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PCA9615DPZ PCA9615DPZ NXP USA Inc. PCA9615.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
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MC33FS6513CAER2 MC33FS6513CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
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PESD3V3S2UQ/S911,115 PESD3V3S2UQ/S911,115 NXP USA Inc. PIRSS12888-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA, TRANS VOLTAGE SUPP
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9622DR/S911118 PCA9622DR/S911118 NXP USA Inc. PCA9622.pdf Description: IC LED DVR LINEAR 100MA 32TSSOP
Packaging: Bulk
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 32-TSSOP
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PDZ12B/S911115 PDZ12B/S911115 NXP USA Inc. PHGLS19616-1.pdf?t.download=true&u=5oefqw Description: PDZ12B - VOLTAGE REGULATOR DIODE
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PSMN1R9-25YLC,115 PSMN1R9-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
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MKV46F256VLL16Q MKV46F256VLL16Q NXP USA Inc. KV4XP100M168.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
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MKV46F256VLL16P MKV46F256VLL16P NXP USA Inc. KINETISKV4X.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
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IP3337CX18/LF/P135 NXP USA Inc. IP3337CX18.pdf Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
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BUK7628-100A,118 BUK7628-100A,118 NXP USA Inc. BUK7628-100A.pdf Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
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N74F38D,602 N74F38D,602 NXP USA Inc. DS_568_74F38.pdf Description: IC GATE NAND 4CH 2-INP 14SO
Features: Open Collector
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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N74F38D-Q100118 N74F38D-Q100118 NXP USA Inc. PHGLS29162-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, F/FAST SERIES, TTL
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BY229-600,127 BY229-600,127 NXP USA Inc. BY229_SERIES.pdf Description: DIODE STANDARD 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
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BY229X-200,127 BY229X-200,127 NXP USA Inc. BY229%28F%2CX%29.pdf Description: DIODE STANDARD 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
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BY229X-600,127 BY229X-600,127 NXP USA Inc. BY229%28F%2CX%29.pdf Description: DIODE STANDARD 500V 8A TO220FP
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
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BY229X-800,127 BY229X-800,127 NXP USA Inc. BY229%28F%2CX%29.pdf Description: DIODE STANDARD 600V 8A TO220FP
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
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BUK9107-55ATE,118 NXP USA Inc. PHGLS18440-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
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BUK7614-55A,118 BUK7614-55A,118 NXP USA Inc. BUK%2875%2C76%2914-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55A,118 BUK7614-55A,118 NXP USA Inc. BUK%2875%2C76%2914-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55,118 BUK7614-55,118 NXP USA Inc. BUK7614-55.pdf Description: MOSFET N-CH 55V 68A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 142W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
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74HC165BQ115 NXP USA Inc. 74HC_HCT165.pdf Description: NOW NEXPERIA 74HC165BQ-Q100 - PA
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Active
Number of Bits per Element: 8
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SPC5606BK0MLL6R,528 NXP USA Inc. Description: POWERPC CORE ARCHITECTURE MPU
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SPC5606BK0CLL6 SPC5606BK0CLL6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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SPC5606BK0VLL4 SPC5606BK0VLL4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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SPC5606BK0CLQ4 SPC5606BK0CLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5606BK0CLQ6 SPC5606BK0CLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5606BK0VLQ4 SPC5606BK0VLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0VLL6R SPC5606BK0VLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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SPC5606BF1VLQ6 SPC5606BF1VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5606BK0CLU4 SPC5606BK0CLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Core Processor: e200z0h
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SPC5606BF1VLQ6R SPC5606BF1VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SPC5606BK0CLU6 SPC5606BK0CLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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SPC5606BK0VLU4 SPC5606BK0VLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLU6 SPC5606BK0VLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLU6R SPC5606BK0VLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0MLU6R SPC5606BK0MLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606SF2CLU6R SPC5606SF2CLU6R NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
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SPC5606EF2VMC SPC5606EF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EF2VMCR SPC5606EF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606EEF2VMC SPC5606EEF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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SPC5606EEF2VMCR SPC5606EEF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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LS2084ASE7TTB,557 NXP USA Inc. Description: QORIQ LAYERSCAPE MULTI-CORE COMM
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XET256MAG MC9S12XET256MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 27 Stücke
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ADC1412D125HN/C1,5 ADC1412D125HN/C1,5 NXP USA Inc. PHGLS22903-1.pdf?t.download=true&u=5oefqw Description: IC ADC 14BIT PIPELINED 64HVQFN
Features: Simultaneous Sampling
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-VFQFPN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
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KITPF5024FRDMEVM KITPF5024FRDMEVM NXP USA Inc. KITPF5024FRDMEVM.pdf Description: KITPF5024FRDMEVM
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF5024
Supplied Contents: Board(s)
Embedded: No
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MCIMX537CVV8C2 MCIMX537CVV8C2 NXP USA Inc. Description: I.MX53 32-BIT MPU ARM CORTEX-A8
Produkt ist nicht verfügbar
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MCIMX537CVV8C2R2 MCIMX537CVV8C2R2 NXP USA Inc. Description: I.MX53 32-BIT MPU ARM CORTEX-A8
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100,125 74LVC1G11GW-Q100,125 NXP USA Inc. 74LVC1G11_Q100.pdf Description: NOW NEXPERIA 74LVC1G11GW - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100125 NXP USA Inc. 74LVC1G11_Q100.pdf Description: NOW NEXPERIA 74LVC1G11GW-Q100 -
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363ATT1/AZ NXP USA Inc. PCF85363A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363ATT1/AZ NXP USA Inc. PCF85363A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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9+2.57 EUR
12+1.87 EUR
25+1.69 EUR
100+1.5 EUR
250+1.42 EUR
500+1.36 EUR
1000+1.31 EUR
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PMV62XN215 PMV62XN215 NXP USA Inc. Description: SMALL SIGNAL FET
Packaging: Bulk
auf Bestellung 9000 Stücke:
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S912ZVC96F0MLF S912ZVC96F0MLF NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
DigiKey Programmable: Not Verified
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96F0MLFR S912ZVC96F0MLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-K22F-AGMP03 FRDM-K22F-AGMP03 NXP USA Inc. UM11588.pdf Description: EVAL BOARD FXLS896XAF
Packaging: Bulk
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXLS8962AF, FXAS21002C, MAG3110, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g, 20 to 110 kPa
Part Status: Active
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MCF54455VR266 MCF54455VR266 NXP USA Inc. MCF54455.pdf Description: RISC MICROPROCESSOR, 32-BIT, 266
Produkt ist nicht verfügbar
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PMEG4005ESF315 PMEG4005ESF315 NXP USA Inc. PMEG4005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN0603-2
Current - Average Rectified (Io): 500mA
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 1.28 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Part Status: Active
Packaging: Bulk
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LS2088ASN7QQB NXP USA Inc. Description: LS2088A ST 1600 R1.1
Produkt ist nicht verfügbar
 Mindestbestellmenge: 21 Stücke
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LS2088AXN711B NXP USA Inc. Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Produkt ist nicht verfügbar
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LS2088AXE711B NXP USA Inc. Description: LS2088A XT WE 2100 R1.1
Produkt ist nicht verfügbar
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PCA9615DPZ PCA9615.pdf
PCA9615DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
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AnzahlPrivatkunde
2500+3.99 EUR
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MC33FS6513CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6513CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Produkt ist nicht verfügbar
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PESD3V3S2UQ/S911,115 PIRSS12888-1.pdf?t.download=true&u=5oefqw
PESD3V3S2UQ/S911,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA, TRANS VOLTAGE SUPP
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9622DR/S911118 PCA9622.pdf
PCA9622DR/S911118
Hersteller: NXP USA Inc.
Description: IC LED DVR LINEAR 100MA 32TSSOP
Packaging: Bulk
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 32-TSSOP
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PDZ12B/S911115 PHGLS19616-1.pdf?t.download=true&u=5oefqw
PDZ12B/S911115
Hersteller: NXP USA Inc.
Description: PDZ12B - VOLTAGE REGULATOR DIODE
Produkt ist nicht verfügbar
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PSMN1R9-25YLC,115
PSMN1R9-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
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MKV46F256VLL16Q KV4XP100M168.pdf
MKV46F256VLL16Q
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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MKV46F256VLL16P KINETISKV4X.pdf
MKV46F256VLL16P
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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IP3337CX18/LF/P135 IP3337CX18.pdf
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
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AnzahlPrivatkunde
875+0.67 EUR
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BUK7628-100A,118 BUK7628-100A.pdf
BUK7628-100A,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
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480+1.21 EUR
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N74F38D,602 DS_568_74F38.pdf
N74F38D,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Features: Open Collector
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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2420+0.24 EUR
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N74F38D-Q100118 PHGLS29162-1.pdf?t.download=true&u=5oefqw
N74F38D-Q100118
Hersteller: NXP USA Inc.
Description: NAND GATE, F/FAST SERIES, TTL
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
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BY229-600,127 BY229_SERIES.pdf
BY229-600,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
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BY229X-200,127 BY229%28F%2CX%29.pdf
BY229X-200,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
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BY229X-600,127 BY229%28F%2CX%29.pdf
BY229X-600,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 500V 8A TO220FP
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
Produkt ist nicht verfügbar
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BY229X-800,127 BY229%28F%2CX%29.pdf
BY229X-800,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 600V 8A TO220FP
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
Produkt ist nicht verfügbar
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BUK9107-55ATE,118 PHGLS18440-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
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BUK7614-55A,118 BUK%2875%2C76%2914-55A.pdf
BUK7614-55A,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55A,118 BUK%2875%2C76%2914-55A.pdf
BUK7614-55A,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BUK7614-55,118 BUK7614-55.pdf
BUK7614-55,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 68A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 142W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
Produkt ist nicht verfügbar
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74HC165BQ115 74HC_HCT165.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC165BQ-Q100 - PA
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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SPC5606BK0MLL6R,528
Hersteller: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
Produkt ist nicht verfügbar
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SPC5606BK0CLL6 MPC5606B.pdf
SPC5606BK0CLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0VLL4 MPC5606B.pdf
SPC5606BK0VLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0CLQ4 MPC5606B.pdf
SPC5606BK0CLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0CLQ6 MPC5606B.pdf
SPC5606BK0CLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0VLQ4 MPC5606B.pdf
SPC5606BK0VLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLL6R MPC5606B.pdf
SPC5606BK0VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BF1VLQ6 MPC560XBFAMFS.pdf
SPC5606BF1VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606BK0CLU4 MPC5606B.pdf
SPC5606BK0CLU4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Core Processor: e200z0h
Produkt ist nicht verfügbar
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SPC5606BF1VLQ6R MPC560XBFAMFS.pdf
SPC5606BF1VLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BK0CLU6 MPC5606B.pdf
SPC5606BK0CLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
Produkt ist nicht verfügbar
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SPC5606BK0VLU4 MPC5606B.pdf
SPC5606BK0VLU4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLU6 MPC5606B.pdf
SPC5606BK0VLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0VLU6R MPC5606B.pdf
SPC5606BK0VLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0MLU6R MPC5606B.pdf
SPC5606BK0MLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606SF2CLU6R MPC5606S.pdf
SPC5606SF2CLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606EF2VMC
SPC5606EF2VMC
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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SPC5606EF2VMCR
SPC5606EF2VMCR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606EEF2VMC
SPC5606EEF2VMC
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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SPC5606EEF2VMCR
SPC5606EEF2VMCR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS2084ASE7TTB,557
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE MULTI-CORE COMM
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XET256MAG MC9S12XEP100RMV1.pdf
MC9S12XET256MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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ADC1412D125HN/C1,5 PHGLS22903-1.pdf?t.download=true&u=5oefqw
ADC1412D125HN/C1,5
Hersteller: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 64HVQFN
Features: Simultaneous Sampling
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-VFQFPN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
auf Bestellung 42 Stücke:
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AnzahlPrivatkunde
7+86.61 EUR
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KITPF5024FRDMEVM KITPF5024FRDMEVM.pdf
KITPF5024FRDMEVM
Hersteller: NXP USA Inc.
Description: KITPF5024FRDMEVM
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF5024
Supplied Contents: Board(s)
Embedded: No
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1+348.85 EUR
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MCIMX537CVV8C2
MCIMX537CVV8C2
Hersteller: NXP USA Inc.
Description: I.MX53 32-BIT MPU ARM CORTEX-A8
Produkt ist nicht verfügbar
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MCIMX537CVV8C2R2
MCIMX537CVV8C2R2
Hersteller: NXP USA Inc.
Description: I.MX53 32-BIT MPU ARM CORTEX-A8
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100,125 74LVC1G11_Q100.pdf
74LVC1G11GW-Q100,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GW - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G11GW-Q100125 74LVC1G11_Q100.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GW-Q100 -
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363A.pdf
PCF85363ATT1/AZ
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCF85363ATT1/AZ PCF85363A.pdf
PCF85363ATT1/AZ
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2390 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.57 EUR
12+1.87 EUR
25+1.69 EUR
100+1.5 EUR
250+1.42 EUR
500+1.36 EUR
1000+1.31 EUR
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PMV62XN215
PMV62XN215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
auf Bestellung 9000 Stücke:
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AnzahlPrivatkunde
6662+0.095 EUR
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S912ZVC96F0MLF S12ZVCFS.pdf
S912ZVC96F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
DigiKey Programmable: Not Verified
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96F0MLFR S12ZVCFS.pdf
S912ZVC96F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-K22F-AGMP03 UM11588.pdf
FRDM-K22F-AGMP03
Hersteller: NXP USA Inc.
Description: EVAL BOARD FXLS896XAF
Packaging: Bulk
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXLS8962AF, FXAS21002C, MAG3110, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g, 20 to 110 kPa
Part Status: Active
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AnzahlPrivatkunde
1+318.43 EUR
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MCF54455VR266 MCF54455.pdf
MCF54455VR266
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32-BIT, 266
Produkt ist nicht verfügbar
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PMEG4005ESF315 PMEG4005ESF.pdf
PMEG4005ESF315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN0603-2
Current - Average Rectified (Io): 500mA
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 1.28 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Part Status: Active
Packaging: Bulk
auf Bestellung 270000 Stücke:
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AnzahlPrivatkunde
7969+0.08 EUR
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LS2088ASN7QQB
Hersteller: NXP USA Inc.
Description: LS2088A ST 1600 R1.1
Produkt ist nicht verfügbar
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LS2088AXN711B
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Produkt ist nicht verfügbar
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LS2088AXE711B
Hersteller: NXP USA Inc.
Description: LS2088A XT WE 2100 R1.1
Produkt ist nicht verfügbar
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