Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36617) > Seite 593 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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S912ZVM16F1MKHR | NXP USA Inc. |
 Description: IC MCU 16BIT 16KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: SCI, SPI Peripherals: DMA, POR, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912ZVM16F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: SCI, SPI Peripherals: DMA, POR, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HCT2G14GV,125 | NXP USA Inc. |
Description: IC SCHMITT TRIG DL INV 6TSOP Packaging: Tape & Reel (TR) Features: Schmitt Trigger Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 6-TSOP Input Logic Level - High: 1.9V ~ 2.1V Input Logic Level - Low: 0.5V ~ 0.6V Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 1 µA |
Produkt ist nicht verfügbar |
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74HCT125N,652 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 14-DIP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HCT125PW,112 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 14-TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 14-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PEMI1QFN/RR,315 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: SC-101, SOT-883 Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 21pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 25dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Number of Channels: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5745CK1AVMH2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100LFBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z2, e200z4 Data Converters: A/D 68x10b, 31x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Grade: Automotive Number of I/O: 65 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5744CFK1ACMH6 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z2, e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 65 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCF5211LCEP66 | NXP USA Inc. |
Description: 32-BIT MICROCONTROLLERS - MCU MC Packaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-QFN-EP (9x9) Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MFS2601AMBA0ADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SFS5600AMBAAESR2 | NXP USA Inc. |
Description: PMIC, DUAL CHANNEL VPRE REGULATO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SFS5600AMBAAES | NXP USA Inc. |
Description: PMIC,DUAL CHANNEL VPRE REGULATOR Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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HEC4069UBT,118 | NXP USA Inc. |
Description: IC INVERTER 6CH 1-INP 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 15V Current - Output High, Low: 3.4mA, 3.4mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 4V ~ 12.5V Input Logic Level - Low: 1V ~ 2.5V Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 1 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33776ASA1AER2 | NXP USA Inc. |
Description: BATTERY JUNCTION BOX CONTROLLER Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Current, Over/Under Voltage |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| SAF4000EL/103Q53CY | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MIMX9302DVVXDAC | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tray Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 900MHz, 250MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| FG32K144HAT0MLLT | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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PEMI2STD/RE,115 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: SOT-665 Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 8.5pF (Total) Height: 0.024" (0.60mm) Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Number of Channels: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| BC857BS,115 | NXP USA Inc. |
Description: TRANS 2PNP 45V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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74AVC8T245PW:112 | NXP USA Inc. |
Description: IC TRANSLATION TXRX 3.6V 24TSSOP Packaging: Tube Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 24-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912XEG128BCAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8535BVJANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (1) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8536EBVJANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC866PZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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74HC238DB,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
Produkt ist nicht verfügbar |
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74HCT4046ADB,112 | NXP USA Inc. |
Description: IC PLL W/VCO 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Output: Clock Frequency - Max: 21MHz Type: Phase Lock Loop (PLL) Input: Clock Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Differential - Input:Output: No/No Supplier Device Package: 16-SSOP PLL: Yes Divider/Multiplier: No/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74HCT4046ADB,118 | NXP USA Inc. |
Description: IC PLL W/VCO 16SSOP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Output: Clock Frequency - Max: 21MHz Type: Phase Lock Loop (PLL) Input: Clock Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Differential - Input:Output: No/No Supplier Device Package: 16-SSOP PLL: Yes Divider/Multiplier: No/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74HCT4046AD,112 | NXP USA Inc. |
Description: IC PHASE LOCK LOOP W/VCO 16SOIC Packaging: Tube DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74HCT4046AD,118 | NXP USA Inc. |
Description: IC PLL W/VCO 16SOIC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BAV170,215 | NXP USA Inc. |
Description: DIODE ARRAY 75V 215MA TO236AB Packaging: Tube |
Produkt ist nicht verfügbar |
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PMEG4005CT,215 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 500MA TO236AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMEG4005ET,215 | NXP USA Inc. |
Description: SCHOTTKY RECT 40V 0.5A SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMEG4005EH,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 0.5A SOD123F Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMEG4005EJ,115 | NXP USA Inc. |
Description: SCHOTTKY RECT 40V 0.5A SOD323F Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PBSS5350D,115 | NXP USA Inc. |
Description: TRANS PNP 50V 3A 6TSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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S32M274LHABVKHSR | NXP USA Inc. |
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 6x12b SAR; D/A 2x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S32M274LHABVKHST | NXP USA Inc. |
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 6x12b SAR; D/A 2x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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1PS76SB10,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 0.2A SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC1G80GW,125 | NXP USA Inc. |
Description: IC D-TYPE POS TRG SNGL 5TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC4511D,653 | NXP USA Inc. |
Description: IC LATCH/DECODER/DRIVER 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Display Type: LED, LCD Mounting Type: Surface Mount Interface: BCD Configuration: 7 Segment Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
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74HC4511D,652 | NXP USA Inc. |
Description: IC LATCH/DECODER/DRIVER 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Display Type: LED, LCD Mounting Type: Surface Mount Interface: BCD Configuration: 7 Segment Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
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PDTC114EK,115 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 0.1A SMT3 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Supplier Device Package: SMT3; MPAK Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 10 kOhms Resistors Included: R1 and R2 |
Produkt ist nicht verfügbar |
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PBSS4320T,215 | NXP USA Inc. |
Description: TRANS NPN 20V 2A SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PBSS4320X,135 | NXP USA Inc. |
Description: TRANS NPN 20V 3A SOT89 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMBTA06,235 | NXP USA Inc. |
Description: TRANS NPN 80V 0.5A TO236AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMBT3904,215 | NXP USA Inc. |
Description: TRANS NPN SW 200MA 40V SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMBT3906,215 | NXP USA Inc. |
Description: TRANS PNP SW 200MA 40V SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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N74F04D,623 | NXP USA Inc. |
Description: IC INVERTR HEX COMM 6.9MA 14SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC2G240DP,125 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 8TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PEMI8QFN/LK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 15dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Number of Channels: 8 |
Produkt ist nicht verfügbar |
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74HC193D,652 | NXP USA Inc. |
Description: IC COUNTER UP/DOWN SYNC 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up, Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 49 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74HC193DB,118 | NXP USA Inc. |
Description: IC 4BIT BINAR UP/DN COUNT 16SSOP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up, Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 49 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| BCV62B,215 | NXP USA Inc. |
Description: TRANS PNP 30V 100MA DUAL SOT143B Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MPC5200CVR266 | NXP USA Inc. |
Description: IC MPU MPC52XX 266MHZ 272BGA Packaging: Tray Package / Case: 272-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 272-PBGA (27x27) Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Graphics Acceleration: No Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| RDW8897P-PCUS-S1 | NXP USA Inc. |
Description: RDW8897P-PCUS-S1 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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74AHCT125D,112 | NXP USA Inc. |
Description: IC BUFF DVR TRI-ST QD 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S08GT60ACFDE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 39 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| P3H2840HNHP | NXP USA Inc. |
Description: I3C HUB WITH 2 CONTROLLER PORTS Packaging: Tape & Reel (TR) Package / Case: 28-QFN Function: Hub Controller Interface: I2C, I3C, SMBus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.63V Protocol: I2C Supplier Device Package: 28-HVQFN (4x4) |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| P3H2840HNHP | NXP USA Inc. |
Description: I3C HUB WITH 2 CONTROLLER PORTS Packaging: Cut Tape (CT) Package / Case: 28-QFN Function: Hub Controller Interface: I2C, I3C, SMBus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.63V Protocol: I2C Supplier Device Package: 28-HVQFN (4x4) |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BT149G,126 | NXP USA Inc. |
Description: THYRISTOR 600V 0.8A SOT54 Packaging: Tape & Box (TB) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| S912ZVM16F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| S912ZVM16F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT2G14GV,125 |
|
Hersteller: NXP USA Inc.
Description: IC SCHMITT TRIG DL INV 6TSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Description: IC SCHMITT TRIG DL INV 6TSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT125N,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HCT125PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
Description: IC BUFF 4.5V/5.5V 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PEMI1QFN/RR,315 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5745CK1AVMH2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
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| SPC5744CFK1ACMH6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
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| MCF5211LCEP66 |
|
Hersteller: NXP USA Inc.
Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MFS2601AMBA0ADR2 |
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| SFS5600AMBAAESR2 |
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| SFS5600AMBAAES |
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
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| HEC4069UBT,118 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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| MC33776ASA1AER2 |
|
Hersteller: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| SAF4000EL/103Q53CY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MIMX9302DVVXDAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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| FG32K144HAT0MLLT |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| PEMI2STD/RE,115 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
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| 74AVC8T245PW:112 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Produkt ist nicht verfügbar
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| S912XEG128BCAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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| MPC8535BVJANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (1)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (1)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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| MPC8536EBVJANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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| MPC866PZP100A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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| 74HC238DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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| 74HCT4046ADB,112 |
|
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| 74HCT4046ADB,118 |
|
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC PLL W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| 74HCT4046AD,112 |
|
Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| 74HCT4046AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16SOIC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC PLL W/VCO 16SOIC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S32M274LHABVKHSR |
|
Hersteller: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| S32M274LHABVKHST |
|
Hersteller: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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| 74HC4511D,653 |
|
Hersteller: NXP USA Inc.
Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
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| 74HC4511D,652 |
|
Hersteller: NXP USA Inc.
Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Description: IC LATCH/DECODER/DRIVER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
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| PDTC114EK,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS NPN 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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| PEMI8QFN/LK,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 8
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| 74HC193D,652 |
|
Hersteller: NXP USA Inc.
Description: IC COUNTER UP/DOWN SYNC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
Description: IC COUNTER UP/DOWN SYNC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
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| 74HC193DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC 4BIT BINAR UP/DN COUNT 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
Description: IC 4BIT BINAR UP/DN COUNT 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
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| MPC5200CVR266 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 266MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Description: IC MPU MPC52XX 266MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08GT60ACFDE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| P3H2840HNHP |
Hersteller: NXP USA Inc.
Description: I3C HUB WITH 2 CONTROLLER PORTS
Packaging: Tape & Reel (TR)
Package / Case: 28-QFN
Function: Hub Controller
Interface: I2C, I3C, SMBus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Protocol: I2C
Supplier Device Package: 28-HVQFN (4x4)
Description: I3C HUB WITH 2 CONTROLLER PORTS
Packaging: Tape & Reel (TR)
Package / Case: 28-QFN
Function: Hub Controller
Interface: I2C, I3C, SMBus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Protocol: I2C
Supplier Device Package: 28-HVQFN (4x4)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6000+ | 13.71 EUR |
| P3H2840HNHP |
Hersteller: NXP USA Inc.
Description: I3C HUB WITH 2 CONTROLLER PORTS
Packaging: Cut Tape (CT)
Package / Case: 28-QFN
Function: Hub Controller
Interface: I2C, I3C, SMBus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Protocol: I2C
Supplier Device Package: 28-HVQFN (4x4)
Description: I3C HUB WITH 2 CONTROLLER PORTS
Packaging: Cut Tape (CT)
Package / Case: 28-QFN
Function: Hub Controller
Interface: I2C, I3C, SMBus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Protocol: I2C
Supplier Device Package: 28-HVQFN (4x4)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.82 EUR |
| 10+ | 17.93 EUR |
| 25+ | 16.72 EUR |
| 100+ | 15.36 EUR |
| 250+ | 14.98 EUR |