Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36619) > Seite 574 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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SPC5742PGK1AMMM9 | NXP USA Inc. |
 Description: IC MCU 32BIT 1.5MB FLSH 257LFBGAPackaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 80MHz, 200MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| KIT-TJA1120-SDBR | NXP USA Inc. |
Description: EVAL BOARD FOR TJA1120 Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA1120 Embedded: No |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| KIT-TJA1120-SDBS | NXP USA Inc. |
Description: EVAL BOARD FOR TJA1120 Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA1120 Embedded: No |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| KIT-TJA1103-SDBS | NXP USA Inc. |
Description: SABRE DEV KIT ETHERNET PHY Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA11xx Embedded: No |
Produkt ist nicht verfügbar |
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| KIT-TJA1103-SDBR | NXP USA Inc. |
Description: KIT-TJA1103-SDBR Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8272VRMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6Q6AVT10AER | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA Packaging: Tape & Reel (TR) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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| LFVBBOK77CW1C | NXP USA Inc. |
Description: NXP MPC5777C 422 PIN 1.0 MM PITC Packaging: Bulk Accessory Type: Calibration Unit Utilized IC / Part: MPCxxxx |
Produkt ist nicht verfügbar |
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MCF51JE128VMB | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 81-MAPBGA (10x10) Peripherals: LVD, PWM, WDT Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b; D/A 1x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 81-LBGA Packaging: Box |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6VP3450HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 860MHz Configuration: Dual Power - Output: 90W Gain: 22.5dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSP Features: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
Produkt ist nicht verfügbar |
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NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSP Features: Slew Rate Controlled Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
auf Bestellung 1845 Stücke: Lieferzeit 10-14 Tag (e) |
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MC35FS4507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
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MC35FS4507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
auf Bestellung 974 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
Produkt ist nicht verfügbar |
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LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
auf Bestellung 993 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S28JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFP Number of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 925 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5528JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Number of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5526JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC860C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 100MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| JN5121-000-AIV | NXP USA Inc. |
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-QFN Interface: 2-Wire Serial, SPI Serial, UART RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V Controller Series: IEEE802.15.4 Program Memory Type: ROM (64kB) Applications: Wireless Number of I/O: 21 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BTA412Y-800C,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220AB-3 Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KITFS23LDOEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| KITFS23SKTEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| KITFS27-SP48VEVM | NXP USA Inc. |
Description: KITFS27-SP48VEVM Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KITFS27EVM | NXP USA Inc. |
Description: KITFS27EVM Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KITFS27SKTEVM | NXP USA Inc. |
Description: KITFS27SKTEVM Packaging: Bulk |
Produkt ist nicht verfügbar |
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| KITFS27-24VEVM | NXP USA Inc. |
Description: KITFS27-24VEVM Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KITFS27-48VEVM | NXP USA Inc. |
Description: KITFS27-48VEVM Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74HC597DB,118 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74HC597DB,112 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74HC597D,652 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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| BT139B-800F,118 | NXP USA Inc. |
Description: TRIAC 800V 16A D2PAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BT139-600E,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 16A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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| BUX87P,127 | NXP USA Inc. | Description: TRANS BJT NPN 450V SOT-82 |
Produkt ist nicht verfügbar |
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SC16C2550BIBS,151 | NXP USA Inc. |
Description: SERIAL I/O CONTROLLER, 2 CHANNEL Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
Produkt ist nicht verfügbar |
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HEF4047BT,652 | NXP USA Inc. |
Description: IC MONO/ASTBL MULTVIBRATR 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
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TDA1560Q/N4,112 | NXP USA Inc. |
Description: IC AUDIO AMP B, H DBS17P Features: Mute, Standby Packaging: Tube Package / Case: 17-SIP Formed Leads Output Type: 1-Channel (Mono) Mounting Type: Through Hole Type: Class B, Class H Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 40W x1 @ 8Ohm Supplier Device Package: DBS17P |
Produkt ist nicht verfügbar |
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TDA1519CTH/N3,512 | NXP USA Inc. |
Description: IC AUDIO AMP B 20-HSOP Packaging: Tube Features: Mute, Standby Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class B Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm Supplier Device Package: 20-HSOP |
Produkt ist nicht verfügbar |
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| BSC9132NXN7MNMB | NXP USA Inc. |
Description: IC MPU QORIQ 1.333GHZ 780FCBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCBGA (23x23) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
Produkt ist nicht verfügbar |
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74HC4024D,652 | NXP USA Inc. |
Description: IC COUNTER 7STAGE BINARY 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1140 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC4024D,653 | NXP USA Inc. |
Description: IC 7STAGE BINARY RIPPLE 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BC847CQAZ | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A DFN1010D-3 Qualification: AEC-Q101 Power - Max: 280 mW Voltage - Collector Emitter Breakdown (Max): 45 V Current - Collector (Ic) (Max): 100 mA Grade: Automotive Supplier Device Package: DFN1010D-3 Frequency - Transition: 100MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Current - Collector Cutoff (Max): 15nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: 3-XDFN Exposed Pad Packaging: Bulk |
auf Bestellung 24340 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC245D,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
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PHD38N02LT,118 | NXP USA Inc. |
Description: MOSFET N-CH 20V 44.7A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PN7642EV/C101Y | NXP USA Inc. |
Description: PN7642EV/C101Y Packaging: Cut Tape (CT) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
auf Bestellung 1281 Stücke: Lieferzeit 10-14 Tag (e) |
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PNX1501E/G,557 | NXP USA Inc. |
Description: IC MEDIA PROC 266MHZ 456-BGA Packaging: Tray Package / Case: 456-BGA Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Operating Temperature: 0°C ~ 85°C Voltage - Supply: 1.14V ~ 1.26V Controller Series: Nexperia Applications: Multimedia Core Processor: TM3260 Supplier Device Package: 456-BGA (27x27) Number of I/O: 61 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| FS32R294LDK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
 |
FS32R294LDK0MJDR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| FS32R294LCK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| FS32R294LCK0MJDR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
 |
SPC5601DF1MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
auf Bestellung 1872 Stücke: Lieferzeit 10-14 Tag (e) |
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|
SPC5601DF1MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BT138-800,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
|
74HC238D,653 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 3:8 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
|
74HC238D,652 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 3:8 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
 |
74HC238PW,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BLF6G20-75,112 | NXP USA Inc. |
Description: TRANSISTOR PWR LDMOS SOT502A Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH |
| SPC5742PGK1AMMM9 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLSH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 16
Description: IC MCU 32BIT 1.5MB FLSH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KIT-TJA1120-SDBR |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 857.55 EUR |
| KIT-TJA1120-SDBS |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 861.8 EUR |
| KIT-TJA1103-SDBS |
Hersteller: NXP USA Inc.
Description: SABRE DEV KIT ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
Description: SABRE DEV KIT ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8272VRMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6Q6AVT10AER |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBOK77CW1C |
Hersteller: NXP USA Inc.
Description: NXP MPC5777C 422 PIN 1.0 MM PITC
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
Description: NXP MPC5777C 422 PIN 1.0 MM PITC
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51JE128VMB |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
Produkt ist nicht verfügbar
Mindestbestellmenge: 1200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MRF6VP3450HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 90W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 90W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX5P1100UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX5P1100UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
auf Bestellung 1845 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 1.99 EUR |
| 15+ | 1.43 EUR |
| 25+ | 1.3 EUR |
| 100+ | 1.14 EUR |
| 250+ | 1.07 EUR |
| 500+ | 1.02 EUR |
| 1000+ | 0.99 EUR |
| MC35FS4507NAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS4507NAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC5528JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC5528JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 974 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.35 EUR |
| 10+ | 11.09 EUR |
| 25+ | 10.28 EUR |
| 100+ | 9.39 EUR |
| 250+ | 8.97 EUR |
| LPC5526JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC5526JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 993 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.38 EUR |
| 10+ | 9.54 EUR |
| 25+ | 8.83 EUR |
| 100+ | 8.04 EUR |
| 250+ | 7.69 EUR |
| 500+ | 7.45 EUR |
| LPC55S28JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 925 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.72 EUR |
| 10+ | 11.41 EUR |
| 25+ | 10.58 EUR |
| 100+ | 9.67 EUR |
| 250+ | 9.23 EUR |
| 500+ | 8.97 EUR |
| LPC5528JBD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.13 EUR |
| 10+ | 10.36 EUR |
| LPC5526JBD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.51 EUR |
| 10+ | 9.63 EUR |
| 90+ | 8.18 EUR |
| JN5121-000-AIV |
|
Hersteller: NXP USA Inc.
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KITFS23LDOEVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 379.3 EUR |
| KITFS23SKTEVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 422.68 EUR |
| 74HC597DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC597DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC597D,652 |
|
Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUX87P,127 |
Hersteller: NXP USA Inc.
Description: TRANS BJT NPN 450V SOT-82
Description: TRANS BJT NPN 450V SOT-82
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SC16C2550BIBS,151 |
|
Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1560Q/N4,112 |
|
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1519CTH/N3,512 |
|
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP B 20-HSOP
Packaging: Tube
Features: Mute, Standby
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
Description: IC AUDIO AMP B 20-HSOP
Packaging: Tube
Features: Mute, Standby
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BSC9132NXN7MNMB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC4024D,652 |
|
Hersteller: NXP USA Inc.
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Produkt ist nicht verfügbar
Mindestbestellmenge: 1140 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74HC4024D,653 |
|
Hersteller: NXP USA Inc.
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BC847CQAZ |
|
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A DFN1010D-3
Qualification: AEC-Q101
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
Description: TRANS NPN 45V 0.1A DFN1010D-3
Qualification: AEC-Q101
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
auf Bestellung 24340 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3877+ | 0.14 EUR |
| PN7642EV/C101Y |
|
Hersteller: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 1281 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.99 EUR |
| 10+ | 19.98 EUR |
| 25+ | 18.93 EUR |
| 100+ | 17.49 EUR |
| 250+ | 16.64 EUR |
| 500+ | 16.03 EUR |
| 1000+ | 15.46 EUR |
| PNX1501E/G,557 |
|
Hersteller: NXP USA Inc.
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| FS32R294LDK0MJDT |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| FS32R294LDK0MJDR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| FS32R294LCK0MJDT |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| FS32R294LCK0MJDR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SPC5601DF1MLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 1872 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 32+ | 16.91 EUR |
| SPC5601DF1MLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| 74HC238D,653 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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| 74HC238D,652 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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| 74HC238PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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| BLF6G20-75,112 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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