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NCJ3321AHF/00100Y NCJ3321AHF/00100Y NXP USA Inc. NCF3321FS.pdf Description: NCJ3321AHF
Packaging: Tape & Reel (TR)
Package / Case: 40-WFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HWQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08AC32MPUE MC9S08AC32MPUE NXP USA Inc. PHGL-S-A0002263322-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 894 Stücke:
Lieferzeit 10-14 Tag (e)
43+10.47 EUR
Mindestbestellmenge: 43
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MC9S08AC32MFUE MC9S08AC32MFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC112N,652 74HC112N,652 NXP USA Inc. 74HC_HCT112_Rev_Oct2000.pdf Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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74HCT112N,652 74HCT112N,652 NXP USA Inc. 74HC_HCT112.pdf Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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MCIMX31LDVMN5DR2 MCIMX31LDVMN5DR2 NXP USA Inc. MCIMX31_5.pdf Description: IC MPU I.MX31 532MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC33PF8100EPTS NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MIMX8QP5AVUFEAB MIMX8QP5AVUFEAB NXP USA Inc. IMX8QP1P3AEC.pdf Description: MIMX8QP5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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MIMX8QP6AVUFEAB MIMX8QP6AVUFEAB NXP USA Inc. IMX8QP1P3AEC.pdf Description: MIMX8QP6AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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MIMX8QM5AVUFEAB MIMX8QM5AVUFEAB NXP USA Inc. IMX8QM1P3AEC.pdf Description: MIMX8QM5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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PMEG3002ESFYL PMEG3002ESFYL NXP USA Inc. NEXP-S-A0003101014-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTK 30V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.42 ns
Technology: Schottky
Capacitance @ Vr, F: 21pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 535 mV @ 200 mA
Current - Reverse Leakage @ Vr: 9 µA @ 30 V
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
2264+0.2 EUR
Mindestbestellmenge: 2264
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ASL9015SHNZ ASL9015SHNZ NXP USA Inc. Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
Produkt ist nicht verfügbar
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ASL9015FHNZ ASL9015FHNZ NXP USA Inc. Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
Produkt ist nicht verfügbar
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LPC55S36JHI48MP LPC55S36JHI48MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
Produkt ist nicht verfügbar
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LPC55S36JHI48MP LPC55S36JHI48MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 3933 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.99 EUR
10+10.89 EUR
25+10.11 EUR
100+9.26 EUR
250+8.85 EUR
500+8.6 EUR
1000+8.4 EUR
Mindestbestellmenge: 2
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LPC55S36JHI48K LPC55S36JHI48K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 1270 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.99 EUR
10+10.89 EUR
25+10.11 EUR
100+9.26 EUR
250+8.85 EUR
500+8.6 EUR
Mindestbestellmenge: 2
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LPC55S36JHI48E LPC55S36JHI48E NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.99 EUR
10+10.89 EUR
25+10.11 EUR
100+9.26 EUR
Mindestbestellmenge: 2
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SC16IS760IBS,128 SC16IS760IBS,128 NXP USA Inc. SC16IS740_750_760.pdf Description: IC UART I2C/SPI 24-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16IS760IBS,128 SC16IS760IBS,128 NXP USA Inc. SC16IS740_750_760.pdf Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
auf Bestellung 762 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.87 EUR
10+5.97 EUR
25+5.5 EUR
100+4.98 EUR
250+4.74 EUR
500+4.59 EUR
Mindestbestellmenge: 3
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PCF85063AT/AY PCF85063AT/AY NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.65 EUR
5000+0.64 EUR
7500+0.63 EUR
12500+0.62 EUR
17500+0.61 EUR
Mindestbestellmenge: 2500
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PCF85063AT/AY PCF85063AT/AY NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 36725 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.39 EUR
18+1 EUR
25+0.9 EUR
100+0.79 EUR
250+0.74 EUR
500+0.71 EUR
1000+0.68 EUR
Mindestbestellmenge: 13
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S32K388HHT0MJBST S32K388HHT0MJBST NXP USA Inc. S32K3xx.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit 5-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)
1+72.58 EUR
10+59.51 EUR
25+56.24 EUR
152+51.82 EUR
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MC9S12XEQ512VAA MC9S12XEQ512VAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BMAGR S912XEQ512BMAGR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9331CVVXMACR NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4200DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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SC33PF8200DXESR2 NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC33PF8200DZESR2 NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200DXES NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200DZES NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Bulk
Produkt ist nicht verfügbar
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N74F32N,602 N74F32N,602 NXP USA Inc. N74F32.pdf Description: IC GATE OR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 4
Produkt ist nicht verfügbar
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BC807-25QAZ BC807-25QAZ NXP USA Inc. BC807-25QA_40QA.pdf Description: TRANS PNP 45V 0.5A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 500mA, 1V
Frequency - Transition: 80MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 900 mW
Qualification: AEC-Q101
auf Bestellung 285000 Stücke:
Lieferzeit 10-14 Tag (e)
3587+0.12 EUR
Mindestbestellmenge: 3587
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74LVC2G3157DPJ 74LVC2G3157DPJ NXP USA Inc. 74LVC2G3157.pdf Description: IC SWITCH SPDT X 2 15OHM 10TSSOP
Packaging: Bulk
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 15Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 10-TSSOP
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Crosstalk: -54dB @ 10MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 5.7ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 2
auf Bestellung 1486 Stücke:
Lieferzeit 10-14 Tag (e)
462+0.99 EUR
Mindestbestellmenge: 462
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LS1017ASE7PQA LS1017ASE7PQA NXP USA Inc. LS1027A%2C%20LS1017A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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TDF8597TH/N1,118 TDF8597TH/N1,118 NXP USA Inc. TDF8597TH-N1-118.pdf Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Produkt ist nicht verfügbar
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TDF8597TH/N1,118 TDF8597TH/N1,118 NXP USA Inc. TDF8597TH-N1-118.pdf Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
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FRDM-IMX91QSB NXP USA Inc. Description: FRDM-IMX91QSB
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
Produkt ist nicht verfügbar
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NT4PLDJHN2/2003LXJ NXP USA Inc. NTAGXDNADS.pdf Description: HVQFN20
Packaging: Tape & Reel (TR)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
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NT4PLDJHN2/2003LXJ NXP USA Inc. NTAGXDNADS.pdf Description: HVQFN20
Packaging: Cut Tape (CT)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
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IW610X-EVK NXP USA Inc. Description: IW610X-EVK
Packaging: Bulk
Produkt ist nicht verfügbar
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FRDMGD3162RPEVM FRDMGD3162RPEVM NXP USA Inc. getting-started-with-the-frdmgd3162rpevm-evaluation-board:GS-FRDMGD3162RPEVM Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: GD3162
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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88W8987-A2-EAHE/AZ 88W8987-A2-EAHE/AZ NXP USA Inc. 88W8987_SDS.pdf Description: IC RF TXRX BLE 83WLCSP
Packaging: Cut Tape (CT)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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MIMXRT1187KVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9352CVVXMABR NXP USA Inc. IMX93XEC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MPC860PZQ66D4 MPC860PZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MC9S08SH32MWL MC9S08SH32MWL NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TFF11115HN/N1,111 TFF11115HN/N1,111 NXP USA Inc. TFF11115HN.pdf Description: IC FREQUENCY GEN VSAT 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 11.8GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC855TCVR50D4 MPC855TCVR50D4 NXP USA Inc. MPC855TTS.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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S912ZVL64F0CLC S912ZVL64F0CLC NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32K312MINI-EVB S32K312MINI-EVB NXP USA Inc. S32K312MINI-EVB-Manual.pdf Description: EVAL BOARD FOR S32K312 MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BAFTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Bulk
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
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S912XEQ384J3VAGR S912XEQ384J3VAGR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK51DX128CMC7 MK51DX128CMC7 NXP USA Inc. K51P100M72SF1.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 61
DigiKey Programmable: Not Verified
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MIMX9332XVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332XVVXMACR NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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LPC1104UK,118 NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 16-WLCSP (2.17x2.32)
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1738GT/N1,118 TEA1738GT/N1,118 NXP USA Inc. TEA1738GT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1738GT/N1,118 TEA1738GT/N1,118 NXP USA Inc. TEA1738GT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
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FRDM-MCXA346 FRDM-MCXA346 NXP USA Inc. MCXAP144M240F60.pdf Description: FREEDOM MCXA346 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXA346
Platform: Freedom
Produkt ist nicht verfügbar
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PTN36502AHQX PTN36502AHQX NXP USA Inc. PTN36502.pdf Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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NCJ3321AHF/00100Y NCF3321FS.pdf
NCJ3321AHF/00100Y
Hersteller: NXP USA Inc.
Description: NCJ3321AHF
Packaging: Tape & Reel (TR)
Package / Case: 40-WFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HWQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08AC32MPUE PHGL-S-A0002263322-1.pdf?t.download=true&u=5oefqw
MC9S08AC32MPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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43+10.47 EUR
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MC9S08AC32MFUE MC9S08AC60AD.pdf
MC9S08AC32MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC112N,652 74HC_HCT112_Rev_Oct2000.pdf
74HC112N,652
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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74HCT112N,652 74HC_HCT112.pdf
74HCT112N,652
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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MCIMX31LDVMN5DR2 MCIMX31_5.pdf
MCIMX31LDVMN5DR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC33PF8100EPTS PF8100_PF8200.pdf
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MIMX8QP5AVUFEAB IMX8QP1P3AEC.pdf
MIMX8QP5AVUFEAB
Hersteller: NXP USA Inc.
Description: MIMX8QP5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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MIMX8QP6AVUFEAB IMX8QP1P3AEC.pdf
MIMX8QP6AVUFEAB
Hersteller: NXP USA Inc.
Description: MIMX8QP6AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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MIMX8QM5AVUFEAB IMX8QM1P3AEC.pdf
MIMX8QM5AVUFEAB
Hersteller: NXP USA Inc.
Description: MIMX8QM5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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PMEG3002ESFYL NEXP-S-A0003101014-1.pdf?t.download=true&u=5oefqw
PMEG3002ESFYL
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTK 30V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.42 ns
Technology: Schottky
Capacitance @ Vr, F: 21pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 535 mV @ 200 mA
Current - Reverse Leakage @ Vr: 9 µA @ 30 V
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2264+0.2 EUR
Mindestbestellmenge: 2264
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ASL9015SHNZ
ASL9015SHNZ
Hersteller: NXP USA Inc.
Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
Produkt ist nicht verfügbar
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ASL9015FHNZ
ASL9015FHNZ
Hersteller: NXP USA Inc.
Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
Produkt ist nicht verfügbar
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LPC55S36JHI48MP LPC553x.pdf
LPC55S36JHI48MP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
Produkt ist nicht verfügbar
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LPC55S36JHI48MP LPC553x.pdf
LPC55S36JHI48MP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 3933 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.99 EUR
10+10.89 EUR
25+10.11 EUR
100+9.26 EUR
250+8.85 EUR
500+8.6 EUR
1000+8.4 EUR
Mindestbestellmenge: 2
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LPC55S36JHI48K LPC553x.pdf
LPC55S36JHI48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 1270 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.99 EUR
10+10.89 EUR
25+10.11 EUR
100+9.26 EUR
250+8.85 EUR
500+8.6 EUR
Mindestbestellmenge: 2
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LPC55S36JHI48E LPC553x.pdf
LPC55S36JHI48E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.99 EUR
10+10.89 EUR
25+10.11 EUR
100+9.26 EUR
Mindestbestellmenge: 2
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SC16IS760IBS,128 SC16IS740_750_760.pdf
SC16IS760IBS,128
Hersteller: NXP USA Inc.
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16IS760IBS,128 SC16IS740_750_760.pdf
SC16IS760IBS,128
Hersteller: NXP USA Inc.
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
auf Bestellung 762 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.87 EUR
10+5.97 EUR
25+5.5 EUR
100+4.98 EUR
250+4.74 EUR
500+4.59 EUR
Mindestbestellmenge: 3
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PCF85063AT/AY PCF85063A.pdf
PCF85063AT/AY
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.65 EUR
5000+0.64 EUR
7500+0.63 EUR
12500+0.62 EUR
17500+0.61 EUR
Mindestbestellmenge: 2500
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PCF85063AT/AY PCF85063A.pdf
PCF85063AT/AY
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 36725 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.39 EUR
18+1 EUR
25+0.9 EUR
100+0.79 EUR
250+0.74 EUR
500+0.71 EUR
1000+0.68 EUR
Mindestbestellmenge: 13
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S32K388HHT0MJBST S32K3xx.pdf
S32K388HHT0MJBST
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit 5-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+72.58 EUR
10+59.51 EUR
25+56.24 EUR
152+51.82 EUR
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MC9S12XEQ512VAA MC9S12XEP100RMV1.pdf
MC9S12XEQ512VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BMAGR MC9S12XEPB.pdf
S912XEQ512BMAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9331CVVXMACR IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4200DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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SC33PF8200DXESR2 PF8100_PF8200.pdf
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC33PF8200DZESR2 PF8100_PF8200.pdf
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200DXES PF8100_PF8200.pdf
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200DZES PF8100_PF8200.pdf
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Bulk
Produkt ist nicht verfügbar
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N74F32N,602 N74F32.pdf
N74F32N,602
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 4
Produkt ist nicht verfügbar
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BC807-25QAZ BC807-25QA_40QA.pdf
BC807-25QAZ
Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 0.5A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 500mA, 1V
Frequency - Transition: 80MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 900 mW
Qualification: AEC-Q101
auf Bestellung 285000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3587+0.12 EUR
Mindestbestellmenge: 3587
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74LVC2G3157DPJ 74LVC2G3157.pdf
74LVC2G3157DPJ
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 15OHM 10TSSOP
Packaging: Bulk
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 15Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 10-TSSOP
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Crosstalk: -54dB @ 10MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 5.7ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 2
auf Bestellung 1486 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
462+0.99 EUR
Mindestbestellmenge: 462
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LS1017ASE7PQA LS1027A%2C%20LS1017A.pdf
LS1017ASE7PQA
Hersteller: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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TDF8597TH/N1,118 TDF8597TH-N1-118.pdf
TDF8597TH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Produkt ist nicht verfügbar
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TDF8597TH/N1,118 TDF8597TH-N1-118.pdf
TDF8597TH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
auf Bestellung 498 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.58 EUR
10+49.39 EUR
25+46.6 EUR
100+43.53 EUR
250+42.07 EUR
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FRDM-IMX91QSB
Hersteller: NXP USA Inc.
Description: FRDM-IMX91QSB
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
Produkt ist nicht verfügbar
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NT4PLDJHN2/2003LXJ NTAGXDNADS.pdf
Hersteller: NXP USA Inc.
Description: HVQFN20
Packaging: Tape & Reel (TR)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
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NT4PLDJHN2/2003LXJ NTAGXDNADS.pdf
Hersteller: NXP USA Inc.
Description: HVQFN20
Packaging: Cut Tape (CT)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
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IW610X-EVK
Hersteller: NXP USA Inc.
Description: IW610X-EVK
Packaging: Bulk
Produkt ist nicht verfügbar
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FRDMGD3162RPEVM getting-started-with-the-frdmgd3162rpevm-evaluation-board:GS-FRDMGD3162RPEVM
FRDMGD3162RPEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: GD3162
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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88W8987-A2-EAHE/AZ 88W8987_SDS.pdf
88W8987-A2-EAHE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 83WLCSP
Packaging: Cut Tape (CT)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.85 EUR
10+17.26 EUR
25+16.36 EUR
100+15.13 EUR
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MIMXRT1187KVM8C IMXRT1180EC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9352CVVXMABR IMX93XEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MPC860PZQ66D4 MPC860EC.pdf
MPC860PZQ66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MC9S08SH32MWL MC9S08SH32.pdf
MC9S08SH32MWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TFF11115HN/N1,111 TFF11115HN.pdf
TFF11115HN/N1,111
Hersteller: NXP USA Inc.
Description: IC FREQUENCY GEN VSAT 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 11.8GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC855TCVR50D4 MPC855TTS.pdf
MPC855TCVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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S912ZVL64F0CLC S9S12ZVL_FamilyRefManual_DS.pdf
S912ZVL64F0CLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32K312MINI-EVB S32K312MINI-EVB-Manual.pdf
S32K312MINI-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K312 MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BTK.pdf
TEA19051BAFTK/1J
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Bulk
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
auf Bestellung 75967 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
190+2.4 EUR
Mindestbestellmenge: 190
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S912XEQ384J3VAGR MC9S12XEPB.pdf
S912XEQ384J3VAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK51DX128CMC7 K51P100M72SF1.pdf
MK51DX128CMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 61
DigiKey Programmable: Not Verified
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
28+16.26 EUR
Mindestbestellmenge: 28
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MIMX9332XVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332XVVXMACR IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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LPC1104UK,118 LPC1102_1104.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 16-WLCSP (2.17x2.32)
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1738GT/N1,118 TEA1738GT.pdf
TEA1738GT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
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TEA1738GT/N1,118 TEA1738GT.pdf
TEA1738GT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
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FRDM-MCXA346 MCXAP144M240F60.pdf
FRDM-MCXA346
Hersteller: NXP USA Inc.
Description: FREEDOM MCXA346 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXA346
Platform: Freedom
Produkt ist nicht verfügbar
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PTN36502AHQX PTN36502.pdf
PTN36502AHQX
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.1 & DP 1.2 QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-XFQFN Exposed Pad
Delay Time: 140ps
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 225mA
Data Rate (Max): 5.4Gbps
Supplier Device Package: 24-HX2QFN (2.4x3.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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