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S32M244LCABWKHST S32M244LCABWKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M244LCABWKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.48 EUR
10+21.51 EUR
25+20.85 EUR
160+17.77 EUR
320+16.61 EUR
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MCXA155VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Produkt ist nicht verfügbar
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SAF4000EL/101Z201Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z201K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC12F0VLF S912ZVC12F0VLF NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RDW8997-PCUS-R1 NXP USA Inc. Description: RDW8997-PCUS-R1
Packaging: Bulk
Produkt ist nicht verfügbar
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FX32K118LAT0MLFT NXP USA Inc. S32K1xx.pdf Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MKL82Z128VMC7 MKL82Z128VMC7 NXP USA Inc. KL82P121M72SF0.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BB202,135 BB202,135 NXP USA Inc. BB202_N.pdf Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
Produkt ist nicht verfügbar
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BB202,135 BB202,135 NXP USA Inc. BB202_N.pdf Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
auf Bestellung 9970 Stücke:
Lieferzeit 10-14 Tag (e)
14+1.3 EUR
18+1.02 EUR
100+0.75 EUR
500+0.58 EUR
1000+0.49 EUR
2000+0.46 EUR
5000+0.42 EUR
Mindestbestellmenge: 14
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PN5190B1EV/C121E PN5190B1EV/C121E NXP USA Inc. PN5190B1.pdf Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.2 EUR
10+11.45 EUR
25+10.84 EUR
100+10 EUR
490+9.16 EUR
980+8.82 EUR
Mindestbestellmenge: 2
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PN5190B2HN/C130Y PN5190B2HN/C130Y NXP USA Inc. PN5190B2.pdf Description: PN5190B2HN/C130Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B1HN/C121Y PN5190B1HN/C121Y NXP USA Inc. PN5190B1.pdf Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B2EV/C130Y NXP USA Inc. PN5190B2.pdf Description: PN5190B2EV/C130Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN5190B2EV/C130K NXP USA Inc. PN5190B2.pdf Description: PN5190B2EV/C130K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN5190B1EV/C121Y NXP USA Inc. PN5190B1.pdf Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN5190B1HN/C127K PN5190B1HN/C127K NXP USA Inc. PN5190B1.pdf Description: PN5190B1HN/C127K
Packaging: Tray
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B2HN/C130K PN5190B2HN/C130K NXP USA Inc. PN5190B2.pdf Description: PN5190B2HN/C130K
Packaging: Tray
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PNEV5190AM NXP USA Inc. Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Produkt ist nicht verfügbar
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TEA1733LT/N1,118 TEA1733LT/N1,118 NXP USA Inc. TEA1733LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.72 EUR
Mindestbestellmenge: 2500
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TEA1792ATS/1Z TEA1792ATS/1Z NXP USA Inc. TEA1792ATS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
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TEA1792ATS/1Z TEA1792ATS/1Z NXP USA Inc. TEA1792ATS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
auf Bestellung 2810 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.57 EUR
16+1.13 EUR
25+1.02 EUR
100+0.9 EUR
250+0.84 EUR
500+0.81 EUR
1000+0.78 EUR
Mindestbestellmenge: 12
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MCXA154VLH MCXA154VLH NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
Produkt ist nicht verfügbar
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MIMXRT1043DFP6B MIMXRT1043DFP6B NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 169-LFBGA (9x9)
Produkt ist nicht verfügbar
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NCJ29D5BHN/00200Y NXP USA Inc. NCJ29D5FS.pdf Description: NCJ29D5BHN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 3980 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.84 EUR
10+14.63 EUR
25+13.86 EUR
100+12.8 EUR
250+12.17 EUR
500+11.73 EUR
1000+11.31 EUR
Mindestbestellmenge: 2
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MMA5224LCWR2 NXP USA Inc. Description: IC SENSOR ACCEL X- AXIS 16QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34PF1550A3EP MC34PF1550A3EP NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.4 EUR
10+6.43 EUR
25+5.93 EUR
100+5.38 EUR
490+4.97 EUR
Mindestbestellmenge: 3
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T2080NXN8T1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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S9S12HA32J0VLHR S9S12HA32J0VLHR NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12HA32J0VLL S9S12HA32J0VLL NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2146FBD64,557 LPC2146FBD64,557 NXP USA Inc. LPC2141_42_44_46_48.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
16+24.9 EUR
Mindestbestellmenge: 16
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MC35FS6510CAE MC35FS6510CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.12 EUR
10+11.77 EUR
25+10.93 EUR
100+10.01 EUR
250+9.57 EUR
Mindestbestellmenge: 2
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PCF85162T/1Y PCF85162T/1Y NXP USA Inc. PCF85162.pdf Description: 32 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 8 Characters, 16 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
auf Bestellung 14920 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.64 EUR
10+2.7 EUR
25+2.46 EUR
100+2.21 EUR
250+2.08 EUR
500+2.03 EUR
Mindestbestellmenge: 5
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MC13770FCR2 MC13770FCR2 NXP USA Inc. MC13770.pdf Description: IC AMP W-CDMA 2.1-2.4GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.1GHz ~ 2.4GHz
RF Type: W-CDMA
Voltage - Supply: 2.7V ~ 3V
Gain: 15dB
Current - Supply: 8mA
Noise Figure: 1.5dB
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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P1013NXN2LFB P1013NXN2LFB NXP USA Inc. P1013NXN2LFB_Web.pdf Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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S912XDT512J1CAA S912XDT512J1CAA NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52232AF50 MCF52232AF50 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXLS96120AESR2 NXP USA Inc. NXLS9XXX0.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NAFE33352B40BSMP NXP USA Inc. NAFE33352.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
Produkt ist nicht verfügbar
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PCA9554PW/Q900,118 PCA9554PW/Q900,118 NXP USA Inc. PCA9554_9554A.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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FRDM-IMX91 FRDM-IMX91 NXP USA Inc. FRDM%20i.MX%2091_Board_Flashing.pdf Description: FRDM DEV BOARD FOR I.MX 91
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
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MIMX9301DVVXDABR NXP USA Inc. IMX93XEC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301CVVXDABR NXP USA Inc. IMX93XEC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9302DVVXDABR NXP USA Inc. IMX93IEC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331DVVXMABR NXP USA Inc. IMX93XEC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9302CVVXDABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332DVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331CVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332CVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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PMEG2010EPASX PMEG2010EPASX NXP USA Inc. NEXP-S-A0003105495-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
auf Bestellung 27000 Stücke:
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1013+0.45 EUR
Mindestbestellmenge: 1013
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MC33FS6505CAE MC33FS6505CAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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40+9.32 EUR
80+9.09 EUR
250+8.73 EUR
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MC33FS6505NAE MC33FS6505NAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+9.31 EUR
10+8.68 EUR
25+8.41 EUR
40+8.28 EUR
80+8.08 EUR
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MC33FS6505CAER2 MC33FS6505CAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6506CAER2 MC33FS6506CAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6506CAE MC33FS6506CAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33911BACR2 MC33911BACR2 NXP USA Inc. MC33911.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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MC33911BACR2 MC33911BACR2 NXP USA Inc. MC33911.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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87+5.19 EUR
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PMEG6010ESBYL PMEG6010ESBYL NXP USA Inc. PMEG6010ESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
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7088+0.067 EUR
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SPC5607BF1VLU6 SPC5607BF1VLU6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5528JBD64Y LPC5528JBD64Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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S32M244LCABWKHST S32M2xx_DS.pdf
S32M244LCABWKHST
Hersteller: NXP USA Inc.
Description: S32M244LCABWKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 480 Stücke:
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Anzahl Preis
1+25.48 EUR
10+21.51 EUR
25+20.85 EUR
160+17.77 EUR
320+16.61 EUR
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MCXA155VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Produkt ist nicht verfügbar
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SAF4000EL/101Z201Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z201K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC12F0VLF S12ZVCFS.pdf
S912ZVC12F0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RDW8997-PCUS-R1
Hersteller: NXP USA Inc.
Description: RDW8997-PCUS-R1
Packaging: Bulk
Produkt ist nicht verfügbar
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FX32K118LAT0MLFT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MKL82Z128VMC7 KL82P121M72SF0.pdf
MKL82Z128VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BB202,135 BB202_N.pdf
BB202,135
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
Produkt ist nicht verfügbar
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BB202,135 BB202_N.pdf
BB202,135
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
auf Bestellung 9970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+1.3 EUR
18+1.02 EUR
100+0.75 EUR
500+0.58 EUR
1000+0.49 EUR
2000+0.46 EUR
5000+0.42 EUR
Mindestbestellmenge: 14
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PN5190B1EV/C121E PN5190B1.pdf
PN5190B1EV/C121E
Hersteller: NXP USA Inc.
Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.2 EUR
10+11.45 EUR
25+10.84 EUR
100+10 EUR
490+9.16 EUR
980+8.82 EUR
Mindestbestellmenge: 2
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PN5190B2HN/C130Y PN5190B2.pdf
PN5190B2HN/C130Y
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C130Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B1HN/C121Y PN5190B1.pdf
PN5190B1HN/C121Y
Hersteller: NXP USA Inc.
Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B2EV/C130Y PN5190B2.pdf
Hersteller: NXP USA Inc.
Description: PN5190B2EV/C130Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN5190B2EV/C130K PN5190B2.pdf
Hersteller: NXP USA Inc.
Description: PN5190B2EV/C130K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PN5190B1EV/C121Y PN5190B1.pdf
Hersteller: NXP USA Inc.
Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PN5190B1HN/C127K PN5190B1.pdf
PN5190B1HN/C127K
Hersteller: NXP USA Inc.
Description: PN5190B1HN/C127K
Packaging: Tray
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PN5190B2HN/C130K PN5190B2.pdf
PN5190B2HN/C130K
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C130K
Packaging: Tray
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PNEV5190AM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Produkt ist nicht verfügbar
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TEA1733LT/N1,118 TEA1733LT.pdf
TEA1733LT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.72 EUR
Mindestbestellmenge: 2500
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TEA1792ATS/1Z TEA1792ATS.pdf
TEA1792ATS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
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TEA1792ATS/1Z TEA1792ATS.pdf
TEA1792ATS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
auf Bestellung 2810 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.57 EUR
16+1.13 EUR
25+1.02 EUR
100+0.9 EUR
250+0.84 EUR
500+0.81 EUR
1000+0.78 EUR
Mindestbestellmenge: 12
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MCXA154VLH
MCXA154VLH
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
Produkt ist nicht verfügbar
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MIMXRT1043DFP6B
MIMXRT1043DFP6B
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 169-LFBGA (9x9)
Produkt ist nicht verfügbar
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NCJ29D5BHN/00200Y NCJ29D5FS.pdf
Hersteller: NXP USA Inc.
Description: NCJ29D5BHN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 3980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.84 EUR
10+14.63 EUR
25+13.86 EUR
100+12.8 EUR
250+12.17 EUR
500+11.73 EUR
1000+11.31 EUR
Mindestbestellmenge: 2
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MMA5224LCWR2
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X- AXIS 16QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34PF1550A3EP PF1550.pdf
MC34PF1550A3EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.4 EUR
10+6.43 EUR
25+5.93 EUR
100+5.38 EUR
490+4.97 EUR
Mindestbestellmenge: 3
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T2080NXN8T1B T2080FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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S9S12HA32J0VLHR
S9S12HA32J0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12HA32J0VLL
S9S12HA32J0VLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2146FBD64,557 LPC2141_42_44_46_48.pdf
LPC2146FBD64,557
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+24.9 EUR
Mindestbestellmenge: 16
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MC35FS6510CAE 35FS4500-35FS6500SDS.pdf
MC35FS6510CAE
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.12 EUR
10+11.77 EUR
25+10.93 EUR
100+10.01 EUR
250+9.57 EUR
Mindestbestellmenge: 2
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PCF85162T/1Y PCF85162.pdf
PCF85162T/1Y
Hersteller: NXP USA Inc.
Description: 32 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 8 Characters, 16 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
auf Bestellung 14920 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.64 EUR
10+2.7 EUR
25+2.46 EUR
100+2.21 EUR
250+2.08 EUR
500+2.03 EUR
Mindestbestellmenge: 5
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MC13770FCR2 MC13770.pdf
MC13770FCR2
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2.1-2.4GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.1GHz ~ 2.4GHz
RF Type: W-CDMA
Voltage - Supply: 2.7V ~ 3V
Gain: 15dB
Current - Supply: 8mA
Noise Figure: 1.5dB
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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P1013NXN2LFB P1013NXN2LFB_Web.pdf
P1013NXN2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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S912XDT512J1CAA
S912XDT512J1CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52232AF50 MCF52235.pdf
MCF52232AF50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXLS96120AESR2 NXLS9XXX0.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NAFE33352B40BSMP NAFE33352.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
Produkt ist nicht verfügbar
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PCA9554PW/Q900,118 PCA9554_9554A.pdf
PCA9554PW/Q900,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.69 EUR
Mindestbestellmenge: 2500
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FRDM-IMX91 FRDM%20i.MX%2091_Board_Flashing.pdf
FRDM-IMX91
Hersteller: NXP USA Inc.
Description: FRDM DEV BOARD FOR I.MX 91
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+119.28 EUR
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MIMX9301DVVXDABR IMX93XEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301CVVXDABR IMX93XEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9302DVVXDABR IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331DVVXMABR IMX93XEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9302CVVXDABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332DVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331CVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332CVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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PMEG2010EPASX NEXP-S-A0003105495-1.pdf?t.download=true&u=5oefqw
PMEG2010EPASX
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1013+0.45 EUR
Mindestbestellmenge: 1013
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MC33FS6505CAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6505CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.49 EUR
10+9.76 EUR
25+9.47 EUR
40+9.32 EUR
80+9.09 EUR
250+8.73 EUR
Mindestbestellmenge: 2
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MC33FS6505NAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6505NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.31 EUR
10+8.68 EUR
25+8.41 EUR
40+8.28 EUR
80+8.08 EUR
Mindestbestellmenge: 2
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MC33FS6505CAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6505CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6506CAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6506CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6506CAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6506CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33911BACR2 MC33911.pdf
MC33911BACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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MC33911BACR2 MC33911.pdf
MC33911BACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
87+5.19 EUR
Mindestbestellmenge: 87
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PMEG6010ESBYL PMEG6010ESB.pdf
PMEG6010ESBYL
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7088+0.067 EUR
Mindestbestellmenge: 7088
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SPC5607BF1VLU6 MPC560XBFAMFS.pdf
SPC5607BF1VLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5528JBD64Y LPC55S2x_LPC552x.pdf
LPC5528JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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