Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36598) > Seite 563 nach 610

Wählen Sie Seite:   [  << Vorherige Seite ]  1 61 122 183 244 305 366 427 488 549 558 559 560 561 562 563 564 565 566 567 568 610  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
CBT3306D,118 CBT3306D,118 NXP USA Inc. PHGLS24512-1.pdf?t.download=true&u=5oefqw Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 14665 Stücke:
Lieferzeit 10-14 Tag (e)
1268+0.48 EUR
Mindestbestellmenge: 1268 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PEMH7,115 PEMH7,115 NXP USA Inc. PEMH7_PUMH7.pdf Description: TRANS 2NPN PREBIAS 0.3W SOT666
Packaging: Bulk
auf Bestellung 132000 Stücke:
Lieferzeit 10-14 Tag (e)
6772+0.08 EUR
Mindestbestellmenge: 6772 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MRF6VP11KHR5 NXP USA Inc. FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
auf Bestellung 841 Stücke:
Lieferzeit 10-14 Tag (e)
1+648.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MC35FS4500NAE MC35FS4500NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.98 EUR
10+12.4 EUR
25+11.51 EUR
100+10.52 EUR
250+10.06 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SPC5742PK1MLQ5R SPC5742PK1MLQ5R NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SPC5742PK1MLQ5 SPC5742PK1MLQ5 NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 60 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SPC5744BK1AMMH2 SPC5744BK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 880 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC33937APEK MC33937APEK NXP USA Inc. MC33937.pdf Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.39 EUR
10+8.76 EUR
26+8.07 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PCA9958HNY PCA9958HNY NXP USA Inc. PCA9958.pdf Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.51 EUR
10+4.11 EUR
25+3.76 EUR
100+3.37 EUR
250+3.19 EUR
500+3.08 EUR
1000+2.99 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MCXC243VFT NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
5+5.11 EUR
10+4.77 EUR
25+4.4 EUR
80+4.07 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8315ECVRAGDA MPC8315ECVRAGDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 36 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S9S12VRP64F0MLFR NXP USA Inc. Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC908AP8ACFBE MC908AP8ACFBE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-QFP (10x10)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 480 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC908AP16ACFBE557 MC908AP16ACFBE557 NXP USA Inc. MC68HC908AP64A.pdf Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AUP1T34GM,132 74AUP1T34GM,132 NXP USA Inc. PHGLS28626-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 470000 Stücke:
Lieferzeit 10-14 Tag (e)
2551+0.24 EUR
Mindestbestellmenge: 2551 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
74AUP1T34GN,132 74AUP1T34GN,132 NXP USA Inc. 74AUP1T34.pdf Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (0.9x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 57632 Stücke:
Lieferzeit 10-14 Tag (e)
1800+0.35 EUR
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TDA19988AET/C1,151 NXP USA Inc. PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA19988BET/C1,151 NXP USA Inc. PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC56F84550VLF MC56F84550VLF NXP USA Inc. Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC56F84550VLFR MC56F84550VLFR NXP USA Inc. MC56F8455X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
UJA1079ATW/3/2Z UJA1079ATW/3/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
UJA1079ATW/5/2Z UJA1079ATW/5/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
UJA1079ATW/3W/2Z UJA1079ATW/3W/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
A7101CHTK2/T0BC2VJ A7101CHTK2/T0BC2VJ NXP USA Inc. A71CH.pdf Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
auf Bestellung 1897 Stücke:
Lieferzeit 10-14 Tag (e)
183+3.28 EUR
Mindestbestellmenge: 183 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MKW31Z256VHT4 MKW31Z256VHT4 NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.43 EUR
10+7.45 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8347VRADDB MPC8347VRADDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 36 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MRF8P20100HSR3 MRF8P20100HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SPC5605BF1MLU6R SPC5605BF1MLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-MCXC444 FRDM-MCXC444 NXP USA Inc. MCXCFS.pdf Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
2+20.15 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AUP2G132GD,125 74AUP2G132GD,125 NXP USA Inc. 74AUP2G132.pdf Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
auf Bestellung 447102 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.3 EUR
Mindestbestellmenge: 2049 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
74AUP2G126GD,125 74AUP2G126GD,125 NXP USA Inc. 74AUP2G126.pdf Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 84319 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.29 EUR
Mindestbestellmenge: 2049 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SC900719BAFR2 NXP USA Inc. Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SC900719BAF NXP USA Inc. Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S912XET256BCAAR S912XET256BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 750 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S912XEG384BCAAR S912XEG384BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 750 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC33PF8200A0ESR2 MC33PF8200A0ESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
FXPS71407BPST1 NXP USA Inc. Description: FXPS71407BPST1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S32K322NHT0VPBSR S32K322NHT0VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PSMN020-30MLCX PSMN020-30MLCX NXP USA Inc. PSMN020-30MLC.pdf Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc)
Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V
auf Bestellung 6572 Stücke:
Lieferzeit 10-14 Tag (e)
725+0.73 EUR
Mindestbestellmenge: 725 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8264AZUPIBB MPC8264AZUPIBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
 Mindestbestellmenge: 21 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
FB32K116LIT0VFMT NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SL3S1205FUD2/HAPBZ NXP USA Inc. SL3S1205_15.pdf Description: SL3S1205FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
 Mindestbestellmenge: 296307 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SL3S1205FUD2/HAPA NXP USA Inc. SL3S1205_15.pdf Description: SL3S1205FUD2/HAPA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PDTA123TU,115 PDTA123TU,115 NXP USA Inc. PDTA123T_SER.pdf Description: TRANS PREBIAS PNP 200MW SOT323
Packaging: Bulk
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.04 EUR
Mindestbestellmenge: 13172 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PDTA123EMB,315 PDTA123EMB,315 NXP USA Inc. PHGLS24543-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
auf Bestellung 139871 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.06 EUR
Mindestbestellmenge: 11225 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PDTA123TMB,315 PDTA123TMB,315 NXP USA Inc. PHGLS24846-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistors Included: R1 Only
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.06 EUR
Mindestbestellmenge: 11225 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC908EY16MFAE MC908EY16MFAE NXP USA Inc. MC68HC908EY16%2C8.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC8MFGE MC9S08AC8MFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
NVT2008BQZ NVT2008BQZ NXP USA Inc. NVT2008_NVT2010.pdf Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SL2S3103FUDA NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MFS2613AMDH3ADR2 NXP USA Inc. Description: MFS2613AMDH3ADR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MCXW716AMFTAT MCXW716AMFTAT NXP USA Inc. MCXW71.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.8V ~ 1.98V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Matter, Thread, Zigbee®
Current - Receiving: 3.69mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.75mA ~ 20.99mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 29
Modulation: 2FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.47 EUR
10+11.26 EUR
25+10.45 EUR
100+9.87 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S9S08SG16E1WTG S9S08SG16E1WTG NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 768 Stücke:
Lieferzeit 10-14 Tag (e)
107+5.65 EUR
Mindestbestellmenge: 107 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TJA1057BTK/0J TJA1057BTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3414 Stücke:
Lieferzeit 10-14 Tag (e)
16+1.34 EUR
22+0.95 EUR
25+0.86 EUR
100+0.75 EUR
250+0.7 EUR
500+0.67 EUR
1000+0.64 EUR
Mindestbestellmenge: 16 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TJA1057CTK/0J TJA1057CTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
11+2.07 EUR
14+1.56 EUR
25+1.37 EUR
100+1.09 EUR
250+0.95 EUR
500+0.86 EUR
1000+0.76 EUR
2500+0.67 EUR
Mindestbestellmenge: 11 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PZU20B2,115 PZU20B2,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 20V 310MW SOD323F
Packaging: Bulk
auf Bestellung 66120 Stücke:
Lieferzeit 10-14 Tag (e)
10804+0.061 EUR
Mindestbestellmenge: 10804 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PCA9530D,112 PCA9530D,112 NXP USA Inc. PCA9530.pdf Description: IC LED DRVR LINEAR I2C 25MA 8SO
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I2C, SMBus
Supplier Device Package: 8-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Frequency: 400kHz
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCXA176VLL MCXA176VLL NXP USA Inc. MCXAFS.pdf Description: IC
Packaging: Tray
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.92 EUR
10+6.77 EUR
90+5.69 EUR
180+5.46 EUR
270+5.34 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08DZ32CLF MC9S08DZ32CLF NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
CBT3306D,118 PHGLS24512-1.pdf?t.download=true&u=5oefqw
CBT3306D,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 14665 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1268+0.48 EUR
Mindestbestellmenge: 1268 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PEMH7,115 PEMH7_PUMH7.pdf
PEMH7,115
Hersteller: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W SOT666
Packaging: Bulk
auf Bestellung 132000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6772+0.08 EUR
Mindestbestellmenge: 6772 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MRF6VP11KHR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
auf Bestellung 841 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+648.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MC35FS4500NAE FS6500-FS4500-ASILD.pdf
MC35FS4500NAE
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.98 EUR
10+12.4 EUR
25+11.51 EUR
100+10.52 EUR
250+10.06 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SPC5742PK1MLQ5R MPC574xP_FS.pdf
SPC5742PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SPC5742PK1MLQ5 MPC574xP_FS.pdf
SPC5742PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SPC5744BK1AMMH2 MPC5746C.pdf
SPC5744BK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC33937APEK MC33937.pdf
MC33937APEK
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.39 EUR
10+8.76 EUR
26+8.07 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PCA9958HNY PCA9958.pdf
PCA9958HNY
Hersteller: NXP USA Inc.
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.51 EUR
10+4.11 EUR
25+3.76 EUR
100+3.37 EUR
250+3.19 EUR
500+3.08 EUR
1000+2.99 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MCXC243VFT MCXCFS.pdf
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+5.11 EUR
10+4.77 EUR
25+4.4 EUR
80+4.07 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8315ECVRAGDA MPC8315EEC.pdf
MPC8315ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S9S12VRP64F0MLFR
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC908AP8ACFBE MC68HC908AP64A.pdf
MC908AP8ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-QFP (10x10)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC908AP16ACFBE557 MC68HC908AP64A.pdf
MC908AP16ACFBE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AUP1T34GM,132 PHGLS28626-1.pdf?t.download=true&u=5oefqw
74AUP1T34GM,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 470000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2551+0.24 EUR
Mindestbestellmenge: 2551 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
74AUP1T34GN,132 74AUP1T34.pdf
74AUP1T34GN,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (0.9x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 57632 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1800+0.35 EUR
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TDA19988AET/C1,151 PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA19988BET/C1,151 PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC56F84550VLF
MC56F84550VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC56F84550VLFR MC56F8455X.pdf
MC56F84550VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
UJA1079ATW/3/2Z
UJA1079ATW/3/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
UJA1079ATW/5/2Z
UJA1079ATW/5/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
UJA1079ATW/3W/2Z
UJA1079ATW/3W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
A7101CHTK2/T0BC2VJ A71CH.pdf
A7101CHTK2/T0BC2VJ
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
auf Bestellung 1897 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
183+3.28 EUR
Mindestbestellmenge: 183 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MKW31Z256VHT4 MKW41Z512.pdf
MKW31Z256VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.43 EUR
10+7.45 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8347VRADDB MPC8347EEC.pdf
MPC8347VRADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MRF8P20100HSR3
MRF8P20100HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SPC5605BF1MLU6R MPC560XBFAMFS.pdf
SPC5605BF1MLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-MCXC444 MCXCFS.pdf
FRDM-MCXC444
Hersteller: NXP USA Inc.
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20.15 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AUP2G132GD,125 74AUP2G132.pdf
74AUP2G132GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
auf Bestellung 447102 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2049+0.3 EUR
Mindestbestellmenge: 2049 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
74AUP2G126GD,125 74AUP2G126.pdf
74AUP2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 84319 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2049+0.29 EUR
Mindestbestellmenge: 2049 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SC900719BAFR2
Hersteller: NXP USA Inc.
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SC900719BAF
Hersteller: NXP USA Inc.
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S912XET256BCAAR MC9S12XEP100RMV1.pdf
S912XET256BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S912XEG384BCAAR MC9S12XEP100RMV1.pdf
S912XEG384BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC33PF8200A0ESR2 PF8100_PF8200.pdf
MC33PF8200A0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
FXPS71407BPST1
Hersteller: NXP USA Inc.
Description: FXPS71407BPST1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S32K322NHT0VPBSR S32K3xx.pdf
S32K322NHT0VPBSR
Hersteller: NXP USA Inc.
Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PSMN020-30MLCX PSMN020-30MLC.pdf
PSMN020-30MLCX
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc)
Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V
auf Bestellung 6572 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
725+0.73 EUR
Mindestbestellmenge: 725 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8264AZUPIBB MPC8260A.pdf
MPC8264AZUPIBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
FB32K116LIT0VFMT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SL3S1205FUD2/HAPBZ SL3S1205_15.pdf
Hersteller: NXP USA Inc.
Description: SL3S1205FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Mindestbestellmenge: 296307 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SL3S1205FUD2/HAPA SL3S1205_15.pdf
Hersteller: NXP USA Inc.
Description: SL3S1205FUD2/HAPA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PDTA123TU,115 PDTA123T_SER.pdf
PDTA123TU,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 200MW SOT323
Packaging: Bulk
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
13172+0.04 EUR
Mindestbestellmenge: 13172 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PDTA123EMB,315 PHGLS24543-1.pdf?t.download=true&u=5oefqw
PDTA123EMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
auf Bestellung 139871 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
11225+0.06 EUR
Mindestbestellmenge: 11225 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PDTA123TMB,315 PHGLS24846-1.pdf?t.download=true&u=5oefqw
PDTA123TMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistors Included: R1 Only
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
11225+0.06 EUR
Mindestbestellmenge: 11225 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC908EY16MFAE MC68HC908EY16%2C8.pdf
MC908EY16MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC8MFGE MC9S08AC60AD.pdf
MC9S08AC8MFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
NVT2008BQZ NVT2008_NVT2010.pdf
NVT2008BQZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SL2S3103FUDA
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MFS2613AMDH3ADR2
Hersteller: NXP USA Inc.
Description: MFS2613AMDH3ADR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MCXW716AMFTAT MCXW71.pdf
MCXW716AMFTAT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.8V ~ 1.98V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Matter, Thread, Zigbee®
Current - Receiving: 3.69mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.75mA ~ 20.99mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 29
Modulation: 2FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.47 EUR
10+11.26 EUR
25+10.45 EUR
100+9.87 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
S9S08SG16E1WTG MC9S08SG32.pdf
S9S08SG16E1WTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 768 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
107+5.65 EUR
Mindestbestellmenge: 107 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TJA1057BTK/0J TJA1057.pdf
TJA1057BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3414 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
16+1.34 EUR
22+0.95 EUR
25+0.86 EUR
100+0.75 EUR
250+0.7 EUR
500+0.67 EUR
1000+0.64 EUR
Mindestbestellmenge: 16 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TJA1057CTK/0J TJA1057.pdf
TJA1057CTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
11+2.07 EUR
14+1.56 EUR
25+1.37 EUR
100+1.09 EUR
250+0.95 EUR
500+0.86 EUR
1000+0.76 EUR
2500+0.67 EUR
Mindestbestellmenge: 11 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PZU20B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B2,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 20V 310MW SOD323F
Packaging: Bulk
auf Bestellung 66120 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10804+0.061 EUR
Mindestbestellmenge: 10804 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PCA9530D,112 PCA9530.pdf
PCA9530D,112
Hersteller: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I2C, SMBus
Supplier Device Package: 8-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Frequency: 400kHz
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCXA176VLL MCXAFS.pdf
MCXA176VLL
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.92 EUR
10+6.77 EUR
90+5.69 EUR
180+5.46 EUR
270+5.34 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08DZ32CLF
MC9S08DZ32CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 61 122 183 244 305 366 427 488 549 558 559 560 561 562 563 564 565 566 567 568 610  [ Nächste Seite >> ]