Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35717) > Seite 420 nach 596
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| BC847CQA147 | NXP USA Inc. |
 Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk |
Produkt ist nicht verfügbar |
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| 74LVC3G17GN115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC3G17GN BUFFER, |
Produkt ist nicht verfügbar |
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PEMI4QFN/CE,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHMS ESD SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 7dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Number of Channels: 4 |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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BC807-40QA147 | NXP USA Inc. |
Description: NOW NEXPERIA BC807-40 - SMALL SI |
Produkt ist nicht verfügbar |
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MCIMX6DP6AVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6DP 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
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MCIMX6G0DVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
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MCIMX6G2AVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Produkt ist nicht verfügbar |
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MC9S08AC128CFUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51AC128ACPUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 32-BIT, FLASH, Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51AC128CCPUE557 | NXP USA Inc. |
Description: COLD FIRE MICROCONTROLLER 32-BI Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BAS21/MI,215 | NXP USA Inc. |
Description: BAS21 - HIGH-VOLTAGE SWITCHING D Packaging: Bulk Part Status: Active |
auf Bestellung 463120 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS21/MI,235 | NXP USA Inc. |
Description: BAS21 - HIGH-VOLTAGE SWITCHING D Packaging: Bulk Part Status: Active |
auf Bestellung 160000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BAS21/MI215 | NXP USA Inc. |
Description: BAS21 - HIGH-VOLTAGE SWITCHING D Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BAS21/ZL215 | NXP USA Inc. |
Description: BAS21 - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX84-C11/LF1R | NXP USA Inc. |
Description: DIODE ZENER 11V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZX84-C11/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 11V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZB784-C6V2115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C5V6 - ZENER Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC34PF3000A7EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
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BAS40-04/ZLR | NXP USA Inc. |
Description: DIODE ARR SCHOTT 40V 120MA SOT23 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 120mA (DC) Supplier Device Package: SOT-23 (TO-236AB) Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA Current - Reverse Leakage @ Vr: 10 µA @ 40 V |
Produkt ist nicht verfügbar |
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BAS40-04/ZLVL | NXP USA Inc. |
Description: DIODE ARR SCHOTT 40V 120MA SOT23 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 120mA (DC) Supplier Device Package: SOT-23 (TO-236AB) Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA Current - Reverse Leakage @ Vr: 10 µA @ 40 V |
Produkt ist nicht verfügbar |
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BGA2748,115 | NXP USA Inc. |
Description: IC AMP ISM 100MHZ-2.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 100MHz ~ 2.2GHz RF Type: ISM Voltage - Supply: 3V ~ 4V Gain: 21.8dB Current - Supply: 15mA Noise Figure: 1.9dB P1dB: -9.2dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BZX84-C5V6/CH/LFVL | NXP USA Inc. |
Description: DIODE ZENER 5.6V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 1 µA @ 2 V |
Produkt ist nicht verfügbar |
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| 74LVC1T45GN132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1T45GN BUS TRA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BAW56QA147 | NXP USA Inc. |
Description: DIODE Packaging: Bulk Part Status: Active Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Common Anode Current - Average Rectified (Io) (per Diode): 310mA (DC) Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 90 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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MC68340FE16VE | NXP USA Inc. |
Description: MICROCONTROLLER, 32-BIT, 16.78MH |
auf Bestellung 912 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F253D,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16SO Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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N74F253D,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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| SW5746R-Z4ICST1F | NXP USA Inc. | Description: AUTO SOFTWARE MPC5746R Z4 INSTRU |
Produkt ist nicht verfügbar |
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| SW574XG-Z4SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE MPC574XG Z4 STRUCT |
Produkt ist nicht verfügbar |
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| SW577XK-Z7SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE MPC577XK Z7 STRUCT |
Produkt ist nicht verfügbar |
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| SWAC57D-A5SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE SAC57D A5 STRUCTUR |
Produkt ist nicht verfügbar |
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| SWAC57D-M4SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE SAC57D M4 STRUCTUR |
Produkt ist nicht verfügbar |
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| LPC11U14FBD48/201 | NXP USA Inc. | Description: RISC MICROCONTROLLER, 32-BIT, FL |
Produkt ist nicht verfügbar |
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LPC11U14FHI33/201551 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC11U14FBD48/20EL | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1440 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C3V0115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C3V0 ZENER D Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC68331CAG25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
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MC68HC16Z1CAG25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
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NCX2220DP,125 | NXP USA Inc. |
Description: IC COMPARATOR 2 GEN PUR 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 8-TSSOP Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| BC847BMB315 | NXP USA Inc. | Description: SMALL SIGNAL BIPOLAR TRANSISTOR, |
Produkt ist nicht verfügbar |
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IP4280CZ10,118 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 8VC 10TSSOP Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: HDMI Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 10-TSSOP Unidirectional Channels: 4 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 8V (Typ) Power Line Protection: Yes |
Produkt ist nicht verfügbar |
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JN5188HN/001K | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5188HN/001Y | NXP USA Inc. |
Description: IC MCU 40VFQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5188THN/001K | NXP USA Inc. |
Description: IC MCU 40VFQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5188THN/001Y | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| JN5189HN/001K | NXP USA Inc. |
Description: IC MCU Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| JN5189HN/001Y | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| JN5189THN/001K | NXP USA Inc. |
Description: IC MCU Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| JN5189THN/001Y | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PDTB123EQA147 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk |
auf Bestellung 79000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BAV70/ZL215 | NXP USA Inc. |
Description: BAV70 - RECTIFIER DIODE Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4 ns Technology: Standard Current - Average Rectified (Io) (per Diode): 215mA (DC) Supplier Device Package: SOT-23-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V |
Produkt ist nicht verfügbar |
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BAV70QA147 | NXP USA Inc. |
Description: DIODE ARRAY GP 100V 175MA 3DFN Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 175mA (DC) Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZX84-C12/LF1R | NXP USA Inc. |
Description: DIODE ZENER 12V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZX84-C12/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 12V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
 |
PEMI8QFN/HK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHM/13.5PF SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 13dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 8 |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
|
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,TO-226_straightlead.jpg "J112,126") |
J112,126 | NXP USA Inc. |
Description: JFET N-CH 40V 400MW TO92-3 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PC33663BSEF | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PC33663BSEFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 14SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BFU530XR | NXP USA Inc. | Description: RF SMALL SIGNAL BIPOLAR TRANSIST |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
 |
BUK751R6-30E,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 120A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 1.6mOhm @ 25A, 10V Power Dissipation (Max): 349W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 154 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 11960 pF @ 25 V |
auf Bestellung 277 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 74LVC3G17GN115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G17GN BUFFER,
Description: NOW NEXPERIA 74LVC3G17GN BUFFER,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI4QFN/CE,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2959+ | 0.16 EUR |
| BC807-40QA147 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC807-40 - SMALL SI
Description: NOW NEXPERIA BC807-40 - SMALL SI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6DP6AVT8AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6G0DVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6G2AVM05AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08AC128CFUE557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51AC128ACPUE557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 32-BIT, FLASH,
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 32-BIT, FLASH,
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51AC128CCPUE557 |
|
Hersteller: NXP USA Inc.
Description: COLD FIRE MICROCONTROLLER 32-BI
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: COLD FIRE MICROCONTROLLER 32-BI
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAS21/MI,215 |
|
Hersteller: NXP USA Inc.
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
auf Bestellung 463120 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13172+ | 0.033 EUR |
| BAS21/MI,235 |
|
Hersteller: NXP USA Inc.
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
auf Bestellung 160000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13172+ | 0.033 EUR |
| BAS21/MI215 |
|
Hersteller: NXP USA Inc.
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C11/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C11/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF3000A7EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAS40-04/ZLR |
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAS40-04/ZLVL |
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGA2748,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP ISM 100MHZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.2GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.8dB
Current - Supply: 15mA
Noise Figure: 1.9dB
P1dB: -9.2dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Description: IC AMP ISM 100MHZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.2GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.8dB
Current - Supply: 15mA
Noise Figure: 1.9dB
P1dB: -9.2dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C5V6/CH/LFVL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC1T45GN132 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1T45GN BUS TRA
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVC1T45GN BUS TRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAW56QA147 |
|
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 310mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 310mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC68340FE16VE |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 32-BIT, 16.78MH
Description: MICROCONTROLLER, 32-BIT, 16.78MH
auf Bestellung 912 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| N74F253D,623 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F253D,623 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1480+ | 0.34 EUR |
| SW5746R-Z4ICST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE MPC5746R Z4 INSTRU
Description: AUTO SOFTWARE MPC5746R Z4 INSTRU
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SW574XG-Z4SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE MPC574XG Z4 STRUCT
Description: AUTO SOFTWARE MPC574XG Z4 STRUCT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SW577XK-Z7SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE MPC577XK Z7 STRUCT
Description: AUTO SOFTWARE MPC577XK Z7 STRUCT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SWAC57D-A5SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC57D A5 STRUCTUR
Description: AUTO SOFTWARE SAC57D A5 STRUCTUR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SWAC57D-M4SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC57D M4 STRUCTUR
Description: AUTO SOFTWARE SAC57D M4 STRUCTUR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U14FBD48/201 |
Hersteller: NXP USA Inc.
Description: RISC MICROCONTROLLER, 32-BIT, FL
Description: RISC MICROCONTROLLER, 32-BIT, FL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U14FHI33/201551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U14FBD48/20EL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1440 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.41 EUR |
| 10+ | 4.86 EUR |
| 25+ | 4.47 EUR |
| 100+ | 4.04 EUR |
| 250+ | 3.84 EUR |
| 500+ | 3.72 EUR |
| 1000+ | 3.61 EUR |
| MC68331CAG25 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC68HC16Z1CAG25 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Description: IC MCU 16BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCX2220DP,125 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BC847BMB315 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP4280CZ10,118 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 8VC 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8V (Typ)
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 8VC 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8V (Typ)
Power Line Protection: Yes
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5188HN/001K |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5188HN/001Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: IC MCU 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5188THN/001K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 40VFQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: IC MCU 40VFQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5188THN/001Y |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5189HN/001K |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5189HN/001Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5189THN/001K |
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5189THN/001Y |
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTB123EQA147 |
|
auf Bestellung 79000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8219+ | 0.067 EUR |
| BAV70/ZL215 |
|
Hersteller: NXP USA Inc.
Description: BAV70 - RECTIFIER DIODE
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Description: BAV70 - RECTIFIER DIODE
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAV70QA147 |
|
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 100V 175MA 3DFN
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 175mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ARRAY GP 100V 175MA 3DFN
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 175mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C12/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 12V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 12V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C12/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 12V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: DIODE ZENER 12V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI8QFN/HK,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1567+ | 0.3 EUR |
| J112,126 |
|
Hersteller: NXP USA Inc.
Description: JFET N-CH 40V 400MW TO92-3
Description: JFET N-CH 40V 400MW TO92-3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFU530XR |
Hersteller: NXP USA Inc.
Description: RF SMALL SIGNAL BIPOLAR TRANSIST
Description: RF SMALL SIGNAL BIPOLAR TRANSIST
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK751R6-30E,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 154 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11960 pF @ 25 V
Description: MOSFET N-CH 30V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 154 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11960 pF @ 25 V
auf Bestellung 277 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 277+ | 2.21 EUR |