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IMX95LPD5EVK-19 NXP USA Inc. Description: EVAL BOARD FOR I.MX 95
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
Produkt ist nicht verfügbar
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MWPR1516CFM MWPR1516CFM NXP USA Inc. FSCL-S-A0000210124-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7 Description: WIRELESS CHARGER RECEIVER ASSP W
Packaging: Bulk
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Receiver
Current - Supply: 120mA
Supplier Device Package: 32-QFN (5x5)
auf Bestellung 980 Stücke:
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132+3.41 EUR
Mindestbestellmenge: 132
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MRF6V2300NR1 MRF6V2300NR1 NXP USA Inc. MRF6V2300N%28B%29R1.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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MRF6V2300NR1 MRF6V2300NR1 NXP USA Inc. MRF6V2300N%28B%29R1.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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SAF4000EL/103Q534Y NXP USA Inc. Description: SAF4000EL/103Q534Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KIT-TJA1121-SDBS NXP USA Inc. Description: KIT-TJA1121-SDBS
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F83766MLK MC56F83766MLK NXP USA Inc. MC56F836XXDS.pdf Description: IC MCU 32BIT 128MB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
Produkt ist nicht verfügbar
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MC56F83786MLK MC56F83786MLK NXP USA Inc. MC56F836XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
Produkt ist nicht verfügbar
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MPXHZ6115A6T1 MPXHZ6115A6T1 NXP USA Inc. MPXA6115A.pdf description Description: SENSOR 16.68PSIA 4.7V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 1000 Stücke:
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1000+15.52 EUR
Mindestbestellmenge: 1000
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MPXHZ6115A6T1 MPXHZ6115A6T1 NXP USA Inc. MPXA6115A.pdf description Description: SENSOR 16.68PSIA 4.7V 8SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 1304 Stücke:
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1+21.79 EUR
5+19.81 EUR
10+19.08 EUR
25+18.2 EUR
50+17.6 EUR
100+17.47 EUR
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MIMXRT1187JVM8B NXP USA Inc. Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2610AMBA0ADR2 MFS2610AMBA0ADR2 NXP USA Inc. FS26_PB.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MFS2610AMBA0AD MFS2610AMBA0AD NXP USA Inc. FS26_PB.pdf Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MC7447AHX1420LB MC7447AHX1420LB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.42GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.42GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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WCT-15W1COILTX NXP USA Inc. WCT15W1COILTXFS.pdf Description: EVAL BOARD FOR MWCT1012CFM
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MWCT1012CFM
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
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PCA9535HF,118 PCA9535HF,118 NXP USA Inc. PCA9535_PCA9535C.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8787AHL/C3,151 TDA8787AHL/C3,151 NXP USA Inc. TDA8787A.pdf Description: IC CCD 10BIT 18M 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: CCD (Charged Coupled Device)
Data Interface: Serial
Operating Temperature: -20°C ~ 75°C
Voltage - Supply: 2.7V ~ 3.6V
Sampling Rate (Per Second): 18m
Resolution (Bits): 10 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 48-LQFP (7x7)
Number of Channels: 1
Produkt ist nicht verfügbar
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FRDM-STBI-A8971 FRDM-STBI-A8971 NXP USA Inc. FRDM-STBI-A8971.pdf Description: FRDM-STBI-A8971
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.64 EUR
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MCXE245VLFR MCXE245VLFR NXP USA Inc. Description: MCXE245 LQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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MC9S12DJ64MFUE MC9S12DJ64MFUE NXP USA Inc. 9S12DT256_ZIP.zip Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7770EL/202Z13CY NXP USA Inc. Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/202Z13CK NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SC32PF8121EKEP NXP USA Inc. Description: PMIC, 7 BUCK REG, 4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200KKESR2 NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMCM6501VNEZ PMCM6501VNEZ NXP USA Inc. PMCM6501VNE.pdf Description: PMCM6501VNE - 12V, N-CHANNEL TRE
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V
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1254+0.36 EUR
Mindestbestellmenge: 1254
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PMCM6501UNEZ PMCM6501UNEZ NXP USA Inc. PMCM6501UNE.pdf Description: PMCM6501UNE - 20V, N-CHANNEL TRE
Packaging: Bulk
auf Bestellung 4464 Stücke:
Lieferzeit 10-14 Tag (e)
1254+0.36 EUR
Mindestbestellmenge: 1254
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SL2S2602FUD/BGZ NXP USA Inc. SL2S2602.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: ISO 15693
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BGU8063J BGU8063J NXP USA Inc. BGU8063.pdf Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.5GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 20dB
Current - Supply: 75mA
Noise Figure: 1.4dB
P1dB: 19dBm
Supplier Device Package: 10-HVSON (3x3)
Produkt ist nicht verfügbar
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ASL2507SHNY ASL2507SHNY NXP USA Inc. ASL2500SHN.pdf Description: BOOST CONVERTER + FSO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KIT-TJA1121-SDBR NXP USA Inc. Description: KIT-TJA1121-SDBR
Packaging: Bulk
Produkt ist nicht verfügbar
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P3A1604UKAZ P3A1604UKAZ NXP USA Inc. P3A1604UK.pdf Description: IC XLTR VL BIDIR 12-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 40Mbps
Supplier Device Package: 12-WLCSP (1.06x1.41)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.63 V
Number of Circuits: 1
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4400+1 EUR
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P3A1604UKAZ P3A1604UKAZ NXP USA Inc. P3A1604UK.pdf Description: IC XLTR VL BIDIR 12-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 40Mbps
Supplier Device Package: 12-WLCSP (1.06x1.41)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.63 V
Number of Circuits: 1
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9+2.08 EUR
12+1.51 EUR
25+1.37 EUR
100+1.21 EUR
250+1.14 EUR
500+1.11 EUR
Mindestbestellmenge: 9
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MFS2401AVMAFESR2 MFS2401AVMAFESR2 NXP USA Inc. FS2400.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2401AVMAFES MFS2401AVMAFES NXP USA Inc. FS2400.pdf Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MBMI7014TA2AER2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDDZADR2 NXP USA Inc. Description: AUTO SBC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDDZAD NXP USA Inc. Description: AUTO SBC
Packaging: Tray
Produkt ist nicht verfügbar
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MBMI7014TA2AE MBMI7014TA2AE NXP USA Inc. BMI7014-MIM-PSP-TEST.pdf Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Produkt ist nicht verfügbar
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MCXN235VDFR NXP USA Inc. MCXN23x.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC33FS8520DVKSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9101DVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121DVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9111CVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131DVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131CVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MFS2300BMBA0EPR2 MFS2300BMBA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC9S12E256VPVE MC9S12E256VPVE NXP USA Inc. MC9S12E256V1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8UD7DVP08SC MIMX8UD7DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 568 Stücke:
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1+29.81 EUR
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MIMX8MN2DVTJZAA MIMX8MN2DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 122 Stücke:
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1+40.5 EUR
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
Produkt ist nicht verfügbar
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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3+6.07 EUR
10+4.59 EUR
25+4.22 EUR
100+3.81 EUR
250+3.62 EUR
500+3.5 EUR
1000+3.41 EUR
2500+3.31 EUR
Mindestbestellmenge: 3
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MC32PF4210A4ESR2 MC32PF4210A4ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC32PF4210A4ES MC32PF4210A4ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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PCAL9539AHF,128 PCAL9539AHF,128 NXP USA Inc. PCAL9539A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS6201UJ BTS6201UJ NXP USA Inc. BTS6201U.pdf Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
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Lieferzeit 10-14 Tag (e)
4+5.83 EUR
10+5.03 EUR
25+4.75 EUR
100+4.38 EUR
250+4.15 EUR
500+3.99 EUR
1000+3.84 EUR
Mindestbestellmenge: 4
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CWA-VSPA--FL NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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ZK-HC08AX-A NXP USA Inc. Description: MC68HC908AB/AS/AZ EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908AB/AS/AZ
Produkt ist nicht verfügbar
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IMX95LPD5EVK-19
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR I.MX 95
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
Produkt ist nicht verfügbar
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MWPR1516CFM FSCL-S-A0000210124-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7
MWPR1516CFM
Hersteller: NXP USA Inc.
Description: WIRELESS CHARGER RECEIVER ASSP W
Packaging: Bulk
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Receiver
Current - Supply: 120mA
Supplier Device Package: 32-QFN (5x5)
auf Bestellung 980 Stücke:
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Anzahl Preis
132+3.41 EUR
Mindestbestellmenge: 132
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MRF6V2300NR1 MRF6V2300N%28B%29R1.pdf
MRF6V2300NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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MRF6V2300NR1 MRF6V2300N%28B%29R1.pdf
MRF6V2300NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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SAF4000EL/103Q534Y
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q534Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KIT-TJA1121-SDBS
Hersteller: NXP USA Inc.
Description: KIT-TJA1121-SDBS
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F83766MLK MC56F836XXDS.pdf
MC56F83766MLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
Produkt ist nicht verfügbar
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MC56F83786MLK MC56F836XXDS.pdf
MC56F83786MLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
Produkt ist nicht verfügbar
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MPXHZ6115A6T1 description MPXA6115A.pdf
MPXHZ6115A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+15.52 EUR
Mindestbestellmenge: 1000
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MPXHZ6115A6T1 description MPXA6115A.pdf
MPXHZ6115A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 1304 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.79 EUR
5+19.81 EUR
10+19.08 EUR
25+18.2 EUR
50+17.6 EUR
100+17.47 EUR
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MIMXRT1187JVM8B
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2610AMBA0ADR2 FS26_PB.pdf
MFS2610AMBA0ADR2
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MFS2610AMBA0AD FS26_PB.pdf
MFS2610AMBA0AD
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MC7447AHX1420LB MPC7447AEC.pdf
MC7447AHX1420LB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.42GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.42GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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WCT-15W1COILTX WCT15W1COILTXFS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MWCT1012CFM
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MWCT1012CFM
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
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PCA9535HF,118 PCA9535_PCA9535C.pdf
PCA9535HF,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8787AHL/C3,151 TDA8787A.pdf
TDA8787AHL/C3,151
Hersteller: NXP USA Inc.
Description: IC CCD 10BIT 18M 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: CCD (Charged Coupled Device)
Data Interface: Serial
Operating Temperature: -20°C ~ 75°C
Voltage - Supply: 2.7V ~ 3.6V
Sampling Rate (Per Second): 18m
Resolution (Bits): 10 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 48-LQFP (7x7)
Number of Channels: 1
Produkt ist nicht verfügbar
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FRDM-STBI-A8971 FRDM-STBI-A8971.pdf
FRDM-STBI-A8971
Hersteller: NXP USA Inc.
Description: FRDM-STBI-A8971
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.64 EUR
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MCXE245VLFR
MCXE245VLFR
Hersteller: NXP USA Inc.
Description: MCXE245 LQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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MC9S12DJ64MFUE 9S12DT256_ZIP.zip
MC9S12DJ64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7770EL/202Z13CY
Hersteller: NXP USA Inc.
Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/202Z13CK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SC32PF8121EKEP
Hersteller: NXP USA Inc.
Description: PMIC, 7 BUCK REG, 4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200KKESR2
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMCM6501VNEZ PMCM6501VNE.pdf
PMCM6501VNEZ
Hersteller: NXP USA Inc.
Description: PMCM6501VNE - 12V, N-CHANNEL TRE
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V
auf Bestellung 2036138 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1254+0.36 EUR
Mindestbestellmenge: 1254
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PMCM6501UNEZ PMCM6501UNE.pdf
PMCM6501UNEZ
Hersteller: NXP USA Inc.
Description: PMCM6501UNE - 20V, N-CHANNEL TRE
Packaging: Bulk
auf Bestellung 4464 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1254+0.36 EUR
Mindestbestellmenge: 1254
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SL2S2602FUD/BGZ SL2S2602.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: ISO 15693
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BGU8063J BGU8063.pdf
BGU8063J
Hersteller: NXP USA Inc.
Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.5GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 20dB
Current - Supply: 75mA
Noise Figure: 1.4dB
P1dB: 19dBm
Supplier Device Package: 10-HVSON (3x3)
Produkt ist nicht verfügbar
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ASL2507SHNY ASL2500SHN.pdf
ASL2507SHNY
Hersteller: NXP USA Inc.
Description: BOOST CONVERTER + FSO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KIT-TJA1121-SDBR
Hersteller: NXP USA Inc.
Description: KIT-TJA1121-SDBR
Packaging: Bulk
Produkt ist nicht verfügbar
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P3A1604UKAZ P3A1604UK.pdf
P3A1604UKAZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 40Mbps
Supplier Device Package: 12-WLCSP (1.06x1.41)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.63 V
Number of Circuits: 1
auf Bestellung 4400 Stücke:
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Anzahl Preis
4400+1 EUR
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P3A1604UKAZ P3A1604UK.pdf
P3A1604UKAZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 40Mbps
Supplier Device Package: 12-WLCSP (1.06x1.41)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.63 V
Number of Circuits: 1
auf Bestellung 4400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.08 EUR
12+1.51 EUR
25+1.37 EUR
100+1.21 EUR
250+1.14 EUR
500+1.11 EUR
Mindestbestellmenge: 9
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MFS2401AVMAFESR2 FS2400.pdf
MFS2401AVMAFESR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2401AVMAFES FS2400.pdf
MFS2401AVMAFES
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MBMI7014TA2AER2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDDZADR2
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDDZAD
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Produkt ist nicht verfügbar
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MBMI7014TA2AE BMI7014-MIM-PSP-TEST.pdf
MBMI7014TA2AE
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Produkt ist nicht verfügbar
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MCXN235VDFR MCXN23x.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC33FS8520DVKSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9101DVXXCAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9101CVXXCAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9121DVVXCAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9121CVVXCAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9111DVXXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9111CVXXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131DVVXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131CVVXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MFS2300BMBA0EPR2 FS23DS.pdf
MFS2300BMBA0EPR2
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC9S12E256VPVE MC9S12E256V1.pdf
MC9S12E256VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8UD7DVP08SC IMX8ULPIEC.pdf
MIMX8UD7DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 568 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.81 EUR
10+23.78 EUR
25+22.28 EUR
100+20.63 EUR
250+19.84 EUR
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MIMX8MN2DVTJZAA IMX8MNCEC.pdf
MIMX8MN2DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+40.5 EUR
10+32.64 EUR
25+30.67 EUR
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
Produkt ist nicht verfügbar
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
auf Bestellung 3408 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.07 EUR
10+4.59 EUR
25+4.22 EUR
100+3.81 EUR
250+3.62 EUR
500+3.5 EUR
1000+3.41 EUR
2500+3.31 EUR
Mindestbestellmenge: 3
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MC32PF4210A4ESR2 PF4210.pdf
MC32PF4210A4ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC32PF4210A4ES PF4210.pdf
MC32PF4210A4ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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PCAL9539AHF,128 PCAL9539A.pdf
PCAL9539AHF,128
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS6201UJ BTS6201U.pdf
BTS6201UJ
Hersteller: NXP USA Inc.
Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
auf Bestellung 5823 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.83 EUR
10+5.03 EUR
25+4.75 EUR
100+4.38 EUR
250+4.15 EUR
500+3.99 EUR
1000+3.84 EUR
Mindestbestellmenge: 4
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CWA-VSPA--FL
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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ZK-HC08AX-A
Hersteller: NXP USA Inc.
Description: MC68HC908AB/AS/AZ EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908AB/AS/AZ
Produkt ist nicht verfügbar
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