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MPC8315ECVRAGDA MPC8315ECVRAGDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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S9S12VRP64F0MLFR NXP USA Inc. Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC908AP8ACFBE MC908AP8ACFBE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP16ACFBE557 MC908AP16ACFBE557 NXP USA Inc. MC68HC908AP64A.pdf Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T2081NSN8T1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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74AUP1T34GM,132 74AUP1T34GM,132 NXP USA Inc. PHGLS28626-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
auf Bestellung 470000 Stücke:
Lieferzeit 10-14 Tag (e)
2551+0.2 EUR
Mindestbestellmenge: 2551
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74AUP1T34GN,132 74AUP1T34GN,132 NXP USA Inc. 74AUP1T34.pdf Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 57632 Stücke:
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1800+0.29 EUR
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TDA19988AET/C1,151 NXP USA Inc. Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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TDA19988BET/C1,151 NXP USA Inc. Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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74LVC2G04GXZ 74LVC2G04GXZ NXP USA Inc. 74LVC2G04.pdf Description: IC INVERTER DUAL
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 89400 Stücke:
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3056+0.15 EUR
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MC56F84550VLF MC56F84550VLF NXP USA Inc. Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F84550VLFR MC56F84550VLFR NXP USA Inc. MC56F8455X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HEF4894BTT,118 HEF4894BTT,118 NXP USA Inc. PHGLS23994-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA HEF4894BTT - 12-STA
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 12
auf Bestellung 3020 Stücke:
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480+1.06 EUR
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UJA1079ATW/3/2Z UJA1079ATW/3/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UJA1079ATW/5/2Z UJA1079ATW/5/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UJA1079ATW/3W/2Z UJA1079ATW/3W/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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A7101CHTK2/T0BC2VJ A7101CHTK2/T0BC2VJ NXP USA Inc. A71CH.pdf Description: SECURE AUTHENTICATION
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
DigiKey Programmable: Not Verified
auf Bestellung 1897 Stücke:
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183+2.76 EUR
Mindestbestellmenge: 183
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MKW31Z256VHT4 MKW31Z256VHT4 NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU BLE 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
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3+7.08 EUR
10+6.26 EUR
Mindestbestellmenge: 3
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MPC8347VRADDB MPC8347VRADDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MRF8P20100HSR3 MRF8P20100HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 20W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 400 mA
Produkt ist nicht verfügbar
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SPC5605BF1MLU6R SPC5605BF1MLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-MCXC444 FRDM-MCXC444 NXP USA Inc. MCXCFS.pdf Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
auf Bestellung 54 Stücke:
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2+16.93 EUR
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K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN36502AHQX PTN36502AHQX NXP USA Inc. PTN36502.pdf Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN36502AHQX PTN36502AHQX NXP USA Inc. PTN36502.pdf Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Cut Tape (CT)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 2427 Stücke:
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3+7.53 EUR
10+5.72 EUR
25+5.27 EUR
100+4.77 EUR
250+4.54 EUR
500+4.39 EUR
1000+4.28 EUR
Mindestbestellmenge: 3
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PTN36502HQX PTN36502HQX NXP USA Inc. PTN36502.pdf Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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PTN36502HQX PTN36502HQX NXP USA Inc. PTN36502.pdf Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Cut Tape (CT)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
auf Bestellung 1832 Stücke:
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3+7.53 EUR
10+5.72 EUR
25+5.27 EUR
100+4.77 EUR
250+4.54 EUR
500+4.39 EUR
1000+4.28 EUR
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74LVC2G32DC,125 74LVC2G32DC,125 NXP USA Inc. 74LVC2G32.pdf Description: IC GATE OR 2CH 2-INP 8-VSSOP
Packaging: Bulk
auf Bestellung 276423 Stücke:
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2126+0.24 EUR
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74AUP2G132GD,125 74AUP2G132GD,125 NXP USA Inc. 74AUP2G132.pdf Description: IC GATE NAND 2CH 2-INP 8-XSON
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
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2049+0.25 EUR
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74AUP2G126GD,125 74AUP2G126GD,125 NXP USA Inc. 74AUP2G126.pdf Description: IC BUFFER/LINEDVR DUAL XSON8U
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (2x3)
auf Bestellung 84319 Stücke:
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2049+0.24 EUR
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SC900719BAFR2 NXP USA Inc. Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC900719BAF NXP USA Inc. Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tray
Produkt ist nicht verfügbar
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S912XET256BCAAR S912XET256BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BCAAR S912XEG384BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8200A0ESR2 MC33PF8200A0ESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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FXPS71407BPST1 NXP USA Inc. Description: FXPS71407BPST1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K322NHT0VPBSR S32K322NHT0VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PSMN020-30MLCX PSMN020-30MLCX NXP USA Inc. PSMN020-30MLC.pdf Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc)
Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V
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MPC8264AZUPIBB MPC8264AZUPIBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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FB32K116LIT0VFMT NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Produkt ist nicht verfügbar
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SL3S1205FUD2/HAPBZ NXP USA Inc. SL3S1205_15.pdf Description: SL3S1205FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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SL3S1205FUD2/HAPA NXP USA Inc. SL3S1205_15.pdf Description: SL3S1205FUD2/HAPA
Packaging: Bulk
Produkt ist nicht verfügbar
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PDTA123TU,115 PDTA123TU,115 NXP USA Inc. PDTA123T_SER.pdf Description: TRANS PREBIAS PNP 200MW SOT323
Packaging: Bulk
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PDTA123EMB,315 PDTA123EMB,315 NXP USA Inc. PHGLS24543-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
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PDTA123TMB,315 PDTA123TMB,315 NXP USA Inc. PHGLS24846-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistors Included: R1 Only
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MC908EY16MFAE MC908EY16MFAE NXP USA Inc. MC68HC908EY16%2C8.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AC8MFGE MC9S08AC8MFGE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NVT2008BQZ NVT2008BQZ NXP USA Inc. NVT2008_NVT2010.pdf Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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SL2S3103FUDA NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2613AMDH3ADR2 NXP USA Inc. Description: MFS2613AMDH3ADR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXW716AMFTAT MCXW716AMFTAT NXP USA Inc. MCXW71.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.8V ~ 1.98V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Matter, Thread, Zigbee®
Current - Receiving: 3.69mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.75mA ~ 20.99mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 29
Modulation: 2FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART
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S9S08SG16E1WTG S9S08SG16E1WTG NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
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TJA1057BTK/0J TJA1057BTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057CTK/0J TJA1057CTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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1000+0.64 EUR
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PZU20B2,115 PZU20B2,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 20V 310MW SOD323F
Packaging: Bulk
auf Bestellung 66120 Stücke:
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PCA9530D,112 PCA9530D,112 NXP USA Inc. PCA9530.pdf Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C, SMBus
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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MCXA176VLL NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08DZ32CLF MC9S08DZ32CLF NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32CLH MC9S08DZ32CLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G79GM,132 74LVC1G79GM,132 NXP USA Inc. PHGLS25116-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Bits per Element: 1
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MPC8315ECVRAGDA MPC8315EEC.pdf
MPC8315ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
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S9S12VRP64F0MLFR
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC908AP8ACFBE MC68HC908AP64A.pdf
MC908AP8ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP16ACFBE557 MC68HC908AP64A.pdf
MC908AP16ACFBE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T2081NSN8T1B T2080FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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74AUP1T34GM,132 PHGLS28626-1.pdf?t.download=true&u=5oefqw
74AUP1T34GM,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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74AUP1T34GN,132 74AUP1T34.pdf
74AUP1T34GN,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
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TDA19988AET/C1,151
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
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TDA19988BET/C1,151
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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74LVC2G04GXZ 74LVC2G04.pdf
74LVC2G04GXZ
Hersteller: NXP USA Inc.
Description: IC INVERTER DUAL
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 89400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3056+0.15 EUR
Mindestbestellmenge: 3056
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MC56F84550VLF
MC56F84550VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F84550VLFR MC56F8455X.pdf
MC56F84550VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HEF4894BTT,118 PHGLS23994-1.pdf?t.download=true&u=5oefqw
HEF4894BTT,118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA HEF4894BTT - 12-STA
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 12
auf Bestellung 3020 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
480+1.06 EUR
Mindestbestellmenge: 480
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UJA1079ATW/3/2Z
UJA1079ATW/3/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UJA1079ATW/5/2Z
UJA1079ATW/5/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UJA1079ATW/3W/2Z
UJA1079ATW/3W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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A7101CHTK2/T0BC2VJ A71CH.pdf
A7101CHTK2/T0BC2VJ
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
DigiKey Programmable: Not Verified
auf Bestellung 1897 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
183+2.76 EUR
Mindestbestellmenge: 183
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MKW31Z256VHT4 MKW41Z512.pdf
MKW31Z256VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.08 EUR
10+6.26 EUR
Mindestbestellmenge: 3
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MPC8347VRADDB MPC8347EEC.pdf
MPC8347VRADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MRF8P20100HSR3
MRF8P20100HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 20W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 400 mA
Produkt ist nicht verfügbar
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SPC5605BF1MLU6R MPC560XBFAMFS.pdf
SPC5605BF1MLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-MCXC444 MCXCFS.pdf
FRDM-MCXC444
Hersteller: NXP USA Inc.
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.93 EUR
Mindestbestellmenge: 2
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K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN36502AHQX PTN36502.pdf
PTN36502AHQX
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN36502AHQX PTN36502.pdf
PTN36502AHQX
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Cut Tape (CT)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 2427 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.53 EUR
10+5.72 EUR
25+5.27 EUR
100+4.77 EUR
250+4.54 EUR
500+4.39 EUR
1000+4.28 EUR
Mindestbestellmenge: 3
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PTN36502HQX PTN36502.pdf
PTN36502HQX
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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PTN36502HQX PTN36502.pdf
PTN36502HQX
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Cut Tape (CT)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
auf Bestellung 1832 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.53 EUR
10+5.72 EUR
25+5.27 EUR
100+4.77 EUR
250+4.54 EUR
500+4.39 EUR
1000+4.28 EUR
Mindestbestellmenge: 3
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74LVC2G32DC,125 74LVC2G32.pdf
74LVC2G32DC,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8-VSSOP
Packaging: Bulk
auf Bestellung 276423 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2126+0.24 EUR
Mindestbestellmenge: 2126
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74AUP2G132GD,125 74AUP2G132.pdf
74AUP2G132GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 447102 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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74AUP2G126GD,125 74AUP2G126.pdf
74AUP2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (2x3)
auf Bestellung 84319 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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SC900719BAFR2
Hersteller: NXP USA Inc.
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC900719BAF
Hersteller: NXP USA Inc.
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tray
Produkt ist nicht verfügbar
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S912XET256BCAAR MC9S12XEP100RMV1.pdf
S912XET256BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BCAAR MC9S12XEP100RMV1.pdf
S912XEG384BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8200A0ESR2 PF8100_PF8200.pdf
MC33PF8200A0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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FXPS71407BPST1
Hersteller: NXP USA Inc.
Description: FXPS71407BPST1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K322NHT0VPBSR S32K3xx.pdf
S32K322NHT0VPBSR
Hersteller: NXP USA Inc.
Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PSMN020-30MLCX PSMN020-30MLC.pdf
PSMN020-30MLCX
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc)
Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2308+0.22 EUR
Mindestbestellmenge: 2308
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MPC8264AZUPIBB MPC8260A.pdf
MPC8264AZUPIBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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FB32K116LIT0VFMT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Produkt ist nicht verfügbar
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SL3S1205FUD2/HAPBZ SL3S1205_15.pdf
Hersteller: NXP USA Inc.
Description: SL3S1205FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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SL3S1205FUD2/HAPA SL3S1205_15.pdf
Hersteller: NXP USA Inc.
Description: SL3S1205FUD2/HAPA
Packaging: Bulk
Produkt ist nicht verfügbar
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PDTA123TU,115 PDTA123T_SER.pdf
PDTA123TU,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 200MW SOT323
Packaging: Bulk
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.034 EUR
Mindestbestellmenge: 13172
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PDTA123EMB,315 PHGLS24543-1.pdf?t.download=true&u=5oefqw
PDTA123EMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
auf Bestellung 139871 Stücke:
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Anzahl Preis
11225+0.05 EUR
Mindestbestellmenge: 11225
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PDTA123TMB,315 PHGLS24846-1.pdf?t.download=true&u=5oefqw
PDTA123TMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistors Included: R1 Only
auf Bestellung 110000 Stücke:
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Anzahl Preis
11225+0.05 EUR
Mindestbestellmenge: 11225
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MC908EY16MFAE MC68HC908EY16%2C8.pdf
MC908EY16MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AC8MFGE MC9S08AC16.pdf
MC9S08AC8MFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NVT2008BQZ NVT2008_NVT2010.pdf
NVT2008BQZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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SL2S3103FUDA
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2613AMDH3ADR2
Hersteller: NXP USA Inc.
Description: MFS2613AMDH3ADR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXW716AMFTAT MCXW71.pdf
MCXW716AMFTAT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.8V ~ 1.98V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Matter, Thread, Zigbee®
Current - Receiving: 3.69mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.75mA ~ 20.99mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 29
Modulation: 2FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.16 EUR
10+9.46 EUR
25+8.78 EUR
100+8.29 EUR
Mindestbestellmenge: 2
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S9S08SG16E1WTG MC9S08SG32.pdf
S9S08SG16E1WTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 768 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
107+4.75 EUR
Mindestbestellmenge: 107
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TJA1057BTK/0J TJA1057.pdf
TJA1057BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4975 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.8 EUR
500+0.72 EUR
1000+0.64 EUR
2500+0.56 EUR
Mindestbestellmenge: 11
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TJA1057CTK/0J TJA1057.pdf
TJA1057CTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.74 EUR
14+1.31 EUR
25+1.15 EUR
100+0.92 EUR
250+0.8 EUR
500+0.72 EUR
1000+0.64 EUR
2500+0.56 EUR
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PZU20B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B2,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 20V 310MW SOD323F
Packaging: Bulk
auf Bestellung 66120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10804+0.051 EUR
Mindestbestellmenge: 10804
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PCA9530D,112 PCA9530.pdf
PCA9530D,112
Hersteller: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C, SMBus
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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MCXA176VLL
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08DZ32CLF
MC9S08DZ32CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32CLH
MC9S08DZ32CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G79GM,132 PHGLS25116-1.pdf?t.download=true&u=5oefqw
74LVC1G79GM,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 120000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4661+0.1 EUR
Mindestbestellmenge: 4661
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