Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (37062) > Seite 579 nach 618

Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth

Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth

Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth

Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: DIODE 100V 250MA SC-90
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: I.MX 93 AUTO-TM
Packaging: Tray
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART

Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 4A TO220AB
Packaging: Tube

Hersteller: NXP USA Inc.
Description: DIODE STANDARD 600V 4A DO201AD
Packaging: Tube
Package / Case: DO-201AD, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 65 ns
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: DO-201AD
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.28 V @ 4 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V

Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART

Hersteller: NXP USA Inc.
Description: TRIAC 800V 16A TO220AB
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.85V 1A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 2.85V
PSRR: 63dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature

Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 500MW SOD123F
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: DIODE ARRAY 150V 30A TO220AB
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20TSSOP
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4

Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.5V 250MW TO236AB
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-TSSOP

Hersteller: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SO

Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: IC LCD DVR UNVRSL LOW-MUX 40VSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS PNP 500MA 45V SOT23
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANSISTOR PNP 45V 100MA SOT23
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die

Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer

Hersteller: NXP USA Inc.
Description: TRANS NPN 50V 3A SOT89
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: DIODE ZENER 7.5V 1W DO41
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)

Hersteller: NXP USA Inc.
Description: TRANSISTOR RF LDMOS SOT800
Packaging: Tray

Hersteller: NXP USA Inc.
Description: QORIQ, 32-BIT POWER ARCH SOC, 1G
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 400MW SOD323
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRIAC 800V 4A DPAK
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: THYRISTOR 600V 8A IPAK
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: THYRISTOR 500V 8A SOT186A
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: THYRISTOR 800V 8A SOT186A
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: THYRISTOR 600V 8A SOT186A
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC HEX INV LEVEL SHIFTER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO

Hersteller: NXP USA Inc.
Description: IC HEX INV LEVEL SHIFTER 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO

Hersteller: NXP USA Inc.
Description: IC HEX INV LEVEL SHIFTER 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP

Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 6V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx

Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD L-SIDE 20-HSOP
Packaging: Tube
Output Type: N-Channel
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage

Hersteller: NXP USA Inc.
Description: IC AUDIO AMP D 100-HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)

Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)

Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)

Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4

Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4

Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4