Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 573 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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MC33FS4502NAE | NXP USA Inc. |
 Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| TEF8232EN1/N1ZZ | NXP USA Inc. |
Description: FULLY INTEGRATED 77 GHZ RFCMOS A Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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NX3P1108UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP Packaging: Tape & Reel (TR) Features: Load Discharge, Slew Rate Controlled Package / Case: 4-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 34mOhm Voltage - Load: 0.9V ~ 3.6V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1.5A Ratio - Input:Output: 1:1 Supplier Device Package: 4-WLCSP (0.96x0.96) |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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NX3P1108UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP Packaging: Cut Tape (CT) Features: Load Discharge, Slew Rate Controlled Package / Case: 4-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 34mOhm Voltage - Load: 0.9V ~ 3.6V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1.5A Ratio - Input:Output: 1:1 Supplier Device Package: 4-WLCSP (0.96x0.96) |
auf Bestellung 6414 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH8CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 6646 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF4000EL/103Q233Y | NXP USA Inc. |
Description: SAF4000EL/103Q233Y Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MF1PH4231DUD/00Z | NXP USA Inc. |
Description: MIFAREA PLUS EV2 Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 34187 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9111CVXXJBB | NXP USA Inc. |
Description: I.MX91 BGA9 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9131CVVXJBB | NXP USA Inc. |
Description: I.MX91 BGA11 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 176 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9311DVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9301DVVXDACR | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tape & Reel (TR) Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Graphics Acceleration: No RAM Controllers: LPDDR4 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1, 1 Core, 64-Bit USB: USB 2.0 OTG (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 306-LFBGA (11x11) Voltage - I/O: 1.8V Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 900MHz, 250MHz Mounting Type: Surface Mount Package / Case: 306-LFBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9311CVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9312DVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9301CVVXDACR | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tape & Reel (TR) Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Graphics Acceleration: No RAM Controllers: LPDDR4 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1, 1 Core, 64-Bit USB: USB 2.0 OTG (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 306-LFBGA (11x11) Voltage - I/O: 1.8V Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Operating Temperature: -40°C ~ 105°C (TJ) Speed: 900MHz, 250MHz Mounting Type: Surface Mount Package / Case: 306-LFBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9301DVVXDAC | NXP USA Inc. |
Description: I.MX93 BGA11 Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Graphics Acceleration: No Packaging: Tray RAM Controllers: LPDDR4 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1, 1 Core, 64-Bit USB: USB 2.0 OTG (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 306-LFBGA (11x11) Voltage - I/O: 1.8V Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 900MHz, 250MHz Mounting Type: Surface Mount Package / Case: 306-LFBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 176 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9321DVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9302DVVXDACR | NXP USA Inc. |
Description: I.MX93 BGA11 Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Graphics Acceleration: No RAM Controllers: LPDDR4 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2, 1 Core, 64-Bit USB: USB 2.0 OTG (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 306-LFBGA (11x11) Voltage - I/O: 1.8V Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 900MHz, 250MHz Mounting Type: Surface Mount Package / Case: 306-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9311XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9331DVVXMACR | NXP USA Inc. |
Description: I.MX93 BGA11 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1, 1 Core, 64-Bit USB: USB 2.0 OTG (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 306-LFBGA (11x11) Voltage - I/O: 1.8V Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 250MHz, 1.7GHz Mounting Type: Surface Mount Package / Case: 306-LFBGA Packaging: Tape & Reel (TR) Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Graphics Acceleration: No RAM Controllers: LPDDR4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9312CVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9322DVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9301CVVXDAC | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 176 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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P87C51X2BN,112 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 33MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR Supplier Device Package: 40-DIP Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| IMX95LPD5EVK-19 | NXP USA Inc. |
Description: EVAL BOARD FOR I.MX 95 Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33 Utilized IC / Part: i.MX 95 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V2300NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-4 Packaging: Tape & Reel (TR) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 220MHz Power - Output: 300W Gain: 25.5dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 900 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MRF6V2300NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-4 Packaging: Cut Tape (CT) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 220MHz Power - Output: 300W Gain: 25.5dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 900 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| SAF4000EL/103Q534Y | NXP USA Inc. |
Description: SAF4000EL/103Q534Y Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| KIT-TJA1121-SDBS | NXP USA Inc. |
Description: KIT-TJA1121-SDBS Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MC56F83766MLK | NXP USA Inc. |
Description: IC MCU 32BIT 128MB FLASH 80LQFP Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 48K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray Number of I/O: 68 Supplier Device Package: 80-FQFP (12x12) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 20x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC56F83786MLK | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80LQFP Number of I/O: 68 Supplier Device Package: 80-FQFP (12x12) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 20x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MIMXRT1187JVM8B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MFS2610AMBA0ADR2 | NXP USA Inc. |
Description: AUTO SBC Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MFS2610AMBA0AD | NXP USA Inc. |
Description: AUTO SBC Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| WCT-15W1COILTX | NXP USA Inc. |
Description: EVAL BOARD FOR MWCT1012CFM Primary Attributes: Transmitter Utilized IC / Part: MWCT1012CFM Contents: Board(s) Type: Power Management Function: Wireless Power Supply/Charging Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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PCA9535HF,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN Features: POR Packaging: Tape & Reel (TR) Package / Case: 24-WFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HWQFN (4x4) Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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FRDM-STBI-A8971 | NXP USA Inc. |
Description: FRDM-STBI-A8971 Packaging: Bulk |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXE245VLFR | NXP USA Inc. |
Description: MCXE245 LQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC9S12DJ64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP DigiKey Programmable: Not Verified Number of I/O: 59 Supplier Device Package: 80-QFP (14x14) Peripherals: PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| SAF7770EL/202Z13CY | NXP USA Inc. |
Description: AUDIO DSPS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF7770EL/202Z13CK | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SC32PF8121EKEP | NXP USA Inc. |
Description: PMIC, 7 BUCK REG, 4 LDOS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SC33PF8200KKESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
PMCM6501VNEZ | NXP USA Inc. |
Description: PMCM6501VNE - 12V, N-CHANNEL TRE Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta) Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V Power Dissipation (Max): 556mW (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 900mV @ 250µA Supplier Device Package: 6-WLCSP (1.48x0.98) Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V |
auf Bestellung 2036138 Stücke: Lieferzeit 10-14 Tag (e) |
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PMCM6501UNEZ | NXP USA Inc. |
Description: PMCM6501UNE - 20V, N-CHANNEL TRE Packaging: Bulk |
auf Bestellung 4464 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL2S2602FUD/BGZ | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ WAFER Supplier Device Package: Wafer Standards: ISO 15693 Type: RFID Transponder Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: Die Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 97092 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
BGU8063J | NXP USA Inc. |
Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON Supplier Device Package: 10-HVSON (3x3) P1dB: 19dBm Noise Figure: 1.4dB Current - Supply: 75mA Gain: 20dB Voltage - Supply: 4.75V ~ 5.25V RF Type: General Purpose Frequency: 2.5GHz ~ 4GHz Mounting Type: Surface Mount Package / Case: 10-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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ASL2507SHNY | NXP USA Inc. |
Description: BOOST CONVERTER + FSO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| KIT-TJA1121-SDBR | NXP USA Inc. |
Description: KIT-TJA1121-SDBR Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
P3A1604UKAZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 12-WLCSP Output Type: Tri-State Package / Case: 12-UFBGA, WLCSP Packaging: Tape & Reel (TR) Number of Circuits: 1 Voltage - VCCB: 1.62 V ~ 3.63 V Voltage - VCCA: 0.72 V ~ 1.98 V Channels per Circuit: 4 Translator Type: Voltage Level Channel Type: Bidirectional Supplier Device Package: 12-WLCSP (1.06x1.41) Data Rate: 40Mbps Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount |
auf Bestellung 4400 Stücke: Lieferzeit 10-14 Tag (e) |
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P3A1604UKAZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 12-WLCSP Number of Circuits: 1 Voltage - VCCB: 1.62 V ~ 3.63 V Voltage - VCCA: 0.72 V ~ 1.98 V Channels per Circuit: 4 Translator Type: Voltage Level Channel Type: Bidirectional Supplier Device Package: 12-WLCSP (1.06x1.41) Data Rate: 40Mbps Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Output Type: Tri-State Package / Case: 12-UFBGA, WLCSP Packaging: Cut Tape (CT) |
auf Bestellung 4400 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2401AVMAFESR2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MFS2401AVMAFES | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MBMI7014TA2AER2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SFS2633AMDDZADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SFS2633AMDDZAD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MBMI7014TA2AE | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Multi-Function Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 150°C (TJ) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Temperature, Over/Under Voltage |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MCXN235VDFR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SC33FS8520DVKSR2 | NXP USA Inc. |
Description: FS8500 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9101DVXXCAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 208-FCBGA (15x15) Ethernet: GbE (1) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9101CVXXCAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 208-FCBGA (15x15) Ethernet: GbE (1) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MC33FS4502NAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TEF8232EN1/N1ZZ |
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NX3P1108UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Tape & Reel (TR)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Tape & Reel (TR)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4000+ | 0.29 EUR |
| NX3P1108UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Cut Tape (CT)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Cut Tape (CT)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
auf Bestellung 6414 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 27+ | 0.67 EUR |
| 39+ | 0.46 EUR |
| 43+ | 0.41 EUR |
| 100+ | 0.36 EUR |
| 250+ | 0.33 EUR |
| 500+ | 0.32 EUR |
| 1000+ | 0.3 EUR |
| MC9S08SH8CTGR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 6646 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.97 EUR |
| 10+ | 5.29 EUR |
| 25+ | 4.87 EUR |
| 100+ | 4.41 EUR |
| 250+ | 4.19 EUR |
| 500+ | 4.06 EUR |
| 1000+ | 3.95 EUR |
| 2500+ | 3.83 EUR |
| SAF4000EL/103Q233Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF1PH4231DUD/00Z |
|
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: MIFAREA PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Mindestbestellmenge: 34187 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9111CVXXJBB |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9131CVVXJBB |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9311DVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9301DVVXDACR |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9311CVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9312DVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| MIMX9301CVVXDACR |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Produkt ist nicht verfügbar
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| MIMX9301DVVXDAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
Packaging: Tray
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Description: I.MX93 BGA11
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
Packaging: Tray
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Produkt ist nicht verfügbar
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| MIMX9321DVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| MIMX9302DVVXDACR |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Packaging: Tape & Reel (TR)
Description: I.MX93 BGA11
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 900MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MIMX9311XVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| MIMX9331DVVXMACR |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 250MHz, 1.7GHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Description: I.MX93 BGA11
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
USB: USB 2.0 OTG (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 306-LFBGA (11x11)
Voltage - I/O: 1.8V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 250MHz, 1.7GHz
Mounting Type: Surface Mount
Package / Case: 306-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: No
RAM Controllers: LPDDR4
Produkt ist nicht verfügbar
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| MIMX9312CVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| MIMX9322DVXXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| MIMX9301CVVXDAC |
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
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| P87C51X2BN,112 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| IMX95LPD5EVK-19 |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR I.MX 95
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
Description: EVAL BOARD FOR I.MX 95
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 2082.64 EUR |
| MRF6V2300NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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| MRF6V2300NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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| SAF4000EL/103Q534Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MC56F83766MLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 80LQFP
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Description: IC MCU 32BIT 128MB FLASH 80LQFP
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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| MC56F83786MLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| MIMXRT1187JVM8B |
Produkt ist nicht verfügbar
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| MFS2610AMBA0ADR2 |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MFS2610AMBA0AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| WCT-15W1COILTX |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MWCT1012CFM
Primary Attributes: Transmitter
Utilized IC / Part: MWCT1012CFM
Contents: Board(s)
Type: Power Management
Function: Wireless Power Supply/Charging
Packaging: Box
Description: EVAL BOARD FOR MWCT1012CFM
Primary Attributes: Transmitter
Utilized IC / Part: MWCT1012CFM
Contents: Board(s)
Type: Power Management
Function: Wireless Power Supply/Charging
Packaging: Box
Produkt ist nicht verfügbar
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| PCA9535HF,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| FRDM-STBI-A8971 |
|
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 37.7 EUR |
| MCXE245VLFR |
|
Hersteller: NXP USA Inc.
Description: MCXE245 LQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Description: MCXE245 LQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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| MC9S12DJ64MFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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| SAF7770EL/202Z13CY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAF7770EL/202Z13CK |
Produkt ist nicht verfügbar
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| SC32PF8121EKEP |
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| SC33PF8200KKESR2 |
Produkt ist nicht verfügbar
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| PMCM6501VNEZ |
|
Hersteller: NXP USA Inc.
Description: PMCM6501VNE - 12V, N-CHANNEL TRE
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V
Description: PMCM6501VNE - 12V, N-CHANNEL TRE
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V
auf Bestellung 2036138 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1254+ | 0.36 EUR |
| PMCM6501UNEZ |
|
auf Bestellung 4464 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1254+ | 0.36 EUR |
| SL2S2602FUD/BGZ |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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| BGU8063J |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Supplier Device Package: 10-HVSON (3x3)
P1dB: 19dBm
Noise Figure: 1.4dB
Current - Supply: 75mA
Gain: 20dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 2.5GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Supplier Device Package: 10-HVSON (3x3)
P1dB: 19dBm
Noise Figure: 1.4dB
Current - Supply: 75mA
Gain: 20dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 2.5GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| ASL2507SHNY |
|
Produkt ist nicht verfügbar
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| P3A1604UKAZ |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Description: IC XLTR VL BIDIR 12-WLCSP
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
auf Bestellung 4400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4400+ | 1 EUR |
| P3A1604UKAZ |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC XLTR VL BIDIR 12-WLCSP
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 4400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 2.08 EUR |
| 12+ | 1.51 EUR |
| 25+ | 1.37 EUR |
| 100+ | 1.21 EUR |
| 250+ | 1.14 EUR |
| 500+ | 1.11 EUR |
| MFS2401AVMAFESR2 |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MFS2401AVMAFES |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MBMI7014TA2AER2 |
Produkt ist nicht verfügbar
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| SFS2633AMDDZADR2 |
Produkt ist nicht verfügbar
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| SFS2633AMDDZAD |
Produkt ist nicht verfügbar
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| MBMI7014TA2AE |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
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| MCXN235VDFR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| SC33FS8520DVKSR2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MIMX9101DVXXCAB |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| MIMX9101CVXXCAB |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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