74AVC16835ADGV,112 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC BUF NON-INVERT 3.6V 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 18
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
auf Bestellung 8850 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 376+ | 1.3 EUR |
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Technische Details 74AVC16835ADGV,112 NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP, Packaging: Tube, Package / Case: 56-TFSOP (0.173", 4.40mm Width), Output Type: 3-State, Mounting Type: Surface Mount, Number of Elements: 1, Logic Type: Buffer, Non-Inverting, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.2V ~ 3.6V, Number of Bits per Element: 18, Current - Output High, Low: 12mA, 12mA, Supplier Device Package: 56-TSSOP, Part Status: Obsolete.
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74AVC16835ADGV,112 | Hersteller : NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 56TSSOP Packaging: Tube Package / Case: 56-TFSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 18 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 56-TSSOP Part Status: Obsolete |
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