Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (37053) > Seite 568 nach 618

Hersteller: NXP USA Inc.
Description: TRIAC 800V 16A D2PAK
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS BJT NPN 450V SOT-82

Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes

Hersteller: NXP USA Inc.
Description: IC MONO/ASTBL MULTVIBRATR 14SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P

Hersteller: NXP USA Inc.
Description: IC AUDIO AMP B 20-HSOP
Features: Mute, Standby
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP

Hersteller: NXP USA Inc.
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7

Hersteller: NXP USA Inc.
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7

Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 280 mW
Qualification: AEC-Q101

Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 44.7A DPAK
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)

Hersteller: NXP USA Inc.
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB CRAM 269LFBGA
Packaging: Tray

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB CRAM 269LFBGA
Packaging: Tray

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO

Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT502A
Packaging: Tray

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: 180MHZ, CORTEX-M33
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 64x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86

Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray

Hersteller: NXP USA Inc.
Description: SABRE DEV BOARD ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No

Hersteller: NXP USA Inc.
Description: MWCT2D16S, MAXQFP172
Packaging: Tray

Hersteller: NXP USA Inc.
Description: MWCT2D16SHVPBR
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: S32K146, M4F, FLASH 1M, RAM 128K
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: S32K146 32-BIT MCU, ARM CORTEX-M
Packaging: Tray

Hersteller: NXP USA Inc.
Description: S32K148 144 LQFP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: S32K146, M4F, FLASH 1M, RAM 128K
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC REGISTER STATIC 4BIT 16-SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 1A TO-92
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89

Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: 15W, MULTI-COIL AUTO, MULTI-DEVI
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Controller, Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: STANDARD 594MAP S32Z280 W/OUT DF
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: STANDARD 594MAP S32Z280 W/OUT DF
Packaging: Tray

Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SSOP

Hersteller: NXP USA Inc.
Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 52

Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)

Hersteller: NXP USA Inc.
Description: MC33PF8201A0TS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)

Hersteller: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO

Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP

Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO

Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6