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SPC5746CSK1MMJ6,557 NXP USA Inc. Description: MPC574XP MICROCONTROLLER POWER A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744PFK1AMLQ8 SPC5744PFK1AMLQ8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
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BZB84-C3V9215 BZB84-C3V9215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
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BZX84-C30/LF1R BZX84-C30/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S908AZ60AH3CFUE S908AZ60AH3CFUE NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64QFP
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S908EY16AE0CFJER S908EY16AE0CFJER NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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S908EY16AE0CFJER S908EY16AE0CFJER NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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G1120B0MIPI G1120B0MIPI NXP USA Inc. IMXRT500RT600FS.pdf Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
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FRDM-K32W042 NXP USA Inc. Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG324DSC2 NXP USA Inc. Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
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74HCT244BQ-Q100 74HCT244BQ-Q100 NXP USA Inc. PHGLS25316-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
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PCAL6408A-ARD PCAL6408A-ARD NXP USA Inc. getting-started-with-the-pcal6408a-ard-evaluation-board:GS-PCAL6408A-ARD Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AEV-ARD PCAL6416AEV-ARD NXP USA Inc. getting-started-with-the-pcal6416aev-ard-evaluation-board:GS-PCAL6416AEV-ARD Description: 16-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6416A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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BZB84-C51,215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA BZB84-C51 - ZENER D
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 180 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMB19,115 PUMB19,115 NXP USA Inc. PEMB19_PUMB19.pdf Description: NOW NEXPERIA PUMB19 - SMALL SIGN
Produkt ist nicht verfügbar
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N74F534D,623 N74F534D,623 NXP USA Inc. 74F534.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Supplier Device Package: 20-SO
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N74F109D,623 N74F109D,623 NXP USA Inc. DS_568_74F109.pdf Description: IC FF JK TYPE DUAL 1BIT 16SO
Number of Bits per Element: 1
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Supplier Device Package: 16-SO
Clock Frequency: 125 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Current - Quiescent (Iq): 17 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: JK Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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N74F10D,602 N74F10D,602 NXP USA Inc. 74F10,11.pdf Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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MC56F83789AVLLA MC56F83789AVLLA NXP USA Inc. MC56F837XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
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10+36.51 EUR
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OMPCA9959LEDEV OMPCA9959LEDEV NXP USA Inc. Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
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S9S08QD2J1VSCR S9S08QD2J1VSCR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
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MF3DH2200DU75/02V NXP USA Inc. Description: MIFARE SMART CARD DESFIRE EV2 XL
Produkt ist nicht verfügbar
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PHPT610035NK115 NXP USA Inc. PHPT610035NK.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN38003AEWY PTN38003AEWY NXP USA Inc. PTN38003A.pdf Description: IC USB-C 3.2 / DP1.4 REDRIVER
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PTN38003AEWY PTN38003AEWY NXP USA Inc. PTN38003A.pdf Description: IC USB-C 3.2 / DP1.4 REDRIVER
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10+10.09 EUR
25+9.54 EUR
100+8.27 EUR
250+7.84 EUR
500+7.04 EUR
1000+6.71 EUR
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TJA1441AT/0Z TJA1441AT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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7+3 EUR
10+2.18 EUR
25+1.99 EUR
100+1.76 EUR
250+1.65 EUR
500+1.59 EUR
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MK28FN2M0CAU15R NXP USA Inc. K28P210M150SF5.pdf Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1R BZX84-C4V7/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1VL BZX84-C4V7/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEMI1QFN/LT,315 PEMI1QFN/LT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
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PEMI1QFN/LT,315 PEMI1QFN/LT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
Number of Channels: 1
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LPC4325JBD144551 LPC4325JBD144551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LPC4322JBD144551 LPC4322JBD144551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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NTM88H065T1 NTM88H065T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTM88H065T1 NTM88H065T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
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5+15.43 EUR
10+13.64 EUR
25+11.07 EUR
50+9.78 EUR
100+9.52 EUR
500+7.97 EUR
1000+7.46 EUR
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SPC5603BAMLL4R SPC5603BAMLL4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12P64J0MFTR NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: CPU12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8314EVRAFDA MPC8314EVRAFDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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S912XEG384BMAL S912XEG384BMAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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FS32K142MAT0MLHT FS32K142MAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5746CHK1AVKU6 SPC5746CHK1AVKU6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SAF3560EL/V1100Y NXP USA Inc. Description: IC DGTL HD RADIO PROCESSOR 170LB
Produkt ist nicht verfügbar
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MRFE6VP6600NR3,528 NXP USA Inc. MRFE6VP6600N.pdf Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
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BUK9K89-100E115 NXP USA Inc. BUK9K89-100E.pdf Description: NOW NEXPERIA BUK9K89-100E - POWE
Packaging: Bulk
Produkt ist nicht verfügbar
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K32W041AZ K32W041AZ NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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K32W041AZ K32W041AZ NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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10+10.17 EUR
25+9.63 EUR
100+8.88 EUR
250+8.43 EUR
500+8.1 EUR
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BZX84-C36/LF1R BZX84-C36/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C36/LF1VL BZX84-C36/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PSMN7R6-60XSQ PSMN7R6-60XSQ NXP USA Inc. Description: MOSFET N-CH 60V 51.5A TO220F
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4.6V @ 1mA
Power Dissipation (Max): 46W (Tc)
Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc)
FET Type: N-Channel
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MCZ33903DS5EK MCZ33903DS5EK NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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NHS3100UK/A1Z NHS3100UK/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 25WLCSP
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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NHS3100UK/A1Z NHS3100UK/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NHS3100UK/A1Z NHS3100UK/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Bulk
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BCW30235 BCW30235 NXP USA Inc. BCW29_BCW30.pdf Description: NOW NEXPERIA BCW30 - SMALL SIGNA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITFS5600FRDMEVM NXP USA Inc. UM11526.pdf Description: EVAL BOARD FOR FS5600
Contents: Board(s), Cable(s)
Outputs and Type: 2 Non-Isolated Outputs
Main Purpose: DC/DC Converter
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FS5600
Board Type: Fully Populated
Regulator Topology: Buck
Current - Output: 10A, 3A
Voltage - Input: 36V
Voltage - Output: 1.8V ~ 8V, 1.8V ~ 7.2V
Packaging: Bulk
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IP3348CX10,135 NXP USA Inc. IP3348CX5%2C10%2C15%2C20.pdf Description: FILTER LC(PI) 15NH/25PF ESD SMD
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Height: 0.026" (0.65mm)
Values: L = 15nH (Total), C = 25pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm)
Package / Case: 10-UFBGA, WLCSP
Packaging: Bulk
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 10
Center / Cutoff Frequency: 350MHz (Cutoff)
Technology: LC (Pi)
Current: 20 mA
Applications: Data Lines for Mobile Devices
Filter Order: 3rd
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MK28FN2M0ACAU15R NXP USA Inc. K28P210M150SF5.pdf Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Produkt ist nicht verfügbar
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FS32K144ULT0VLLR FS32K144ULT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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MVR5510AVMAHEPR2 MVR5510AVMAHEPR2 NXP USA Inc. VR5510.pdf Description: IC PMIC VR5510 QM
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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RDDRONE-CUPK64 NXP USA Inc. Description: NXP CUP DRONE MAINBOARD
Part Status: Active
Platform: Mikroe NXP Cup Mainboard
Utilized IC / Part: K64
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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SPC5746CSK1MMJ6,557
Hersteller: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744PFK1AMLQ8 MPC5744P.pdf
SPC5744PFK1AMLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB84-C3V9215 BZB84_SER.pdf
BZB84-C3V9215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
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BZX84-C30/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C30/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S908AZ60AH3CFUE
S908AZ60AH3CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
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S908EY16AE0CFJER MC68HC908EY16A.pdf
S908EY16AE0CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S908EY16AE0CFJER MC68HC908EY16A.pdf
S908EY16AE0CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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47+11.77 EUR
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G1120B0MIPI IMXRT500RT600FS.pdf
G1120B0MIPI
Hersteller: NXP USA Inc.
Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
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FRDM-K32W042
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG324DSC2
Hersteller: NXP USA Inc.
Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
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74HCT244BQ-Q100 PHGLS25316-1.pdf?t.download=true&u=5oefqw
74HCT244BQ-Q100
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
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1282+0.44 EUR
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PCAL6408A-ARD getting-started-with-the-pcal6408a-ard-evaluation-board:GS-PCAL6408A-ARD
PCAL6408A-ARD
Hersteller: NXP USA Inc.
Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AEV-ARD getting-started-with-the-pcal6416aev-ard-evaluation-board:GS-PCAL6416AEV-ARD
PCAL6416AEV-ARD
Hersteller: NXP USA Inc.
Description: 16-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6416A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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BZB84-C51,215 BZB84_SER.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C51 - ZENER D
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 180 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMB19,115 PEMB19_PUMB19.pdf
PUMB19,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PUMB19 - SMALL SIGN
Produkt ist nicht verfügbar
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N74F534D,623 74F534.pdf
N74F534D,623
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Supplier Device Package: 20-SO
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N74F109D,623 DS_568_74F109.pdf
N74F109D,623
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SO
Number of Bits per Element: 1
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Supplier Device Package: 16-SO
Clock Frequency: 125 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Current - Quiescent (Iq): 17 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: JK Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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N74F10D,602 74F10,11.pdf
N74F10D,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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MC56F83789AVLLA MC56F837XXDS.pdf
MC56F83789AVLLA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
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OMPCA9959LEDEV
OMPCA9959LEDEV
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
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S9S08QD2J1VSCR MC9S08AC60.pdf
S9S08QD2J1VSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
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MF3DH2200DU75/02V
Hersteller: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Produkt ist nicht verfügbar
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PHPT610035NK115 PHPT610035NK.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN38003AEWY PTN38003A.pdf
PTN38003AEWY
Hersteller: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
Produkt ist nicht verfügbar
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PTN38003AEWY PTN38003A.pdf
PTN38003AEWY
Hersteller: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
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2+11.22 EUR
10+10.09 EUR
25+9.54 EUR
100+8.27 EUR
250+7.84 EUR
500+7.04 EUR
1000+6.71 EUR
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TJA1441AT/0Z TJA1441.pdf
TJA1441AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 926 Stücke:
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7+3 EUR
10+2.18 EUR
25+1.99 EUR
100+1.76 EUR
250+1.65 EUR
500+1.59 EUR
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MK28FN2M0CAU15R K28P210M150SF5.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V7/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V7/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEMI1QFN/LT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI1QFN/LT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
Number of Channels: 1
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3806+0.17 EUR
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LPC4325JBD144551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4325JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LPC4322JBD144551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4322JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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NTM88H065T1
NTM88H065T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTM88H065T1
NTM88H065T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
auf Bestellung 1847 Stücke:
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2+17.49 EUR
5+15.43 EUR
10+13.64 EUR
25+11.07 EUR
50+9.78 EUR
100+9.52 EUR
500+7.97 EUR
1000+7.46 EUR
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SPC5603BAMLL4R
SPC5603BAMLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12P64J0MFTR MC9S12P128RMV1.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: CPU12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8314EVRAFDA MPC8314EEC.pdf
MPC8314EVRAFDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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6+104.28 EUR
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S912XEG384BMAL
S912XEG384BMAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K142MAT0MLHT S32K1xx.pdf
FS32K142MAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5746CHK1AVKU6 MPC5746C.pdf
SPC5746CHK1AVKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
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SAF3560EL/V1100Y
Hersteller: NXP USA Inc.
Description: IC DGTL HD RADIO PROCESSOR 170LB
Produkt ist nicht verfügbar
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MRFE6VP6600NR3,528 MRFE6VP6600N.pdf
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
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BUK9K89-100E115 BUK9K89-100E.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9K89-100E - POWE
Packaging: Bulk
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K32W041AZ K32W041AM.pdf
K32W041AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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K32W041AZ K32W041AM.pdf
K32W041AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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2+11.75 EUR
10+10.17 EUR
25+9.63 EUR
100+8.88 EUR
250+8.43 EUR
500+8.1 EUR
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BZX84-C36/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C36/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
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BZX84-C36/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C36/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
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PSMN7R6-60XSQ
PSMN7R6-60XSQ
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 51.5A TO220F
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4.6V @ 1mA
Power Dissipation (Max): 46W (Tc)
Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc)
FET Type: N-Channel
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MCZ33903DS5EK MC33903-MC33904-MC33905.pdf
MCZ33903DS5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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NHS3100UK/A1Z NHS3100.pdf
NHS3100UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
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NHS3100UK/A1Z NHS3100.pdf
NHS3100UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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NHS3100UK/A1Z NHS3100.pdf
NHS3100UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Bulk
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163+3.71 EUR
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BCW30235 BCW29_BCW30.pdf
BCW30235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCW30 - SMALL SIGNA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITFS5600FRDMEVM UM11526.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS5600
Contents: Board(s), Cable(s)
Outputs and Type: 2 Non-Isolated Outputs
Main Purpose: DC/DC Converter
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FS5600
Board Type: Fully Populated
Regulator Topology: Buck
Current - Output: 10A, 3A
Voltage - Input: 36V
Voltage - Output: 1.8V ~ 8V, 1.8V ~ 7.2V
Packaging: Bulk
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IP3348CX10,135 IP3348CX5%2C10%2C15%2C20.pdf
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Height: 0.026" (0.65mm)
Values: L = 15nH (Total), C = 25pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm)
Package / Case: 10-UFBGA, WLCSP
Packaging: Bulk
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 10
Center / Cutoff Frequency: 350MHz (Cutoff)
Technology: LC (Pi)
Current: 20 mA
Applications: Data Lines for Mobile Devices
Filter Order: 3rd
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MK28FN2M0ACAU15R K28P210M150SF5.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Produkt ist nicht verfügbar
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FS32K144ULT0VLLR S32K1xx.pdf
FS32K144ULT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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MVR5510AVMAHEPR2 VR5510.pdf
MVR5510AVMAHEPR2
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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RDDRONE-CUPK64
Hersteller: NXP USA Inc.
Description: NXP CUP DRONE MAINBOARD
Part Status: Active
Platform: Mikroe NXP Cup Mainboard
Utilized IC / Part: K64
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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