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MIMX9121DVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB MIMX9131DVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MFS2300BMBA0EPR2 MFS2300BMBA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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MC9S12E256VPVE MC9S12E256VPVE NXP USA Inc. MC9S12E256V1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 2x8b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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MIMX8UD7DVP08SC MIMX8UD7DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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1+31.43 EUR
10+25.09 EUR
25+23.5 EUR
100+21.76 EUR
250+20.93 EUR
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MIMX8MN2DVTJZAA MIMX8MN2DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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1+42.4 EUR
10+34.17 EUR
25+32.11 EUR
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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3+7.09 EUR
10+5.39 EUR
25+4.96 EUR
100+4.49 EUR
250+4.27 EUR
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MC32PF4210A4ESR2 MC32PF4210A4ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC32PF4210A4ES MC32PF4210A4ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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PCAL9539AHF,128 PCAL9539AHF,128 NXP USA Inc. PCAL9539A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BTS6201UJ BTS6201UJ NXP USA Inc. BTS6201U.pdf Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
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3+6.44 EUR
10+5.56 EUR
25+5.25 EUR
100+4.84 EUR
250+4.58 EUR
500+4.41 EUR
1000+4.24 EUR
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CWA-VSPA--FL NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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ZK-HC08AX-A NXP USA Inc. Description: MC68HC908AB/AS/AZ EVAL BRD
Utilized IC / Part: MC68HC908AB/AS/AZ
Core Processor: HC08
Contents: Board(s), Cable(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Socket
Packaging: Box
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MRFE6S9160HSR3 MRFE6S9160HSR3 NXP USA Inc. MRFE6S9160HR3H%28S%29R3.pdf Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 21dB
Power - Output: 35W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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SE050D2HQ1/Z01PAZ NXP USA Inc. Description: SE050D2HQ1/Z01PAZ
DigiKey Programmable: Not Verified
Packaging: Bulk
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MC35FS4505NAER2 MC35FS4505NAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE MC35FS4505NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC50XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC22XS4200DEKR2 MC22XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MC50XS4200DEK MC50XS4200DEK NXP USA Inc. MC20XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
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MC17XS6400DEKR2 MC17XS6400DEKR2 NXP USA Inc. MC07XS6517.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
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MC20XS4200BDFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC20XS4200DFK MC20XS4200DFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
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MC22XS4200DEK MC22XS4200DEK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
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MC17XS6400DEK MC17XS6400DEK NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
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MC20XS4200BDFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
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MC06XS4200DFKR2 MC06XS4200DFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 12A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: CMOS
Rds On (Typ): 12mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MGD3162AM551EKT MGD3162AM551EKT NXP USA Inc. SDS_GD3162.pdf Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
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NAFE11348B40BSK NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34DCH NXP USA Inc. 74AUP3G34.pdf Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Supplier Device Package: 8-VSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 3
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
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LS2084ASE7V17B NXP USA Inc. LS2084A%2C%20LS2044A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Tray
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SPC5747GK0AVKU6 SPC5747GK0AVKU6 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB MPC8349VVAJDB NXP USA Inc. Description: IC MPU 672LBGA
Supplier Device Package: 672-LBGA (35x35)
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PCA1626U/F2,026 NXP USA Inc. PCA16XX.pdf Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB MIMX8QM5CVUFFAB NXP USA Inc. Download?colCode=IMX8QMAEC&amp;location=null Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PCA9509PGM,125 PCA9509PGM,125 NXP USA Inc. PCA9509P.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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PCA9509PGM,125 PCA9509PGM,125 NXP USA Inc. PCA9509P.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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88W8897PB1-NMJC/AZ NXP USA Inc. Description: 88W8897PB1-NMJC/AZ
Packaging: Bulk
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PCA9846PWJ PCA9846PWJ NXP USA Inc. PCA9846.pdf Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Dual Supply
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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PCA9846PWJ PCA9846PWJ NXP USA Inc. PCA9846.pdf Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Dual Supply
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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S32K328NHT1MJBSR NXP USA Inc. S32K3xx.pdf Description: IC MCU
Packaging: Tape & Reel (TR)
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MC56F81646VLFR MC56F81646VLFR NXP USA Inc. MC56F81XXXL.pdf Description: 32-BIT DSC, 56800EX CORE, 64KB F
Supplier Device Package: 48-LQFP (7x7)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Type: Digital Signal Controllers
Interface: I2C, LINbus, QSCI, QSPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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SFS2633AMDGCADR2 NXP USA Inc. Description: FS2600
Packaging: Tape & Reel (TR)
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SFS2633AMDGCAD NXP USA Inc. Description: FS2600
Packaging: Tray
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MPC8349EZUAJDB MPC8349EZUAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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NPIC6C596D,118 NPIC6C596D,118 NXP USA Inc. PHGL-S-A0000765027-1.pdf?t.download=true&u=5oefqw Description: IC SR OPEN DRAIN 8BIT 16-SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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RD5746RBMSEVM NXP USA Inc. Description: RD5746RBMSEVM
Contents: Board(s)
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1446B-EVB NXP USA Inc. UM12257.pdf Description: TJA1446B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
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TJA1465A-EVB NXP USA Inc. UM12257.pdf Description: TJA1465A-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
Produkt ist nicht verfügbar
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MCF51JF32VFM MCF51JF32VFM NXP USA Inc. MCF51JG256.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 22
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
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MCF51JF32VFM MCF51JF32VFM NXP USA Inc. MCF51JF128.pdf Description: MCF51JX 32-BIT MCU, COLDFIRE V1
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 6x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
DigiKey Programmable: Not Verified
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74HC175N,652 74HC175N,652 NXP USA Inc. 74HC_HCT175.pdf Description: IC FF D-TYPE SINGLE 4BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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MC32PF3000A2EPR2 MC32PF3000A2EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
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TDA8029HL/C206,118 TDA8029HL/C206,118 NXP USA Inc. TDA8029.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
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MIMX9121DVVXCAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB IMX91FAMFS.pdf
MIMX9131DVVXJAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MFS2300BMBA0EPR2 FS23DS.pdf
MFS2300BMBA0EPR2
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC9S12E256VPVE MC9S12E256V1.pdf
MC9S12E256VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 2x8b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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MIMX8UD7DVP08SC IMX8ULPIEC.pdf
MIMX8UD7DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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1+31.43 EUR
10+25.09 EUR
25+23.5 EUR
100+21.76 EUR
250+20.93 EUR
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MIMX8MN2DVTJZAA IMX8MNCEC.pdf
MIMX8MN2DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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1+42.4 EUR
10+34.17 EUR
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
Produkt ist nicht verfügbar
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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3+7.09 EUR
10+5.39 EUR
25+4.96 EUR
100+4.49 EUR
250+4.27 EUR
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MC32PF4210A4ESR2 PF4210.pdf
MC32PF4210A4ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC32PF4210A4ES PF4210.pdf
MC32PF4210A4ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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PCAL9539AHF,128 PCAL9539A.pdf
PCAL9539AHF,128
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS6201UJ BTS6201U.pdf
BTS6201UJ
Hersteller: NXP USA Inc.
Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
auf Bestellung 5817 Stücke:
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AnzahlPreis
3+6.44 EUR
10+5.56 EUR
25+5.25 EUR
100+4.84 EUR
250+4.58 EUR
500+4.41 EUR
1000+4.24 EUR
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CWA-VSPA--FL
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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ZK-HC08AX-A
Hersteller: NXP USA Inc.
Description: MC68HC908AB/AS/AZ EVAL BRD
Utilized IC / Part: MC68HC908AB/AS/AZ
Core Processor: HC08
Contents: Board(s), Cable(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Socket
Packaging: Box
Produkt ist nicht verfügbar
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MRFE6S9160HSR3 MRFE6S9160HR3H%28S%29R3.pdf
MRFE6S9160HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 21dB
Power - Output: 35W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SE050D2HQ1/Z01PAZ
Hersteller: NXP USA Inc.
Description: SE050D2HQ1/Z01PAZ
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
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MC35FS4505NAER2 FS6500-FS4500-ASILD.pdf
MC35FS4505NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4505NAE FS6500-FS4500-ASILD.pdf
MC35FS4505NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC50XS4200DEKR2 MC22XS4200.pdf
MC50XS4200DEKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC22XS4200DEKR2 MC22XS4200.pdf
MC22XS4200DEKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC50XS4200DEK MC20XS4200.pdf
MC50XS4200DEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Produkt ist nicht verfügbar
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MC17XS6400DEKR2 MC07XS6517.pdf
MC17XS6400DEKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Produkt ist nicht verfügbar
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MC20XS4200BDFKR2 MC22XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC20XS4200DFK MC22XS4200.pdf
MC20XS4200DFK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Produkt ist nicht verfügbar
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MC22XS4200DEK MC22XS4200.pdf
MC22XS4200DEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Produkt ist nicht verfügbar
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MC17XS6400DEK MC12XS6D3.pdf
MC17XS6400DEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
Produkt ist nicht verfügbar
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MC20XS4200BDFK MC22XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Produkt ist nicht verfügbar
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MC06XS4200DFKR2 MC22XS4200.pdf
MC06XS4200DFKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 12A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: CMOS
Rds On (Typ): 12mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MGD3162AM551EKT SDS_GD3162.pdf
MGD3162AM551EKT
Hersteller: NXP USA Inc.
Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
auf Bestellung 836 Stücke:
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AnzahlPreis
2+16.77 EUR
10+13.13 EUR
25+12.22 EUR
176+10.92 EUR
352+10.6 EUR
528+10.44 EUR
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NAFE11348B40BSK NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSK
Packaging: Tray
Produkt ist nicht verfügbar
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NAFE11348B40BSE NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSE
Packaging: Tray
Produkt ist nicht verfügbar
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74AUP3G34DCH 74AUP3G34.pdf
74AUP3G34DCH
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Supplier Device Package: 8-VSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 3
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
auf Bestellung 716 Stücke:
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AnzahlPreis
716+0.63 EUR
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LS2084ASE7V17B LS2084A%2C%20LS2044A.pdf
Hersteller: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5747GK0AVKU6 MPC5646C.pdf
SPC5747GK0AVKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8349VVAJDB
MPC8349VVAJDB
Hersteller: NXP USA Inc.
Description: IC MPU 672LBGA
Supplier Device Package: 672-LBGA (35x35)
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PCA1626U/F2,026 PCA16XX.pdf
Hersteller: NXP USA Inc.
Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8QM5CVUFFAB Download?colCode=IMX8QMAEC&amp;location=null
MIMX8QM5CVUFFAB
Hersteller: NXP USA Inc.
Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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PCA9509PGM,125 PCA9509P.pdf
PCA9509PGM,125
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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PCA9509PGM,125 PCA9509P.pdf
PCA9509PGM,125
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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14+1.34 EUR
19+0.96 EUR
25+0.87 EUR
100+0.76 EUR
250+0.71 EUR
500+0.68 EUR
1000+0.65 EUR
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88W8897PB1-NMJC/AZ
Hersteller: NXP USA Inc.
Description: 88W8897PB1-NMJC/AZ
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9846PWJ PCA9846.pdf
PCA9846PWJ
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Dual Supply
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
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2500+1.93 EUR
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PCA9846PWJ PCA9846.pdf
PCA9846PWJ
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Dual Supply
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 3516 Stücke:
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AnzahlPreis
5+3.71 EUR
10+2.76 EUR
25+2.52 EUR
100+2.26 EUR
250+2.14 EUR
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S32K328NHT1MJBSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC56F81646VLFR MC56F81XXXL.pdf
MC56F81646VLFR
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Supplier Device Package: 48-LQFP (7x7)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Type: Digital Signal Controllers
Interface: I2C, LINbus, QSCI, QSPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDGCADR2
Hersteller: NXP USA Inc.
Description: FS2600
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDGCAD
Hersteller: NXP USA Inc.
Description: FS2600
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8349EZUAJDB MPC8349EAEC.pdf
MPC8349EZUAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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NPIC6C596D,118 PHGL-S-A0000765027-1.pdf?t.download=true&u=5oefqw
NPIC6C596D,118
Hersteller: NXP USA Inc.
Description: IC SR OPEN DRAIN 8BIT 16-SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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RD5746RBMSEVM
Hersteller: NXP USA Inc.
Description: RD5746RBMSEVM
Contents: Board(s)
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1446B-EVB UM12257.pdf
Hersteller: NXP USA Inc.
Description: TJA1446B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
Produkt ist nicht verfügbar
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TJA1465A-EVB UM12257.pdf
Hersteller: NXP USA Inc.
Description: TJA1465A-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
Produkt ist nicht verfügbar
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MCF51JF32VFM MCF51JG256.pdf
MCF51JF32VFM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 22
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Produkt ist nicht verfügbar
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MCF51JF32VFM MCF51JF128.pdf
MCF51JF32VFM
Hersteller: NXP USA Inc.
Description: MCF51JX 32-BIT MCU, COLDFIRE V1
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 6x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 948 Stücke:
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AnzahlPreis
82+5.52 EUR
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74HC175N,652 74HC_HCT175.pdf
74HC175N,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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MC32PF3000A2EPR2 PF3000.pdf
MC32PF3000A2EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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TDA8029HL/C206,118 TDA8029.pdf
TDA8029HL/C206,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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