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SPC5606BK0CLQ4 SPC5606BK0CLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5606BK0CLQ6 SPC5606BK0CLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5606BK0VLQ4 SPC5606BK0VLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0VLL6R SPC5606BK0VLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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SPC5606BF1VLQ6 SPC5606BF1VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5606BK0CLU4 SPC5606BK0CLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Core Processor: e200z0h
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SPC5606BF1VLQ6R SPC5606BF1VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SPC5606BK0CLU6 SPC5606BK0CLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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SPC5606BK0VLU4 SPC5606BK0VLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0VLU6 SPC5606BK0VLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0VLU6R SPC5606BK0VLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0MLU6R SPC5606BK0MLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606SF2CLU6R SPC5606SF2CLU6R NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
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SPC5606EF2VMC SPC5606EF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EF2VMCR SPC5606EF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
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SPC5606EEF2VMC SPC5606EEF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EEF2VMCR SPC5606EEF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LS2084ASE7TTB,557 NXP USA Inc. Description: QORIQ LAYERSCAPE MULTI-CORE COMM
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XET256MAG MC9S12XET256MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
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ADC1412D125HN/C1,5 ADC1412D125HN/C1,5 NXP USA Inc. PHGLS22903-1.pdf?t.download=true&u=5oefqw Description: IC ADC 14BIT PIPELINED 64HVQFN
Features: Simultaneous Sampling
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-VFQFPN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
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KITPF5024FRDMEVM KITPF5024FRDMEVM NXP USA Inc. KITPF5024FRDMEVM.pdf Description: KITPF5024FRDMEVM
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF5024
Supplied Contents: Board(s)
Embedded: No
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MCIMX537CVV8C2 MCIMX537CVV8C2 NXP USA Inc. Description: I.MX53 32-BIT MPU ARM CORTEX-A8
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MCIMX537CVV8C2R2 MCIMX537CVV8C2R2 NXP USA Inc. Description: I.MX53 32-BIT MPU ARM CORTEX-A8
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74LVC1G11GW-Q100,125 74LVC1G11GW-Q100,125 NXP USA Inc. 74LVC1G11_Q100.pdf Description: NOW NEXPERIA 74LVC1G11GW - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100125 NXP USA Inc. 74LVC1G11_Q100.pdf Description: NOW NEXPERIA 74LVC1G11GW-Q100 -
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363ATT1/AZ NXP USA Inc. PCF85363A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PCF85363ATT1/AZ PCF85363ATT1/AZ NXP USA Inc. PCF85363A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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12+1.87 EUR
25+1.69 EUR
100+1.5 EUR
250+1.42 EUR
500+1.36 EUR
1000+1.31 EUR
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PMV62XN215 PMV62XN215 NXP USA Inc. Description: SMALL SIGNAL FET
Packaging: Bulk
auf Bestellung 9000 Stücke:
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S912ZVC96F0MLF S912ZVC96F0MLF NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
DigiKey Programmable: Not Verified
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96F0MLFR S912ZVC96F0MLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-K22F-AGMP03 FRDM-K22F-AGMP03 NXP USA Inc. UM11588.pdf Description: EVAL BOARD FXLS896XAF
Packaging: Bulk
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXLS8962AF, FXAS21002C, MAG3110, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g, 20 to 110 kPa
Part Status: Active
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MCF54455VR266 MCF54455VR266 NXP USA Inc. MCF54455.pdf Description: RISC MICROPROCESSOR, 32-BIT, 266
Produkt ist nicht verfügbar
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PMEG4005ESF315 PMEG4005ESF315 NXP USA Inc. PMEG4005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN0603-2
Current - Average Rectified (Io): 500mA
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 1.28 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Part Status: Active
Packaging: Bulk
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LS2088ASN7QQB NXP USA Inc. Description: LS2088A ST 1600 R1.1
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LS2088AXN711B NXP USA Inc. Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
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LS2088AXE711B NXP USA Inc. Description: LS2088A XT WE 2100 R1.1
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PMV50XP215 PMV50XP215 NXP USA Inc. PMV50XP.pdf Description: P-CHANNEL MOSFET
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MMRF2010NR1 MMRF2010NR1 NXP USA Inc. MMRF2010N.pdf Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
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MMRF2010GNR1 MMRF2010GNR1 NXP USA Inc. MMRF2010N.pdf Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
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MMRF2010GNR1 MMRF2010GNR1 NXP USA Inc. MMRF2010N.pdf Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
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LPC2468FET208K LPC2468FET208K NXP USA Inc. LPC2468.pdf Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Number of I/O: 160
DigiKey Programmable: Not Verified
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100+42.22 EUR
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PCA9615DPZ PCA9615DPZ NXP USA Inc. PCA9615.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
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74LVC1G11GF/S505125 74LVC1G11GF/S505125 NXP USA Inc. PHGLS25111-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND
Packaging: Bulk
Part Status: Active
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74LVC1G11GXZ 74LVC1G11GXZ NXP USA Inc. 74LVC1G11.pdf Description: IC SNGL 3-INP
Part Status: Active
Packaging: Bulk
Current - Quiescent (Max): 4 µA
Number of Circuits: 1
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Input Logic Level - Low: 0.7V ~ 0.8V
Input Logic Level - High: 1.7V ~ 2V
Number of Inputs: 3
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Supplier Device Package: 6-X2SON (1.0x0.8)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
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74LVC1G11GF/S500,132 74LVC1G11GF/S500,132 NXP USA Inc. PHGLS25111-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC1G11GF - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G11GF/S500132 NXP USA Inc. PHGLS25111-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC1G11GF - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10/Z TJA1028TK/5V0/10/Z NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 10.4kBaud
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
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TJA1028TK/5V0/10/Z TJA1028TK/5V0/10/Z NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 10.4kBaud
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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10+2.28 EUR
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1000+1.65 EUR
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TJA1028T3V31011 NXP USA Inc. Description: LIN TRANSCEIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T5V02011 NXP USA Inc. TJA1028.pdf Description: LIN TRANSCEIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/5V0/2011 NXP USA Inc. PHGLS25235-1.pdf?t.download=true&u=5oefqw Description: LIN TRANSCEIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20AZ TJA1028TK/5V0/20AZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 1/1
Qualification: AEC-Q100
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
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TJA1028TK/5V0/20AZ TJA1028TK/5V0/20AZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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10+2.28 EUR
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500+1.67 EUR
1000+1.65 EUR
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TJA1028T/5V0/20/1118 TJA1028T/5V0/20/1118 NXP USA Inc. Description: LIN TRANSCEIVER WITH INTEGRATED
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1028T/5V0/20112 NXP USA Inc. Description: LIN TRANSCEIVER WITH INTEGRATED
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10118 NXP USA Inc. TJA1028.pdf Description: LIN TRANSCEIVER WITH INTEGRATED
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1028T/3V3/20/1118 NXP USA Inc. TJA1028.pdf Description: LIN TRANSCEIVER WITH INTEGRATED
Packaging: Bulk
DigiKey Programmable: Not Verified
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20115 NXP USA Inc. TJA1028.pdf Description: LIN TRANSCEIVER WITH INTEGRATED
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT106SCVL5B MIMXRT106SCVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Active
Supplier Device Package: 196-MAPBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
DigiKey Programmable: Not Verified
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10+22.87 EUR
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240+18.96 EUR
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AFT18H357-24SR6 AFT18H357-24SR6 NXP USA Inc. AFT18H357-24S.pdf Description: RF POWER FIELD-EFFECT TRANSISTOR
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SPC5606BK0CLQ4 MPC5606B.pdf
SPC5606BK0CLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0CLQ6 MPC5606B.pdf
SPC5606BK0CLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0VLQ4 MPC5606B.pdf
SPC5606BK0VLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLL6R MPC5606B.pdf
SPC5606BK0VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BF1VLQ6 MPC560XBFAMFS.pdf
SPC5606BF1VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0CLU4 MPC5606B.pdf
SPC5606BK0CLU4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Core Processor: e200z0h
Produkt ist nicht verfügbar
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SPC5606BF1VLQ6R MPC560XBFAMFS.pdf
SPC5606BF1VLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BK0CLU6 MPC5606B.pdf
SPC5606BK0CLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
Produkt ist nicht verfügbar
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SPC5606BK0VLU4 MPC5606B.pdf
SPC5606BK0VLU4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLU6 MPC5606B.pdf
SPC5606BK0VLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLU6R MPC5606B.pdf
SPC5606BK0VLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0MLU6R MPC5606B.pdf
SPC5606BK0MLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606SF2CLU6R MPC5606S.pdf
SPC5606SF2CLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606EF2VMC
SPC5606EF2VMC
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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SPC5606EF2VMCR
SPC5606EF2VMCR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606EEF2VMC
SPC5606EEF2VMC
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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SPC5606EEF2VMCR
SPC5606EEF2VMCR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS2084ASE7TTB,557
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE MULTI-CORE COMM
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XET256MAG MC9S12XEP100RMV1.pdf
MC9S12XET256MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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ADC1412D125HN/C1,5 PHGLS22903-1.pdf?t.download=true&u=5oefqw
ADC1412D125HN/C1,5
Hersteller: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 64HVQFN
Features: Simultaneous Sampling
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-VFQFPN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
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7+86.61 EUR
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KITPF5024FRDMEVM KITPF5024FRDMEVM.pdf
KITPF5024FRDMEVM
Hersteller: NXP USA Inc.
Description: KITPF5024FRDMEVM
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF5024
Supplied Contents: Board(s)
Embedded: No
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MCIMX537CVV8C2
MCIMX537CVV8C2
Hersteller: NXP USA Inc.
Description: I.MX53 32-BIT MPU ARM CORTEX-A8
Produkt ist nicht verfügbar
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MCIMX537CVV8C2R2
MCIMX537CVV8C2R2
Hersteller: NXP USA Inc.
Description: I.MX53 32-BIT MPU ARM CORTEX-A8
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100,125 74LVC1G11_Q100.pdf
74LVC1G11GW-Q100,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GW - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100125 74LVC1G11_Q100.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GW-Q100 -
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363A.pdf
PCF85363ATT1/AZ
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363A.pdf
PCF85363ATT1/AZ
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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9+2.57 EUR
12+1.87 EUR
25+1.69 EUR
100+1.5 EUR
250+1.42 EUR
500+1.36 EUR
1000+1.31 EUR
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PMV62XN215
PMV62XN215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
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6662+0.095 EUR
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S912ZVC96F0MLF S12ZVCFS.pdf
S912ZVC96F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
DigiKey Programmable: Not Verified
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96F0MLFR S12ZVCFS.pdf
S912ZVC96F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-K22F-AGMP03 UM11588.pdf
FRDM-K22F-AGMP03
Hersteller: NXP USA Inc.
Description: EVAL BOARD FXLS896XAF
Packaging: Bulk
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXLS8962AF, FXAS21002C, MAG3110, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g, 20 to 110 kPa
Part Status: Active
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1+311.77 EUR
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MCF54455VR266 MCF54455.pdf
MCF54455VR266
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32-BIT, 266
Produkt ist nicht verfügbar
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PMEG4005ESF315 PMEG4005ESF.pdf
PMEG4005ESF315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN0603-2
Current - Average Rectified (Io): 500mA
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 1.28 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Part Status: Active
Packaging: Bulk
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7969+0.08 EUR
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LS2088ASN7QQB
Hersteller: NXP USA Inc.
Description: LS2088A ST 1600 R1.1
Produkt ist nicht verfügbar
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LS2088AXN711B
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Produkt ist nicht verfügbar
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LS2088AXE711B
Hersteller: NXP USA Inc.
Description: LS2088A XT WE 2100 R1.1
Produkt ist nicht verfügbar
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PMV50XP215 PMV50XP.pdf
PMV50XP215
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
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MMRF2010NR1 MMRF2010N.pdf
MMRF2010NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
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1+818.86 EUR
10+710.92 EUR
25+683.98 EUR
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MMRF2010GNR1 MMRF2010N.pdf
MMRF2010GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
Produkt ist nicht verfügbar
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MMRF2010GNR1 MMRF2010N.pdf
MMRF2010GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
Produkt ist nicht verfügbar
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LPC2468FET208K LPC2468.pdf
LPC2468FET208K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Number of I/O: 160
DigiKey Programmable: Not Verified
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1+59.55 EUR
10+48.17 EUR
50+43.63 EUR
100+42.22 EUR
126+41.8 EUR
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PCA9615DPZ PCA9615.pdf
PCA9615DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
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74LVC1G11GF/S505125 PHGLS25111-1.pdf?t.download=true&u=5oefqw
74LVC1G11GF/S505125
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Part Status: Active
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720+0.83 EUR
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74LVC1G11GXZ 74LVC1G11.pdf
74LVC1G11GXZ
Hersteller: NXP USA Inc.
Description: IC SNGL 3-INP
Part Status: Active
Packaging: Bulk
Current - Quiescent (Max): 4 µA
Number of Circuits: 1
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Input Logic Level - Low: 0.7V ~ 0.8V
Input Logic Level - High: 1.7V ~ 2V
Number of Inputs: 3
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Supplier Device Package: 6-X2SON (1.0x0.8)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
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AnzahlPrivatkunde
1950+0.27 EUR
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74LVC1G11GF/S500,132 PHGLS25111-1.pdf?t.download=true&u=5oefqw
74LVC1G11GF/S500,132
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GF - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G11GF/S500132 PHGLS25111-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GF - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10/Z TJA1028.pdf
TJA1028TK/5V0/10/Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 10.4kBaud
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+1.55 EUR
12000+1.51 EUR
Mindestbestellmenge: 6000 Stücke
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TJA1028TK/5V0/10/Z TJA1028.pdf
TJA1028TK/5V0/10/Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 10.4kBaud
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 23421 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.12 EUR
10+2.28 EUR
25+2.07 EUR
100+1.84 EUR
250+1.74 EUR
500+1.67 EUR
1000+1.65 EUR
Mindestbestellmenge: 7 Stücke
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TJA1028T3V31011
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T5V02011 TJA1028.pdf
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/5V0/2011 PHGLS25235-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20AZ TJA1028.pdf
TJA1028TK/5V0/20AZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 1/1
Qualification: AEC-Q100
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+1.55 EUR
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
TJA1028TK/5V0/20AZ TJA1028.pdf
TJA1028TK/5V0/20AZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 7088 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.12 EUR
10+2.28 EUR
25+2.07 EUR
100+1.84 EUR
250+1.74 EUR
500+1.67 EUR
1000+1.65 EUR
Mindestbestellmenge: 7 Stücke
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TJA1028T/5V0/20/1118
TJA1028T/5V0/20/1118
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER WITH INTEGRATED
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1028T/5V0/20112
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER WITH INTEGRATED
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10118 TJA1028.pdf
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER WITH INTEGRATED
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1028T/3V3/20/1118 TJA1028.pdf
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER WITH INTEGRATED
Packaging: Bulk
DigiKey Programmable: Not Verified
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20115 TJA1028.pdf
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER WITH INTEGRATED
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT106SCVL5B IMXRT1060IEC.pdf
MIMXRT106SCVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Active
Supplier Device Package: 196-MAPBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
DigiKey Programmable: Not Verified
auf Bestellung 457 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+28.91 EUR
10+22.87 EUR
25+21.37 EUR
240+18.96 EUR
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AFT18H357-24SR6 AFT18H357-24S.pdf
AFT18H357-24SR6
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 4 Stücke
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