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MC68302CEH20C MC68302CEH20C NXP USA Inc. MC68302FACT.pdf Description: IC MPU M683XX 20MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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J3R200PAU15/0ZB86V NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PMU15/0ZB42V NXP USA Inc. Description: J3R200PMU15/0ZB42V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PIU15/0ZA3FV NXP USA Inc. Description: J3R200PIU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PAU15/0ZA3FV NXP USA Inc. Description: J3R200PAU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200P1U15/0ZA45V NXP USA Inc. Description: J3R200P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PBU15/0ZA3FV NXP USA Inc. Description: J3R200PBU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200BDU15/0ZB40V NXP USA Inc. Description: J3R200BDU15/0ZB40V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PPU15/0ZA7CV NXP USA Inc. Description: J3R200PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PPU15/0ZA7CV NXP USA Inc. Description: J3R150PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PTU15/0ZA96V NXP USA Inc. Description: J3R150PTU15
Packaging: Tray
Produkt ist nicht verfügbar
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MMA2612KW MMA2612KW NXP USA Inc. Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±125g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AD MCIMX6D6AVT08AD NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 182 Stücke:
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1+135.33 EUR
10+112.62 EUR
60+102.74 EUR
120+100.07 EUR
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MC68F375BGMVR33 NXP USA Inc. MC68F375RM.pdf Description: IC MCU 32BIT 256KB FLASH 217PBGA
Packaging: Tray
Package / Case: 217-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: CANbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 217-PBGA (23x23)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908KX2CDWE MC908KX2CDWE NXP USA Inc. MC68HC908KX8.pdf Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908KX2CDWER MC908KX2CDWER NXP USA Inc. MC68HC908KX8.pdf Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTA124TM,315 PDTA124TM,315 NXP USA Inc. PDTA124T_SERIES.pdf Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 190000 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.05 EUR
Mindestbestellmenge: 11871
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74ALVC244D,118 74ALVC244D,118 NXP USA Inc. PHGLS11912-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
auf Bestellung 2010 Stücke:
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1116+0.45 EUR
Mindestbestellmenge: 1116
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MIMX8ML2DVNLZAB MIMX8ML2DVNLZAB NXP USA Inc. MIMX8ML2DVNLZAB.pdf Description: MIMX8ML2DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
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1+68.85 EUR
10+56.24 EUR
25+53.09 EUR
126+49.18 EUR
252+47.97 EUR
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MIMX8ML5DVNLZAB MIMX8ML5DVNLZAB NXP USA Inc. MIMX8ML2CVNKZAB.pdf Description: MIMX8ML5DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
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1+63.24 EUR
10+51.87 EUR
25+50.42 EUR
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MIMX8ML5CVNKZAB MIMX8ML5CVNKZAB NXP USA Inc. MIMX8ML2CVNKZAB.pdf Description: MIMX8ML5CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 620 Stücke:
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1+68.62 EUR
10+56.43 EUR
25+55.09 EUR
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MIMX8ML2CVNKZAB MIMX8ML2CVNKZAB NXP USA Inc. MIMX8ML2CVNKZAB.pdf Description: MIMX8ML2CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
1+53.93 EUR
10+44.03 EUR
25+42.44 EUR
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MC34PF8100CHEPR2 MC34PF8100CHEPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC34PF8100CHEP MC34PF8100CHEP NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB MCIMX6V2CVM08AB NXP USA Inc. IMX6SLLIEC.pdf Description: I.MX 6 SERIES 32-BIT MPU, ARM CO
Packaging: Bulk
auf Bestellung 289 Stücke:
Lieferzeit 10-14 Tag (e)
24+21.46 EUR
Mindestbestellmenge: 24
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PN7642EV/C101Y NXP USA Inc. PN7642.pdf Description: PN7642EV/C101Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MC9S08SH8MTGR MC9S08SH8MTGR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S16JBD64K LPC55S16JBD64K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.59 EUR
10+6.72 EUR
25+6.41 EUR
40+6.26 EUR
80+6.04 EUR
230+5.74 EUR
Mindestbestellmenge: 3
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SPC5746RK1MMT5R SPC5746RK1MMT5R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC56F8255MLD MC56F8255MLD NXP USA Inc. FSCLS11848-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
39+13.27 EUR
Mindestbestellmenge: 39
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MFS8412AMBP7ES MFS8412AMBP7ES NXP USA Inc. FS84QFN48EP.pdf Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LFVBBOJ76Z1A NXP USA Inc. Description: QORIVVA MPC5676R 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Base Board
Produkt ist nicht verfügbar
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BC69-16PASX BC69-16PASX NXP USA Inc. NEXP-S-A0002912321-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 20V 2A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
Frequency - Transition: 140MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 420 mW
auf Bestellung 66000 Stücke:
Lieferzeit 10-14 Tag (e)
3776+0.14 EUR
Mindestbestellmenge: 3776
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S912XEG384BCAA S912XEG384BCAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAA S912XEQ384BCAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-B68,215 BZX84-B68,215 NXP USA Inc. BZX84_Series.pdf Description: DIODE ZENER 68V 250MW SOT23
Packaging: Bulk
auf Bestellung 233696 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.03 EUR
Mindestbestellmenge: 13172
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BZT52H-C2V7,115 BZT52H-C2V7,115 NXP USA Inc. NEXP-S-A0002882686-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 2.7V 375MW SOD123F
Packaging: Bulk
auf Bestellung 81728 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.03 EUR
Mindestbestellmenge: 13172
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74HCT153D,653 74HCT153D,653 NXP USA Inc. 74HC_HCT153.pdf Description: IC MULTIPLEXER 4-INPUT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HCT153DB,112 74HCT153DB,112 NXP USA Inc. 74HC_HCT153.pdf Description: IC DUAL 4-INPUT MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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MC56F8246VLFR MC56F8246VLFR NXP USA Inc. MC56F825X.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P1016NSE5FFB P1016NSE5FFB NXP USA Inc. Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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MGD3160AM535EKT MGD3160AM535EKT NXP USA Inc. PB_GD3160.pdf Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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MGD3160AM335EKT MGD3160AM335EKT NXP USA Inc. PB_GD3160.pdf Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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PCF8885TS/1,118 PCF8885TS/1,118 NXP USA Inc. PCF8885.pdf Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
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PCA2002DUS/DAZ NXP USA Inc. PCA2002.pdf Description: IC WATCH CIRCUIT 8WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Watch Circuit
Supplier Device Package: 8-WLCSP (1.16x0.86)
Produkt ist nicht verfügbar
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74LVTH574PW,118 74LVTH574PW,118 NXP USA Inc. 74LVT%28H%29574.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
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Lieferzeit 10-14 Tag (e)
1025+0.49 EUR
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MW7IC2220GNR1 NXP USA Inc. MW7IC2220.pdf Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31dB
Current - Supply: 300mA
P1dB: 43dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16 GULL
Produkt ist nicht verfügbar
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FRDM-IMX93 FRDM-IMX93 NXP USA Inc. FRDM-IMX93.pdf Description: FRDM dev board - i.MX 93
Packaging: Box
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S912ZVML64F3VKHR S912ZVML64F3VKHR NXP USA Inc. Description: S12Z CORE, 64K FLASH, LIN, 64LQF
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 24
Produkt ist nicht verfügbar
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RW610UK/A2IZ RW610UK/A2IZ NXP USA Inc. RW61XFS.pdf Description: RW610UK/A2IZ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OT406,135 OT406,135 NXP USA Inc. OT406.pdf Description: TRIAC SC73
Packaging: Bulk
auf Bestellung 7672 Stücke:
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2049+0.25 EUR
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MML20242HT1 MML20242HT1 NXP USA Inc. MML20242H.pdf Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
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MC68HC908QT4CPE MC68HC908QT4CPE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1044DTK/0J TJA1044DTK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044DTK/0J
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044BTK/0J TJA1044BTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5655 Stücke:
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11+1.74 EUR
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25+1.15 EUR
100+0.92 EUR
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500+0.72 EUR
1000+0.64 EUR
2500+0.56 EUR
Mindestbestellmenge: 11
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TJA1044ET/0Z TJA1044ET/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044ET/0Z
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.74 EUR
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25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
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TJA1044ETK/0J TJA1044ETK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044ETK/0J
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044CT/0Z TJA1044CT/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2368 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
Mindestbestellmenge: 11
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TJA1044CTK/0J TJA1044CTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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11+1.74 EUR
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100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
2500+0.56 EUR
Mindestbestellmenge: 11
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TJA1044DT/0Z TJA1044DT/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044DT/0Z
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.74 EUR
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250+0.80 EUR
500+0.72 EUR
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Mindestbestellmenge: 11
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MC68302CEH20C MC68302FACT.pdf
MC68302CEH20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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J3R200PAU15/0ZB86V
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PMU15/0ZB42V
Hersteller: NXP USA Inc.
Description: J3R200PMU15/0ZB42V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PIU15/0ZA3FV
Hersteller: NXP USA Inc.
Description: J3R200PIU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PAU15/0ZA3FV
Hersteller: NXP USA Inc.
Description: J3R200PAU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200P1U15/0ZA45V
Hersteller: NXP USA Inc.
Description: J3R200P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PBU15/0ZA3FV
Hersteller: NXP USA Inc.
Description: J3R200PBU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200BDU15/0ZB40V
Hersteller: NXP USA Inc.
Description: J3R200BDU15/0ZB40V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PPU15/0ZA7CV
Hersteller: NXP USA Inc.
Description: J3R200PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PPU15/0ZA7CV
Hersteller: NXP USA Inc.
Description: J3R150PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PTU15/0ZA96V
Hersteller: NXP USA Inc.
Description: J3R150PTU15
Packaging: Tray
Produkt ist nicht verfügbar
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MMA2612KW
MMA2612KW
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±125g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AD IMX6DQIEC.pdf
MCIMX6D6AVT08AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+135.33 EUR
10+112.62 EUR
60+102.74 EUR
120+100.07 EUR
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MC68F375BGMVR33 MC68F375RM.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 217PBGA
Packaging: Tray
Package / Case: 217-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: CANbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 217-PBGA (23x23)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908KX2CDWE MC68HC908KX8.pdf
MC908KX2CDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908KX2CDWER MC68HC908KX8.pdf
MC908KX2CDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTA124TM,315 PDTA124T_SERIES.pdf
PDTA124TM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 190000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11871+0.05 EUR
Mindestbestellmenge: 11871
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74ALVC244D,118 PHGLS11912-1.pdf?t.download=true&u=5oefqw
74ALVC244D,118
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
auf Bestellung 2010 Stücke:
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Anzahl Preis
1116+0.45 EUR
Mindestbestellmenge: 1116
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MIMX8ML2DVNLZAB MIMX8ML2DVNLZAB.pdf
MIMX8ML2DVNLZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML2DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+68.85 EUR
10+56.24 EUR
25+53.09 EUR
126+49.18 EUR
252+47.97 EUR
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MIMX8ML5DVNLZAB MIMX8ML2CVNKZAB.pdf
MIMX8ML5DVNLZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML5DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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Anzahl Preis
1+63.24 EUR
10+51.87 EUR
25+50.42 EUR
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MIMX8ML5CVNKZAB MIMX8ML2CVNKZAB.pdf
MIMX8ML5CVNKZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML5CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 620 Stücke:
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Anzahl Preis
1+68.62 EUR
10+56.43 EUR
25+55.09 EUR
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MIMX8ML2CVNKZAB MIMX8ML2CVNKZAB.pdf
MIMX8ML2CVNKZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML2CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+53.93 EUR
10+44.03 EUR
25+42.44 EUR
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MC34PF8100CHEPR2 PF8100_PF8200.pdf
MC34PF8100CHEPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC34PF8100CHEP PF8100_PF8200.pdf
MC34PF8100CHEP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB IMX6SLLIEC.pdf
MCIMX6V2CVM08AB
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU, ARM CO
Packaging: Bulk
auf Bestellung 289 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+21.46 EUR
Mindestbestellmenge: 24
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PN7642EV/C101Y PN7642.pdf
Hersteller: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MC9S08SH8MTGR MC9S08SH8.pdf
MC9S08SH8MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S16JBD64K LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.59 EUR
10+6.72 EUR
25+6.41 EUR
40+6.26 EUR
80+6.04 EUR
230+5.74 EUR
Mindestbestellmenge: 3
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SPC5746RK1MMT5R
SPC5746RK1MMT5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC56F8255MLD FSCLS11848-1.pdf?t.download=true&u=5oefqw
MC56F8255MLD
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
39+13.27 EUR
Mindestbestellmenge: 39
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MFS8412AMBP7ES FS84QFN48EP.pdf
MFS8412AMBP7ES
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LFVBBOJ76Z1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676R 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Base Board
Produkt ist nicht verfügbar
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BC69-16PASX NEXP-S-A0002912321-1.pdf?t.download=true&u=5oefqw
BC69-16PASX
Hersteller: NXP USA Inc.
Description: TRANS PNP 20V 2A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
Frequency - Transition: 140MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 420 mW
auf Bestellung 66000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3776+0.14 EUR
Mindestbestellmenge: 3776
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S912XEG384BCAA
S912XEG384BCAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAA
S912XEQ384BCAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-B68,215 BZX84_Series.pdf
BZX84-B68,215
Hersteller: NXP USA Inc.
Description: DIODE ZENER 68V 250MW SOT23
Packaging: Bulk
auf Bestellung 233696 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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BZT52H-C2V7,115 NEXP-S-A0002882686-1.pdf?t.download=true&u=5oefqw
BZT52H-C2V7,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 2.7V 375MW SOD123F
Packaging: Bulk
auf Bestellung 81728 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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74HCT153D,653 74HC_HCT153.pdf
74HCT153D,653
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 4-INPUT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 4156 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1995+0.25 EUR
Mindestbestellmenge: 1995
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74HCT153DB,112 74HC_HCT153.pdf
74HCT153DB,112
Hersteller: NXP USA Inc.
Description: IC DUAL 4-INPUT MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 2184 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
807+0.62 EUR
Mindestbestellmenge: 807
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MC56F8246VLFR MC56F825X.pdf
MC56F8246VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P1016NSE5FFB
P1016NSE5FFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+126.72 EUR
Mindestbestellmenge: 4
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MGD3160AM535EKT PB_GD3160.pdf
MGD3160AM535EKT
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 316 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.19 EUR
10+12.61 EUR
25+11.72 EUR
176+10.43 EUR
Mindestbestellmenge: 2
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MGD3160AM335EKT PB_GD3160.pdf
MGD3160AM335EKT
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.19 EUR
10+12.61 EUR
25+11.72 EUR
176+10.43 EUR
Mindestbestellmenge: 2
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PCF8885TS/1,118 PCF8885.pdf
PCF8885TS/1,118
Hersteller: NXP USA Inc.
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
auf Bestellung 71605 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
138+3.68 EUR
Mindestbestellmenge: 138
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PCA2002DUS/DAZ PCA2002.pdf
Hersteller: NXP USA Inc.
Description: IC WATCH CIRCUIT 8WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Watch Circuit
Supplier Device Package: 8-WLCSP (1.16x0.86)
Produkt ist nicht verfügbar
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74LVTH574PW,118 74LVT%28H%29574.pdf
74LVTH574PW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1025+0.49 EUR
Mindestbestellmenge: 1025
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MW7IC2220GNR1 MW7IC2220.pdf
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31dB
Current - Supply: 300mA
P1dB: 43dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16 GULL
Produkt ist nicht verfügbar
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FRDM-IMX93 FRDM-IMX93.pdf
FRDM-IMX93
Hersteller: NXP USA Inc.
Description: FRDM dev board - i.MX 93
Packaging: Box
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+123.80 EUR
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S912ZVML64F3VKHR
S912ZVML64F3VKHR
Hersteller: NXP USA Inc.
Description: S12Z CORE, 64K FLASH, LIN, 64LQF
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 24
Produkt ist nicht verfügbar
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RW610UK/A2IZ RW61XFS.pdf
RW610UK/A2IZ
Hersteller: NXP USA Inc.
Description: RW610UK/A2IZ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OT406,135 OT406.pdf
OT406,135
Hersteller: NXP USA Inc.
Description: TRIAC SC73
Packaging: Bulk
auf Bestellung 7672 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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MML20242HT1 MML20242H.pdf
MML20242HT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 34dB
Current - Supply: 160mA
Noise Figure: 0.57dB
P1dB: 24dBm
Test Frequency: 1.95GHz
Supplier Device Package: 12-QFN (3x3)
auf Bestellung 1199 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
66+7.77 EUR
Mindestbestellmenge: 66
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MC68HC908QT4CPE MC68HC908QY4.pdf
MC68HC908QT4CPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1044DTK/0J TJA1044.pdf
TJA1044DTK/0J
Hersteller: NXP USA Inc.
Description: TJA1044DTK/0J
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044BTK/0J TJA1044.pdf
TJA1044BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5655 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
2500+0.56 EUR
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TJA1044ET/0Z TJA1044.pdf
TJA1044ET/0Z
Hersteller: NXP USA Inc.
Description: TJA1044ET/0Z
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
Mindestbestellmenge: 11
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TJA1044ETK/0J TJA1044.pdf
TJA1044ETK/0J
Hersteller: NXP USA Inc.
Description: TJA1044ETK/0J
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044CT/0Z TJA1044.pdf
TJA1044CT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2368 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
Mindestbestellmenge: 11
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TJA1044CTK/0J TJA1044.pdf
TJA1044CTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
2500+0.56 EUR
Mindestbestellmenge: 11
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TJA1044DT/0Z TJA1044.pdf
TJA1044DT/0Z
Hersteller: NXP USA Inc.
Description: TJA1044DT/0Z
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.80 EUR
500+0.72 EUR
1000+0.64 EUR
Mindestbestellmenge: 11
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