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P3A9606JKZ P3A9606JKZ NXP USA Inc. P3A9606JK.pdf Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 52Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 0.72 V ~ 1.98 V
Part Status: Active
Number of Circuits: 2
auf Bestellung 20000 Stücke:
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20000+0.58 EUR
Mindestbestellmenge: 20000
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P3A9606JKZ P3A9606JKZ NXP USA Inc. P3A9606JK.pdf Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 52Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 0.72 V ~ 1.98 V
Part Status: Active
Number of Circuits: 2
auf Bestellung 20261 Stücke:
Lieferzeit 10-14 Tag (e)
14+1.32 EUR
19+0.94 EUR
25+0.84 EUR
100+0.74 EUR
250+0.69 EUR
500+0.66 EUR
1000+0.64 EUR
2500+0.61 EUR
5000+0.6 EUR
Mindestbestellmenge: 14
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UJA1168AXF-EVB UJA1168AXF-EVB NXP USA Inc. UJA1168A.pdf Description: UJA1168AXF EVAL BOARD
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1168AX
Supplied Contents: Board(s)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 1 Stücke:
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1+143.11 EUR
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FS32K148HFT0MLQR FS32K148HFT0MLQR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C2550BIB48,157 SC16C2550BIB48,157 NXP USA Inc. SC16C2550B.pdf Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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SC16C554DBIB64,128 SC16C554DBIB64,128 NXP USA Inc. SC16C554B_554DB.pdf Description: UART IC 4, QUART CHANNEL 16 BYTE
Produkt ist nicht verfügbar
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SC16C754BIB80,557 SC16C754BIB80,557 NXP USA Inc. SC16C754B.pdf Description: UART IC 4, QUART CHANNEL 64 BYTE
Packaging: Tray
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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SC16C554BIB64,151 SC16C554BIB64,151 NXP USA Inc. SC16C554B_554DB.pdf Description: DESCRIPTION SERIAL I/O CONTROLLE
Produkt ist nicht verfügbar
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SC16C654BIBM,157 SC16C654BIBM,157 NXP USA Inc. SC16C654B_654DB.pdf Description: SERIAL I/O CONTROLLER, 4 CHANNEL
Produkt ist nicht verfügbar
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PCA9555AHF128 NXP USA Inc. PCA9555A.pdf Description: LOW-VOLTAGE 16-BIT I2C-BUS I/O P
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MVR5510AMMAHES MVR5510AMMAHES NXP USA Inc. Description: IC PMIC VR5510 QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMMAHESR2 MVR5510AMMAHESR2 NXP USA Inc. Description: IC PMIC VR5510 QM
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5643AF0MVZ2R SPC5643AF0MVZ2R NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 3MB FLASH 324PBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 151
Produkt ist nicht verfügbar
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PUSB3AB6471 NXP USA Inc. PUSB3AB6.pdf Description: NOW NEXPERIA PUSB3AB6 - TRANS VO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A2I20D040NR1 A2I20D040NR1 NXP USA Inc. A2I20D040N.pdf Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
auf Bestellung 317 Stücke:
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1+76.33 EUR
10+71.17 EUR
25+66.02 EUR
100+61.89 EUR
250+57.76 EUR
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FRDM-STBC-AGM02 NXP USA Inc. Sensor_Fusion_for_Kinetis_MCUs_Gde.pdf Description: FREEDOM SENSOR SHIELD BOARD ENAB
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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PN7161B1HN/C100E PN7161B1HN/C100E NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER SPI HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 112 Stücke:
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2+12.88 EUR
10+11.17 EUR
25+10.58 EUR
100+9.76 EUR
Mindestbestellmenge: 2
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PN7160B1EV/C100K PN7160B1EV/C100K NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.23 EUR
10+10.61 EUR
25+10.05 EUR
100+9.27 EUR
250+8.81 EUR
500+8.48 EUR
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PN7161A1HN/C100E PN7161A1HN/C100E NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.43 EUR
10+10.77 EUR
25+10.19 EUR
100+9.41 EUR
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PN7160A1HN/C100E PN7160A1HN/C100E NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 5282 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.39 EUR
10+10.74 EUR
25+10.16 EUR
100+9.38 EUR
490+8.58 EUR
980+8.27 EUR
1470+8.09 EUR
Mindestbestellmenge: 2
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PN7160B1HN/C100E PN7160B1HN/C100E NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER SPI HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 912 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.21 EUR
10+10.59 EUR
25+10.02 EUR
100+9.25 EUR
490+8.46 EUR
Mindestbestellmenge: 2
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P80C32SBBB,557 P80C32SBBB,557 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1150 Stücke:
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43+10.75 EUR
Mindestbestellmenge: 43
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MPC8343EVRADDB NXP USA Inc. FSCLS06083-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: DUART, I2C, PCI, SPI
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
4+124.68 EUR
Mindestbestellmenge: 4
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BFU668F,115 BFU668F,115 NXP USA Inc. BFU668F.pdf Description: TRANSISTOR NPN SOT343F
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Supplier Device Package: 4-DFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5744PK1MLQ8R SPC5744PK1MLQ8R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK7M21-40E,115 NXP USA Inc. Description: BUK7M21-40E - N-CHANNEL 40V MOSF
Produkt ist nicht verfügbar
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MIMX8MM4CVTKZAA MIMX8MM4CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 137 Stücke:
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1+54.19 EUR
10+43.93 EUR
25+41.37 EUR
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S912XEQ512ACAL S912XEQ512ACAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A2T21H360-23NR6 NXP USA Inc. A2T21H360-23N.pdf Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Frequency: 2.11GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 373W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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A3I20X050GNR1 NXP USA Inc. A3I20X050N.pdf Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400G-8
Current Rating (Amps): 10µA
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400G-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Mounting Type: Surface Mount
Voltage - Supply: 20V ~ 32V
Produkt ist nicht verfügbar
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A3I20X050NR1 NXP USA Inc. A3I20X050N.pdf Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Mounting Type: Surface Mount
Voltage - Supply: 20V ~ 32V
Produkt ist nicht verfügbar
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74LV165DB118 74LV165DB118 NXP USA Inc. 74LV165.pdf Description: NOW NEXPERIA 74LV165DB - PARALLE
Produkt ist nicht verfügbar
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PCF85176T/1Y PCF85176T/1Y NXP USA Inc. PCF85176.pdf Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5977 Stücke:
Lieferzeit 10-14 Tag (e)
2000+1.58 EUR
4000+1.55 EUR
Mindestbestellmenge: 2000
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PCF85176T/1Y PCF85176T/1Y NXP USA Inc. PCF85176.pdf Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5977 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.1 EUR
10+2.28 EUR
25+2.07 EUR
100+1.85 EUR
250+1.74 EUR
500+1.68 EUR
1000+1.65 EUR
Mindestbestellmenge: 6
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BZX84-B5V1215 BZX84-B5V1215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.1V 250MW TO236AB
Produkt ist nicht verfügbar
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S9S08RNA60W1VLHR S9S08RNA60W1VLHR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.01 EUR
10+7.69 EUR
25+7.11 EUR
100+6.47 EUR
250+6.17 EUR
500+6.14 EUR
Mindestbestellmenge: 2
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LPC3240FET296015 LPC3240FET296015 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
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MCZ33903CS5EK MCZ33903CS5EK NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
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CGD944C,112 CGD944C,112 NXP USA Inc. CGD944C.pdf Description: IC AMP CATV SOT115J
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A3T23H300W23SR6 NXP USA Inc. A3T23H300W23S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCX2131TF NXP USA Inc. Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BK0MLL4 SPC5603BK0MLL4 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BK0MLL4R SPC5603BK0MLL4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMB15,115 PEMB15,115 NXP USA Inc. PHGLS24211-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PEMB15 - SMALL SIGN
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MC33772BTP1AE MC33772BTP1AE NXP USA Inc. MC33772B_SDS.pdf Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
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PCF8578HT/1,518 PCF8578HT/1,518 NXP USA Inc. PCF8578.pdf Description: IC DRVR DOT MATRIX 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 6V
Supplier Device Package: 64-TQFP (10x10)
Produkt ist nicht verfügbar
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S9KEAZN64ACLH S9KEAZN64ACLH NXP USA Inc. QP1010FS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
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6+3.2 EUR
10+2.91 EUR
25+2.87 EUR
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MCU-LINK-PRO MCU-LINK-PRO NXP USA Inc. UM11673.pdf Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
auf Bestellung 170 Stücke:
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74HC11PW-Q100118 74HC11PW-Q100118 NXP USA Inc. 74HC_HCT11_Q100.pdf Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC9S08SE4MWL MC9S08SE4MWL NXP USA Inc. MC9S08SE8.pdf Description: IC MCU 8BIT 4KB FLASH 28SOIC
auf Bestellung 3666 Stücke:
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171+3.23 EUR
Mindestbestellmenge: 171
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BB199,115 BB199,115 NXP USA Inc. BB199_Rev1.pdf Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Produkt ist nicht verfügbar
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BB199,115 BB199,115 NXP USA Inc. BB199_Rev1.pdf Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
auf Bestellung 3000 Stücke:
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2219+0.23 EUR
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S9S12GN16AMLFR S9S12GN16AMLFR NXP USA Inc. S12G Family Fact Sheet.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LX2082RC82029B NXP USA Inc. Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
Produkt ist nicht verfügbar
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BAP70AM135 BAP70AM135 NXP USA Inc. BAP70-03.pdf Description: DIODE PIN 50V 100MA 6TSSOP
auf Bestellung 10000 Stücke:
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BAP70AM/A115 BAP70AM/A115 NXP USA Inc. PHGLS29507-1.pdf?t.download=true&u=5oefqw Description: BAP70AM - PIN DIODE
Produkt ist nicht verfügbar
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LX2160XC72029B LX2160XC72029B NXP USA Inc. Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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74AHC126PW-Q100118 74AHC126PW-Q100118 NXP USA Inc. 74AHC_AHCT126_Q100.pdf Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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NBP8FD4T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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BFG31,115 BFG31,115 NXP USA Inc. BFG31.pdf Description: RF TRANS PNP 15V 5GHZ SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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P3A9606JKZ P3A9606JK.pdf
P3A9606JKZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 52Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 0.72 V ~ 1.98 V
Part Status: Active
Number of Circuits: 2
auf Bestellung 20000 Stücke:
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Anzahl Preis
20000+0.58 EUR
Mindestbestellmenge: 20000
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P3A9606JKZ P3A9606JK.pdf
P3A9606JKZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 52Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 0.72 V ~ 1.98 V
Voltage - VCCB: 0.72 V ~ 1.98 V
Part Status: Active
Number of Circuits: 2
auf Bestellung 20261 Stücke:
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Anzahl Preis
14+1.32 EUR
19+0.94 EUR
25+0.84 EUR
100+0.74 EUR
250+0.69 EUR
500+0.66 EUR
1000+0.64 EUR
2500+0.61 EUR
5000+0.6 EUR
Mindestbestellmenge: 14
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UJA1168AXF-EVB UJA1168A.pdf
UJA1168AXF-EVB
Hersteller: NXP USA Inc.
Description: UJA1168AXF EVAL BOARD
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1168AX
Supplied Contents: Board(s)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 1 Stücke:
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FS32K148HFT0MLQR S32K-DS.pdf
FS32K148HFT0MLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C2550BIB48,157 SC16C2550B.pdf
SC16C2550BIB48,157
Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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SC16C554DBIB64,128 SC16C554B_554DB.pdf
SC16C554DBIB64,128
Hersteller: NXP USA Inc.
Description: UART IC 4, QUART CHANNEL 16 BYTE
Produkt ist nicht verfügbar
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SC16C754BIB80,557 SC16C754B.pdf
SC16C754BIB80,557
Hersteller: NXP USA Inc.
Description: UART IC 4, QUART CHANNEL 64 BYTE
Packaging: Tray
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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SC16C554BIB64,151 SC16C554B_554DB.pdf
SC16C554BIB64,151
Hersteller: NXP USA Inc.
Description: DESCRIPTION SERIAL I/O CONTROLLE
Produkt ist nicht verfügbar
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SC16C654BIBM,157 SC16C654B_654DB.pdf
SC16C654BIBM,157
Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 4 CHANNEL
Produkt ist nicht verfügbar
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PCA9555AHF128 PCA9555A.pdf
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE 16-BIT I2C-BUS I/O P
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MVR5510AMMAHES
MVR5510AMMAHES
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMMAHESR2
MVR5510AMMAHESR2
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5643AF0MVZ2R MPC5644A.pdf
SPC5643AF0MVZ2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 324PBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 151
Produkt ist nicht verfügbar
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PUSB3AB6471 PUSB3AB6.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PUSB3AB6 - TRANS VO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A2I20D040NR1 A2I20D040N.pdf
A2I20D040NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
auf Bestellung 317 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+76.33 EUR
10+71.17 EUR
25+66.02 EUR
100+61.89 EUR
250+57.76 EUR
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FRDM-STBC-AGM02 Sensor_Fusion_for_Kinetis_MCUs_Gde.pdf
Hersteller: NXP USA Inc.
Description: FREEDOM SENSOR SHIELD BOARD ENAB
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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PN7161B1HN/C100E PN7160_PN7161.pdf
PN7161B1HN/C100E
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.88 EUR
10+11.17 EUR
25+10.58 EUR
100+9.76 EUR
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PN7160B1EV/C100K PN7160_PN7161.pdf
PN7160B1EV/C100K
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.23 EUR
10+10.61 EUR
25+10.05 EUR
100+9.27 EUR
250+8.81 EUR
500+8.48 EUR
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PN7161A1HN/C100E PN7160_PN7161.pdf
PN7161A1HN/C100E
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.43 EUR
10+10.77 EUR
25+10.19 EUR
100+9.41 EUR
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PN7160A1HN/C100E PN7160_PN7161.pdf
PN7160A1HN/C100E
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 5282 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.39 EUR
10+10.74 EUR
25+10.16 EUR
100+9.38 EUR
490+8.58 EUR
980+8.27 EUR
1470+8.09 EUR
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PN7160B1HN/C100E PN7160_PN7161.pdf
PN7160B1HN/C100E
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 912 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.21 EUR
10+10.59 EUR
25+10.02 EUR
100+9.25 EUR
490+8.46 EUR
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P80C32SBBB,557 80C31_80C32.pdf
P80C32SBBB,557
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1150 Stücke:
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Anzahl Preis
43+10.75 EUR
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MPC8343EVRADDB FSCLS06083-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: DUART, I2C, PCI, SPI
auf Bestellung 23 Stücke:
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Anzahl Preis
4+124.68 EUR
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BFU668F,115 BFU668F.pdf
BFU668F,115
Hersteller: NXP USA Inc.
Description: TRANSISTOR NPN SOT343F
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Supplier Device Package: 4-DFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5744PK1MLQ8R
SPC5744PK1MLQ8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK7M21-40E,115
Hersteller: NXP USA Inc.
Description: BUK7M21-40E - N-CHANNEL 40V MOSF
Produkt ist nicht verfügbar
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MIMX8MM4CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM4CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 137 Stücke:
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Anzahl Preis
1+54.19 EUR
10+43.93 EUR
25+41.37 EUR
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S912XEQ512ACAL MC9S12XEPB.pdf
S912XEQ512ACAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A2T21H360-23NR6 A2T21H360-23N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Frequency: 2.11GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 373W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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A3I20X050GNR1 A3I20X050N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400G-8
Current Rating (Amps): 10µA
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400G-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Mounting Type: Surface Mount
Voltage - Supply: 20V ~ 32V
Produkt ist nicht verfügbar
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A3I20X050NR1 A3I20X050N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Mounting Type: Surface Mount
Voltage - Supply: 20V ~ 32V
Produkt ist nicht verfügbar
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74LV165DB118 74LV165.pdf
74LV165DB118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LV165DB - PARALLE
Produkt ist nicht verfügbar
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PCF85176T/1Y PCF85176.pdf
PCF85176T/1Y
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5977 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+1.58 EUR
4000+1.55 EUR
Mindestbestellmenge: 2000
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PCF85176T/1Y PCF85176.pdf
PCF85176T/1Y
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5977 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.1 EUR
10+2.28 EUR
25+2.07 EUR
100+1.85 EUR
250+1.74 EUR
500+1.68 EUR
1000+1.65 EUR
Mindestbestellmenge: 6
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BZX84-B5V1215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B5V1215
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW TO236AB
Produkt ist nicht verfügbar
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S9S08RNA60W1VLHR S9S08RN60DS.pdf
S9S08RNA60W1VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.01 EUR
10+7.69 EUR
25+7.11 EUR
100+6.47 EUR
250+6.17 EUR
500+6.14 EUR
Mindestbestellmenge: 2
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LPC3240FET296015 LPC3220_30_40_50.pdf
LPC3240FET296015
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
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MCZ33903CS5EK MC33903,4,5.pdf
MCZ33903CS5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
auf Bestellung 61 Stücke:
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Anzahl Preis
61+9.8 EUR
Mindestbestellmenge: 61
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CGD944C,112 CGD944C.pdf
CGD944C,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
auf Bestellung 20 Stücke:
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A3T23H300W23SR6 A3T23H300W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCX2131TF
Hersteller: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BK0MLL4 MPC5602D.pdf
SPC5603BK0MLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BK0MLL4R MPC5602D.pdf
SPC5603BK0MLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMB15,115 PHGLS24211-1.pdf?t.download=true&u=5oefqw
PEMB15,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMB15 - SMALL SIGN
auf Bestellung 62428 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7340+0.068 EUR
Mindestbestellmenge: 7340
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MC33772BTP1AE MC33772B_SDS.pdf
MC33772BTP1AE
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
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PCF8578HT/1,518 PCF8578.pdf
PCF8578HT/1,518
Hersteller: NXP USA Inc.
Description: IC DRVR DOT MATRIX 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 6V
Supplier Device Package: 64-TQFP (10x10)
Produkt ist nicht verfügbar
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S9KEAZN64ACLH QP1010FS.pdf
S9KEAZN64ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 1400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.2 EUR
10+2.91 EUR
25+2.87 EUR
Mindestbestellmenge: 6
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MCU-LINK-PRO UM11673.pdf
MCU-LINK-PRO
Hersteller: NXP USA Inc.
Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
auf Bestellung 170 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+87.51 EUR
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74HC11PW-Q100118 74HC_HCT11_Q100.pdf
74HC11PW-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC9S08SE4MWL MC9S08SE8.pdf
MC9S08SE4MWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
auf Bestellung 3666 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
171+3.23 EUR
Mindestbestellmenge: 171
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BB199,115 BB199_Rev1.pdf
BB199,115
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Produkt ist nicht verfügbar
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BB199,115 BB199_Rev1.pdf
BB199,115
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2219+0.23 EUR
Mindestbestellmenge: 2219
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S9S12GN16AMLFR S12G Family Fact Sheet.pdf
S9S12GN16AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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LX2082RC82029B
Hersteller: NXP USA Inc.
Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
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BAP70AM135 BAP70-03.pdf
BAP70AM135
Hersteller: NXP USA Inc.
Description: DIODE PIN 50V 100MA 6TSSOP
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
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BAP70AM/A115 PHGLS29507-1.pdf?t.download=true&u=5oefqw
BAP70AM/A115
Hersteller: NXP USA Inc.
Description: BAP70AM - PIN DIODE
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LX2160XC72029B
LX2160XC72029B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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74AHC126PW-Q100118 74AHC_AHCT126_Q100.pdf
74AHC126PW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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NBP8FD4T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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BFG31,115 BFG31.pdf
BFG31,115
Hersteller: NXP USA Inc.
Description: RF TRANS PNP 15V 5GHZ SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
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