Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35545) > Seite 573 nach 593
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| T1014NXN7PQA | NXP USA Inc. |
 Description: IC MPU QORIQ T1 1.4GHZ 780FBGAPackaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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| T1024NXN7PQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA Packaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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| T1014NXN7KQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 780FBGA Packaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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T1020NSE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA Packaging: Bulk Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (12) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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T1022NXE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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| KMI86/WHP | NXP USA Inc. |
Description: KMI86 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| KMI86/PHP | NXP USA Inc. |
Description: KMI86 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| KMI86/P | NXP USA Inc. |
Description: MAG SWITCH ANGULAR SENS SOT1291 Packaging: Tape & Reel (TR) Mounting Type: Through Hole |
Produkt ist nicht verfügbar |
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S912ZVCA19AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x12b SAR; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S912ZVC96AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| TEA8918BAT/2Y | NXP USA Inc. |
Description: POWER MANAGEMENT SPECIALIZED Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| FB32K144UAT0VLHR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| FB32K144UAT0VLHT | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
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MKL02Z32VFK4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL02Z32VFK4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24QFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 3906 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1043AXN7MQB | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
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| BSC9132NXN7KNKB | NXP USA Inc. |
Description: BSC9132 - QORIQ QONVERGE SOC, 2X Packaging: Bulk |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68340CAG16E | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: CPU32 Voltage - I/O: 5.0V Supplier Device Package: 144-LQFP (20x20) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: USART |
Produkt ist nicht verfügbar |
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MC33215BE | NXP USA Inc. |
Description: IC TELECOM INTERFACE 42DIP Packaging: Tube Package / Case: 42-SDIP (0.600", 15.24mm) Mounting Type: Through Hole Function: Voice-Switched Speakerphone Operating Temperature: -20°C ~ 70°C Supplier Device Package: 42-PDIP Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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| T1024NSE7KNA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 780FBGA Packaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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MC33774ASP1AE | NXP USA Inc. |
Description: MC33774ASP1AE Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Number of Cells: 4 ~ 18 Mounting Type: Surface Mount Function: Multi-Function Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Temperature Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 155 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33771CTP1AE | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, PREMIUM Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S12G96J0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
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| S9S12G96J0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
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MC56F81748MLH | NXP USA Inc. |
Description: 32-BIT DSC, 56800EX CORE, 64KB F Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: I2C, LINbus, QSCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 125°C (TA) Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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LPC1114JBD48/303QL | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BYV32E-100,127 | NXP USA Inc. |
Description: DIODE ARRAY 100V 20A TO220AB Packaging: Bulk |
auf Bestellung 8398 Stücke: Lieferzeit 10-14 Tag (e) |
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| IW611UK/A1CAZ | NXP USA Inc. |
Description: IC RF 140WLCSP Packaging: Tape & Reel (TR) Package / Case: 140-XFBGA, WLCSP Mounting Type: Surface Mount Supplier Device Package: 140-WLCSP (4.96x4.39) |
Produkt ist nicht verfügbar |
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| IW611UK/A1IAZ | NXP USA Inc. |
Description: IC RF 140WLCSP Packaging: Tape & Reel (TR) Package / Case: 140-XFBGA, WLCSP Mounting Type: Surface Mount Supplier Device Package: 140-WLCSP (4.96x4.39) |
Produkt ist nicht verfügbar |
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| IW612UK/A1CAZ | NXP USA Inc. |
Description: IC RF 140WLCSP Packaging: Tape & Reel (TR) Package / Case: 140-XFBGA, WLCSP Mounting Type: Surface Mount Supplier Device Package: 140-WLCSP (4.96x4.39) |
Produkt ist nicht verfügbar |
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| IW612UK/A1IAZ | NXP USA Inc. |
Description: IC RF 140WLCSP Packaging: Tape & Reel (TR) Package / Case: 140-XFBGA, WLCSP Mounting Type: Surface Mount Supplier Device Package: 140-WLCSP (4.96x4.39) |
Produkt ist nicht verfügbar |
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| IW611UK/A1IZ | NXP USA Inc. |
Description: IC RF 140WLCSP Packaging: Tape & Reel (TR) Package / Case: 140-XFBGA, WLCSP Mounting Type: Surface Mount Supplier Device Package: 140-WLCSP (4.96x4.39) |
Produkt ist nicht verfügbar |
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| IW611UK/A1CZ | NXP USA Inc. |
Description: IC RF 140WLCSP Packaging: Tape & Reel (TR) Package / Case: 140-XFBGA, WLCSP Mounting Type: Surface Mount Supplier Device Package: 140-WLCSP (4.96x4.39) |
Produkt ist nicht verfügbar |
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| IW611HN/A1CMP | NXP USA Inc. |
Description: IW611HN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| IW611HN/A1IMP | NXP USA Inc. |
Description: IC RF 116HVQFN Packaging: Tape & Reel (TR) Package / Case: 116-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 116-HVQFN (9x9) |
Produkt ist nicht verfügbar |
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| IW611HN/A1CK | NXP USA Inc. |
Description: IC RF BLE Packaging: Tray Frequency: 2.4GHz, 5GHz RF Family/Standard: Bluetooth, WiFi |
Produkt ist nicht verfügbar |
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| IW611HN/A1IK | NXP USA Inc. |
Description: IC RF 116HVQFN Packaging: Tray Package / Case: 116-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 116-HVQFN (9x9) |
Produkt ist nicht verfügbar |
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| IW612UK/A1CZ | NXP USA Inc. |
Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 ( Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| IW612UK/A1IZ | NXP USA Inc. |
Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 ( Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| IW612HN/A1CMP | NXP USA Inc. |
Description: IC RF 116HVQFN Packaging: Tape & Reel (TR) Package / Case: 116-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 116-HVQFN (9x9) |
Produkt ist nicht verfügbar |
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| IW612HN/A1IMP | NXP USA Inc. |
Description: IC RF 116HVQFN Packaging: Tape & Reel (TR) Package / Case: 116-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 116-HVQFN (9x9) |
Produkt ist nicht verfügbar |
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| IW612HN/A1IK | NXP USA Inc. |
Description: IC RF 116HVQFN Packaging: Tray Package / Case: 116-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 116-HVQFN (9x9) |
Produkt ist nicht verfügbar |
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| IW612HN/A1CK | NXP USA Inc. |
Description: IC RF 116HVQFN Packaging: Tray Package / Case: 116-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 116-HVQFN (9x9) |
Produkt ist nicht verfügbar |
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| AW611HN/A1BMP | NXP USA Inc. |
Description: AW611HN/A1BMP Packaging: Bulk |
Produkt ist nicht verfügbar |
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| AW611HN/A1BK | NXP USA Inc. |
Description: AW611HN/A1BK Packaging: Bulk |
Produkt ist nicht verfügbar |
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| BATT-14CTCABLE25 | NXP USA Inc. |
Description: CELL TERMINAL (CT) CABLE, 14 CEL Packaging: Bulk Accessory Type: Cable |
Produkt ist nicht verfügbar |
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| MKE02Z32VLH4R | NXP USA Inc. |
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5 Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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| MKL27Z256VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12G64F0VLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MFS2325BMMA0EPR2 | NXP USA Inc. |
Description: MFS2325BMMA0EPR2 Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 120°C Voltage - Supply: 3.3V, 5V Applications: System Basis Chip Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
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| MFS2325BMMA0EP | NXP USA Inc. |
Description: MFS2325BMMA0EP Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 120°C Voltage - Supply: 3.3V, 5V Applications: System Basis Chip Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MCF51JE256VMB | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA Packaging: Box Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Number of I/O: 48 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
PDTC123TE,115 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 0.1A SC75 Packaging: Tape & Reel (TR) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Resistor - Base (R1): 2.2 kOhms |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| FB32K148HFT0VLQT | NXP USA Inc. |
Description: S32K148 144 LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MPVZ5004G6T1 | NXP USA Inc. |
Description: SENSOR 0.57PSIG 4.9V Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD Module Output Type: Analog Voltage Mounting Type: Surface Mount Output: 1 V ~ 4.9 V Operating Pressure: 0.57PSI (3.92kPa) Pressure Type: Vented Gauge Accuracy: ±6.25% Operating Temperature: 0°C ~ 85°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Port Style: No Port Maximum Pressure: 2.32PSI (16kPa) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPVZ4006G6T1 | NXP USA Inc. |
Description: SENSOR 0.87PSIG 4.6V Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD Module Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.3 V ~ 4.6 V Operating Pressure: 0.87PSI (6kPa) Pressure Type: Vented Gauge Operating Temperature: 10°C ~ 60°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPVZ4006G6U | NXP USA Inc. |
 Description: SENSOR 0.87PSIG 4.6V 8SOPFeatures: Temperature Compensated Packaging: Tube Package / Case: 8-SMD Module Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.3 V ~ 4.6 V Operating Pressure: 0.87PSI (6kPa) Pressure Type: Vented Gauge Operating Temperature: 10°C ~ 60°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MPVZ4006G7U | NXP USA Inc. |
Description: SENSOR 0.87PSIG 4.6V 8DIP Features: Temperature Compensated Packaging: Tube Package / Case: 8-DIP Module Output Type: Analog Voltage Mounting Type: Through Hole Output: 0.3 V ~ 4.6 V Operating Pressure: 0.87PSI (6kPa) Pressure Type: Vented Gauge Operating Temperature: 10°C ~ 60°C Termination Style: PC Pin Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-DIP Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
ASL5115SHNZ | NXP USA Inc. |
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 36-HVQFN (6x6) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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|
ASL5115SHNZ | NXP USA Inc. |
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN Packaging: Cut Tape (CT) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 36-HVQFN (6x6) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Grade: Automotive |
auf Bestellung 404 Stücke: Lieferzeit 10-14 Tag (e) |
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| T1014NXN7PQA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T1024NXN7PQA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T1014NXN7KQA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T1020NSE7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T1022NXE7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KMI86/P |
Hersteller: NXP USA Inc.
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVCA19AMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVC96AMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKL02Z32VFK4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKL02Z32VFK4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 3906 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.30 EUR |
| 10+ | 3.97 EUR |
| 25+ | 3.64 EUR |
| 100+ | 3.28 EUR |
| 250+ | 3.10 EUR |
| 500+ | 3.00 EUR |
| 1000+ | 2.91 EUR |
| 2500+ | 2.82 EUR |
| LS1043AXN7MQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BSC9132NXN7KNKB |
|
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 236.01 EUR |
| MC68340CAG16E |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33215BE |
|
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 70°C
Supplier Device Package: 42-PDIP
Number of Circuits: 1
Description: IC TELECOM INTERFACE 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 70°C
Supplier Device Package: 42-PDIP
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T1024NSE7KNA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33774ASP1AE |
|
Hersteller: NXP USA Inc.
Description: MC33774ASP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
Description: MC33774ASP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 155 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.19 EUR |
| 10+ | 15.75 EUR |
| 25+ | 14.09 EUR |
| MC33771CTP1AE |
|
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 28.32 EUR |
| S9S12G96J0MLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G96J0MLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F81748MLH |
|
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1114JBD48/303QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BYV32E-100,127 |
|
auf Bestellung 8398 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 556+ | 0.87 EUR |
| IW611UK/A1CAZ |
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW611UK/A1IAZ |
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW612UK/A1CAZ |
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW612UK/A1IAZ |
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW611UK/A1IZ |
|
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW611UK/A1CZ |
|
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW611HN/A1IMP |
|
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW611HN/A1CK |
|
Hersteller: NXP USA Inc.
Description: IC RF BLE
Packaging: Tray
Frequency: 2.4GHz, 5GHz
RF Family/Standard: Bluetooth, WiFi
Description: IC RF BLE
Packaging: Tray
Frequency: 2.4GHz, 5GHz
RF Family/Standard: Bluetooth, WiFi
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW611HN/A1IK |
|
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW612HN/A1CMP |
|
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW612HN/A1IMP |
|
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW612HN/A1IK |
|
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IW612HN/A1CK |
|
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BATT-14CTCABLE25 |
|
Hersteller: NXP USA Inc.
Description: CELL TERMINAL (CT) CABLE, 14 CEL
Packaging: Bulk
Accessory Type: Cable
Description: CELL TERMINAL (CT) CABLE, 14 CEL
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKE02Z32VLH4R |
|
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.67 EUR |
| 10+ | 5.03 EUR |
| 25+ | 4.79 EUR |
| 50+ | 4.62 EUR |
| 100+ | 4.46 EUR |
| 250+ | 4.25 EUR |
| 500+ | 4.10 EUR |
| MKL27Z256VFM4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G64F0VLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS2325BMMA0EPR2 |
|
Hersteller: NXP USA Inc.
Description: MFS2325BMMA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2325BMMA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS2325BMMA0EP |
|
Hersteller: NXP USA Inc.
Description: MFS2325BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2325BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51JE256VMB |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
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| PDTC123TE,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
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| MPVZ5004G6T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 4.9V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±6.25%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 2.32PSI (16kPa)
Description: SENSOR 0.57PSIG 4.9V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±6.25%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 2.32PSI (16kPa)
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| MPVZ4006G6T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Description: SENSOR 0.87PSIG 4.6V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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| MPVZ4006G6U | |
|
Hersteller: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V 8SOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Description: SENSOR 0.87PSIG 4.6V 8SOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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| MPVZ4006G7U |
|
Hersteller: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Description: SENSOR 0.87PSIG 4.6V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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| ASL5115SHNZ |
|
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
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| ASL5115SHNZ |
|
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
auf Bestellung 404 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.84 EUR |
| 10+ | 12.35 EUR |
| 25+ | 11.48 EUR |
| 100+ | 10.52 EUR |
| 250+ | 10.06 EUR |