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SE052F2HN2/Z019HJ NXP USA Inc. Description: SE052F2HN2/Z019HJ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51JE128CMB MCF51JE128CMB NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RW610BUK/A2IZ RW610BUK/A2IZ NXP USA Inc. RW61XFS.pdf Description: RW610BUK/A2IZ
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IMP RW610BHN/A2IMP NXP USA Inc. RW61XFS.pdf Description: RW610BHN/A2IMP
Packaging: Bulk
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RW610BHN/A2IK RW610BHN/A2IK NXP USA Inc. RW61XFS.pdf Description: RW610BHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IY RW610BET/A2IY NXP USA Inc. RW61XFS.pdf Description: RW610BET/A2IY
Packaging: Bulk
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RW610BET/A2IK RW610BET/A2IK NXP USA Inc. RW61XFS.pdf Description: RW610BET/A2IK
Packaging: Bulk
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RW612CHN/A2IMP RW612CHN/A2IMP NXP USA Inc. RW61XFS.pdf Description: RW612CHN/A2IMP
Packaging: Bulk
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RW612CHN/A2IK RW612CHN/A2IK NXP USA Inc. RW61XFS.pdf Description: RW612CHN/A2IK
Packaging: Bulk
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RW612CET/A2IY RW612CET/A2IY NXP USA Inc. RW61XFS.pdf Description: RW612CET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CET/A2IK RW612CET/A2IK NXP USA Inc. RW61XFS.pdf Description: RW612CET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G384GXH 74LVC1G384GXH NXP USA Inc. 74LVC1G384.pdf Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 5-X2SON (0.80x0.80)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
auf Bestellung 833262 Stücke:
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2953+0.16 EUR
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MCF52110CEP66 MCF52110CEP66 NXP USA Inc. MCF52110.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Box
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SE051C2HQ1/Z01XDZ NXP USA Inc. AN13013.pdf Description: SE051C2HQ1
Packaging: Cut Tape (CT)
auf Bestellung 4790 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.80 EUR
10+5.94 EUR
25+5.48 EUR
100+4.97 EUR
250+4.72 EUR
500+4.58 EUR
1000+4.46 EUR
Mindestbestellmenge: 3
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BGU8019X BGU8019X NXP USA Inc. BGU8019.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 25000 Stücke:
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5000+0.31 EUR
10000+0.29 EUR
25000+0.28 EUR
Mindestbestellmenge: 5000
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BGU8019X BGU8019X NXP USA Inc. BGU8019.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 26091 Stücke:
Lieferzeit 10-14 Tag (e)
34+0.53 EUR
39+0.45 EUR
42+0.43 EUR
100+0.39 EUR
250+0.37 EUR
500+0.35 EUR
1000+0.34 EUR
Mindestbestellmenge: 34
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BZX84-B5V1,235 BZX84-B5V1,235 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.1V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Qualification: AEC-Q101
auf Bestellung 637900 Stücke:
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13172+0.03 EUR
Mindestbestellmenge: 13172
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PZU8.2B,115 PZU8.2B,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 8.2V 310MW SOD323F
Packaging: Bulk
auf Bestellung 25464 Stücke:
Lieferzeit 10-14 Tag (e)
10804+0.05 EUR
Mindestbestellmenge: 10804
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S9S08QD2J1MSC S9S08QD2J1MSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFG21W,115 BFG21W,115 NXP USA Inc. BFG21W.pdf Description: RF TRANS NPN 4.5V 18GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 600mW
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 200mA, 2V
Frequency - Transition: 18GHz
Supplier Device Package: CMPAK-4
Produkt ist nicht verfügbar
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MC68020CRC25E MC68020CRC25E NXP USA Inc. MC68020UM.pdf Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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74HC4049DB,118 74HC4049DB,118 NXP USA Inc. PHGL-S-A0001463357-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 6V 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 16-SSOP
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+0.52 EUR
Mindestbestellmenge: 1000
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S912ZVC64ACLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVC64ACLF NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LVC1G19GS,132 74LVC1G19GS,132 NXP USA Inc. 74LVC1G19.pdf Description: IC DECODER/DEMUX 1 X 1:2 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT1202 (1x1)
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
3443+0.15 EUR
Mindestbestellmenge: 3443
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74LVC1G19GN,132 74LVC1G19GN,132 NXP USA Inc. PHGLS30449-1.pdf?t.download=true&u=5oefqw Description: IC DECODER/DEMUX 1X1:2 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (0.9x1)
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3049+0.17 EUR
Mindestbestellmenge: 3049
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FH32K144HAT0MLFT NXP USA Inc. Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11U37HFBD64/4QL LPC11U37HFBD64/4QL NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC7448HX1250ND MC7448HX1250ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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P3A9606JK-EVB P3A9606JK-EVB NXP USA Inc. UM11385.pdf Description: EVAL BOARD FOR P3A9606
Packaging: Bulk
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: P3A9606
Primary Attributes: 2-Channel (Dual)
Embedded: No
Produkt ist nicht verfügbar
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PMBS3906,235 PMBS3906,235 NXP USA Inc. PHGLS19665-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 40V 0.1A SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 38414 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.03 EUR
Mindestbestellmenge: 13172
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74AUP1G07GX,125 74AUP1G07GX,125 NXP USA Inc. PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 9500 Stücke:
Lieferzeit 10-14 Tag (e)
4661+0.10 EUR
Mindestbestellmenge: 4661
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MC9S08LC36LH MC9S08LC36LH NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08LC36LH MC9S08LC36LH NXP USA Inc. FSCLS03842-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
49+10.50 EUR
Mindestbestellmenge: 49
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ON5200,118 ON5200,118 NXP USA Inc. Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Produkt ist nicht verfügbar
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S912XEP100J5CAG S912XEP100J5CAG NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC623AD,118 74LVC623AD,118 NXP USA Inc. 74lvc623a_3.pdf Description: IC TXRX NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
auf Bestellung 3220 Stücke:
Lieferzeit 10-14 Tag (e)
720+0.71 EUR
Mindestbestellmenge: 720
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MC35FS6507NAER2 MC35FS6507NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6507NAE MC35FS6507NAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33AR6000BGT MC33AR6000BGT NXP USA Inc. AR6000.pdf Description: IC REG ALTERNATOR 1OUT TO220-5
Packaging: Tape & Reel (TR)
Package / Case: TO-220-5
Voltage - Output: 10.6V ~ 16V
Mounting Type: Through Hole
Number of Outputs: 1
Voltage - Input: 5V ~ 16.5V
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Alternator, 3-Phase
Supplier Device Package: TO-220-5
Grade: Automotive
Produkt ist nicht verfügbar
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MK20DX256VLK10R MK20DX256VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+11.54 EUR
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MK20DX256VLK10R MK20DX256VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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1+20.06 EUR
10+14.66 EUR
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100+13.08 EUR
250+12.13 EUR
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A3T21H456W23SR6 NXP USA Inc. A3T21H456W23S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RDA777T2 NXP USA Inc. Description: RDA777T2
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4230DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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SPC5643AF0MVZ2 SPC5643AF0MVZ2 NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 3MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 151
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32G233ASBK0VUCT NXP USA Inc. S32G2.pdf Description: S32G233A ARM CORTEX-M7 AND -A53,
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SLS1046ASN8T1A NXP USA Inc. Description: SLS1046A ST 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8034T/C1,112 TDA8034T/C1,112 NXP USA Inc. TDA8034T_TDA8034AT.pdf Description: IC INTERFACE SPECIALIZED 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 3V, 5V
Supplier Device Package: 16-SO
auf Bestellung 653 Stücke:
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10+1.87 EUR
14+1.35 EUR
50+1.14 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
Mindestbestellmenge: 10
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MC9S12GC64MFUE MC9S12GC64MFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC35FS6518CAER2 MC35FS6518CAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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P1020NSE2DFB P1020NSE2DFB NXP USA Inc. P1020PB.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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S32G234MSBK1VUCR NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NCK2982RHN/10101Y NXP USA Inc. Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8UD7CVP08SC MIMX8UD7CVP08SC NXP USA Inc. AN13914.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 234 Stücke:
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1+42.49 EUR
10+34.20 EUR
25+32.13 EUR
100+29.85 EUR
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MPF5020CMBA0ES MPF5020CMBA0ES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 349 Stücke:
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2+10.61 EUR
10+8.15 EUR
25+7.53 EUR
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Mindestbestellmenge: 2
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MPF5024CMBA0ES MPF5024CMBA0ES NXP USA Inc. PF5024.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 490 Stücke:
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2+12.30 EUR
10+9.50 EUR
25+8.80 EUR
100+8.03 EUR
490+7.44 EUR
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MPF7100BVMA3ES MPF7100BVMA3ES NXP USA Inc. PF7100.pdf Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
2+12.85 EUR
10+9.94 EUR
25+9.21 EUR
100+8.42 EUR
260+8.02 EUR
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MIMX8US5DVP08SC MIMX8US5DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 630 Stücke:
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1+24.66 EUR
10+19.62 EUR
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100+18.03 EUR
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MSC8157TAG1000A MSC8157TAG1000A NXP USA Inc. MSC8157.pdf Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
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SE052F2HN2/Z019HJ
Hersteller: NXP USA Inc.
Description: SE052F2HN2/Z019HJ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51JE128CMB MCF51JE256.pdf
MCF51JE128CMB
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RW610BUK/A2IZ RW61XFS.pdf
RW610BUK/A2IZ
Hersteller: NXP USA Inc.
Description: RW610BUK/A2IZ
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IMP RW61XFS.pdf
RW610BHN/A2IMP
Hersteller: NXP USA Inc.
Description: RW610BHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IK RW61XFS.pdf
RW610BHN/A2IK
Hersteller: NXP USA Inc.
Description: RW610BHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IY RW61XFS.pdf
RW610BET/A2IY
Hersteller: NXP USA Inc.
Description: RW610BET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IK RW61XFS.pdf
RW610BET/A2IK
Hersteller: NXP USA Inc.
Description: RW610BET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CHN/A2IMP RW61XFS.pdf
RW612CHN/A2IMP
Hersteller: NXP USA Inc.
Description: RW612CHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CHN/A2IK RW61XFS.pdf
RW612CHN/A2IK
Hersteller: NXP USA Inc.
Description: RW612CHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CET/A2IY RW61XFS.pdf
RW612CET/A2IY
Hersteller: NXP USA Inc.
Description: RW612CET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CET/A2IK RW61XFS.pdf
RW612CET/A2IK
Hersteller: NXP USA Inc.
Description: RW612CET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G384GXH 74LVC1G384.pdf
74LVC1G384GXH
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 5-X2SON (0.80x0.80)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
auf Bestellung 833262 Stücke:
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Anzahl Preis
2953+0.16 EUR
Mindestbestellmenge: 2953
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MCF52110CEP66 MCF52110.pdf
MCF52110CEP66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Box
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SE051C2HQ1/Z01XDZ AN13013.pdf
Hersteller: NXP USA Inc.
Description: SE051C2HQ1
Packaging: Cut Tape (CT)
auf Bestellung 4790 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.80 EUR
10+5.94 EUR
25+5.48 EUR
100+4.97 EUR
250+4.72 EUR
500+4.58 EUR
1000+4.46 EUR
Mindestbestellmenge: 3
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BGU8019X BGU8019.pdf
BGU8019X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 25000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+0.31 EUR
10000+0.29 EUR
25000+0.28 EUR
Mindestbestellmenge: 5000
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BGU8019X BGU8019.pdf
BGU8019X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 26091 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
34+0.53 EUR
39+0.45 EUR
42+0.43 EUR
100+0.39 EUR
250+0.37 EUR
500+0.35 EUR
1000+0.34 EUR
Mindestbestellmenge: 34
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BZX84-B5V1,235 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B5V1,235
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Qualification: AEC-Q101
auf Bestellung 637900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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PZU8.2B,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU8.2B,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 310MW SOD323F
Packaging: Bulk
auf Bestellung 25464 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10804+0.05 EUR
Mindestbestellmenge: 10804
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S9S08QD2J1MSC MC9S08QD4.pdf
S9S08QD2J1MSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFG21W,115 BFG21W.pdf
BFG21W,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 18GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 600mW
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 200mA, 2V
Frequency - Transition: 18GHz
Supplier Device Package: CMPAK-4
Produkt ist nicht verfügbar
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MC68020CRC25E MC68020UM.pdf
MC68020CRC25E
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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74HC4049DB,118 PHGL-S-A0001463357-1.pdf?t.download=true&u=5oefqw
74HC4049DB,118
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 6V 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 16-SSOP
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+0.52 EUR
Mindestbestellmenge: 1000
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S912ZVC64ACLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVC64ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LVC1G19GS,132 74LVC1G19.pdf
74LVC1G19GS,132
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 1:2 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT1202 (1x1)
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3443+0.15 EUR
Mindestbestellmenge: 3443
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74LVC1G19GN,132 PHGLS30449-1.pdf?t.download=true&u=5oefqw
74LVC1G19GN,132
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X1:2 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 3049 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3049+0.17 EUR
Mindestbestellmenge: 3049
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FH32K144HAT0MLFT
Hersteller: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11U37HFBD64/4QL LPC11U3X.pdf
LPC11U37HFBD64/4QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC7448HX1250ND MPC7448ECS01AD.pdf
MC7448HX1250ND
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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P3A9606JK-EVB UM11385.pdf
P3A9606JK-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR P3A9606
Packaging: Bulk
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: P3A9606
Primary Attributes: 2-Channel (Dual)
Embedded: No
Produkt ist nicht verfügbar
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PMBS3906,235 PHGLS19665-1.pdf?t.download=true&u=5oefqw
PMBS3906,235
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.1A SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-23
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 38414 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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74AUP1G07GX,125 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GX,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 9500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4661+0.10 EUR
Mindestbestellmenge: 4661
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MC9S08LC36LH MC9S08LC60.pdf
MC9S08LC36LH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08LC36LH FSCLS03842-1.pdf?t.download=true&u=5oefqw
MC9S08LC36LH
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
49+10.50 EUR
Mindestbestellmenge: 49
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ON5200,118
ON5200,118
Hersteller: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Produkt ist nicht verfügbar
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S912XEP100J5CAG
S912XEP100J5CAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC623AD,118 74lvc623a_3.pdf
74LVC623AD,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
auf Bestellung 3220 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
720+0.71 EUR
Mindestbestellmenge: 720
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MC35FS6507NAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6507NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6507NAE 35FS4500-35FS6500-ASILD.pdf
MC35FS6507NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33AR6000BGT AR6000.pdf
MC33AR6000BGT
Hersteller: NXP USA Inc.
Description: IC REG ALTERNATOR 1OUT TO220-5
Packaging: Tape & Reel (TR)
Package / Case: TO-220-5
Voltage - Output: 10.6V ~ 16V
Mounting Type: Through Hole
Number of Outputs: 1
Voltage - Input: 5V ~ 16.5V
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Alternator, 3-Phase
Supplier Device Package: TO-220-5
Grade: Automotive
Produkt ist nicht verfügbar
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MK20DX256VLK10R K20P81M100SF2V2.pdf
MK20DX256VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+11.54 EUR
Mindestbestellmenge: 1000
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MK20DX256VLK10R K20P81M100SF2V2.pdf
MK20DX256VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.06 EUR
10+14.66 EUR
25+13.87 EUR
100+13.08 EUR
250+12.13 EUR
500+11.54 EUR
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A3T21H456W23SR6 A3T21H456W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RDA777T2
Hersteller: NXP USA Inc.
Description: RDA777T2
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4230DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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SPC5643AF0MVZ2 MPC5644A.pdf
SPC5643AF0MVZ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 151
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32G233ASBK0VUCT S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53,
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SLS1046ASN8T1A
Hersteller: NXP USA Inc.
Description: SLS1046A ST 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8034T/C1,112 TDA8034T_TDA8034AT.pdf
TDA8034T/C1,112
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 3V, 5V
Supplier Device Package: 16-SO
auf Bestellung 653 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.87 EUR
14+1.35 EUR
50+1.14 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
Mindestbestellmenge: 10
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MC9S12GC64MFUE MC9S12C128V1.pdf
MC9S12GC64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC35FS6518CAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6518CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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P1020NSE2DFB P1020PB.pdf
P1020NSE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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S32G234MSBK1VUCR S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NCK2982RHN/10101Y
Hersteller: NXP USA Inc.
Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8UD7CVP08SC AN13914.pdf
MIMX8UD7CVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 234 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.49 EUR
10+34.20 EUR
25+32.13 EUR
100+29.85 EUR
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MPF5020CMBA0ES PF5020.pdf
MPF5020CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 349 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.61 EUR
10+8.15 EUR
25+7.53 EUR
100+6.86 EUR
Mindestbestellmenge: 2
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MPF5024CMBA0ES PF5024.pdf
MPF5024CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.30 EUR
10+9.50 EUR
25+8.80 EUR
100+8.03 EUR
490+7.44 EUR
Mindestbestellmenge: 2
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MPF7100BVMA3ES PF7100.pdf
MPF7100BVMA3ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.85 EUR
10+9.94 EUR
25+9.21 EUR
100+8.42 EUR
260+8.02 EUR
Mindestbestellmenge: 2
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MIMX8US5DVP08SC IMX8ULPIEC.pdf
MIMX8US5DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.66 EUR
10+19.62 EUR
25+18.36 EUR
100+18.03 EUR
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MSC8157TAG1000A MSC8157.pdf
MSC8157TAG1000A
Hersteller: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
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