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PUMD2,115 PUMD2,115 NXP USA Inc. PEMD2_PIMD2_PUMD2.pdf Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PUMD24,115 PUMD24,115 NXP USA Inc. PEMD24_PUMD24.pdf Description: TRANS PREBIASED DUAL 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT365DB,112 74HCT365DB,112 NXP USA Inc. 74HC_HCT365.pdf Description: IC BUFF 4.5V/5.5V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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74HCT365D,653 74HCT365D,653 NXP USA Inc. 74HC_HCT365.pdf Description: IC BUFF 4.5V/5.5V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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PDZ3.3B,115 PDZ3.3B,115 NXP USA Inc. PHGLS19616-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 400MW SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IMX95LP4XCPU-15 NXP USA Inc. Description: IMX95LP4XCPU-15
Packaging: Bulk
Produkt ist nicht verfügbar
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MC33772BTP1AE MC33772BTP1AE NXP USA Inc. MC33772B_SDS.pdf Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
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MC33FS6522CAER2 MC33FS6522CAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6522CAER2 MC33FS6522CAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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BFG310W/XR,115 BFG310W/XR,115 NXP USA Inc. BFG310W_XR_Rev2.pdf Description: RF TRANS NPN 6V 14GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: CMPAK-4
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74HCT03PW,112 74HCT03PW,112 NXP USA Inc. 74HC%28T%2903.pdf Description: IC GATE NAND 4CH 2-INP 14-TSSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HCT03D,652 74HCT03D,652 NXP USA Inc. 74HC%28T%2903.pdf Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HCT03DB,112 74HCT03DB,112 NXP USA Inc. 74HC%28T%2903.pdf Description: IC GATE NAND 4CH 2-INP 14-SSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74ALVC16245DL,118 74ALVC16245DL,118 NXP USA Inc. 74ALVC_ALVCH16245.pdf Description: IC TRANSCVR 3-ST 16BIT 48SSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74ALVC16245DL,112 74ALVC16245DL,112 NXP USA Inc. 74ALVC_ALVCH16245.pdf Description: IC TRANSCVR 3-ST 16BIT 48SSOP
Packaging: Tube
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74ALVC16245DGG,112 74ALVC16245DGG,112 NXP USA Inc. 74ALVC_ALVCH16245.pdf Description: IC TRANSCVR TRI-ST 16BIT 48TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
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BF622,115 NXP USA Inc. BF622.pdf Description: TRANS NPN 250V 50MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF3EH43A1DUF/01EVZ NXP USA Inc. MF3E(H)x3_SDS.pdf Description: MF3EH43A1DUF/01EV
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MC7447AVS1000LB MC7447AVS1000LB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7447AVS1000NB MC7447AVS1000NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MCXW727AMFTBT MCXW727AMFTBT NXP USA Inc. MCXW72DS.pdf Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
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2+13.92 EUR
10+10.76 EUR
25+9.97 EUR
100+9.09 EUR
260+8.66 EUR
520+8.41 EUR
1040+8.21 EUR
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MCXW727CMFTBT MCXW727CMFTBT NXP USA Inc. MCXW72DS.pdf Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
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KW47Z42082AFTBT NXP USA Inc. KW47DS.pdf Description: KW47 AUTO QFN48
Packaging: Tray
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KW47Z42092AFTBT NXP USA Inc. KW47DS.pdf Description: KW47 AUTO QFN48
Packaging: Tray
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KW47Z420B3AFTBT NXP USA Inc. KW47DS.pdf Description: KW47 AUTO QFN48
Packaging: Tray
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KW47Z420B2AFTBT NXP USA Inc. KW47DS.pdf Description: KW47 AUTO QFN48
Packaging: Tray
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KW47B42ZB2AFTBT NXP USA Inc. KW47DS.pdf Description: KW47 AUTO QFN48
Packaging: Tray
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MPF5103AMMA0ES NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
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MPF5103AMBA0ES NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5113AMMA0ES NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
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MPF5113AMMA0ESR2 NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
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MPF5113AMBA0ESR2 NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
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MPF5113AMBA0ES NXP USA Inc. PF5103-PF5113-PF5123.pdf Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5123AMMA0ESR2 NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5123AMMA0ES NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5123AMBA0ESR2 NXP USA Inc. PF5103-PF5113-PF5123.pdf Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5123AMBA0ES NXP USA Inc. PF5103-PF5113-PF5123.pdf Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5103AMMA0ESR2 NXP USA Inc. PF5103-PF5113-PF5123.pdf Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Bulk
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5103AMBA0ESR2 NXP USA Inc. PF0300.pdf Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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BF620,115 NXP USA Inc. Description: TRANS NPN 300V 50MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BF621,115 NXP USA Inc. BF621.pdf Description: TRANS PNP 300V 50MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAS70-04W,115 BAS70-04W,115 NXP USA Inc. BAS70-05.pdf Description: DIODE SCHOTTKY 70V 70MA SOT323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC849B,235 NXP USA Inc. BC849B.pdf Description: TRANSISTOR NPN 30V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AHC157D,118 74AHC157D,118 NXP USA Inc. 74AHC_AHCT157.pdf Description: IC QUAD 2-INPUT MUX 16SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC112N,652 74HC112N,652 NXP USA Inc. 74HC_HCT112_Rev_Oct2000.pdf Description: IC FF JK-TYPE 2-ELE 1-BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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74HC597PW,112 74HC597PW,112 NXP USA Inc. 74HC_HCT597.pdf Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597D,653 74HCT597D,653 NXP USA Inc. 74HC_HCT597.pdf Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597DB,112 74HCT597DB,112 NXP USA Inc. 74HC_HCT597.pdf Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597DB,118 74HCT597DB,118 NXP USA Inc. 74HC_HCT597.pdf Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597D,652 74HCT597D,652 NXP USA Inc. 74HC_HCT597.pdf Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT161D,653 74HCT161D,653 NXP USA Inc. 74HC_HCT161_Dec_1990.pdf Description: IC BINARY COUNTER 4-BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 41 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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MCXN546VPBT NXP USA Inc. MCXNP184M150F70.pdf Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 84 Stücke
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S32G378ASAK1VUCR S32G378ASAK1VUCR NXP USA Inc. S32G3.pdf Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Cut Tape (CT)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
auf Bestellung 500 Stücke:
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1+161.92 EUR
10+135.01 EUR
25+128.35 EUR
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S32G378AAAK1VUCT S32G378AAAK1VUCT NXP USA Inc. S32E27.pdf Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AAAK1VUCR S32G378AAAK1VUCR NXP USA Inc. S32E27.pdf Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AABK1VUCT S32G378AABK1VUCT NXP USA Inc. S32E27.pdf Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AABK1VUCR S32G378AABK1VUCR NXP USA Inc. S32E27.pdf Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AADK1VUCT S32G378AADK1VUCT NXP USA Inc. S32E280AABAAVJGR.pdf Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 420 Stücke
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S32G378AADK1VUCR S32G378AADK1VUCR NXP USA Inc. S32E280AABAAVJGR.pdf Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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S32G378ASDK1VUCT NXP USA Inc. Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 420 Stücke
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PUMD2,115 PEMD2_PIMD2_PUMD2.pdf
PUMD2,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PUMD24,115 PEMD24_PUMD24.pdf
PUMD24,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIASED DUAL 6TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT365DB,112 74HC_HCT365.pdf
74HCT365DB,112
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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74HCT365D,653 74HC_HCT365.pdf
74HCT365D,653
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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PDZ3.3B,115 PHGLS19616-1.pdf?t.download=true&u=5oefqw
PDZ3.3B,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 400MW SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IMX95LP4XCPU-15
Hersteller: NXP USA Inc.
Description: IMX95LP4XCPU-15
Packaging: Bulk
Produkt ist nicht verfügbar
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MC33772BTP1AE MC33772B_SDS.pdf
MC33772BTP1AE
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
34+15.76 EUR
Mindestbestellmenge: 34 Stücke
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MC33FS6522CAER2 FS6500-FS4500-ASILD.pdf
MC33FS6522CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS6522CAER2 FS6500-FS4500-ASILD.pdf
MC33FS6522CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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BFG310W/XR,115 BFG310W_XR_Rev2.pdf
BFG310W/XR,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: CMPAK-4
Produkt ist nicht verfügbar
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74HCT03PW,112 74HC%28T%2903.pdf
74HCT03PW,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-TSSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HCT03D,652 74HC%28T%2903.pdf
74HCT03D,652
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HCT03DB,112 74HC%28T%2903.pdf
74HCT03DB,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74ALVC16245DL,118 74ALVC_ALVCH16245.pdf
74ALVC16245DL,118
Hersteller: NXP USA Inc.
Description: IC TRANSCVR 3-ST 16BIT 48SSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74ALVC16245DL,112 74ALVC_ALVCH16245.pdf
74ALVC16245DL,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR 3-ST 16BIT 48SSOP
Packaging: Tube
Produkt ist nicht verfügbar
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74ALVC16245DGG,112 74ALVC_ALVCH16245.pdf
74ALVC16245DGG,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 16BIT 48TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
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BF622,115 BF622.pdf
Hersteller: NXP USA Inc.
Description: TRANS NPN 250V 50MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF3EH43A1DUF/01EVZ MF3E(H)x3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3EH43A1DUF/01EV
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MC7447AVS1000LB MPC7447AEC.pdf
MC7447AVS1000LB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AVS1000NB MPC7447AEC.pdf
MC7447AVS1000NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCXW727AMFTBT MCXW72DS.pdf
MCXW727AMFTBT
Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.92 EUR
10+10.76 EUR
25+9.97 EUR
100+9.09 EUR
260+8.66 EUR
520+8.41 EUR
1040+8.21 EUR
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MCXW727CMFTBT MCXW72DS.pdf
MCXW727CMFTBT
Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Produkt ist nicht verfügbar
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KW47Z42082AFTBT KW47DS.pdf
Hersteller: NXP USA Inc.
Description: KW47 AUTO QFN48
Packaging: Tray
Produkt ist nicht verfügbar
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KW47Z42092AFTBT KW47DS.pdf
Hersteller: NXP USA Inc.
Description: KW47 AUTO QFN48
Packaging: Tray
Produkt ist nicht verfügbar
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KW47Z420B3AFTBT KW47DS.pdf
Hersteller: NXP USA Inc.
Description: KW47 AUTO QFN48
Packaging: Tray
Produkt ist nicht verfügbar
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KW47Z420B2AFTBT KW47DS.pdf
Hersteller: NXP USA Inc.
Description: KW47 AUTO QFN48
Packaging: Tray
Produkt ist nicht verfügbar
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KW47B42ZB2AFTBT KW47DS.pdf
Hersteller: NXP USA Inc.
Description: KW47 AUTO QFN48
Packaging: Tray
Produkt ist nicht verfügbar
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MPF5103AMMA0ES PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5103AMBA0ES PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5113AMMA0ES PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5113AMMA0ESR2 PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5113AMBA0ESR2 PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5113AMBA0ES PF5103-PF5113-PF5123.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
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MPF5123AMMA0ESR2 PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MPF5123AMMA0ES PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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MPF5123AMBA0ESR2 PF5103-PF5113-PF5123.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MPF5123AMBA0ES PF5103-PF5113-PF5123.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
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MPF5103AMMA0ESR2 PF5103-PF5113-PF5123.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Bulk
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MPF5103AMBA0ESR2 PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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BF620,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 300V 50MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BF621,115 BF621.pdf
Hersteller: NXP USA Inc.
Description: TRANS PNP 300V 50MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAS70-04W,115 BAS70-05.pdf
BAS70-04W,115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 70V 70MA SOT323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC849B,235 BC849B.pdf
Hersteller: NXP USA Inc.
Description: TRANSISTOR NPN 30V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AHC157D,118 74AHC_AHCT157.pdf
74AHC157D,118
Hersteller: NXP USA Inc.
Description: IC QUAD 2-INPUT MUX 16SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC112N,652 74HC_HCT112_Rev_Oct2000.pdf
74HC112N,652
Hersteller: NXP USA Inc.
Description: IC FF JK-TYPE 2-ELE 1-BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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74HC597PW,112 74HC_HCT597.pdf
74HC597PW,112
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597D,653 74HC_HCT597.pdf
74HCT597D,653
Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597DB,112 74HC_HCT597.pdf
74HCT597DB,112
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597DB,118 74HC_HCT597.pdf
74HCT597DB,118
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT597D,652 74HC_HCT597.pdf
74HCT597D,652
Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT161D,653 74HC_HCT161_Dec_1990.pdf
74HCT161D,653
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 41 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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MCXN546VPBT MCXNP184M150F70.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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S32G378ASAK1VUCR S32G3.pdf
S32G378ASAK1VUCR
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Cut Tape (CT)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+161.92 EUR
10+135.01 EUR
25+128.35 EUR
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S32G378AAAK1VUCT S32E27.pdf
S32G378AAAK1VUCT
Hersteller: NXP USA Inc.
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AAAK1VUCR S32E27.pdf
S32G378AAAK1VUCR
Hersteller: NXP USA Inc.
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AABK1VUCT S32E27.pdf
S32G378AABK1VUCT
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AABK1VUCR S32E27.pdf
S32G378AABK1VUCR
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G378AADK1VUCT S32E280AABAAVJGR.pdf
S32G378AADK1VUCT
Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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S32G378AADK1VUCR S32E280AABAAVJGR.pdf
S32G378AADK1VUCR
Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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S32G378ASDK1VUCT
Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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