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88W8987-A2-NYEE/AZ 88W8987-A2-NYEE/AZ NXP USA Inc. 88W8987_SDS.pdf Description: IC RF TXRX BLE 68HVQFN
Packaging: Cut Tape (CT)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
auf Bestellung 458 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.85 EUR
10+16.39 EUR
25+15.53 EUR
100+14.36 EUR
250+13.65 EUR
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LPC4078FBD144,551 LPC4078FBD144,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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1+19.71 EUR
10+13.03 EUR
60+12.79 EUR
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LPC4074FBD144,551 LPC4074FBD144,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4076FBD144E LPC4076FBD144E NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/101Q534Y NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5340
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Q534K NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5340
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1759FBD80Y LPC1759FBD80Y NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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1+20.75 EUR
10+16.35 EUR
25+15.25 EUR
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SPC5604BF2CLQ6R SPC5604BF2CLQ6R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33285D MC33285D NXP USA Inc. MC33285.pdf Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Channel Type: Synchronous
Driven Configuration: High-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.7V, 1.7V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8347ECZQADDB MPC8347ECZQADDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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NAFE73388B40BSK NAFE73388B40BSK NXP USA Inc. NAFE73388.pdf Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 160 mW
auf Bestellung 1300 Stücke:
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1+29.85 EUR
10+23.96 EUR
25+22.49 EUR
100+22.39 EUR
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NAFE73388B40BSE NAFE73388B40BSE NXP USA Inc. NAFE73388.pdf Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 160 mW
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1+37.31 EUR
10+29.95 EUR
25+28.11 EUR
100+26.09 EUR
260+25.09 EUR
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MPC862PVR66B MPC862PVR66B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC8358ECVRAGDDA MPC8358ECVRAGDDA NXP USA Inc. MPC8358EEC.pdf Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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MC9S08DV48ACLC MC9S08DV48ACLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U22FBD48/30QL LPC11U22FBD48/30QL NXP USA Inc. LPC11U1X.pdf Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 242 Stücke:
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3+6.69 EUR
10+5.07 EUR
25+4.67 EUR
100+4.22 EUR
Mindestbestellmenge: 3
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MC56F81768LVLH MC56F81768LVLH NXP USA Inc. MC56F81XXX.pdf Description: MC56F81768LVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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C9KEAZN8AMTGR NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AVTG NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AMFKR NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AMFK NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AMTG C9KEAZN8AMTG NXP USA Inc. Description: C9KEAZN8AMTG
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 22
Produkt ist nicht verfügbar
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C9KEAZ128AVLHR NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MCZ33742EGR2 MCZ33742EGR2 NXP USA Inc. MC33742.pdf Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MIMX9351DVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331XVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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C9KEAZN64AMLHR C9KEAZN64AMLHR NXP USA Inc. Description: C9KEAZN64AMLHR
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
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C9KEAZN64AMLH C9KEAZN64AMLH NXP USA Inc. Description: C9KEAZN64AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
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BGA3131J BGA3131J NXP USA Inc. BGA3131.pdf Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5MHz ~ 205MHz
RF Type: CATV
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37dB
Current - Supply: 660mA
Noise Figure: 6.5dB ~ 15dB
Supplier Device Package: 20-HVQFN (5x5)
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6000+3.08 EUR
Mindestbestellmenge: 6000
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S32E288ABCAAMJGT S32E288ABCAAMJGT NXP USA Inc. S32Z27_DS.pdf Description: IC
Packaging: Tray
Mounting Type: Surface Mount
auf Bestellung 200 Stücke:
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10+169.89 EUR
40+158.74 EUR
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PCA9540BD,112 PCA9540BD,112 NXP USA Inc. PCA9540B.pdf Description: IC INTERFACE SPECIALIZED 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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MPC8272VRPIEA MPC8272VRPIEA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH, 30
Packaging: Bulk
auf Bestellung 7 Stücke:
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4+129.29 EUR
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S32M24XEVB-C064 S32M24XEVB-C064 NXP USA Inc. S32M24xEVB-L064.pdf Description: S32M24XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M24X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
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1+317.2 EUR
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88W8864-B0-NMMC/AZ NXP USA Inc. 88W8864-FACT-SHEET.pdf Description: 802.11 A/B/G/N/AC 4X4 SINGLE-CHI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K366EHT1MJBSR S32K366EHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K366EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCXW716CMFPAR NXP USA Inc. MCXW71.pdf Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT1041DJM6B MIMXRT1041DJM6B NXP USA Inc. IMXRT1040CEC.pdf Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (11x11)
Number of I/O: 114
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MCXN236VDFR NXP USA Inc. MCXN23x.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH870502DT1 FXTH870502DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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NCF29AEXHN4/0100IY NXP USA Inc. Description: NCF29AEXHN4
Packaging: Cut Tape (CT)
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C9S12VR48AL0VLC NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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C9S12VR48AL0VLFR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLF NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08JE128CLK MC9S08JE128CLK NXP USA Inc. MC9S08JE128.pdf Description: IC MCU 8BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9332DVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
auf Bestellung 528 Stücke:
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1+29.06 EUR
10+23.17 EUR
25+21.69 EUR
176+19.57 EUR
352+19.06 EUR
528+18.8 EUR
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MIMX9332CVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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MIMX9352CVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9352XVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MPC17529EVEL MPC17529EVEL NXP USA Inc. MPC17529.pdf Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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PDTB143EUF PDTB143EUF NXP USA Inc. NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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6601+0.077 EUR
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N74F10N,602 N74F10N,602 NXP USA Inc. 74F10%2C11.pdf Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043ABXY NXP USA Inc. PTN36043A.pdf Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Number of Circuits: 2
auf Bestellung 28577 Stücke:
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MCF51AC128CCFGE MCF51AC128CCFGE NXP USA Inc. MCF51AC256.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M2-NAND-FLASH NXP USA Inc. Description: IC
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: GD5F2GM7, W25N02KW
Produkt ist nicht verfügbar
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UJA1078ATW/5W/2Z UJA1078ATW/5W/2Z NXP USA Inc. UJA1078A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.64 EUR
Mindestbestellmenge: 2000
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UJA1078ATW/5W/2Z UJA1078ATW/5W/2Z NXP USA Inc. UJA1078A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
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3+8.25 EUR
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N74F245N,602 N74F245N,602 NXP USA Inc. 74F245.pdf Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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FXLS8961AFR1 FXLS8961AFR1 NXP USA Inc. FXLS8961AF.pdf Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
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1250+3.14 EUR
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FXLS8961AFR1 FXLS8961AFR1 NXP USA Inc. FXLS8961AF.pdf Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
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MC33662JEFR2 MC33662JEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AZ 88W8987_SDS.pdf
88W8987-A2-NYEE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Cut Tape (CT)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
auf Bestellung 458 Stücke:
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Anzahl Preis
1+18.85 EUR
10+16.39 EUR
25+15.53 EUR
100+14.36 EUR
250+13.65 EUR
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LPC4078FBD144,551 LPC408X_7X.pdf
LPC4078FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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1+19.71 EUR
10+13.03 EUR
60+12.79 EUR
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LPC4074FBD144,551 LPC408X_7X.pdf
LPC4074FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4076FBD144E LPC408X_7X.pdf
LPC4076FBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/101Q534Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5340
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Q534K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5340
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1759FBD80Y LPC1759_58_56_54_52_51.pdf
LPC1759FBD80Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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1+20.75 EUR
10+16.35 EUR
25+15.25 EUR
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SPC5604BF2CLQ6R
SPC5604BF2CLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33285D MC33285.pdf
MC33285D
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Channel Type: Synchronous
Driven Configuration: High-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.7V, 1.7V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8347ECZQADDB MPC8347EEC.pdf
MPC8347ECZQADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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NAFE73388B40BSK NAFE73388.pdf
NAFE73388B40BSK
Hersteller: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 160 mW
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.85 EUR
10+23.96 EUR
25+22.49 EUR
100+22.39 EUR
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NAFE73388B40BSE NAFE73388.pdf
NAFE73388B40BSE
Hersteller: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 160 mW
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+37.31 EUR
10+29.95 EUR
25+28.11 EUR
100+26.09 EUR
260+25.09 EUR
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MPC862PVR66B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC862PVR66B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC8358ECVRAGDDA MPC8358EEC.pdf
MPC8358ECVRAGDDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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MC9S08DV48ACLC MC9S08DV60.pdf
MC9S08DV48ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U22FBD48/30QL LPC11U1X.pdf
LPC11U22FBD48/30QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 242 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.69 EUR
10+5.07 EUR
25+4.67 EUR
100+4.22 EUR
Mindestbestellmenge: 3
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MC56F81768LVLH MC56F81XXX.pdf
MC56F81768LVLH
Hersteller: NXP USA Inc.
Description: MC56F81768LVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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C9KEAZN8AMTGR
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AVTG
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AMFK
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZN8AMTG
C9KEAZN8AMTG
Hersteller: NXP USA Inc.
Description: C9KEAZN8AMTG
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 22
Produkt ist nicht verfügbar
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C9KEAZ128AVLHR
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MCZ33742EGR2 MC33742.pdf
MCZ33742EGR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MIMX9351DVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331XVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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C9KEAZN64AMLHR
C9KEAZN64AMLHR
Hersteller: NXP USA Inc.
Description: C9KEAZN64AMLHR
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
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C9KEAZN64AMLH
C9KEAZN64AMLH
Hersteller: NXP USA Inc.
Description: C9KEAZN64AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
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BGA3131J BGA3131.pdf
BGA3131J
Hersteller: NXP USA Inc.
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5MHz ~ 205MHz
RF Type: CATV
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37dB
Current - Supply: 660mA
Noise Figure: 6.5dB ~ 15dB
Supplier Device Package: 20-HVQFN (5x5)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+3.08 EUR
Mindestbestellmenge: 6000
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S32E288ABCAAMJGT S32Z27_DS.pdf
S32E288ABCAAMJGT
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Mounting Type: Surface Mount
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+201.34 EUR
10+169.89 EUR
40+158.74 EUR
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PCA9540BD,112 PCA9540B.pdf
PCA9540BD,112
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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MPC8272VRPIEA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8272VRPIEA
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH, 30
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+129.29 EUR
Mindestbestellmenge: 4
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S32M24XEVB-C064 S32M24xEVB-L064.pdf
S32M24XEVB-C064
Hersteller: NXP USA Inc.
Description: S32M24XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M24X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+317.2 EUR
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88W8864-B0-NMMC/AZ 88W8864-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: 802.11 A/B/G/N/AC 4X4 SINGLE-CHI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K366EHT1MJBSR S32K39-S32K37-DS.pdf
S32K366EHT1MJBSR
Hersteller: NXP USA Inc.
Description: S32K366EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCXW716CMFPAR MCXW71.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT1041DJM6B IMXRT1040CEC.pdf
MIMXRT1041DJM6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (11x11)
Number of I/O: 114
auf Bestellung 880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.44 EUR
10+12.86 EUR
25+11.96 EUR
100+10.98 EUR
250+10.51 EUR
880+9.13 EUR
Mindestbestellmenge: 2
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MCXN236VDFR MCXN23x.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH870502DT1
FXTH870502DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1998 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
73+6.28 EUR
Mindestbestellmenge: 73
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NCF29AEXHN4/0100IY
Hersteller: NXP USA Inc.
Description: NCF29AEXHN4
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLC
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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C9S12VR48AL0VLFR
Hersteller: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLF
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08JE128CLK MC9S08JE128.pdf
MC9S08JE128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9332DVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
auf Bestellung 528 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.06 EUR
10+23.17 EUR
25+21.69 EUR
176+19.57 EUR
352+19.06 EUR
528+18.8 EUR
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MIMX9332CVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX9352CVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9352XVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MPC17529EVEL MPC17529.pdf
MPC17529EVEL
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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PDTB143EUF NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw
PDTB143EUF
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
auf Bestellung 29187 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6601+0.077 EUR
Mindestbestellmenge: 6601
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N74F10N,602 74F10%2C11.pdf
N74F10N,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043A.pdf
PTN36043ABXY
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Number of Circuits: 2
auf Bestellung 28577 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.36 EUR
10+2.58 EUR
25+2.57 EUR
100+2.33 EUR
250+2.22 EUR
500+2 EUR
1000+1.78 EUR
2500+1.66 EUR
5000+1.59 EUR
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MCF51AC128CCFGE MCF51AC256.pdf
MCF51AC128CCFGE
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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M2-NAND-FLASH
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: GD5F2GM7, W25N02KW
Produkt ist nicht verfügbar
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UJA1078ATW/5W/2Z UJA1078A.pdf
UJA1078ATW/5W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.64 EUR
Mindestbestellmenge: 2000
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UJA1078ATW/5W/2Z UJA1078A.pdf
UJA1078ATW/5W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
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Anzahl Preis
3+8.25 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
250+5.02 EUR
500+4.87 EUR
1000+4.74 EUR
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N74F245N,602 74F245.pdf
N74F245N,602
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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FXLS8961AFR1 FXLS8961AF.pdf
FXLS8961AFR1
Hersteller: NXP USA Inc.
Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1250+3.14 EUR
Mindestbestellmenge: 1250
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FXLS8961AFR1 FXLS8961AF.pdf
FXLS8961AFR1
Hersteller: NXP USA Inc.
Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1583 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.8 EUR
5+4.28 EUR
10+4.09 EUR
25+3.86 EUR
50+3.71 EUR
100+3.57 EUR
500+3.28 EUR
Mindestbestellmenge: 4
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MC33662JEFR2 MC33662.pdf
MC33662JEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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