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MFS2305BMMA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2305BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
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MFS2322BMBA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2322BMBA0EPR2
Packaging: Tape & Reel (TR)
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MFS2323BMBA0EPR2 MFS2323BMBA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2323BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
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MFS2322BMBA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2322BMBA0EP
Packaging: Tray
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NPM8KD4ST1 NXP USA Inc. Description: NPM8 INDUSTRIAL PRESSURE MONITOR
Packaging: Tape & Reel (TR)
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MFS2323BMBA0EP MFS2323BMBA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2323BMBA0EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
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MIMXRT1172AVM8BR NXP USA Inc. IMXRT1170RM.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
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BAS316,115 BAS316,115 NXP USA Inc. BAS16_SER.pdf Description: DIODE SWITCH 100V 0.25A SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3365BSMP PTN3365BSMP NXP USA Inc. PTN3365.pdf Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
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PTN3365BSMP PTN3365BSMP NXP USA Inc. PTN3365.pdf Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
auf Bestellung 1631 Stücke:
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10+2.12 EUR
25+1.92 EUR
100+1.7 EUR
250+1.61 EUR
500+1.55 EUR
1000+1.54 EUR
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74HC237D,652 74HC237D,652 NXP USA Inc. 74HC237.pdf Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC237DB,118 74HC237DB,118 NXP USA Inc. 74HC237.pdf Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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74HC237DB,112 74HC237DB,112 NXP USA Inc. 74HC237.pdf Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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PMBT3904YS,115 PMBT3904YS,115 NXP USA Inc. PMBT3904YS_1.pdf Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCZ33903DS3EK MCZ33903DS3EK NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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74HC377D,653 74HC377D,653 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE 1-ELE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC2G04GXZ 74LVC2G04GXZ NXP USA Inc. 74LVC2G04.pdf Description: IC INV 2-CIR 2-IN 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
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74LVC2G04GM,115 74LVC2G04GM,115 NXP USA Inc. 74LVC2G04.pdf Description: IC DUAL INVERTER 6XSON
Packaging: Tape & Reel (TR)
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74LVC245ADB,118 74LVC245ADB,118 NXP USA Inc. 74LVC_LVCH245A.pdf Description: IC 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
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S912ZVLA12AMLFR S912ZVLA12AMLFR NXP USA Inc. 568_MC9S12ZVLRM.pdf Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA12AMLF S912ZVLA12AMLF NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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74LV4066D,112 74LV4066D,112 NXP USA Inc. 74LV4066.pdf Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tube
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74LV4066PW,112 74LV4066PW,112 NXP USA Inc. 74LV4066.pdf Description: IC SWITCH QUAD 1X2 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 4
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S912ZVM16F1MKHR S912ZVM16F1MKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVM16F1MKHR S912ZVM16F1MKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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74HCT2G14GV,125 74HCT2G14GV,125 NXP USA Inc. 74HC_HCT2G14.pdf Description: IC SCHMITT TRIG DL INV 6TSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
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74HCT125N,652 74HCT125N,652 NXP USA Inc. 74HC_HCT125_Rev5.pdf Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
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74HCT125PW,112 74HCT125PW,112 NXP USA Inc. 74HC_HCT125.pdf Description: IC BUFF 4.5V/5.5V 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
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PEMI1QFN/RR,315 PEMI1QFN/RR,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1
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SPC5745CK1AVMH2 SPC5745CK1AVMH2 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100
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SPC5744CFK1ACMH6 SPC5744CFK1ACMH6 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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MCF5211LCEP66 MCF5211LCEP66 NXP USA Inc. MCF5213EC.pdf Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MFS2601AMBA0ADR2 NXP USA Inc. Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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SFS5600AMBAAESR2 NXP USA Inc. Description: PMIC, DUAL CHANNEL VPRE REGULATO
Packaging: Tape & Reel (TR)
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SFS5600AMBAAES NXP USA Inc. Description: PMIC,DUAL CHANNEL VPRE REGULATOR
Packaging: Tray
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HEC4069UBT,118 HEC4069UBT,118 NXP USA Inc. HEF4069UB.pdf Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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MC33776ASA1AER2 MC33776ASA1AER2 NXP USA Inc. MC33777A_PB.pdf Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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SAF4000EL/103Q53CY NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MIMX9302DVVXDAC MIMX9302DVVXDAC NXP USA Inc. IMX93CEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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FG32K144HAT0MLLT NXP USA Inc. PdfFile_890942.pdf Description: IC MCU
Packaging: Tray
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PEMI2STD/RE,115 PEMI2STD/RE,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
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BC857BS,115 NXP USA Inc. BC857BS.pdf Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC8T245PW:112 74AVC8T245PW:112 NXP USA Inc. 74AVC8T245.pdf Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Produkt ist nicht verfügbar
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S912XEG128BCAL S912XEG128BCAL NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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74HC238DB,112 74HC238DB,112 NXP USA Inc. 74HC_HCT238.pdf Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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74HCT4046ADB,112 74HCT4046ADB,112 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT4046ADB,118 74HCT4046ADB,118 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PLL W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT4046AD,112 74HCT4046AD,112 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT4046AD,118 74HCT4046AD,118 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PLL W/VCO 16SOIC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMEG4005CT,215 PMEG4005CT,215 NXP USA Inc. PMEG4005CT.pdf Description: DIODE SCHOTTKY 40V 500MA TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG4005EH,115 PMEG4005EH,115 NXP USA Inc. PMEGXX05EH_EJ_SER.pdf Description: DIODE SCHOTTKY 40V 0.5A SOD123F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG4005EJ,115 PMEG4005EJ,115 NXP USA Inc. PMEGXX05EH_EJ_SER.pdf Description: SCHOTTKY RECT 40V 0.5A SOD323F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32M274LHABVKHSR S32M274LHABVKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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S32M274LHABVKHST S32M274LHABVKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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1PS76SB10,115 1PS76SB10,115 NXP USA Inc. 1PS76SB10.pdf Description: DIODE SCHOTTKY 30V 0.2A SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC4511D,653 74HC4511D,653 NXP USA Inc. 74HC_HCT4511.pdf Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HC4511D,652 74HC4511D,652 NXP USA Inc. 74HC_HCT4511.pdf Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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PBSS4320T,215 PBSS4320T,215 NXP USA Inc. PBSS4320T.pdf Description: TRANS NPN 20V 2A SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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N74F04D,623 N74F04D,623 NXP USA Inc. N74F04.pdf Description: IC INVERTR HEX COMM 6.9MA 14SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC2G240DP,125 74LVC2G240DP,125 NXP USA Inc. 74LVC2G240.pdf Description: IC INVERTER DUAL 4-INPUT 8TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2305BMMA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2305BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2322BMBA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2322BMBA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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MFS2323BMBA0EPR2 568_FS23.pdf
MFS2323BMBA0EPR2
Hersteller: NXP USA Inc.
Description: MFS2323BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2322BMBA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2322BMBA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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NPM8KD4ST1
Hersteller: NXP USA Inc.
Description: NPM8 INDUSTRIAL PRESSURE MONITOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2323BMBA0EP 568_FS23.pdf
MFS2323BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2323BMBA0EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MIMXRT1172AVM8BR IMXRT1170RM.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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BAS316,115 BAS16_SER.pdf
BAS316,115
Hersteller: NXP USA Inc.
Description: DIODE SWITCH 100V 0.25A SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3365BSMP PTN3365.pdf
PTN3365BSMP
Hersteller: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
Produkt ist nicht verfügbar
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PTN3365BSMP PTN3365.pdf
PTN3365BSMP
Hersteller: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
auf Bestellung 1631 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
8+2.92 EUR
10+2.12 EUR
25+1.92 EUR
100+1.7 EUR
250+1.61 EUR
500+1.55 EUR
1000+1.54 EUR
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74HC237D,652 74HC237.pdf
74HC237D,652
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HC237DB,118 74HC237.pdf
74HC237DB,118
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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74HC237DB,112 74HC237.pdf
74HC237DB,112
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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PMBT3904YS,115 PMBT3904YS_1.pdf
PMBT3904YS,115
Hersteller: NXP USA Inc.
Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCZ33903DS3EK MC33903-MC33904-MC33905.pdf
MCZ33903DS3EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Produkt ist nicht verfügbar
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74HC377D,653 74HC_HCT377.pdf
74HC377D,653
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE 1-ELE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC2G04GXZ 74LVC2G04.pdf
74LVC2G04GXZ
Hersteller: NXP USA Inc.
Description: IC INV 2-CIR 2-IN 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 89400 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1302+0.42 EUR
Mindestbestellmenge: 1302 Stücke
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74LVC2G04GM,115 74LVC2G04.pdf
74LVC2G04GM,115
Hersteller: NXP USA Inc.
Description: IC DUAL INVERTER 6XSON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC245ADB,118 74LVC_LVCH245A.pdf
74LVC245ADB,118
Hersteller: NXP USA Inc.
Description: IC 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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S912ZVLA12AMLFR 568_MC9S12ZVLRM.pdf
S912ZVLA12AMLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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S912ZVLA12AMLF MC9S12ZVLRM.pdf
S912ZVLA12AMLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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74LV4066D,112 74LV4066.pdf
74LV4066D,112
Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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74LV4066PW,112 74LV4066.pdf
74LV4066PW,112
Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 4
Produkt ist nicht verfügbar
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S912ZVM16F1MKHR S12ZVMFS.pdf
S912ZVM16F1MKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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S912ZVM16F1MKHR S12ZVMFS.pdf
S912ZVM16F1MKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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74HCT2G14GV,125 74HC_HCT2G14.pdf
74HCT2G14GV,125
Hersteller: NXP USA Inc.
Description: IC SCHMITT TRIG DL INV 6TSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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74HCT125N,652 74HC_HCT125_Rev5.pdf
74HCT125N,652
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
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74HCT125PW,112 74HC_HCT125.pdf
74HCT125PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
Produkt ist nicht verfügbar
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PEMI1QFN/RR,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RR,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1
Produkt ist nicht verfügbar
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SPC5745CK1AVMH2 MPC5746C-Datasheet.pdf
SPC5745CK1AVMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5744CFK1ACMH6 MPC5746C-Datasheet.pdf
SPC5744CFK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5211LCEP66 MCF5213EC.pdf
MCF5211LCEP66
Hersteller: NXP USA Inc.
Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MFS2601AMBA0ADR2
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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SFS5600AMBAAESR2
Hersteller: NXP USA Inc.
Description: PMIC, DUAL CHANNEL VPRE REGULATO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS5600AMBAAES
Hersteller: NXP USA Inc.
Description: PMIC,DUAL CHANNEL VPRE REGULATOR
Packaging: Tray
Produkt ist nicht verfügbar
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HEC4069UBT,118 HEF4069UB.pdf
HEC4069UBT,118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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MC33776ASA1AER2 MC33777A_PB.pdf
MC33776ASA1AER2
Hersteller: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Produkt ist nicht verfügbar
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SAF4000EL/103Q53CY
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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MIMX9302DVVXDAC IMX93CEC.pdf
MIMX9302DVVXDAC
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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FG32K144HAT0MLLT PdfFile_890942.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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PEMI2STD/RE,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/RE,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
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BC857BS,115 BC857BS.pdf
Hersteller: NXP USA Inc.
Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC8T245PW:112 74AVC8T245.pdf
74AVC8T245PW:112
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Produkt ist nicht verfügbar
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S912XEG128BCAL MC9S12XEP100RMV1.pdf
S912XEG128BCAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC238DB,112 74HC_HCT238.pdf
74HC238DB,112
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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74HCT4046ADB,112 74HC_HCT4046A.pdf
74HCT4046ADB,112
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT4046ADB,118 74HC_HCT4046A.pdf
74HCT4046ADB,118
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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74HCT4046AD,112 74HC_HCT4046A.pdf
74HCT4046AD,112
Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
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74HCT4046AD,118 74HC_HCT4046A.pdf
74HCT4046AD,118
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16SOIC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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PMEG4005CT,215 PMEG4005CT.pdf
PMEG4005CT,215
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 500MA TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG4005EH,115 PMEGXX05EH_EJ_SER.pdf
PMEG4005EH,115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 0.5A SOD123F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG4005EJ,115 PMEGXX05EH_EJ_SER.pdf
PMEG4005EJ,115
Hersteller: NXP USA Inc.
Description: SCHOTTKY RECT 40V 0.5A SOD323F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32M274LHABVKHSR S32M2xx_DS.pdf
S32M274LHABVKHSR
Hersteller: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32M274LHABVKHST S32M2xx_DS.pdf
S32M274LHABVKHST
Hersteller: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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1PS76SB10,115 1PS76SB10.pdf
1PS76SB10,115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 0.2A SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC4511D,653 74HC_HCT4511.pdf
74HC4511D,653
Hersteller: NXP USA Inc.
Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HC4511D,652 74HC_HCT4511.pdf
74HC4511D,652
Hersteller: NXP USA Inc.
Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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PBSS4320T,215 PBSS4320T.pdf
PBSS4320T,215
Hersteller: NXP USA Inc.
Description: TRANS NPN 20V 2A SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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N74F04D,623 N74F04.pdf
N74F04D,623
Hersteller: NXP USA Inc.
Description: IC INVERTR HEX COMM 6.9MA 14SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC2G240DP,125 74LVC2G240.pdf
74LVC2G240DP,125
Hersteller: NXP USA Inc.
Description: IC INVERTER DUAL 4-INPUT 8TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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