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BUK954R4-40B127 BUK954R4-40B127 NXP USA Inc. BUK954R4-40B.pdf Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 64 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 7124 pF @ 25 V
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
417+1.2 EUR
Mindestbestellmenge: 417
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BUK953R5-60E,127 BUK953R5-60E,127 NXP USA Inc. PHGL-S-A0001060188-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 60V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Ta)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Ta)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 95 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 13490 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 2400 Stücke:
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333+1.5 EUR
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BUK952R8-60E,127 BUK952R8-60E,127 NXP USA Inc. BUK952R8-60E.pdf Description: MOSFET N-CH 60V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 17450 pF @ 25 V
auf Bestellung 411 Stücke:
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231+2.14 EUR
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BUK95180-100A,127 BUK95180-100A,127 NXP USA Inc. BUK95180-100A.pdf Description: MOSFET N-CH 100V 11A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 54W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1000 Stücke:
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1000+0.51 EUR
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BUK9523-75A,127 BUK9523-75A,127 NXP USA Inc. BUK9523-75A.pdf Description: MOSFET N-CH 75V 53A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 53A (Tc)
Rds On (Max) @ Id, Vgs: 22mOhm @ 25A, 10V
Power Dissipation (Max): 138W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 75 V
Input Capacitance (Ciss) (Max) @ Vds: 3120 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 5307 Stücke:
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579+0.84 EUR
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BUK9510-55A,127 BUK9510-55A,127 NXP USA Inc. BUK9510-55A.pdf Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 68 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 4307 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
452+1.11 EUR
Mindestbestellmenge: 452
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BUK954R8-60E,127 BUK954R8-60E,127 NXP USA Inc. BUK954R8-60E.pdf Description: MOSFET N-CH 60V 100A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 65 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 9710 pF @ 25 V
Produkt ist nicht verfügbar
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BUK9505-30A,127 BUK9505-30A,127 NXP USA Inc. Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 25A, 10V
Power Dissipation (Max): 230W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V
auf Bestellung 4000 Stücke:
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273+1.8 EUR
Mindestbestellmenge: 273
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BUK9516-75B,127 BUK9516-75B,127 NXP USA Inc. BUK9516-75B.pdf Description: MOSFET N-CH 75V 67A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 67A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 4034 pF @ 25 V
auf Bestellung 684 Stücke:
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684+0.95 EUR
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74LVCH16245ABQ,518 74LVCH16245ABQ,518 NXP USA Inc. 74LVC_LVCH16245A_Rev09.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Bulk
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 60-HUQFNU (4x6)
Part Status: Obsolete
auf Bestellung 10000 Stücke:
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485+1.01 EUR
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BUK7908-40AIE127 NXP USA Inc. BUK7908-40AIE.pdf Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 50A, 10V
FET Feature: Current Sensing
Power Dissipation (Max): 221W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220-5
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 84 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3140 pF @ 25 V
auf Bestellung 1998 Stücke:
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307+1.72 EUR
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S912ZVHY32F1CLL557 S912ZVHY32F1CLL557 NXP USA Inc. FSCLS11435-1.pdf?t.download=true&u=5oefqw Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Produkt ist nicht verfügbar
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ON5258215 ON5258215 NXP USA Inc. Description: NOW NEXPERIA ON5258 - RF MOSFET
auf Bestellung 696000 Stücke:
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1374+0.35 EUR
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HEF4024BP,652 HEF4024BP,652 NXP USA Inc. HEF4024B.pdf Description: IC BINARY COUNTER 7-BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 85°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DIP
Part Status: Obsolete
Voltage - Supply: 4.5 V ~ 15.5 V
Count Rate: 35 MHz
Number of Bits per Element: 7
auf Bestellung 9386 Stücke:
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720+0.71 EUR
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HEF40244BT652 HEF40244BT652 NXP USA Inc. HEF40244B.pdf Description: NOW NEXPERIA HEF40244BT - BUS DR
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32CFAE-NXP MC908AP32CFAE-NXP NXP USA Inc. FSCLS03875-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA85276ATT/AJ PCA85276ATT/AJ NXP USA Inc. PCA85276.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 6 µA
auf Bestellung 61 Stücke:
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6+3.29 EUR
10+2.43 EUR
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PCA8561AHN/A518 NXP USA Inc. PHGL-S-A0000724239-1.pdf?t.download=true&u=5oefqw Description: AUTOMOTIVE 18 X 4 LCD SEGMENT DR
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PCA8565TS/1 PCA8565TS/1 NXP USA Inc. PHGL-S-A0000135279-1.pdf?t.download=true&u=5oefqw Description: IC RTC CLK/CALENDAR I2C 8-TSSOP
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CBT3306PW/S400118 NXP USA Inc. CBT3306.pdf Description: BUS DRIVER, CBT SERIES
auf Bestellung 124665 Stücke:
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2623+0.18 EUR
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CBT3306D-Q100J CBT3306D-Q100J NXP USA Inc. NEXP-S-A0002882796-1.pdf?t.download=true&u=5oefqw Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SOIC
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2294+0.24 EUR
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SL2S6002FUD/BGZ NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
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BAS116QA147 BAS116QA147 NXP USA Inc. BAS116QA.pdf Description: NOW NEXPERIA BAS116QA - RECTIFIE
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: -55°C ~ 150°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Qualification: AEC-Q101
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NX3L4051HR-Q100115 NX3L4051HR-Q100115 NXP USA Inc. PHGLS25483-1.pdf?t.download=true&u=5oefqw Description: DIFFERENTIAL MULTIPLEXER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NX3L4051HR-Q100X NX3L4051HR-Q100X NXP USA Inc. NX3L4051-Q100.pdf Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NX3L4051HRZ NX3L4051HRZ NXP USA Inc. NX3L4051.pdf Description: IC MUX 8:1 900MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PESD5V0G1BL315 PESD5V0G1BL315 NXP USA Inc. PESD5V0G1BL.pdf Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7E2R7-30B,127 BUK7E2R7-30B,127 NXP USA Inc. BUK7E2R7-30B.pdf Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
auf Bestellung 973 Stücke:
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201+2.46 EUR
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74ABT657D,623 74ABT657D,623 NXP USA Inc. 74ABT657.pdf Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 800 Stücke:
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452+1.11 EUR
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MPC561MZP56R2518 MPC561MZP56R2518 NXP USA Inc. FSCLS06750-1.pdf?t.download=true&u=5oefqw Description: RISC MICROPROCESSOR, 32 BIT, POW
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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KMZ49/AJ KMZ49/AJ NXP USA Inc. KMZ49.pdf Description: SENSOR ANGLE 45DEG 8SOIC SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 180°C
Termination Style: Gull Wing
Voltage - Supply: 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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NCR401U115 NCR401U115 NXP USA Inc. NCR401U.pdf Description: LED DRIVER, 1-SEGMENT
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NCR401T215 NCR401T215 NXP USA Inc. NCR401T.pdf Description: NCR401T LED DRIVER, TO-236AB
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PMCM4401VPE084 PMCM4401VPE084 NXP USA Inc. PMCM4401VPE.pdf Description: PMCM4401 SMALL SIGNAL FET
auf Bestellung 279000 Stücke:
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BUK664R8-75C,118 BUK664R8-75C,118 NXP USA Inc. PHGLS21700-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 75V 120A D2PAK
auf Bestellung 4672 Stücke:
Lieferzeit 10-14 Tag (e)
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MF1SPLUS1031DA4/0J NXP USA Inc. Description: MF1SPLUS1031DA4/0J
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1SPLUS1031DA8/0J NXP USA Inc. Description: MF1SPLUS1031DA8/0J
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1SPLUS1031DUD/0V NXP USA Inc. Description: MF1SPLUS1031DUD/0V
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G132GF132 74AUP1G132GF132 NXP USA Inc. 74AUP1G132.pdf Description: IC GATE NAND 1CH 2IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 139950 Stücke:
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2533+0.21 EUR
Mindestbestellmenge: 2533
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TDA8350Q/N6,112 TDA8350Q/N6,112 NXP USA Inc. TDA8350Q.pdf Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFSC5G35D35T2 AFSC5G35D35T2 NXP USA Inc. AFSC5G35D35.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
auf Bestellung 1451 Stücke:
Lieferzeit 10-14 Tag (e)
1+67 EUR
10+54.63 EUR
25+51.53 EUR
100+48.14 EUR
250+46.52 EUR
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NTS0302JKZ NTS0302JKZ NXP USA Inc. NTS0302.pdf Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
auf Bestellung 4304 Stücke:
Lieferzeit 10-14 Tag (e)
16+1.13 EUR
23+0.79 EUR
25+0.71 EUR
100+0.62 EUR
250+0.58 EUR
500+0.56 EUR
1000+0.55 EUR
Mindestbestellmenge: 16
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BC517,112 BC517,112 NXP USA Inc. DS_568_BC517.pdf Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Produkt ist nicht verfügbar
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TDA1308TT/N2,118 TDA1308TT/N2,118 NXP USA Inc. TDA1308.pdf Description: IC AMP CLASS AB STER 80MW 8TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308TT/N2,118 TDA1308TT/N2,118 NXP USA Inc. TDA1308.pdf Description: IC AMP CLASS AB STER 80MW 8TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AUK,027 TDA1308AUK,027 NXP USA Inc. TDA1308.pdf Description: IC AMP CLASS AB STER 80MW 8WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AUK,027 TDA1308AUK,027 NXP USA Inc. TDA1308.pdf Description: IC AMP CLASS AB STER 80MW 8WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308T/N2,115 TDA1308T/N2,115 NXP USA Inc. TDA1308_A.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N2,112 TDA1308T/N2,112 NXP USA Inc. TDA1308.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AT/N2,115 TDA1308AT/N2,115 NXP USA Inc. TDA1308_A.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AT/N2,115 TDA1308AT/N2,115 NXP USA Inc. TDA1308_A.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N2,115 TDA1308T/N2,115 NXP USA Inc. TDA1308_A.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N1,112 TDA1308T/N1,112 NXP USA Inc. TDA1308_A.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AT/N2,112 TDA1308AT/N2,112 NXP USA Inc. TDA1308_A.pdf Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308/N2,112 TDA1308/N2,112 NXP USA Inc. Description: IC AMP CLASS AB STEREO 80MW 8DIP
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMXRT106FDVL6B MIMXRT106FDVL6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.69 EUR
10+16.39 EUR
25+14.78 EUR
80+14.63 EUR
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MIMXRT1061CVL5B MIMXRT1061CVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 614 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.03 EUR
10+13.03 EUR
Mindestbestellmenge: 2
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MIMXRT1061CVJ5B MIMXRT1061CVJ5B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.99 EUR
10+19.75 EUR
25+18.45 EUR
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MIMXRT106SDVL6B MIMXRT106SDVL6B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.83 EUR
10+16.26 EUR
25+14.57 EUR
80+12.93 EUR
240+11.8 EUR
480+11.23 EUR
960+10.96 EUR
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MIMXRT106FCVL5B MIMXRT106FCVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.6 EUR
10+17.95 EUR
25+16.79 EUR
240+16.45 EUR
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BUK954R4-40B127 BUK954R4-40B.pdf
BUK954R4-40B127
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 64 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 7124 pF @ 25 V
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
417+1.2 EUR
Mindestbestellmenge: 417
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BUK953R5-60E,127 PHGL-S-A0001060188-1.pdf?t.download=true&u=5oefqw
BUK953R5-60E,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Ta)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Ta)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 95 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 13490 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
333+1.5 EUR
Mindestbestellmenge: 333
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BUK952R8-60E,127 BUK952R8-60E.pdf
BUK952R8-60E,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 17450 pF @ 25 V
auf Bestellung 411 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
231+2.14 EUR
Mindestbestellmenge: 231
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BUK95180-100A,127 BUK95180-100A.pdf
BUK95180-100A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 11A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 54W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+0.51 EUR
Mindestbestellmenge: 1000
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BUK9523-75A,127 BUK9523-75A.pdf
BUK9523-75A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 53A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 53A (Tc)
Rds On (Max) @ Id, Vgs: 22mOhm @ 25A, 10V
Power Dissipation (Max): 138W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 75 V
Input Capacitance (Ciss) (Max) @ Vds: 3120 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 5307 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
579+0.84 EUR
Mindestbestellmenge: 579
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BUK9510-55A,127 BUK9510-55A.pdf
BUK9510-55A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 68 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 4307 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
452+1.11 EUR
Mindestbestellmenge: 452
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BUK954R8-60E,127 BUK954R8-60E.pdf
BUK954R8-60E,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 100A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 65 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 9710 pF @ 25 V
Produkt ist nicht verfügbar
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BUK9505-30A,127
BUK9505-30A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 25A, 10V
Power Dissipation (Max): 230W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
273+1.8 EUR
Mindestbestellmenge: 273
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BUK9516-75B,127 BUK9516-75B.pdf
BUK9516-75B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 67A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 67A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 4034 pF @ 25 V
auf Bestellung 684 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
684+0.95 EUR
Mindestbestellmenge: 684
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74LVCH16245ABQ,518 74LVC_LVCH16245A_Rev09.pdf
74LVCH16245ABQ,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Bulk
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 60-HUQFNU (4x6)
Part Status: Obsolete
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
485+1.01 EUR
Mindestbestellmenge: 485
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BUK7908-40AIE127 BUK7908-40AIE.pdf
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 50A, 10V
FET Feature: Current Sensing
Power Dissipation (Max): 221W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220-5
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 84 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3140 pF @ 25 V
auf Bestellung 1998 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
307+1.72 EUR
Mindestbestellmenge: 307
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S912ZVHY32F1CLL557 FSCLS11435-1.pdf?t.download=true&u=5oefqw
S912ZVHY32F1CLL557
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Produkt ist nicht verfügbar
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ON5258215
ON5258215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ON5258 - RF MOSFET
auf Bestellung 696000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1374+0.35 EUR
Mindestbestellmenge: 1374
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HEF4024BP,652 HEF4024B.pdf
HEF4024BP,652
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 7-BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 85°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DIP
Part Status: Obsolete
Voltage - Supply: 4.5 V ~ 15.5 V
Count Rate: 35 MHz
Number of Bits per Element: 7
auf Bestellung 9386 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
720+0.71 EUR
Mindestbestellmenge: 720
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HEF40244BT652 HEF40244B.pdf
HEF40244BT652
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA HEF40244BT - BUS DR
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32CFAE-NXP FSCLS03875-1.pdf?t.download=true&u=5oefqw
MC908AP32CFAE-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA85276ATT/AJ PCA85276.pdf
PCA85276ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 6 µA
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.29 EUR
10+2.43 EUR
25+2.21 EUR
Mindestbestellmenge: 6
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PCA8561AHN/A518 PHGL-S-A0000724239-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE 18 X 4 LCD SEGMENT DR
Produkt ist nicht verfügbar
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PCA8565TS/1 PHGL-S-A0000135279-1.pdf?t.download=true&u=5oefqw
PCA8565TS/1
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8-TSSOP
Produkt ist nicht verfügbar
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CBT3306PW/S400118 CBT3306.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
auf Bestellung 124665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2623+0.18 EUR
Mindestbestellmenge: 2623
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CBT3306D-Q100J NEXP-S-A0002882796-1.pdf?t.download=true&u=5oefqw
CBT3306D-Q100J
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SOIC
auf Bestellung 2294 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2294+0.24 EUR
Mindestbestellmenge: 2294
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SL2S6002FUD/BGZ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
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BAS116QA147 BAS116QA.pdf
BAS116QA147
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAS116QA - RECTIFIE
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: -55°C ~ 150°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Qualification: AEC-Q101
auf Bestellung 329700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9746+0.048 EUR
Mindestbestellmenge: 9746
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NX3L4051HR-Q100115 PHGLS25483-1.pdf?t.download=true&u=5oefqw
NX3L4051HR-Q100115
Hersteller: NXP USA Inc.
Description: DIFFERENTIAL MULTIPLEXER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NX3L4051HR-Q100X NX3L4051-Q100.pdf
NX3L4051HR-Q100X
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NX3L4051HRZ NX3L4051.pdf
NX3L4051HRZ
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 900MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PESD5V0G1BL315 PESD5V0G1BL.pdf
PESD5V0G1BL315
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7E2R7-30B,127 BUK7E2R7-30B.pdf
BUK7E2R7-30B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
auf Bestellung 973 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
201+2.46 EUR
Mindestbestellmenge: 201
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74ABT657D,623 74ABT657.pdf
74ABT657D,623
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
452+1.11 EUR
Mindestbestellmenge: 452
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MPC561MZP56R2518 FSCLS06750-1.pdf?t.download=true&u=5oefqw
MPC561MZP56R2518
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, POW
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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KMZ49/AJ KMZ49.pdf
KMZ49/AJ
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 45DEG 8SOIC SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 180°C
Termination Style: Gull Wing
Voltage - Supply: 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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NCR401U115 NCR401U.pdf
NCR401U115
Hersteller: NXP USA Inc.
Description: LED DRIVER, 1-SEGMENT
Produkt ist nicht verfügbar
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NCR401T215 NCR401T.pdf
NCR401T215
Hersteller: NXP USA Inc.
Description: NCR401T LED DRIVER, TO-236AB
Produkt ist nicht verfügbar
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PMCM4401VPE084 PMCM4401VPE.pdf
PMCM4401VPE084
Hersteller: NXP USA Inc.
Description: PMCM4401 SMALL SIGNAL FET
auf Bestellung 279000 Stücke:
Lieferzeit 10-14 Tag (e)
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BUK664R8-75C,118 PHGLS21700-1.pdf?t.download=true&u=5oefqw
BUK664R8-75C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 120A D2PAK
auf Bestellung 4672 Stücke:
Lieferzeit 10-14 Tag (e)
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MF1SPLUS1031DA4/0J
Hersteller: NXP USA Inc.
Description: MF1SPLUS1031DA4/0J
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1SPLUS1031DA8/0J
Hersteller: NXP USA Inc.
Description: MF1SPLUS1031DA8/0J
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1SPLUS1031DUD/0V
Hersteller: NXP USA Inc.
Description: MF1SPLUS1031DUD/0V
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G132GF132 74AUP1G132.pdf
74AUP1G132GF132
Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 2IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 139950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2533+0.21 EUR
Mindestbestellmenge: 2533
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TDA8350Q/N6,112 TDA8350Q.pdf
TDA8350Q/N6,112
Hersteller: NXP USA Inc.
Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFSC5G35D35T2 AFSC5G35D35.pdf
AFSC5G35D35T2
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
auf Bestellung 1451 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+67 EUR
10+54.63 EUR
25+51.53 EUR
100+48.14 EUR
250+46.52 EUR
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NTS0302JKZ NTS0302.pdf
NTS0302JKZ
Hersteller: NXP USA Inc.
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
auf Bestellung 4304 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.13 EUR
23+0.79 EUR
25+0.71 EUR
100+0.62 EUR
250+0.58 EUR
500+0.56 EUR
1000+0.55 EUR
Mindestbestellmenge: 16
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BC517,112 DS_568_BC517.pdf
BC517,112
Hersteller: NXP USA Inc.
Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308TT/N2,118 TDA1308.pdf
TDA1308TT/N2,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308TT/N2,118 TDA1308.pdf
TDA1308TT/N2,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AUK,027 TDA1308.pdf
TDA1308AUK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AUK,027 TDA1308.pdf
TDA1308AUK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N2,115 TDA1308_A.pdf
TDA1308T/N2,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N2,112 TDA1308.pdf
TDA1308T/N2,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AT/N2,115 TDA1308_A.pdf
TDA1308AT/N2,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AT/N2,115 TDA1308_A.pdf
TDA1308AT/N2,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N2,115 TDA1308_A.pdf
TDA1308T/N2,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N1,112 TDA1308_A.pdf
TDA1308T/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308AT/N2,112 TDA1308_A.pdf
TDA1308AT/N2,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308/N2,112
TDA1308/N2,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8DIP
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT106FDVL6B IMXRT1060CEC.pdf
MIMXRT106FDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.69 EUR
10+16.39 EUR
25+14.78 EUR
80+14.63 EUR
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MIMXRT1061CVL5B IMXRT1060IEC.pdf
MIMXRT1061CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 614 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.03 EUR
10+13.03 EUR
Mindestbestellmenge: 2
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MIMXRT1061CVJ5B IMXRT1060CEC.pdf
MIMXRT1061CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.99 EUR
10+19.75 EUR
25+18.45 EUR
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MIMXRT106SDVL6B IMXRT1060IEC.pdf
MIMXRT106SDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.83 EUR
10+16.26 EUR
25+14.57 EUR
80+12.93 EUR
240+11.8 EUR
480+11.23 EUR
960+10.96 EUR
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MIMXRT106FCVL5B IMXRT1060IEC.pdf
MIMXRT106FCVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.6 EUR
10+17.95 EUR
25+16.79 EUR
240+16.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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