Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35731) > Seite 588 nach 596
| Foto | Bezeichnung | Hersteller | Beschreibung |
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PEMI8QFN/RK,132 | NXP USA Inc. |
 Description: FILTER RC(PI) 100 OHMS ESD SMDPackaging: Tape & Reel (TR) Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 18dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Number of Channels: 8 |
Produkt ist nicht verfügbar |
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MCXA346VLL | NXP USA Inc. |
Description: 180MHZ, CORTEX-M33 Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 64x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
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| FB32K144HFT0MLLT | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
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| TJA1103-SDBS | NXP USA Inc. |
Description: SABRE DEV BOARD ETHERNET PHY Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA11xx Embedded: No |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XDG128F2VAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC32D,653 | NXP USA Inc. |
Description: IC GATE OR 4CH 2-INP 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74AHC32D,112 | NXP USA Inc. |
Description: IC GATE OR 4CH 2-INP 14-SO Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MWCT2D16SHVPB | NXP USA Inc. |
Description: MWCT2D16S, MAXQFP172 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MWCT2D16SHVPBR | NXP USA Inc. |
Description: MWCT2D16SHVPBR Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K146HRT0MLLR | NXP USA Inc. |
Description: S32K146, M4F, FLASH 1M, RAM 128K Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K146HFT0VLLR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K146HRT0VLHT | NXP USA Inc. |
Description: S32K146 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K148HFT0VLQR | NXP USA Inc. |
Description: S32K148 144 LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K148HET0MLQR | NXP USA Inc. |
Description: S32K148 32-BIT MCU, ARM CORTEX- Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K146HFT0VLQR | NXP USA Inc. |
Description: S32K146, M4F, FLASH 1M, RAM 128K Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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PBLS4003Y,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PBLS4005Y,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PBLS4001Y,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PBLS4003D,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PBLS4005D,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PBLS4001D,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PBLS4002D,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AHC14D,118 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14-SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AHC14D,112 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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HEF4015BT,652 | NXP USA Inc. |
Description: IC REGISTER STATIC 4BIT 16-SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| BT136-600D,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 4A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| BT136-600,127 | NXP USA Inc. |
Description: TRIAC 600V 4A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| BUJ100LR,412 | NXP USA Inc. |
Description: TRANS NPN 400V 1A TO-92 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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BAS70-05,235 | NXP USA Inc. |
Description: DIODE SCHOTTKY 70V 70MA TO236AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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BAS70-05W,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 70V 70MA SOT323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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FS32K142HFT0MLFT | NXP USA Inc. |
Description: S32K142, 256K FLASH, 32K RAM Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 89 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| FS32K142HFT0MLFR | NXP USA Inc. |
Description: S32K142, 256K FLASH, 32K RAM Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MWCT1213AVLH | NXP USA Inc. |
Description: 15W, MULTI-COIL AUTO, MULTI-DEVI Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Applications: Controller, Wireless Power Transmitter Current - Supply: 300µA Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| S32Z280AACK0VJFR | NXP USA Inc. |
Description: STANDARD 594MAP S32Z280 W/OUT DF Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S32Z280AACK0VJFT | NXP USA Inc. |
Description: STANDARD 594MAP S32Z280 W/OUT DF Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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74HC125D,653 | NXP USA Inc. |
Description: IC BUFFER NON-INVERTING 6V 14-SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 14-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AHC125D,112 | NXP USA Inc. |
Description: IC BUFF DVR TRI-ST QD 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC125D,652 | NXP USA Inc. |
Description: IC BUFFER NON-INVERTING 6V 14-SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 14-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC125DB,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 14-SSOP Packaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 14-SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC4094D,652 | NXP USA Inc. |
Description: IC SHFT REG TRI-STATE 8BIT 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Tri-State Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC4094PW,118 | NXP USA Inc. |
Description: IC SR TRI-STATE 8BIT 16-TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Tri-State Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-TSSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| BT137-600,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| BT137-600G,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| BT137-600E,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| BT137-600D,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MCXA152VLF | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 52 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MC33PF8201A0TSR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33PF8201A0TS | NXP USA Inc. |
Description: MC33PF8201A0TS Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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PDTC143ZT,215 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW TO236AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PDTC143ZT,235 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW TO236AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PCA9564D,112 | NXP USA Inc. |
Description: IC CONTROLLER PARALLEL INTERFACE Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Function: Controller Interface: Parallel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Supply: 6mA Protocol: I2C Supplier Device Package: 20-SO DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PCA9564D,118 | NXP USA Inc. |
Description: IC CONTROLLER PARALLEL INTERFACE Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Function: Controller Interface: Parallel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Supply: 6mA Protocol: I2C Supplier Device Package: 20-SO DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74ABT640N,602 | NXP USA Inc. |
Description: IC TXRX INVERT 5.5V 20-DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Transceiver, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-DIP |
Produkt ist nicht verfügbar |
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N74F240N,602 | NXP USA Inc. |
Description: IC BUFFER INVERTING 5.5V 20-DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-DIP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC241D,652 | NXP USA Inc. |
Description: IC BUFFER NON-INVERTING 6V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 4 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC241D,653 | NXP USA Inc. |
Description: IC BUFFER NON-INVERTING 6V 20-SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 4 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC241DB,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 20-SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 4 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HCT241PW,118 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 5.5V 20-TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HCT241D,652 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HCT241DB,112 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 5.5V 20-SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PEMI8QFN/RK,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCXA346VLL |
|
Hersteller: NXP USA Inc.
Description: 180MHZ, CORTEX-M33
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 64x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Description: 180MHZ, CORTEX-M33
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 64x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.5 EUR |
| 10+ | 5.7 EUR |
| 25+ | 5.26 EUR |
| 100+ | 4.77 EUR |
| 450+ | 4.41 EUR |
| TJA1103-SDBS |
Hersteller: NXP USA Inc.
Description: SABRE DEV BOARD ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
Description: SABRE DEV BOARD ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 365.55 EUR |
| S912XDG128F2VAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC32D,653 |
|
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| FS32K142HFT0MLFT |
|
Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
Produkt ist nicht verfügbar
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| MWCT1213AVLH |
|
Hersteller: NXP USA Inc.
Description: 15W, MULTI-COIL AUTO, MULTI-DEVI
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Controller, Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: 15W, MULTI-COIL AUTO, MULTI-DEVI
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Controller, Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC125D,653 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC125D,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC125DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SSOP
Description: IC BUFFER NON-INVERT 6V 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC4094D,652 |
|
Hersteller: NXP USA Inc.
Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC4094PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC SR TRI-STATE 8BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
Description: IC SR TRI-STATE 8BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCXA152VLF |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 52
Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 52
Produkt ist nicht verfügbar
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| MC33PF8201A0TSR2 |
|
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33PF8201A0TS |
|
Hersteller: NXP USA Inc.
Description: MC33PF8201A0TS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Description: MC33PF8201A0TS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9564D,112 |
|
Hersteller: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9564D,118 |
|
Hersteller: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74ABT640N,602 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-DIP
Description: IC TXRX INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F240N,602 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC241D,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC241D,653 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC241DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT241PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
Description: IC BUFF NON-INVERT 5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
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| 74HCT241D,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT241DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH