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NX3L4684TK,115 NX3L4684TK,115 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Number of Circuits: 2
Part Status: Active
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 50pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-HVSON (3x3)
-3db Bandwidth: 20MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Channel-to-Channel Matching (ΔRon): 40mOhm
Multiplexer/Demultiplexer Circuit: 2:1
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PHB110NQ06LT,118 PHB110NQ06LT,118 NXP USA Inc. PHB110NQ06LT.pdf Description: MOSFET N-CH 55V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
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SC28L92A1A,518 SC28L92A1A,518 NXP USA Inc. SC28L92.pdf Description: IC UART DUAL W/FIFO 44-PLCC
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S32G274AABK0VUCT S32G274AABK0VUCT NXP USA Inc. S32G2.pdf Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Tape & Reel (TR)
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Cut Tape (CT)
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TEA1723DT/N1,118 TEA1723DT/N1,118 NXP USA Inc. TEA1723DT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
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PTVS12VZ1USKN315 PTVS12VZ1USKN315 NXP USA Inc. PTVS12VZ1USKN.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
Supplier Device Package: DSN1608-2
Voltage - Reverse Standoff (Typ): 12V (Max)
Current - Peak Pulse (10/1000µs): 10.5A
Capacitance @ Frequency: 430pF @ 1MHz
Applications: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 0603 (1608 Metric)
Power Line Protection: No
Power - Peak Pulse: 1900W (1.9kW)
Voltage - Clamping (Max) @ Ipp: 21.8V
Voltage - Breakdown (Min): 13.3V
Unidirectional Channels: 1
Part Status: Active
Packaging: Bulk
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PCA9574PW,118 PCA9574PW,118 NXP USA Inc. PCA9574.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9574PW,112 PCA9574PW,112 NXP USA Inc. PCA9574.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SPC5566MVR132,557 NXP USA Inc. Description: NXP 32 BIT MCU, POWER ARCHITECTU
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5566MZP144 SPC5566MZP144 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5566MZP132R SPC5566MZP132R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5566MZP144R SPC5566MZP144R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5566MZP112R SPC5566MZP112R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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BZB784-C4V7115 BZB784-C4V7115 NXP USA Inc. BZB784_SERIES.pdf Description: NOW NEXPERIA BZB784-C4V7 ZENER D
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9306DC1Z PCA9306DC1Z NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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SEN-SPI-BOX NXP USA Inc. Description: AUTOMOTIVE SENSOR EVAL KIT
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300GNR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 27dB
Power - Output: 300W
Configuration: Dual
Frequency: 1.8MHz ~ 600MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Cut Tape (CT)
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RDK-S32R274 RDK-S32R274 NXP USA Inc. RDK-S32R274_FS.pdf Description: S32R274 EVAL BRD
Utilized IC / Part: S32R274
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S08DZ96MLL NXP USA Inc. FSCLS06295-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 96KB FLASH 100LQFP
Number of I/O: 87
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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MVF60NS151CMK40 NXP USA Inc. FSCL-S-A0000149011-1.pdf?t.download=true&u=5oefqw Description: VYBRID F 32-BIT MPU, ARM CORTEX-
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MVF60NS152CMK50 MVF60NS152CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364MAPBGA
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UJA1168ATK/F/0Z UJA1168ATK/F/0Z NXP USA Inc. UJA1168A.pdf Description: IC TXRX 14-HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Grade: Automotive
Qualification: AEC-Q100
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MC9S08SE8VWL MC9S08SE8VWL NXP USA Inc. MC9S08SE8.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
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LS1023ASE8MNLB LS1023ASE8MNLB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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S9S12G240F0VLFR S9S12G240F0VLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 240KB FLASH 48LQFP
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PEMI8QFN/HE,132 PEMI8QFN/HE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
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MMG3015NT1-NXP MMG3015NT1-NXP NXP USA Inc. FSCL-S-A0000226252-1.pdf?t.download=true&u=5oefqw Description: WIDE BAND LOW POWER AMPLIFIER, 0
Packaging: Bulk
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74AVC16835ADGV,112 74AVC16835ADGV,112 NXP USA Inc. 74AVC16835A_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 3.6V 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 18
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
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PBHV9560Z115 PBHV9560Z115 NXP USA Inc. PBHV9560Z.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN3460BS/F4518 PTN3460BS/F4518 NXP USA Inc. PTN3460I.pdf Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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PTN3460BS/F3518 PTN3460BS/F3518 NXP USA Inc. PHGLS28090-1.pdf?t.download=true&u=5oefqw Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F4 NXP USA Inc. PTN3460I.pdf Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9959HN-ARD PCA9959HN-ARD NXP USA Inc. UM11581.pdf Description: EVK ARDUINO SHIELD LED CTRL
Platform: Arduino
Utilized IC / Part: PCA9959
Contents: Board(s)
Type: Power Management
Function: LED Driver
Packaging: Bulk
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S9S08SG32E1VTLR S9S08SG32E1VTLR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
DigiKey Programmable: Not Verified
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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S9S08SG32E1VTLR S9S08SG32E1VTLR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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P80C51FA-4B557 P80C51FA-4B557 NXP USA Inc. RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT ROMLESS 44QFP
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 44-PQFP (10x10)
Peripherals: POR, PWM
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
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SPC5607BF1VLQ6 SPC5607BF1VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
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S9S12G96AMLFR S9S12G96AMLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVC96F0CLF S912ZVC96F0CLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G96AMLF S9S12G96AMLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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PSMN130-200D,118 PSMN130-200D,118 NXP USA Inc. PSMN130-200D.pdf Description: MOSFET N-CH 200V 20A DPAK
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PCA24S08ADP,118 PCA24S08ADP,118 NXP USA Inc. PCA24S08A.pdf Description: IC EEPROM 8KBIT I2C 8TSSOP
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Kbit
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 1K x 8
Memory Interface: I2C
Supplier Device Package: 8-TSSOP
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
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PN7161A1EV/C100K PN7161A1EV/C100K NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
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MC33772CTP2AE MC33772CTP2AE NXP USA Inc. MC33772C-DS.pdf Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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RB521CS30L315 RB521CS30L315 NXP USA Inc. RB521CS30L.pdf Description: 100MA LOW VF MEGA SCHOTTKY BARRI
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LS1046ASE8Q1A LS1046ASE8Q1A NXP USA Inc. LS1046A.pdf Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM
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SPC5605BK0MLQ6R SPC5605BK0MLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
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T1042NXN7MQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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MC908GR32ACFAE-NXP NXP USA Inc. FSCL-S-A0001046826-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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PCA8547BHT/AY PCA8547BHT/AY NXP USA Inc. PCA8547.pdf Description: IC DRVR 7 SEGMENT 64TQFP
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Current - Supply: 90 µA
Part Status: Obsolete
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: SPI
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NCF3340AHN/00311Y NCF3340AHN/00311Y NXP USA Inc. NCX3340.pdf Description: IC RFID RDR/TRAN 27.12MZ 40HVQFN
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LS1020ASE8KQB LS1020ASE8KQB NXP USA Inc. LS1020ALS1022AFS.pdf Description: LS1020 32BIT ARM SOC 1GHZ DDR3
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SLN-VIZN3D-IOT SLN-VIZN3D-IOT NXP USA Inc. getting-started-with-the-nxp-edgeready-mcu-based-solution-for-3d-face-recognition:GS-SLN-VIZN3D-IOT Description: DEV KIT I.MXRT117F 3D FACE REC
Part Status: Active
Utilized IC / Part: RT117F
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Contents: Board(s), Cable(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
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FXPS7550A4T1 FXPS7550A4T1 NXP USA Inc. FXPS7250A4.pdf Description: PRESSURE SENSOR, 3.3V/5V, 20/550
Supplier Device Package: 16-HQFN (4x4)
Applications: Board Mount
Voltage - Supply: 3.1V ~ 5.25V
Operating Temperature: -40°C ~ 130°C
Accuracy: ±3%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 79.77PSI (20kPa ~ 550kPa)
Output: 0 V ~ 4.6 V
Mounting Type: Surface Mount, Wettable Flank
Output Type: Analog Voltage
Package / Case: 16-QFN Exposed Pad
Part Status: Active
Packaging: Bulk
Maximum Pressure: 87.02PSI (600kPa)
Port Style: No Port
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FXPS7550DI4ST1 FXPS7550DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7550A4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7550DS4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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NX3DV2567HR-Q100X NX3DV2567HR-Q100X NXP USA Inc. NX3DV2567_Q100.pdf Description: IC ANLG SWITCH 4PDT 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Part Status: Active
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
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NX3L4684TK,115 NX3L4684.pdf
NX3L4684TK,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Number of Circuits: 2
Part Status: Active
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 50pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-HVSON (3x3)
-3db Bandwidth: 20MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Channel-to-Channel Matching (ΔRon): 40mOhm
Multiplexer/Demultiplexer Circuit: 2:1
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25+1.19 EUR
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PHB110NQ06LT,118 PHB110NQ06LT.pdf
PHB110NQ06LT,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
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SC28L92A1A,518 SC28L92.pdf
SC28L92A1A,518
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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S32G274AABK0VUCT S32G2.pdf
S32G274AABK0VUCT
Hersteller: NXP USA Inc.
Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Tape & Reel (TR)
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Cut Tape (CT)
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25+8 EUR
100+6.76 EUR
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1000+5.49 EUR
2500+5.18 EUR
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TEA1723DT/N1,118 TEA1723DT.pdf
TEA1723DT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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PTVS12VZ1USKN315 PTVS12VZ1USKN.pdf
PTVS12VZ1USKN315
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Supplier Device Package: DSN1608-2
Voltage - Reverse Standoff (Typ): 12V (Max)
Current - Peak Pulse (10/1000µs): 10.5A
Capacitance @ Frequency: 430pF @ 1MHz
Applications: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 0603 (1608 Metric)
Power Line Protection: No
Power - Peak Pulse: 1900W (1.9kW)
Voltage - Clamping (Max) @ Ipp: 21.8V
Voltage - Breakdown (Min): 13.3V
Unidirectional Channels: 1
Part Status: Active
Packaging: Bulk
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PCA9574PW,118 PCA9574.pdf
PCA9574PW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
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10+2.15 EUR
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100+1.74 EUR
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500+1.58 EUR
1000+1.52 EUR
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PCA9574PW,112 PCA9574.pdf
PCA9574PW,112
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SPC5566MVR132,557
Hersteller: NXP USA Inc.
Description: NXP 32 BIT MCU, POWER ARCHITECTU
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144 MPC5566.pdf
SPC5566MZP144
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP132R MPC5566.pdf
SPC5566MZP132R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144R MPC5566.pdf
SPC5566MZP144R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP112R MPC5566.pdf
SPC5566MZP112R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB784-C4V7115 BZB784_SERIES.pdf
BZB784-C4V7115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C4V7 ZENER D
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9306DC1Z PCA9306.pdf
PCA9306DC1Z
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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SEN-SPI-BOX
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE SENSOR EVAL KIT
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300N.pdf
MRFE6VP5300GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 27dB
Power - Output: 300W
Configuration: Dual
Frequency: 1.8MHz ~ 600MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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RDK-S32R274 RDK-S32R274_FS.pdf
RDK-S32R274
Hersteller: NXP USA Inc.
Description: S32R274 EVAL BRD
Utilized IC / Part: S32R274
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S08DZ96MLL FSCLS06295-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 100LQFP
Number of I/O: 87
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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26+24.86 EUR
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MVF60NS151CMK40 FSCL-S-A0000149011-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: VYBRID F 32-BIT MPU, ARM CORTEX-
Produkt ist nicht verfügbar
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MVF60NS152CMK50 VYBRIDFSERIESEC.pdf
MVF60NS152CMK50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Produkt ist nicht verfügbar
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UJA1168ATK/F/0Z UJA1168A.pdf
UJA1168ATK/F/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX 14-HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Grade: Automotive
Qualification: AEC-Q100
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3+7.16 EUR
10+5.43 EUR
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500+4.25 EUR
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MC9S08SE8VWL MC9S08SE8.pdf
MC9S08SE8VWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Produkt ist nicht verfügbar
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LS1023ASE8MNLB LS1043AFS.pdf
LS1023ASE8MNLB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G240F0VLFR MC9S12GRMV1.pdf
S9S12G240F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 48LQFP
Produkt ist nicht verfügbar
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PEMI8QFN/HE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HE,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
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1567+0.38 EUR
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MMG3015NT1-NXP FSCL-S-A0000226252-1.pdf?t.download=true&u=5oefqw
MMG3015NT1-NXP
Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER, 0
Packaging: Bulk
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189+2.93 EUR
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74AVC16835ADGV,112 74AVC16835A_Rev_Feb2017.pdf
74AVC16835ADGV,112
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 18
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
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376+1.5 EUR
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PBHV9560Z115 PBHV9560Z.pdf
PBHV9560Z115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN3460BS/F4518 PTN3460I.pdf
PTN3460BS/F4518
Hersteller: NXP USA Inc.
Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F3518 PHGLS28090-1.pdf?t.download=true&u=5oefqw
PTN3460BS/F3518
Hersteller: NXP USA Inc.
Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F4 PTN3460I.pdf
Hersteller: NXP USA Inc.
Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9959HN-ARD UM11581.pdf
PCA9959HN-ARD
Hersteller: NXP USA Inc.
Description: EVK ARDUINO SHIELD LED CTRL
Platform: Arduino
Utilized IC / Part: PCA9959
Contents: Board(s)
Type: Power Management
Function: LED Driver
Packaging: Bulk
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S9S08SG32E1VTLR MC9S08SG32.pdf
S9S08SG32E1VTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
DigiKey Programmable: Not Verified
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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2500+5.12 EUR
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S9S08SG32E1VTLR MC9S08SG32.pdf
S9S08SG32E1VTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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3+9.26 EUR
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P80C51FA-4B557 RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw
P80C51FA-4B557
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 44-PQFP (10x10)
Peripherals: POR, PWM
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
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21+28.13 EUR
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SPC5607BF1VLQ6 MPC560XBFAMFS.pdf
SPC5607BF1VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Produkt ist nicht verfügbar
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S9S12G96AMLFR
S9S12G96AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVC96F0CLF
S912ZVC96F0CLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G96AMLF
S9S12G96AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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PSMN130-200D,118 PSMN130-200D.pdf
PSMN130-200D,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 200V 20A DPAK
Produkt ist nicht verfügbar
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PCA24S08ADP,118 PCA24S08A.pdf
PCA24S08ADP,118
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 8TSSOP
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Kbit
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 1K x 8
Memory Interface: I2C
Supplier Device Package: 8-TSSOP
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
auf Bestellung 2500 Stücke:
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AnzahlPrivatkunde
919+0.67 EUR
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PN7161A1EV/C100K PN7160_PN7161.pdf
PN7161A1EV/C100K
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
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2+17.15 EUR
10+14.88 EUR
25+14.09 EUR
100+13.01 EUR
250+12.35 EUR
500+11.9 EUR
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MC33772CTP2AE MC33772C-DS.pdf
MC33772CTP2AE
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 325 Stücke:
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2+20.69 EUR
10+16.17 EUR
25+15.05 EUR
100+13.82 EUR
250+13.22 EUR
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RB521CS30L315 RB521CS30L.pdf
RB521CS30L315
Hersteller: NXP USA Inc.
Description: 100MA LOW VF MEGA SCHOTTKY BARRI
Produkt ist nicht verfügbar
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LS1046ASE8Q1A LS1046A.pdf
LS1046ASE8Q1A
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM
Produkt ist nicht verfügbar
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SPC5605BK0MLQ6R MPC560XBFAMFS.pdf
SPC5605BK0MLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1042NXN7MQB T1FAMILYFS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC908GR32ACFAE-NXP FSCL-S-A0001046826-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
auf Bestellung 990 Stücke:
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26+24.86 EUR
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PCA8547BHT/AY PCA8547.pdf
PCA8547BHT/AY
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Current - Supply: 90 µA
Part Status: Obsolete
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: SPI
auf Bestellung 19 Stücke:
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4+6.47 EUR
10+5.82 EUR
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NCF3340AHN/00311Y NCX3340.pdf
NCF3340AHN/00311Y
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 27.12MZ 40HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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LS1020ASE8KQB LS1020ALS1022AFS.pdf
LS1020ASE8KQB
Hersteller: NXP USA Inc.
Description: LS1020 32BIT ARM SOC 1GHZ DDR3
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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SLN-VIZN3D-IOT getting-started-with-the-nxp-edgeready-mcu-based-solution-for-3d-face-recognition:GS-SLN-VIZN3D-IOT
SLN-VIZN3D-IOT
Hersteller: NXP USA Inc.
Description: DEV KIT I.MXRT117F 3D FACE REC
Part Status: Active
Utilized IC / Part: RT117F
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Contents: Board(s), Cable(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
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1+657.34 EUR
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FXPS7550A4T1 FXPS7250A4.pdf
FXPS7550A4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR, 3.3V/5V, 20/550
Supplier Device Package: 16-HQFN (4x4)
Applications: Board Mount
Voltage - Supply: 3.1V ~ 5.25V
Operating Temperature: -40°C ~ 130°C
Accuracy: ±3%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 79.77PSI (20kPa ~ 550kPa)
Output: 0 V ~ 4.6 V
Mounting Type: Surface Mount, Wettable Flank
Output Type: Analog Voltage
Package / Case: 16-QFN Exposed Pad
Part Status: Active
Packaging: Bulk
Maximum Pressure: 87.02PSI (600kPa)
Port Style: No Port
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68+8.54 EUR
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FXPS7550DI4ST1
FXPS7550DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7550A4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7550DS4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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NX3DV2567HR-Q100X NX3DV2567_Q100.pdf
NX3DV2567HR-Q100X
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Part Status: Active
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 872 Stücke:
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7+3.22 EUR
10+2.37 EUR
25+2.15 EUR
100+1.92 EUR
250+1.8 EUR
500+1.74 EUR
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