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LD6806CX4/C33P,315 LD6806CX4/C33P,315 NXP USA Inc. PHGLS23997-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6805K/21H115 LD6805K/21H115 NXP USA Inc. PHGLS27962-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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2959+0.19 EUR
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LD6836TD/21H125 LD6836TD/21H125 NXP USA Inc. PHGLS25657-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6805K/15H115 LD6805K/15H115 NXP USA Inc. PHGLS27962-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.5V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6816CX4/C29P,315 LD6816CX4/C29P,315 NXP USA Inc. PHGLS25656-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 2.9V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6806TD/28P,125 LD6806TD/28P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LS1043AXE8QQB,557 NXP USA Inc. Description: QORIQ LAYERSCAPE, ARM CORTEX A53
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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LS1023AXN8KQB557 NXP USA Inc. Description: LS1023A - QORIQ LAYERSCAPE, ARM
Part Status: Active
Packaging: Bulk
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
Supplier Device Package: 780-FCPBGA (23x23)
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043AXE7QQB557 NXP USA Inc. Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1023ASN7MNLB557 NXP USA Inc. Description: LS1023A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043ASN8QQB557 NXP USA Inc. Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1020ASN7HNB557 LS1020ASN7HNB557 NXP USA Inc. Description: LS1020A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1026ASE8Q1A LS1026ASE8Q1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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TJA1124CHG/0Z TJA1124CHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Part Status: Active
Duplex: Full
Receiver Hysteresis: 200 mV
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124CHG/0Z TJA1124CHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Part Status: Active
Duplex: Full
Receiver Hysteresis: 200 mV
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 5681 Stücke:
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10+4.27 EUR
25+3.92 EUR
100+3.52 EUR
250+3.33 EUR
500+3.22 EUR
1000+3.13 EUR
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MC9S08SH32CTG,574 MC9S08SH32CTG,574 NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Number of I/O: 13
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S08SH32CTLR,518 MC9S08SH32CTLR,518 NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Produkt ist nicht verfügbar
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PX1011B-EL1/Q900551 PX1011B-EL1/Q900551 NXP USA Inc. PHGLS23032-1.pdf?t.download=true&u=5oefqw Description: PCI EXPRESS STAND-ALONE X1 PHY
Packaging: Bulk
Produkt ist nicht verfügbar
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MWCT1015SFVMHN MWCT1015SFVMHN NXP USA Inc. Description: WCT1015 100BGA
Produkt ist nicht verfügbar
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74HC40103PW 74HC40103PW NXP USA Inc. PHGL-S-A0001770506-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74HC40103PW - BINAR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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PTVS22VZ1USKYL PTVS22VZ1USKYL NXP USA Inc. PTVS22VZ1USK.pdf Description: DIODES NOT PHOTOSENSITIVE/LED
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S9S08DN16F2CLF S9S08DN16F2CLF NXP USA Inc. MC9S08DN60.pdf Description: 8-BIT MCU, S08 CORE, 16KB FLASH,
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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NVT4858HKZ NXP USA Inc. Description: IC XLTR VL BIDIR 16-XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
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NVT4858HKZ NXP USA Inc. Description: IC XLTR VL BIDIR 16-XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
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1000+0.83 EUR
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PCA9544AD PCA9544AD NXP USA Inc. PHGLS30051-1.pdf?t.download=true&u=5oefqw Description: 2 LINE MUX
Produkt ist nicht verfügbar
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PCA9544AWP112 NXP USA Inc. Description: IC I2C MUX 4CH 20-TSSOP
Produkt ist nicht verfügbar
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PCA9547D,118 PCA9547D,118 NXP USA Inc. PCA9547.pdf Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
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PCA9547D,118 PCA9547D,118 NXP USA Inc. PCA9547.pdf Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
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TJR1443AT/0Z TJR1443AT/0Z NXP USA Inc. TJR1443.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1443AT/0Z TJR1443AT/0Z NXP USA Inc. TJR1443.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9KEAZN16AMLCR S9KEAZN16AMLCR NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1960 Stücke:
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4+5.57 EUR
10+4.16 EUR
25+3.81 EUR
100+3.43 EUR
250+3.25 EUR
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74AUP1G126GN,132 74AUP1G126GN,132 NXP USA Inc. PHGLS24874-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
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74AHC1G126GM115 74AHC1G126GM115 NXP USA Inc. 74AHC_AHCT1G126.pdf Description: NOW NEXPERIA 74AHC1G126GM - BUS
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP1G125GW-Q100125 74AUP1G125GW-Q100125 NXP USA Inc. 74AUP1G125_Q100.pdf Description: IC BUFFER NON-INVERT 3.6V 5TSSOP
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74ALVC245PW118 NXP USA Inc. 74ALVC245.pdf Description: NOW NEXPERIA 74ALVC245PW BUS TRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8548J/N1,112 TDF8548J/N1,112 NXP USA Inc. TDF854x_Feb2011.pdf Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2 SPC5745BK1AVMH2 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
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SPC5745BK1AVMH2R SPC5745BK1AVMH2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
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SPC5604SF2CLQ6 SPC5604SF2CLQ6 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 105
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GPS1503MC NXP USA Inc. Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU8103UK/SZ NXP USA Inc. AN11678.pdf Description: MMIC LNA GPS 6XSON
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GPS1503MCZ NXP USA Inc. Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU6005/N2X BGU6005/N2X NXP USA Inc. BGU6005_N2.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
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BGU8019X115 BGU8019X115 NXP USA Inc. PHGL-S-A0008130814-1.pdf?t.download=true&u=5oefqw Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
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MVR5510AMBAHES MVR5510AMBAHES NXP USA Inc. VR5510.pdf Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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MVR5510AMBAHESR2 MVR5510AMBAHESR2 NXP USA Inc. VR5510.pdf Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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LPC1125JBD48/303EL LPC1125JBD48/303EL NXP USA Inc. LPC112X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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KITPF8201FRDMEVM KITPF8201FRDMEVM NXP USA Inc. KITPF8201FRDMEVM.pdf Description: FRDM EXPANSION BOARD PF8201
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8201
Supplied Contents: Board(s)
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TDF19971BHN/C1,551 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19971BHN/C1,518 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19971BHN/C1,557 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34PF8100A0EP MC34PF8100A0EP NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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AFM907NT1 AFM907NT1 NXP USA Inc. AFM907N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
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AFM907NT1 AFM907NT1 NXP USA Inc. AFM907N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
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SC16C652BIB48,157 SC16C652BIB48,157 NXP USA Inc. SC16C652B.pdf Description: UART IC 2, DUART CHANNEL 32 BYTE
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
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N74F153D,623 N74F153D,623 NXP USA Inc. DS_568_74F153.pdf Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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PTN3311DP,118 PTN3311DP,118 NXP USA Inc. PTN3310_PTN3311.pdf Description: IC TRANSLATOR UNIDIR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 800Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 1
Input Signal: PECL
Part Status: Obsolete
Number of Circuits: 1
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DSP56311VL150R2 DSP56311VL150R2 NXP USA Inc. DSP56311.pdf Description: IC DSP 24BIT 150MHZ 196-MAPBGA
Produkt ist nicht verfügbar
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74LVC377D,118 74LVC377D,118 NXP USA Inc. PHGLS25767-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20SO
Current - Quiescent (Iq): 10 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 5 pF
Clock Frequency: 330 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
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PTN3944EVM-KIT NXP USA Inc. UM11596.pdf Description: PTN3944 EVALUATION BOARD
Packaging: Box
Function: Equalizer
Type: Interface
Utilized IC / Part: PTN3944
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
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LD6806CX4/C33P,315 PHGLS23997-1.pdf?t.download=true&u=5oefqw
LD6806CX4/C33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6805K/21H115 PHGLS27962-1.pdf?t.download=true&u=5oefqw
LD6805K/21H115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6836TD/21H125 PHGLS25657-1.pdf?t.download=true&u=5oefqw
LD6836TD/21H125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6805K/15H115 PHGLS27962-1.pdf?t.download=true&u=5oefqw
LD6805K/15H115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.5V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6816CX4/C29P,315 PHGLS25656-1.pdf?t.download=true&u=5oefqw
LD6816CX4/C29P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.9V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6806TD/28P,125 LD6806_Series.pdf
LD6806TD/28P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LS1043AXE8QQB,557
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE, ARM CORTEX A53
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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LS1023AXN8KQB557
Hersteller: NXP USA Inc.
Description: LS1023A - QORIQ LAYERSCAPE, ARM
Part Status: Active
Packaging: Bulk
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
Supplier Device Package: 780-FCPBGA (23x23)
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
DigiKey Programmable: Not Verified
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LS1043AXE7QQB557
Hersteller: NXP USA Inc.
Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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LS1023ASN7MNLB557
Hersteller: NXP USA Inc.
Description: LS1023A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043ASN8QQB557
Hersteller: NXP USA Inc.
Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1020ASN7HNB557
LS1020ASN7HNB557
Hersteller: NXP USA Inc.
Description: LS1020A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1026ASE8Q1A LS1046A.pdf
LS1026ASE8Q1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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TJA1124CHG/0Z TJA1124.pdf
TJA1124CHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Part Status: Active
Duplex: Full
Receiver Hysteresis: 200 mV
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124CHG/0Z TJA1124.pdf
TJA1124CHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Part Status: Active
Duplex: Full
Receiver Hysteresis: 200 mV
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 5681 Stücke:
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4+5.7 EUR
10+4.27 EUR
25+3.92 EUR
100+3.52 EUR
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500+3.22 EUR
1000+3.13 EUR
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MC9S08SH32CTG,574 MC9S08SH32.pdf
MC9S08SH32CTG,574
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Number of I/O: 13
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S08SH32CTLR,518 MC9S08SH32.pdf
MC9S08SH32CTLR,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Produkt ist nicht verfügbar
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PX1011B-EL1/Q900551 PHGLS23032-1.pdf?t.download=true&u=5oefqw
PX1011B-EL1/Q900551
Hersteller: NXP USA Inc.
Description: PCI EXPRESS STAND-ALONE X1 PHY
Packaging: Bulk
Produkt ist nicht verfügbar
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MWCT1015SFVMHN
MWCT1015SFVMHN
Hersteller: NXP USA Inc.
Description: WCT1015 100BGA
Produkt ist nicht verfügbar
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74HC40103PW PHGL-S-A0001770506-1.pdf?t.download=true&u=5oefqw
74HC40103PW
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC40103PW - BINAR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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PTVS22VZ1USKYL PTVS22VZ1USK.pdf
PTVS22VZ1USKYL
Hersteller: NXP USA Inc.
Description: DIODES NOT PHOTOSENSITIVE/LED
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S9S08DN16F2CLF MC9S08DN60.pdf
S9S08DN16F2CLF
Hersteller: NXP USA Inc.
Description: 8-BIT MCU, S08 CORE, 16KB FLASH,
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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NVT4858HKZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 16-XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
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4000+0.8 EUR
8000+0.77 EUR
20000+0.76 EUR
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NVT4858HKZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 16-XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
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13+1.7 EUR
18+1.21 EUR
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500+0.86 EUR
1000+0.83 EUR
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PCA9544AD PHGLS30051-1.pdf?t.download=true&u=5oefqw
PCA9544AD
Hersteller: NXP USA Inc.
Description: 2 LINE MUX
Produkt ist nicht verfügbar
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PCA9544AWP112
Hersteller: NXP USA Inc.
Description: IC I2C MUX 4CH 20-TSSOP
Produkt ist nicht verfügbar
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PCA9547D,118 PCA9547.pdf
PCA9547D,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
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1000+1.88 EUR
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PCA9547D,118 PCA9547.pdf
PCA9547D,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
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6+4.05 EUR
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TJR1443AT/0Z TJR1443.pdf
TJR1443AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1443AT/0Z TJR1443.pdf
TJR1443AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9KEAZN16AMLCR S9KEA64P64M20SF0.pdf
S9KEAZN16AMLCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1960 Stücke:
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4+5.57 EUR
10+4.16 EUR
25+3.81 EUR
100+3.43 EUR
250+3.25 EUR
500+3.15 EUR
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74AUP1G126GN,132 PHGLS24874-1.pdf?t.download=true&u=5oefqw
74AUP1G126GN,132
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
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2137+0.3 EUR
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74AHC1G126GM115 74AHC_AHCT1G126.pdf
74AHC1G126GM115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC1G126GM - BUS
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP1G125GW-Q100125 74AUP1G125_Q100.pdf
74AUP1G125GW-Q100125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5TSSOP
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4243+0.13 EUR
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74ALVC245PW118 74ALVC245.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVC245PW BUS TRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8548J/N1,112 TDF854x_Feb2011.pdf
TDF8548J/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2
SPC5745BK1AVMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2R
SPC5745BK1AVMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604SF2CLQ6
SPC5604SF2CLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 105
Produkt ist nicht verfügbar
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GPS1503MC
Hersteller: NXP USA Inc.
Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU8103UK/SZ AN11678.pdf
Hersteller: NXP USA Inc.
Description: MMIC LNA GPS 6XSON
Produkt ist nicht verfügbar
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GPS1503MCZ
Hersteller: NXP USA Inc.
Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU6005/N2X BGU6005_N2.pdf
BGU6005/N2X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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BGU8019X115 PHGL-S-A0008130814-1.pdf?t.download=true&u=5oefqw
BGU8019X115
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3181 Stücke:
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2144+0.3 EUR
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MVR5510AMBAHES VR5510.pdf
MVR5510AMBAHES
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMBAHESR2 VR5510.pdf
MVR5510AMBAHESR2
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC1125JBD48/303EL LPC112X.pdf
LPC1125JBD48/303EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.17 EUR
10+6.97 EUR
25+6.41 EUR
80+5.89 EUR
250+5.52 EUR
500+5.36 EUR
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KITPF8201FRDMEVM KITPF8201FRDMEVM.pdf
KITPF8201FRDMEVM
Hersteller: NXP USA Inc.
Description: FRDM EXPANSION BOARD PF8201
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8201
Supplied Contents: Board(s)
auf Bestellung 8 Stücke:
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1+834.68 EUR
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TDF19971BHN/C1,551
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19971BHN/C1,518
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19971BHN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34PF8100A0EP PF8100_PF8200.pdf
MC34PF8100A0EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+21.63 EUR
10+16.96 EUR
25+15.78 EUR
100+14.49 EUR
260+13.85 EUR
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AFM907NT1 AFM907N.pdf
AFM907NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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AFM907NT1 AFM907N.pdf
AFM907NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 993 Stücke:
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4+5.53 EUR
10+4.14 EUR
25+3.8 EUR
100+3.42 EUR
250+3.27 EUR
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SC16C652BIB48,157 SC16C652B.pdf
SC16C652BIB48,157
Hersteller: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 32 BYTE
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
134+7.83 EUR
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N74F153D,623 DS_568_74F153.pdf
N74F153D,623
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 2672 Stücke:
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AnzahlPrivatkunde
1665+0.36 EUR
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PTN3311DP,118 PTN3310_PTN3311.pdf
PTN3311DP,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 800Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 1
Input Signal: PECL
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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DSP56311VL150R2 DSP56311.pdf
DSP56311VL150R2
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 196-MAPBGA
Produkt ist nicht verfügbar
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74LVC377D,118 PHGLS25767-1.pdf?t.download=true&u=5oefqw
74LVC377D,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Current - Quiescent (Iq): 10 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 5 pF
Clock Frequency: 330 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
auf Bestellung 5500 Stücke:
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928+0.63 EUR
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PTN3944EVM-KIT UM11596.pdf
Hersteller: NXP USA Inc.
Description: PTN3944 EVALUATION BOARD
Packaging: Box
Function: Equalizer
Type: Interface
Utilized IC / Part: PTN3944
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
auf Bestellung 5 Stücke:
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AnzahlPrivatkunde
1+1160.13 EUR
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