Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36619) > Seite 567 nach 611
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MKL26Z256VMC4R | NXP USA Inc. |
 Description: IC MCU 32B 256KB FLASH 121MAPBGADigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 121-MAPBGA (8x8) Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D - 16bit; D/A - 12bit Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MKL26Z256VMC4 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 121-MAPBGA (8x8) Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D - 16bit; D/A - 12bit Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1740 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K148UAT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100LQFP Packaging: Tape & Reel (TR) Number of I/O: 156 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 32x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 112MHz Mounting Type: Surface Mount Package / Case: 100-LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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N74F373D,602 | NXP USA Inc. |
Description: IC D-TYPE TRANSP 8:8 20-SO Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: D-Type Transparent Latch Circuit: 8:8 Mounting Type: Surface Mount Output Type: Tri-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube Supplier Device Package: 20-SO Delay Time - Propagation: 2ns Current - Output High, Low: 3mA, 24mA Independent Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33SA0528ACR2 | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 2/2 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5V Number of Drivers/Receivers: 2/2 Data Rate: 125kbps Protocol: DSI Supplier Device Package: 32-LQFP (7x7) Receiver Hysteresis: 350 mV Duplex: Full |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC68360AI33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8536BVJANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8536AVTATHA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8536AVTATHA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC35FS6517CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC35FS6517CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MIMXRT1189XVM8C | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 800MHz Program Memory Size: 160KB (160K x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F Data Converters: A/D 30x16b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 289-LFBGA (14x14) Number of I/O: 173 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HCT10N,652 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MFS2613AMDAAAD | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCIMX513DJM8C | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGA Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Display & Interface Controllers: Keypad, LCD Graphics Acceleration: No RAM Controllers: LPDDR, DDR2 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (3), USB 2.0 + PHY (1) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-BGA (19x19) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Core Processor: ARM® Cortex®-A8 Operating Temperature: -20°C ~ 85°C (TC) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| RDW8801-SD-S0 | NXP USA Inc. |
Description: RDW8801-SD-S0 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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88W8987-A2-NYEE/AZ | NXP USA Inc. |
Description: IC RF TXRX BLE 68HVQFN Packaging: Cut Tape (CT) Package / Case: 68-VFQFN Exposed Pad Sensitivity: -99dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -30°C ~ 85°C Voltage - Supply: 1.1V, 1.8V, 2.2V Power - Output: 22dBm Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Current - Receiving: 38mA ~ 82mA Data Rate (Max): 433Mbps Current - Transmitting: 79mA ~ 145mA Supplier Device Package: 68-HVQFN (8x8) GPIO: 21 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART |
auf Bestellung 458 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4078FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4032 x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
auf Bestellung 171 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF4000EL/101Q534Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5340 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SAF4000EL/101Q534K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5340 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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LPC1759FBD80Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80LQFP Packaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5604BF2CLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33285D | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 7V ~ 40V Input Type: Non-Inverting Supplier Device Package: 8-SOIC Channel Type: Synchronous Driven Configuration: High-Side Number of Drivers: 2 Gate Type: MOSFET (N-Channel) Logic Voltage - VIL, VIH: 0.7V, 1.7V DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 98 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8347ECZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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NAFE73388B40BSK | NXP USA Inc. |
Description: UNIVERSAL 25 V 8-INPUT LOW POWER Number of Channels: 8 Supplier Device Package: 64-HVQFN (9x9) Voltage - Supply, Digital: 3V ~ 3.6V Voltage - Supply, Analog: 3V ~ 3.6V Number of Bits: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 64-VFQFN Exposed Pad Packaging: Tray Power (Watts): 160 mW |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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NAFE73388B40BSE | NXP USA Inc. |
Description: UNIVERSAL 25 V 8-INPUT LOW POWER Power (Watts): 160 mW Number of Channels: 8 Supplier Device Package: 64-HVQFN (9x9) Voltage - Supply, Digital: 3V ~ 3.6V Voltage - Supply, Analog: 3V ~ 3.6V Number of Bits: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 64-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC862PVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 44 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8358ECVRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGA Packaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9S08DV48ACLC | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LPC11U22FBD48/30QL | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 242 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F81768LVLH | NXP USA Inc. |
Description: MC56F81768LVLH Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: DMA, I2C, LINbus, SCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| C9KEAZN8AMTGR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| C9KEAZN8AVTG | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 96 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| C9KEAZN8AMFKR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| C9KEAZN8AMFK | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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C9KEAZN8AMTG | NXP USA Inc. |
Description: C9KEAZN8AMTG Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 22 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 96 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| C9KEAZ128AVLHR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCZ33742EGR2 | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 18V Current - Supply: 42mA Supplier Device Package: 28-SOIC Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MIMX9351DVVXMABR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MIMX9331XVVXMABR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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C9KEAZN64AMLHR | NXP USA Inc. |
Description: C9KEAZN64AMLHR Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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C9KEAZN64AMLH | NXP USA Inc. |
Description: C9KEAZN64AMLH Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BGA3131J | NXP USA Inc. |
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN Packaging: Tape & Reel (TR) Package / Case: 20-VQFN Exposed Pad Mounting Type: Surface Mount Frequency: 5MHz ~ 205MHz RF Type: CATV Voltage - Supply: 4.75V ~ 5.25V Gain: 37dB Current - Supply: 660mA Noise Figure: 6.5dB ~ 15dB Supplier Device Package: 20-HVQFN (5x5) |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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S32E288ABCAAMJGT | NXP USA Inc. |
Description: IC Packaging: Tray Mounting Type: Surface Mount |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9540BD,112 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SO Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I2C Multiplexer Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8272VRPIEA | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCH, 30 Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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S32M24XEVB-C064 | NXP USA Inc. |
Description: S32M24XEVB-C064 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: S32M24X Primary Attributes: Motors (BLDC, PMSM) Embedded: Yes, MCU, 32-Bit |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| 88W8864-B0-NMMC/AZ | NXP USA Inc. |
Description: 802.11 A/B/G/N/AC 4X4 SINGLE-CHI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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S32K366EHT1MJBSR | NXP USA Inc. |
Description: S32K366EHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 704K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MCXW716CMFPAR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MIMXRT1041DJM6B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 169-MAPBGA (11x11) Number of I/O: 114 |
auf Bestellung 880 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCXN236VDFR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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FXTH870502DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF Packaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 1998 Stücke: Lieferzeit 10-14 Tag (e) |
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| NCF29AEXHN4/0100IY | NXP USA Inc. |
Description: NCF29AEXHN4 Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| C9S12VR48AL0VLC | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| C9S12VR48AL0VLFR | NXP USA Inc. |
Description: 16-BIT MICROCONTROLLERS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| C9S12VR48AL0VLF | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC9S08JE128CLK | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 46 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MIMX9332DVVXMAC | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tray |
auf Bestellung 885 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9332CVVXMAC | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tray Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 107 Stücke: Lieferzeit 10-14 Tag (e) |
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| MKL26Z256VMC4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MKL26Z256VMC4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 1740 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FS32K148UAT0VLLR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 156
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 156
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| N74F373D,602 |
|
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP 8:8 20-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Delay Time - Propagation: 2ns
Current - Output High, Low: 3mA, 24mA
Independent Circuits: 1
Description: IC D-TYPE TRANSP 8:8 20-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Delay Time - Propagation: 2ns
Current - Output High, Low: 3mA, 24mA
Independent Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33SA0528ACR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V
Number of Drivers/Receivers: 2/2
Data Rate: 125kbps
Protocol: DSI
Supplier Device Package: 32-LQFP (7x7)
Receiver Hysteresis: 350 mV
Duplex: Full
Description: IC TRANSCEIVER FULL 2/2 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V
Number of Drivers/Receivers: 2/2
Data Rate: 125kbps
Protocol: DSI
Supplier Device Package: 32-LQFP (7x7)
Receiver Hysteresis: 350 mV
Duplex: Full
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC68360AI33L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8536BVJANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8536AVTATHA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 293.58 EUR |
| MPC8536AVTATHA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6517CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6517CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MIMXRT1189XVM8C |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HCT10N,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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| MFS2613AMDAAAD |
Produkt ist nicht verfügbar
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| MCIMX513DJM8C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 88W8987-A2-NYEE/AZ |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Cut Tape (CT)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Description: IC RF TXRX BLE 68HVQFN
Packaging: Cut Tape (CT)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
auf Bestellung 458 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.43 EUR |
| 10+ | 19.5 EUR |
| 25+ | 18.48 EUR |
| 100+ | 17.09 EUR |
| 250+ | 16.24 EUR |
| LPC4078FBD144,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
auf Bestellung 171 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.44 EUR |
| 10+ | 24.93 EUR |
| 60+ | 22.09 EUR |
| 120+ | 21.32 EUR |
| SAF4000EL/101Q534Y |
Produkt ist nicht verfügbar
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| SAF4000EL/101Q534K |
Produkt ist nicht verfügbar
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| LPC1759FBD80Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.69 EUR |
| 10+ | 19.46 EUR |
| 25+ | 18.15 EUR |
| SPC5604BF2CLQ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC33285D |
|
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Channel Type: Synchronous
Driven Configuration: High-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.7V, 1.7V
DigiKey Programmable: Not Verified
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Channel Type: Synchronous
Driven Configuration: High-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.7V, 1.7V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC8347ECZQADDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NAFE73388B40BSK |
|
Hersteller: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Power (Watts): 160 mW
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Power (Watts): 160 mW
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.52 EUR |
| 10+ | 28.51 EUR |
| 25+ | 26.76 EUR |
| 100+ | 26.64 EUR |
| NAFE73388B40BSE |
|
Hersteller: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Power (Watts): 160 mW
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Power (Watts): 160 mW
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.4 EUR |
| 10+ | 35.64 EUR |
| 25+ | 33.45 EUR |
| 100+ | 31.05 EUR |
| 260+ | 29.86 EUR |
| MPC862PVR66B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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| MPC8358ECVRAGDDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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| MC9S08DV48ACLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| LPC11U22FBD48/30QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 242 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.96 EUR |
| 10+ | 6.03 EUR |
| 25+ | 5.56 EUR |
| 100+ | 5.02 EUR |
| MC56F81768LVLH |
|
Hersteller: NXP USA Inc.
Description: MC56F81768LVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: MC56F81768LVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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| C9KEAZN8AMTGR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| C9KEAZN8AVTG |
Produkt ist nicht verfügbar
Mindestbestellmenge: 96 Stücke
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| C9KEAZN8AMFKR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| C9KEAZN8AMFK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
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| C9KEAZN8AMTG |
Hersteller: NXP USA Inc.
Description: C9KEAZN8AMTG
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 22
Description: C9KEAZN8AMTG
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 22
Produkt ist nicht verfügbar
Mindestbestellmenge: 96 Stücke
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| C9KEAZ128AVLHR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| MCZ33742EGR2 |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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| MIMX9351DVVXMABR |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| MIMX9331XVVXMABR |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| C9KEAZN64AMLHR |
Hersteller: NXP USA Inc.
Description: C9KEAZN64AMLHR
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Description: C9KEAZN64AMLHR
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| C9KEAZN64AMLH |
Hersteller: NXP USA Inc.
Description: C9KEAZN64AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Description: C9KEAZN64AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| BGA3131J |
|
Hersteller: NXP USA Inc.
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5MHz ~ 205MHz
RF Type: CATV
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37dB
Current - Supply: 660mA
Noise Figure: 6.5dB ~ 15dB
Supplier Device Package: 20-HVQFN (5x5)
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5MHz ~ 205MHz
RF Type: CATV
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37dB
Current - Supply: 660mA
Noise Figure: 6.5dB ~ 15dB
Supplier Device Package: 20-HVQFN (5x5)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6000+ | 3.67 EUR |
| S32E288ABCAAMJGT |
|
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 239.59 EUR |
| 10+ | 202.17 EUR |
| 40+ | 188.9 EUR |
| PCA9540BD,112 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-SO
Description: IC INTERFACE SPECIALIZED 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8272VRPIEA |
|
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 156.13 EUR |
| S32M24XEVB-C064 |
|
Hersteller: NXP USA Inc.
Description: S32M24XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M24X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
Description: S32M24XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M24X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 377.47 EUR |
| 88W8864-B0-NMMC/AZ |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| S32K366EHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K366EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K366EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MCXW716CMFPAR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| MIMXRT1041DJM6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (11x11)
Number of I/O: 114
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (11x11)
Number of I/O: 114
auf Bestellung 880 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.56 EUR |
| 10+ | 15.3 EUR |
| 25+ | 14.23 EUR |
| 100+ | 13.07 EUR |
| 250+ | 12.51 EUR |
| 880+ | 10.86 EUR |
| MCXN236VDFR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| FXTH870502DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1998 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.47 EUR |
| C9S12VR48AL0VLC |
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| C9S12VR48AL0VLFR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| C9S12VR48AL0VLF |
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| MC9S08JE128CLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
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| MIMX9332DVVXMAC |
|
auf Bestellung 885 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.87 EUR |
| 10+ | 29.38 EUR |
| 25+ | 27.51 EUR |
| 100+ | 25.45 EUR |
| 250+ | 24.48 EUR |
| MIMX9332CVVXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.01 EUR |
| 10+ | 35.26 EUR |
| 25+ | 33.08 EUR |