Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35538) > Seite 414 nach 593
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NX7002BKXB147 | NXP USA Inc. |
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auf Bestellung 1459345 Stücke: Lieferzeit 10-14 Tag (e) |
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NX7002BKS115 | NXP USA Inc. |
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auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVC4T245PW-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 2 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 16-TSSOP Part Status: Active |
auf Bestellung 968 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1998TS/1115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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TEA1993TS/1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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TEA1993TS/1125 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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TEA2208T/1J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
Produkt ist nicht verfügbar |
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TEA2208T/1J | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
auf Bestellung 2484 Stücke: Lieferzeit 10-14 Tag (e) |
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74AXP1G11GSH | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: 8mA, 8mA Number of Inputs: 3 Supplier Device Package: 6-XSON, SOT1202 (1x1) Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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IP3348CX20,135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-UFBGA, WLCSP Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 15nH (Total), C = 25pF (Total) Height: 0.026" (0.65mm) Attenuation Value: 40dB @ 1GHz ~ 3GHz Filter Order: 3rd Applications: Data Lines for Mobile Devices Technology: LC (Pi) Center / Cutoff Frequency: 350MHz (Cutoff) Resistance - Channel (Ohms): 10 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 Current: 20 mA |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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IP3088CX20,135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-WFBGA, WLCSP Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 40nH (Total), C = 42pF (Total) Height: 0.028" (0.70mm) Attenuation Value: 40dB @ 800MHz ~ 1.5GHz Filter Order: 5th Applications: GSM, LAN, PCS, WAN Technology: LC (Pi) Center / Cutoff Frequency: 175MHz (Cutoff) Resistance - Channel (Ohms): 18 ESD Protection: Yes Part Status: Active Number of Channels: 8 Current: 30 mA |
auf Bestellung 10902 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1225FBD48/301EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 1061 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1225FBD48/301151 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LPC1225FBD48/321151 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BLF7G10L-250,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: SOT-502A Frequency: 920MHz ~ 960MHz Power - Output: 60W Gain: 19.5dB Technology: LDMOS Supplier Device Package: LDMOST Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS4500LAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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BSC9131NXN7KHKB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
Produkt ist nicht verfügbar |
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T1023NXE7PQA | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SPC5606BF1MLQ6R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08QA4CFQER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-DFN-EP (4x4) Number of I/O: 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MRF24301HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI780 Packaging: Bulk Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 300W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L |
auf Bestellung 123 Stücke: Lieferzeit 10-14 Tag (e) |
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A7102CHUK/T0BC2VAZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 1721 Stücke: Lieferzeit 10-14 Tag (e) |
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A7102CHTK2/T0BC2CJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
auf Bestellung 4822 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT685SFAWBR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MIMXRT685SFAWBR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
auf Bestellung 5781 Stücke: Lieferzeit 10-14 Tag (e) |
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BAT74S135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 2 Independent Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: 6-TSSOP Operating Temperature - Junction: 125°C (Max) Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V |
Produkt ist nicht verfügbar |
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BAT74V115 | NXP USA Inc. |
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auf Bestellung 11400 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX233CJM4B | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9S12GA128F0MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TJA1441AT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G17GX/S500125 | NXP USA Inc. |
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auf Bestellung 330000 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV31F512VLH12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX6Y0DVM05AB557 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
auf Bestellung 152 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y7DVM09AA | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S08PB16MTJ | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 140 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA8296HN/C1,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.1V ~ 3.6V Supplier Device Package: 40-HVQFN (6x6) Part Status: Obsolete Current - Supply: 65 mA |
auf Bestellung 16251 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18252HN/C1,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Part Status: Obsolete Control Interface: I2C |
auf Bestellung 35100 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA19998HL/C1,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Function: Switch Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V Applications: Video Display Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Control Interface: I2C |
auf Bestellung 16183 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18257HN/C1557 | NXP USA Inc. |
Description: SI TUNER LOWCOST FOR DTMB IN CHI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 63700 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC850DEVR50BU | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV42F128VLH16 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BUK7635-55A118 | NXP USA Inc. |
![]() Packaging: Bulk |
Produkt ist nicht verfügbar |
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74HCT4002N,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 4 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
auf Bestellung 4659 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AW32CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 750 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AW32CPUE557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BUK9Y41-80E/GFX | NXP USA Inc. | Description: MOSFET N-CH LFPAK |
Produkt ist nicht verfügbar |
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BUK9Y43-60E/GFX | NXP USA Inc. | Description: MOSFET N-CH LFPAK |
Produkt ist nicht verfügbar |
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BUK9Y07-30B115 | NXP USA Inc. |
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auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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A3G26D055N-100 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
Produkt ist nicht verfügbar |
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MIMXRT685SFFOB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
auf Bestellung 821 Stücke: Lieferzeit 10-14 Tag (e) |
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BC846B215 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MKV30F128VLF10557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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NT3H1201W0FHK125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 3400 Stücke: Lieferzeit 10-14 Tag (e) |
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SL3S4021FHK125 | NXP USA Inc. |
Description: UCODE I2C UHF RFID Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
NT3H1101W0FHK125 | NXP USA Inc. |
Description: NTAG I2C 1K - ENERGY HARVESTING Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MCF51JF64VHS | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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SAF4000EL/101S233Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SAF4000EL/101S233K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MK66FN2M0VLQ18R,528 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CBTU02044HEJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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NX7002BKXB147 |
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auf Bestellung 1459345 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5495+ | 0.08 EUR |
NX7002BKS115 |
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auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
8242+ | 0.07 EUR |
74AVC4T245PW-Q100118 |
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Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 968 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
968+ | 0.63 EUR |
TEA1998TS/1115 |
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Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TEA1993TS/1 |
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Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TEA1993TS/1125 |
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Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TEA2208T/1J |
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Hersteller: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TEA2208T/1J |
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Hersteller: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
auf Bestellung 2484 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.87 EUR |
10+ | 7.59 EUR |
25+ | 7.02 EUR |
100+ | 6.39 EUR |
250+ | 6.09 EUR |
500+ | 5.91 EUR |
1000+ | 5.76 EUR |
74AXP1G11GSH |
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Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3249+ | 0.15 EUR |
IP3348CX20,135 |
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Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2049+ | 0.25 EUR |
IP3088CX20,135 |
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Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 40NH/42PF ESD SMD
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
Description: FILTER LC(PI) 40NH/42PF ESD SMD
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
auf Bestellung 10902 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
807+ | 0.62 EUR |
LPC1225FBD48/301EL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1061 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.59 EUR |
10+ | 6.25 EUR |
25+ | 6.05 EUR |
80+ | 5.84 EUR |
250+ | 5.62 EUR |
500+ | 5.50 EUR |
1000+ | 5.25 EUR |
LPC1225FBD48/301151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LPC1225FBD48/321151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BLF7G10L-250,112 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 181.78 EUR |
MC33FS4500LAER2 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BSC9131NXN7KHKB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
T1023NXE7PQA |
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Hersteller: NXP USA Inc.
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1.
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1.
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5606BF1MLQ6R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC9S08QA4CFQER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MRF24301HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 161.75 EUR |
A7102CHUK/T0BC2VAZ |
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Hersteller: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 1721 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.79 EUR |
10+ | 4.36 EUR |
25+ | 4.00 EUR |
100+ | 3.61 EUR |
250+ | 3.42 EUR |
500+ | 3.31 EUR |
1000+ | 3.21 EUR |
A7102CHTK2/T0BC2CJ |
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Hersteller: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 4822 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 5.93 EUR |
10+ | 4.47 EUR |
25+ | 4.10 EUR |
100+ | 3.70 EUR |
250+ | 3.51 EUR |
500+ | 3.39 EUR |
1000+ | 3.30 EUR |
2500+ | 3.20 EUR |
MIMXRT685SFAWBR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MIMXRT685SFAWBR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 5781 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 32.63 EUR |
10+ | 26.02 EUR |
25+ | 24.36 EUR |
100+ | 22.55 EUR |
250+ | 21.68 EUR |
500+ | 21.16 EUR |
BAT74S135 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BAT74V115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAT74V - RECTIFIER
Description: NOW NEXPERIA BAT74V - RECTIFIER
auf Bestellung 11400 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
MCIMX233CJM4B |
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Hersteller: NXP USA Inc.
Description: MICROPROCESSOR, CMOS, PBGA169
Description: MICROPROCESSOR, CMOS, PBGA169
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12GA128F0MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TJA1441AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2500+ | 1.02 EUR |
5000+ | 0.99 EUR |
74LVC1G17GX/S500125 |
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Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Description: BUFFER, LVC/LCX/Z SERIES
auf Bestellung 330000 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
MKV31F512VLH12R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MCIMX6Y0DVM05AB557 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
32+ | 15.96 EUR |
MCIMX6Y7DVM09AA |
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Hersteller: NXP USA Inc.
Description: PROCESSORS - APPLICATION SPECIAL
Description: PROCESSORS - APPLICATION SPECIAL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC9S08PB16MTJ |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 2.76 EUR |
10+ | 2.05 EUR |
75+ | 1.70 EUR |
TDA8296HN/C1,557 |
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Hersteller: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
auf Bestellung 16251 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
239+ | 2.11 EUR |
TDA18252HN/C1,557 |
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Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
auf Bestellung 35100 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
204+ | 2.49 EUR |
TDA19998HL/C1,557 |
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Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
auf Bestellung 16183 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
102+ | 4.81 EUR |
TDA18257HN/C1557 |
Hersteller: NXP USA Inc.
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 63700 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
357+ | 1.35 EUR |
MPC850DEVR50BU |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 87.00 EUR |
MKV42F128VLH16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74HCT4002N,112 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
auf Bestellung 4659 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
666+ | 0.74 EUR |
MC9S08AW32CFUER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
48+ | 10.36 EUR |
MC9S08AW32CPUE557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BUK9Y41-80E/GFX |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH LFPAK
Description: MOSFET N-CH LFPAK
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BUK9Y43-60E/GFX |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH LFPAK
Description: MOSFET N-CH LFPAK
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BUK9Y07-30B115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9Y07-30B - POWER
Description: NOW NEXPERIA BUK9Y07-30B - POWER
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
A3G26D055N-100 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MIMXRT685SFFOB |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
auf Bestellung 821 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.96 EUR |
10+ | 33.72 EUR |
25+ | 31.66 EUR |
80+ | 29.70 EUR |
230+ | 28.41 EUR |
440+ | 27.78 EUR |
MKV30F128VLF10557 |
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Hersteller: NXP USA Inc.
Description: KINETIS KV30: 100MHZ CORTEX-M4F
Description: KINETIS KV30: 100MHZ CORTEX-M4F
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
NT3H1201W0FHK125 |
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Hersteller: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3400 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
384+ | 1.37 EUR |
SL3S4021FHK125 |
Hersteller: NXP USA Inc.
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
NT3H1101W0FHK125 |
Hersteller: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MCF51JF64VHS |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 13.20 EUR |
10+ | 10.37 EUR |
80+ | 8.58 EUR |
SAF4000EL/101S233Y |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK66FN2M0VLQ18R,528 |
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Hersteller: NXP USA Inc.
Description: KINETIS K66, RISC MICROCONTROLLE
Description: KINETIS K66, RISC MICROCONTROLLE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
CBTU02044HEJ |
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Hersteller: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10000+ | 1.34 EUR |