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PTN36043BXZ PTN36043BXZ NXP USA Inc. PTN36043.pdf Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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PTN36043BXZ PTN36043BXZ NXP USA Inc. PTN36043.pdf Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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UCANS32K1SIC UCANS32K1SIC NXP USA Inc. getting-started-with-the-ucans32k1sic-evaluation-board:GS-UCANS32K1SIC Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: S32K1, SE050, TJA1463
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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KIT-UCANS32K1SIC KIT-UCANS32K1SIC NXP USA Inc. Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: S32K1, SE050, TJA1463
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
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TJA1441BT/0Z TJA1441BT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1441BT/0Z TJA1441BT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1145ATK/0Z TJA1145ATK/0Z NXP USA Inc. TJA1145A.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1442AT/0Z TJA1442AT/0Z NXP USA Inc. TJA1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1442AT/0Z TJA1442AT/0Z NXP USA Inc. TJA1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1145ATK/FD/0Z TJA1145ATK/FD/0Z NXP USA Inc. TJA1145A.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1101BHN/0Z TJA1101BHN/0Z NXP USA Inc. TJA1101B.pdf Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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TJA1101BHN/0Z TJA1101BHN/0Z NXP USA Inc. TJA1101B.pdf Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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TJA1462BT/0Z TJA1462BT/0Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1443ATK/0Z TJA1443ATK/0Z NXP USA Inc. TJA1443.pdf Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1443ATK/0Z TJA1443ATK/0Z NXP USA Inc. TJA1443.pdf Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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74AHCT2G126DP-Q100125 NXP USA Inc. 74AHC_AHCT2G126_Q100.pdf Description: BUS DRIVER
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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SC16C554DBIA68512 NXP USA Inc. Description: IC UART QUAD
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
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SPC5675KFF0VJM2 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BUK661R8-30C,118 BUK661R8-30C,118 NXP USA Inc. PHGLS23130-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 30V 120A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 263W (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
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BUK764R2-80E,118 BUK764R2-80E,118 NXP USA Inc. PHGLS25532-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 80V 120A D2PAK
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S912XEP100BVALR S912XEP100BVALR NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MC9S12DJ128CFUE557 MC9S12DJ128CFUE557 NXP USA Inc. FSCLS04317-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, FLASH,
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QN9020/D518 QN9020/D518 NXP USA Inc. PHGL-S-A0006655104-1.pdf?t.download=true&u=5oefqw Description: ULTRA LOW POWER BLUETOOTH LE SYS
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QN9020DK NXP USA Inc. Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Active
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QN9020DKUL NXP USA Inc. Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Contents: Board(s)
Utilized IC / Part: QN902x
Supplied Contents: Board(s)
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QN9020/EY QN9020/EY NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SYS
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QN9020/DY QN9020/DY NXP USA Inc. QN902X.pdf Description: IC RF TXRX BLE 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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PCA8575D,118 PCA8575D,118 NXP USA Inc. PCA8575.pdf Description: REMOTE 16-BIT I/O EXPANDER FOR I
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAMTK/1J NXP USA Inc. TEA19051BTK.pdf Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
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SPC5746CSK1MMJ6,557 NXP USA Inc. Description: MPC574XP MICROCONTROLLER POWER A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744PFK1AMLQ8 SPC5744PFK1AMLQ8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
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BZB84-C3V9215 BZB84-C3V9215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
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BZX84-C30/LF1R BZX84-C30/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S908AZ60AH3CFUE S908AZ60AH3CFUE NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64QFP
auf Bestellung 452 Stücke:
Lieferzeit 10-14 Tag (e)
18+30.75 EUR
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S908EY16AE0CFJER S908EY16AE0CFJER NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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S908EY16AE0CFJER S908EY16AE0CFJER NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
47+9.89 EUR
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G1120B0MIPI G1120B0MIPI NXP USA Inc. IMXRT500RT600FS.pdf Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
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FRDM-K32W042 NXP USA Inc. Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG324DSC2 NXP USA Inc. Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
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74HCT244BQ-Q100 74HCT244BQ-Q100 NXP USA Inc. PHGLS25316-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
auf Bestellung 2971 Stücke:
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PCAL6408A-ARD PCAL6408A-ARD NXP USA Inc. getting-started-with-the-pcal6408a-ard-evaluation-board:GS-PCAL6408A-ARD Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AEV-ARD PCAL6416AEV-ARD NXP USA Inc. getting-started-with-the-pcal6416aev-ard-evaluation-board:GS-PCAL6416AEV-ARD Description: 16-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6416A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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BZB84-C51,215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA BZB84-C51 - ZENER D
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 180 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMB19,115 PUMB19,115 NXP USA Inc. PEMB19_PUMB19.pdf Description: NOW NEXPERIA PUMB19 - SMALL SIGN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2850 Stücke
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N74F534D,623 N74F534D,623 NXP USA Inc. 74F534.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Supplier Device Package: 20-SO
auf Bestellung 2000 Stücke:
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1031+0.48 EUR
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N74F109D,623 N74F109D,623 NXP USA Inc. DS_568_74F109.pdf Description: IC FF JK TYPE DUAL 1BIT 16SO
Number of Bits per Element: 1
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Supplier Device Package: 16-SO
Clock Frequency: 125 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Current - Quiescent (Iq): 17 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: JK Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 7500 Stücke:
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2049+0.25 EUR
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N74F10D,602 N74F10D,602 NXP USA Inc. 74F10,11.pdf Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 9686 Stücke:
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2623+0.18 EUR
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MC56F83789AVLLA MC56F83789AVLLA NXP USA Inc. MC56F837XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.4 EUR
10+30.68 EUR
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OMPCA9959LEDEV OMPCA9959LEDEV NXP USA Inc. Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
auf Bestellung 2 Stücke:
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S9S08QD2J1VSCR S9S08QD2J1VSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2500 Stücke
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MF3DH2200DU75/02V NXP USA Inc. Description: MIFARE SMART CARD DESFIRE EV2 XL
Produkt ist nicht verfügbar
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PHPT610035NK115 NXP USA Inc. PHPT610035NK.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN38003AEWY PTN38003AEWY NXP USA Inc. PTN38003A.pdf Description: IC USB-C 3.2 / DP1.4 REDRIVER
Produkt ist nicht verfügbar
 Mindestbestellmenge: 7000 Stücke
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PTN38003AEWY PTN38003AEWY NXP USA Inc. PTN38003A.pdf Description: IC USB-C 3.2 / DP1.4 REDRIVER
auf Bestellung 6898 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.43 EUR
10+8.48 EUR
25+8.02 EUR
100+6.95 EUR
250+6.59 EUR
500+5.92 EUR
1000+5.64 EUR
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TJA1441AT/0Z TJA1441AT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7943 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.46 EUR
10+1.79 EUR
25+1.63 EUR
100+1.45 EUR
250+1.36 EUR
500+1.31 EUR
1000+1.3 EUR
Mindestbestellmenge: 8 Stücke
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MK28FN2M0CAU15R NXP USA Inc. K28P210M150SF5.pdf Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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BZX84-C4V7/LF1R BZX84-C4V7/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1VL BZX84-C4V7/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEMI1QFN/LT,315 PEMI1QFN/LT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PTN36043BXZ PTN36043.pdf
PTN36043BXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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PTN36043BXZ PTN36043.pdf
PTN36043BXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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UCANS32K1SIC getting-started-with-the-ucans32k1sic-evaluation-board:GS-UCANS32K1SIC
UCANS32K1SIC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: S32K1, SE050, TJA1463
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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KIT-UCANS32K1SIC
KIT-UCANS32K1SIC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: S32K1, SE050, TJA1463
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
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AnzahlPreis
1+58.43 EUR
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TJA1441BT/0Z TJA1441.pdf
TJA1441BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+0.97 EUR
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TJA1441BT/0Z TJA1441.pdf
TJA1441BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3189 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
9+1.99 EUR
13+1.44 EUR
25+1.31 EUR
100+1.16 EUR
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500+1.04 EUR
1000+1.01 EUR
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TJA1145ATK/0Z TJA1145A.pdf
TJA1145ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 7389 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.58 EUR
10+3.43 EUR
25+3.14 EUR
100+2.82 EUR
250+2.67 EUR
500+2.62 EUR
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TJA1442AT/0Z TJA1442.pdf
TJA1442AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+1.54 EUR
Mindestbestellmenge: 2500 Stücke
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TJA1442AT/0Z TJA1442.pdf
TJA1442AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3607 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+2.97 EUR
10+2.19 EUR
25+1.99 EUR
100+1.78 EUR
250+1.67 EUR
500+1.61 EUR
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TJA1145ATK/FD/0Z TJA1145A.pdf
TJA1145ATK/FD/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2861 Stücke:
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AnzahlPreis
4+4.8 EUR
10+3.6 EUR
25+3.3 EUR
100+2.97 EUR
250+2.81 EUR
500+2.77 EUR
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TJA1101BHN/0Z TJA1101B.pdf
TJA1101BHN/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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4000+3.38 EUR
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TJA1101BHN/0Z TJA1101B.pdf
TJA1101BHN/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 6618 Stücke:
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3+6.18 EUR
10+4.67 EUR
25+4.29 EUR
100+3.88 EUR
250+3.68 EUR
500+3.66 EUR
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TJA1462BT/0Z TJA1462.pdf
TJA1462BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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AnzahlPreis
2500+1 EUR
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TJA1443ATK/0Z TJA1443.pdf
TJA1443ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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6000+0.91 EUR
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TJA1443ATK/0Z TJA1443.pdf
TJA1443ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 9171 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
10+1.94 EUR
13+1.41 EUR
25+1.27 EUR
100+1.12 EUR
250+1.06 EUR
500+1.01 EUR
1000+0.98 EUR
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74AHCT2G126DP-Q100125 74AHC_AHCT2G126_Q100.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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SC16C554DBIA68512
Hersteller: NXP USA Inc.
Description: IC UART QUAD
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BUK661R8-30C,118 PHGLS23130-1.pdf?t.download=true&u=5oefqw
BUK661R8-30C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 263W (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
auf Bestellung 1473 Stücke:
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AnzahlPreis
245+2.16 EUR
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BUK764R2-80E,118 PHGLS25532-1.pdf?t.download=true&u=5oefqw
BUK764R2-80E,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 80V 120A D2PAK
auf Bestellung 338 Stücke:
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202+2.53 EUR
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S912XEP100BVALR
S912XEP100BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DJ128CFUE557 FSCLS04317-1.pdf?t.download=true&u=5oefqw
MC9S12DJ128CFUE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
auf Bestellung 240 Stücke:
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QN9020/D518 PHGL-S-A0006655104-1.pdf?t.download=true&u=5oefqw
QN9020/D518
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
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AnzahlPreis
105+4.73 EUR
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QN9020DK
Hersteller: NXP USA Inc.
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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QN9020DKUL
Hersteller: NXP USA Inc.
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Contents: Board(s)
Utilized IC / Part: QN902x
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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QN9020/EY QN902X.pdf
QN9020/EY
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
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QN9020/DY QN902X.pdf
QN9020/DY
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575D,118 PCA8575.pdf
PCA8575D,118
Hersteller: NXP USA Inc.
Description: REMOTE 16-BIT I/O EXPANDER FOR I
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAMTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 20000 Stücke:
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AnzahlPreis
190+2.36 EUR
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SPC5746CSK1MMJ6,557
Hersteller: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744PFK1AMLQ8 MPC5744P.pdf
SPC5744PFK1AMLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB84-C3V9215 BZB84_SER.pdf
BZB84-C3V9215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
auf Bestellung 39472 Stücke:
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11632+0.048 EUR
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BZX84-C30/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C30/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S908AZ60AH3CFUE
S908AZ60AH3CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
auf Bestellung 452 Stücke:
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AnzahlPreis
18+30.75 EUR
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S908EY16AE0CFJER MC68HC908EY16A.pdf
S908EY16AE0CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S908EY16AE0CFJER MC68HC908EY16A.pdf
S908EY16AE0CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
47+9.89 EUR
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G1120B0MIPI IMXRT500RT600FS.pdf
G1120B0MIPI
Hersteller: NXP USA Inc.
Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
auf Bestellung 6 Stücke:
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AnzahlPreis
1+150.52 EUR
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FRDM-K32W042
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG324DSC2
Hersteller: NXP USA Inc.
Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
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74HCT244BQ-Q100 PHGLS25316-1.pdf?t.download=true&u=5oefqw
74HCT244BQ-Q100
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
auf Bestellung 2971 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1282+0.37 EUR
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PCAL6408A-ARD getting-started-with-the-pcal6408a-ard-evaluation-board:GS-PCAL6408A-ARD
PCAL6408A-ARD
Hersteller: NXP USA Inc.
Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AEV-ARD getting-started-with-the-pcal6416aev-ard-evaluation-board:GS-PCAL6416AEV-ARD
PCAL6416AEV-ARD
Hersteller: NXP USA Inc.
Description: 16-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6416A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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BZB84-C51,215 BZB84_SER.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C51 - ZENER D
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 180 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMB19,115 PEMB19_PUMB19.pdf
PUMB19,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PUMB19 - SMALL SIGN
Produkt ist nicht verfügbar
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N74F534D,623 74F534.pdf
N74F534D,623
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Supplier Device Package: 20-SO
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1031+0.48 EUR
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N74F109D,623 DS_568_74F109.pdf
N74F109D,623
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SO
Number of Bits per Element: 1
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Supplier Device Package: 16-SO
Clock Frequency: 125 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Current - Quiescent (Iq): 17 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: JK Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2049+0.25 EUR
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N74F10D,602 74F10,11.pdf
N74F10D,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 9686 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2623+0.18 EUR
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MC56F83789AVLLA MC56F837XXDS.pdf
MC56F83789AVLLA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+38.4 EUR
10+30.68 EUR
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OMPCA9959LEDEV
OMPCA9959LEDEV
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9959
Part Status: Active
Outputs and Type: 24 Non-Isolated Outputs
Supplied Contents: Board(s)
Utilized IC / Part: PCA9959
Current - Output / Channel: 63mA
Voltage - Input: 2.7V ~ 5.5V
Voltage - Output: 5.5V
Features: Dimmable
Packaging: Bulk
Contents: Board(s)
auf Bestellung 2 Stücke:
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AnzahlPreis
1+956.6 EUR
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S9S08QD2J1VSCR MC9S08QD4.pdf
S9S08QD2J1VSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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MF3DH2200DU75/02V
Hersteller: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Produkt ist nicht verfügbar
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PHPT610035NK115 PHPT610035NK.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN38003AEWY PTN38003A.pdf
PTN38003AEWY
Hersteller: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
Produkt ist nicht verfügbar
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PTN38003AEWY PTN38003A.pdf
PTN38003AEWY
Hersteller: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
auf Bestellung 6898 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.43 EUR
10+8.48 EUR
25+8.02 EUR
100+6.95 EUR
250+6.59 EUR
500+5.92 EUR
1000+5.64 EUR
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TJA1441AT/0Z TJA1441.pdf
TJA1441AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7943 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
8+2.46 EUR
10+1.79 EUR
25+1.63 EUR
100+1.45 EUR
250+1.36 EUR
500+1.31 EUR
1000+1.3 EUR
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MK28FN2M0CAU15R K28P210M150SF5.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 210-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: 210-WLCSP (6.94x6.94)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V7/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C4V7/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V7/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEMI1QFN/LT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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