22 EUR
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LPC5516JEV59E LPC5516JEV59E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 455 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.67 EUR
10+8.19 EUR
25+7.58 EUR
100+6.9 EUR
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LPC55S16JEV59Y LPC55S16JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S16JEV59Y LPC55S16JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2646 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.77 EUR
10+9.09 EUR
25+8.42 EUR
100+7.68 EUR
250+7.32 EUR
500+7.11 EUR
1000+6.94 EUR
Mindestbestellmenge: 2
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S9S08SG32E1MTJR S9S08SG32E1MTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI8QFN/BYP,132 PEMI8QFN/BYP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.020" (0.50mm)
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 56000 Stücke:
Lieferzeit 10-14 Tag (e)
1567+0.32 EUR
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MCIMX6D4AVT10AC MCIMX6D4AVT10AC NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08DZ60F2CLHR S9S08DZ60F2CLHR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFTAS32K3NMQA NXP USA Inc. Description: LFTAS32K3NMQA
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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MMW9004KCAZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz ~ 27.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MMW9002KCAZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MMW9002KCZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MMW9004KCZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz ~ 27.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MCXA145VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.03 EUR
10+5.84 EUR
90+4.74 EUR
Mindestbestellmenge: 3
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MC56F83786VLK MC56F83786VLK NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8US5CVP08SC MIMX8US5CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 606 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.45 EUR
10+24.3 EUR
25+22.77 EUR
100+21.08 EUR
250+20.28 EUR
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MIMX8UD5CVP08SC MIMX8UD5CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 478 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.91 EUR
10+25.51 EUR
25+23.91 EUR
100+22.15 EUR
250+21.31 EUR
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MIMX8UD3CVP08SC MIMX8UD3CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 447 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.02 EUR
10+28.07 EUR
25+26.34 EUR
100+24.43 EUR
250+23.52 EUR
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SAF4000EL/102Z52AY
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33PF8200DEES PF8100_PF8200.pdf
MC33PF8200DEES
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.04 EUR
10+13.35 EUR
25+12.42 EUR
100+11.41 EUR
260+10.91 EUR
Mindestbestellmenge: 2
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MC33FS6515KAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6515KAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UBA2081T/1,518 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Bulk
auf Bestellung 80681 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
533+0.94 EUR
Mindestbestellmenge: 533
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MKE04Z8VWJ4R MKE04P24M48SF0.pdf
MKE04Z8VWJ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z8VWJ4R MKE04P24M48SF0.pdf
MKE04Z8VWJ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.31 EUR
10+1.91 EUR
25+1.88 EUR
100+1.85 EUR
500+1.84 EUR
Mindestbestellmenge: 6
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SAF7770EL/200Z13BY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13BK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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MIMXRT1187XVM8B
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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MR-B3RB-M
Hersteller: NXP USA Inc.
Description: MR-B3RB-M MAIN VERSION OF BUGGY3
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1043AXE8MQB LS1043AFS.pdf
LS1043AXE8MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXE8PQB LS1043AFS.pdf
LS1043AXE8PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8KQB LS1043AFS.pdf
LS1043AXN8KQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8MQB LS1043AFS.pdf
LS1043AXN8MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1043AXN8QQB LS1043AFS.pdf
LS1043AXN8QQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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S9KEAZN16ACLC AN4942.pdf
S9KEAZN16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBR
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+720.63 EUR
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TJA1104-SDBR
Hersteller: NXP USA Inc.
Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104-SDBS
Hersteller: NXP USA Inc.
Description: EVAL BOARD TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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KIT-TJA1104-SDBS
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1104
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1104
Embedded: No
Produkt ist nicht verfügbar
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TJA1104CHN/0J
Hersteller: NXP USA Inc.
Description: TJA1104CHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1104BHN/0J
Hersteller: NXP USA Inc.
Description: TJA1104BHN/0J
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08GT8AMFDE MC9S08GB60A.pdf
MC9S08GT8AMFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MVR5510AMMALES VR5510.pdf
MVR5510AMMALES
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FG32K144HRT0VLLT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5747CSK0AVMJ2 MPC5748G.pdf
SPC5747CSK0AVMJ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043ASN8KNLB LS1043AFS.pdf
LS1043ASN8KNLB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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SPC5514GBMLQ66 MPC5510PB.pdf
SPC5514GBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5516GBMLQ66 MPC5510PB.pdf
SPC5516GBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5516EACMG48 MPC5510.pdf
SPC5516EACMG48
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7SH04GV,125 XC7SH04.pdf
XC7SH04GV,125
Hersteller: NXP USA Inc.
Description: IC INVERTER SIGATE CMOS 5TSOP
Packaging: Bulk
auf Bestellung 113950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1679+0.3 EUR
Mindestbestellmenge: 1679
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MRFG35010AR5 FSCLS02783-1.pdf?t.download=true&u=5oefqw
MRFG35010AR5
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 140 mA
Produkt ist nicht verfügbar
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MRFG35010R5 FSCLS02935-1.pdf?t.download=true&u=5oefqw
MRFG35010R5
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 10W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 180 mA
Produkt ist nicht verfügbar
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MCXC443VMP MCXCFS.pdf
MCXC443VMP
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 50
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
Mindestbestellmenge: 4
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MCXC443VLH MCXCFS.pdf
MCXC443VLH
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.44 EUR
10+4.19 EUR
25+3.91 EUR
100+3.43 EUR
250+3.29 EUR
Mindestbestellmenge: 4
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MMRF1006HR5 FSCLS11594-1.pdf?t.download=true&u=5oefqw
MMRF1006HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MCIMX7D3DVK10SD
MCIMX7D3DVK10SD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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IMX91LP4EVK-11CM IMX91LP4EVK-11CM.pdf
IMX91LP4EVK-11CM
Hersteller: NXP USA Inc.
Description: I.MX 91 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+733.13 EUR
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LPC55S16JEV59E LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 387 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.77 EUR
10+9.09 EUR
25+8.42 EUR
100+7.68 EUR
Mindestbestellmenge: 2
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LPC5514JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5514JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+5.26 EUR
Mindestbestellmenge: 3000
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LPC5514JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5514JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.29 EUR
10+7.11 EUR
25+6.57 EUR
100+5.97 EUR
250+5.68 EUR
500+5.51 EUR
1000+5.37 EUR
Mindestbestellmenge: 2
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LPC5516JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5516JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC5516JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC5516JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2890 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.67 EUR
10+8.19 EUR
25+7.58 EUR
100+6.9 EUR
250+6.58 EUR
500+6.38 EUR
1000+6.22 EUR
Mindestbestellmenge: 2
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LPC5516JEV59E LPC55S1x_LPC551x_DS.pdf
LPC5516JEV59E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 455 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.67 EUR
10+8.19 EUR
25+7.58 EUR
100+6.9 EUR
Mindestbestellmenge: 2
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LPC55S16JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S16JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 2646 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.77 EUR
10+9.09 EUR
25+8.42 EUR
100+7.68 EUR
250+7.32 EUR
500+7.11 EUR
1000+6.94 EUR
Mindestbestellmenge: 2
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S9S08SG32E1MTJR MC9S08SG32.pdf
S9S08SG32E1MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI8QFN/BYP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/BYP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.020" (0.50mm)
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 56000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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MCIMX6D4AVT10AC IMX6DQAEC.pdf
MCIMX6D4AVT10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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S9S08DZ60F2CLHR
S9S08DZ60F2CLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFTAS32K3NMQA
Hersteller: NXP USA Inc.
Description: LFTAS32K3NMQA
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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MMW9004KCAZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz ~ 27.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MMW9002KCAZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MMW9002KCZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MMW9004KCZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz ~ 27.5GHz
RF Type: General Purpose
Secondary Attributes: SPI Interface
Supplier Device Package: 56-WLCSP (4.39x3.59)
Produkt ist nicht verfügbar
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MCXA145VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.03 EUR
10+5.84 EUR
90+4.74 EUR
Mindestbestellmenge: 3
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MC56F83786VLK MC56F83XXXFS.pdf
MC56F83786VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8US5CVP08SC IMX8ULPIEC.pdf
MIMX8US5CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 606 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.45 EUR
10+24.3 EUR
25+22.77 EUR
100+21.08 EUR
250+20.28 EUR
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MIMX8UD5CVP08SC IMX8ULPIEC.pdf
MIMX8UD5CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 478 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.91 EUR
10+25.51 EUR
25+23.91 EUR
100+22.15 EUR
250+21.31 EUR
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MIMX8UD3CVP08SC IMX8ULPIEC.pdf
MIMX8UD3CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 447 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.02 EUR
10+28.07 EUR
25+26.34 EUR
100+24.43 EUR
250+23.52 EUR
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