Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36263) > Seite 595 nach 605
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BSC9131NJN1HHHB | NXP USA Inc. |
 Description: IC MPU QORIQ 800MHZ 520FCBGAPackaging: Bulk Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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BSC9131NJN1HHHB | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 520FCBGA Packaging: Box Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
Produkt ist nicht verfügbar |
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TDF8534HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Cut Tape (CT) Package / Case: 100-FQFP Exposed Pad Output Type: 5-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm Supplier Device Package: 100-HLQFP (14x14) |
auf Bestellung 483 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF8100CCEP | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QXP Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
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MC34PF8100CCEPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PR Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
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74HC85D,652 | NXP USA Inc. |
Description: IC MAG COMPARATOR 4BIT 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Output: Active High Type: Magnitude Comparator Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: 16-SO Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF Output Function: A Number of Bits: 4 |
Produkt ist nicht verfügbar |
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74HC85D,653 | NXP USA Inc. |
Description: IC MAG COMPARATOR 4BIT 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Output: Active High Type: Magnitude Comparator Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: 16-SO Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF Output Function: A Number of Bits: 4 |
Produkt ist nicht verfügbar |
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74HC85DB,118 | NXP USA Inc. |
Description: IC MAG COMPARATOR 4BIT 16-SSOP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Output: Active High Type: Magnitude Comparator Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: 16-SSOP Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF Output Function: A Number of Bits: 4 |
Produkt ist nicht verfügbar |
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MC33FS4508NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6L2DVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L3DVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L7DVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L2EVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L3EVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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NE5234N,602 | NXP USA Inc. |
Description: IC OPAMP MATCHED QUAD HP 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: Rail-to-Rail Mounting Type: Through Hole Amplifier Type: Standard (General Purpose) Operating Temperature: 0°C ~ 70°C Current - Supply: 2.8mA (x4 Channels) Slew Rate: 0.8V/µs Current - Input Bias: 25 nA Voltage - Input Offset: 200 µV Supplier Device Package: 14-DIP Number of Circuits: 4 Current - Output / Channel: 12 mA -3db Bandwidth: 2.5 MHz Voltage - Supply Span (Min): 2 V Voltage - Supply Span (Max): 5.5 V |
Produkt ist nicht verfügbar |
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NE5234N,602 | NXP USA Inc. |
Description: IC OPAMP MATCHED QUAD HP 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: Rail-to-Rail Mounting Type: Through Hole Amplifier Type: Standard (General Purpose) Operating Temperature: 0°C ~ 70°C Current - Supply: 2.8mA (x4 Channels) Slew Rate: 0.8V/µs Current - Input Bias: 25 nA Voltage - Input Offset: 200 µV Supplier Device Package: 14-DIP Number of Circuits: 4 Current - Output / Channel: 12 mA -3db Bandwidth: 2.5 MHz Voltage - Supply Span (Min): 2 V Voltage - Supply Span (Max): 5.5 V |
Produkt ist nicht verfügbar |
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BCP69-16/DG,115 | NXP USA Inc. |
Description: TRANS PNP SC73 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Supplier Device Package: SC-73 |
Produkt ist nicht verfügbar |
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PDTA115EM,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 250MW SOT883 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PDTA115EU,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 200MW SOT323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| LFTAA13C | NXP USA Inc. |
Description: 32 PIN 0.5MM QFN TARGET ADAPTER Packaging: Bulk Module/Board Type: Socket Module - QFN |
Produkt ist nicht verfügbar |
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DAC1001D125HL/C1,1 | NXP USA Inc. |
Description: IC DAC 10BIT DL 125MSPS 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1201D125HL/C1,1 | NXP USA Inc. |
Description: IC DAC 12BIT DL 125MSPS 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1401D125HL/C1,1 | NXP USA Inc. |
Description: IC DAC 14BIT DL 125MSPS 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1003D160HW/C1,5 | NXP USA Inc. |
Description: IC DAC 10BIT 160MSPS 80-HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1003D160HW/C1:5 | NXP USA Inc. |
Description: IC DAC 10BIT 160MSPS 80-HTQFP Packaging: Tray |
Produkt ist nicht verfügbar |
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DAC1203D160HW/C1,5 | NXP USA Inc. |
Description: IC DAC 12BIT 160MSPS 80-HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1203D160HW/C1:5 | NXP USA Inc. |
Description: IC DAC 12BIT 160MSPS 80-HTQFP Packaging: Tray |
Produkt ist nicht verfügbar |
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| DAC1405D650HW/C1,5 | NXP USA Inc. |
Description: IC DAC 14BIT 650MSPD DL 100HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1403D160HW/C1,5 | NXP USA Inc. |
Description: IC DAC 14BIT 160MSPS 80-HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| DAC1005D650HW/C1,5 | NXP USA Inc. |
Description: IC DAC 10BIT 650MSPS DL 100HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1403D160HW/C1:5 | NXP USA Inc. |
Description: IC DAC 14BIT 160MSPS 80-HTQFP Packaging: Tray |
Produkt ist nicht verfügbar |
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| DAC1205D650HW/C1,5 | NXP USA Inc. |
Description: IC DAC 12BIT 650MSPS DL 100HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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DAC1408D750HN/C1:5 | NXP USA Inc. |
Description: IC DAC 14BIT 750MSPS DL 16HVQFN Packaging: Tray |
Produkt ist nicht verfügbar |
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DAC1405D750HW/C1,5 | NXP USA Inc. |
Description: IC DAC 14BIT SRL/SPI 100HTQFP Packaging: Tray |
Produkt ist nicht verfügbar |
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| BT137-600G,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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MPC857TVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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74LVC240ABQ,115 | NXP USA Inc. |
Description: IC INVERT DUAL 4-INPUT 20DHVQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC240AD,112 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
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74LVC240APW,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC240ADB,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC240AD,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC33972TEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
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MC33972TEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
auf Bestellung 894 Stücke: Lieferzeit 10-14 Tag (e) |
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PZTA92,115 | NXP USA Inc. |
Description: TRANS PNP 300V 100MA SOT223 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BUK964R2-55B,118 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A D2PAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC03DB,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SSOP Features: Open Drain Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: -, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC03D,653 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Features: Open Drain Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: -, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC03D,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Features: Open Drain Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: -, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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MIMX8ML4DVNLZAB | NXP USA Inc. |
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA Packaging: Tray Package / Case: 548-LFBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 548-LFBGA (15x15) Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, RDC Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
auf Bestellung 116 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN5DVPIZDA | NXP USA Inc. |
Description: MIMX8MN5DVPIZDA Packaging: Tray Package / Case: 306-TFBGA Speed: 1.4GHz, 750MHz RAM Size: 544kB Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART Peripherals: DMA, PWM, WDT Supplier Device Package: 306-TFBGA (11x11) Architecture: MPU |
auf Bestellung 168 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC160DB,112 | NXP USA Inc. |
Description: IC SYNC BCD DECADE COUNTR 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 66 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
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74HC160D,653 | NXP USA Inc. |
Description: IC SYNC BCD DECADE COUNT 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 66 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCF51QM64VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 2x16b, 12x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC85DB,112 | NXP USA Inc. |
Description: IC MAG COMPARATOR 4BIT 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Output: Active High Type: Magnitude Comparator Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: 16-SSOP Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF Output Function: A Number of Bits: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BAT54S,215 | NXP USA Inc. |
 Description: DIODE SCHOTTKY 30V 200MA TO236ABPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74AHCT541BQ,115 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST 8BIT 20DHVQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74AHCT541PW,112 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74AHCT541D,112 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST 8BIT 20SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC1G14GW,125 | NXP USA Inc. |
Description: IC INV SCHMITT TRIGGER 5TSSOP Features: Schmitt Trigger Packaging: Tape & Reel (TR) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 2.6mA, 2.6mA Number of Inputs: 1 Supplier Device Package: 5-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 32ns @ 6V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 20 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC1G32GW,165 | NXP USA Inc. |
Description: IC GATE OR 1CH 2-INP 5-TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BSC9131NJN1HHHB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 103.6 EUR |
| BSC9131NJN1HHHB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8534HH/N3Y |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
auf Bestellung 483 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 63.06 EUR |
| 10+ | 51.42 EUR |
| 25+ | 48.51 EUR |
| 100+ | 46.12 EUR |
| MC34PF8100CCEP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF8100CCEPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC85D,652 |
|
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: A
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC85D,653 |
|
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: A
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC85DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: A
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS4508NAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.24 EUR |
| 10+ | 11.07 EUR |
| 25+ | 10.28 EUR |
| 100+ | 9.41 EUR |
| 250+ | 8.99 EUR |
| MCIMX6L2DVN10AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6L3DVN10AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6L7DVN10AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6L2EVN10AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6L3EVN10AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NE5234N,602 |
|
Hersteller: NXP USA Inc.
Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NE5234N,602 |
|
Hersteller: NXP USA Inc.
Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BCP69-16/DG,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PNP SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Description: TRANS PNP SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LFTAA13C |
Hersteller: NXP USA Inc.
Description: 32 PIN 0.5MM QFN TARGET ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Description: 32 PIN 0.5MM QFN TARGET ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC857TVR66B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33972TEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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Im Einkaufswagen
Stück im Wert von UAH
| MC33972TEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
auf Bestellung 894 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.62 EUR |
| 10+ | 5.81 EUR |
| 25+ | 5.35 EUR |
| 100+ | 4.85 EUR |
| 250+ | 4.61 EUR |
| 500+ | 4.54 EUR |
| 74HC03DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Features: Open Drain
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Features: Open Drain
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC03D,653 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Features: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Features: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC03D,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Features: Open Drain
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Features: Open Drain
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8ML4DVNLZAB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 63.94 EUR |
| 10+ | 52.16 EUR |
| 25+ | 49.22 EUR |
| MIMX8MN5DVPIZDA |
|
Hersteller: NXP USA Inc.
Description: MIMX8MN5DVPIZDA
Packaging: Tray
Package / Case: 306-TFBGA
Speed: 1.4GHz, 750MHz
RAM Size: 544kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 306-TFBGA (11x11)
Architecture: MPU
Description: MIMX8MN5DVPIZDA
Packaging: Tray
Package / Case: 306-TFBGA
Speed: 1.4GHz, 750MHz
RAM Size: 544kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 306-TFBGA (11x11)
Architecture: MPU
auf Bestellung 168 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 41.27 EUR |
| 10+ | 33.21 EUR |
| 25+ | 31.2 EUR |
| 168+ | 28.36 EUR |
| 74HC160DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC BCD DECADE COUNTR 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Description: IC SYNC BCD DECADE COUNTR 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC160D,653 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC BCD DECADE COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Description: IC SYNC BCD DECADE COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF51QM64VLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 2x16b, 12x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 2x16b, 12x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC85DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: A
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC1G14GW,125 |
|
Hersteller: NXP USA Inc.
Description: IC INV SCHMITT TRIGGER 5TSSOP
Features: Schmitt Trigger
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 2.6mA, 2.6mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 32ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Description: IC INV SCHMITT TRIGGER 5TSSOP
Features: Schmitt Trigger
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 2.6mA, 2.6mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 32ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Produkt ist nicht verfügbar
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