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LPC4088FET180 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4088FBD208K LPC4088FBD208K NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.79 EUR
10+22.12 EUR
36+17.33 EUR
108+16.59 EUR
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OM13050UL NXP USA Inc. Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
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74LVT16245BBX,518 NXP USA Inc. PHGLS24309-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Packaging: Bulk
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
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833+0.59 EUR
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74LVT162245BDL,112 74LVT162245BDL,112 NXP USA Inc. 74LVT162245B.pdf Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
auf Bestellung 1414 Stücke:
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494+1.07 EUR
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LPC1817JBD144551 LPC1817JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LD6816CX4/16P,315 LD6816CX4/16P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6816CX4/C14P,315 LD6816CX4/C14P,315 NXP USA Inc. PHGLS25656-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6816CX4/33P,315 LD6816CX4/33P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6816CX4/18P,315 LD6816CX4/18P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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3328+0.15 EUR
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LD6816CX4/25P,315 LD6816CX4/25P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
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3328+0.15 EUR
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BLF6G20S-45112 NXP USA Inc. Description: RF POWER TRANSISTORS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6X1EVK10AC MCIMX6X1EVK10AC NXP USA Inc. IMX6SXCEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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XC540203CZT75A NXP USA Inc. Description: PROCESSOR
auf Bestellung 7091 Stücke:
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XC540203CZT75AR2 NXP USA Inc. Description: INTEGRATED CIRCUIT
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MCIMX6S1AVM10AD MCIMX6S1AVM10AD NXP USA Inc. Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S6AVM10AD MCIMX6S6AVM10AD NXP USA Inc. Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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PBSM5240PFH115 NXP USA Inc. PBSM5240PFH.pdf Description: NOW NEXPERIA PBSM5240PFH SMALL S
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Voltage - Rated: 40V
Package / Case: 6-UDFN Exposed Pad
Current Rating (Amps): 1.8A
Mounting Type: Surface Mount
Transistor Type: PNP, N-Channel
Applications: General Purpose
Supplier Device Package: 6-HUSON (2x2)
auf Bestellung 63000 Stücke:
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2544+0.19 EUR
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74AHC157D112 74AHC157D112 NXP USA Inc. 74AHC_AHCT157.pdf Description: NOW NEXPERIA 74AHC157D - MULTIPL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 2000 Stücke:
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2000+0.24 EUR
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CBT3245ADS,112 CBT3245ADS,112 NXP USA Inc. CBT3245A.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 14604 Stücke:
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1776+0.28 EUR
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CBT3245ADS,118 CBT3245ADS,118 NXP USA Inc. CBT3245A.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 7500 Stücke:
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1776+0.28 EUR
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CBT3245APW-Q100118 CBT3245APW-Q100118 NXP USA Inc. CBT3245A_Q100.pdf Description: BUS DRIVER, CBT SERIES
Packaging: Bulk
auf Bestellung 36196 Stücke:
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1528+0.35 EUR
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TEA1723DT/N1118 TEA1723DT/N1118 NXP USA Inc. TEA1723DT.pdf Description: GREENCHIP SMPS LOW POWER CONTROL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-B2V7/DG/B3215 BZX84-B2V7/DG/B3215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
auf Bestellung 69000 Stücke:
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15000+0.03 EUR
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BZX84-B2V7 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZX84-B2V7 - ZENER
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 350 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Produkt ist nicht verfügbar
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BZX84-B4V7/DG/B3215 BZX84-B4V7/DG/B3215 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
auf Bestellung 30000 Stücke:
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15000+0.03 EUR
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BZX84-B4V7/LF1R BZX84-B4V7/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC9S08PT32AVLH MC9S08PT32AVLH NXP USA Inc. MC9S08PT60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462BT/0Z TJA1462BT/0Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 16 Stücke:
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9+2.16 EUR
12+1.56 EUR
Mindestbestellmenge: 9
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LPC55S06-EVK LPC55S06-EVK NXP USA Inc. LPC55S06-EVK-QSG.pdf Description: EVAL KIT LPC55
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S06
Platform: LPCXpresso™
Part Status: Active
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1+80.38 EUR
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LPC55S04JBD64E LPC55S04JBD64E NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
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3+8.47 EUR
10+6.45 EUR
25+5.94 EUR
Mindestbestellmenge: 3
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LPC5502JHI48QL LPC5502JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 354 Stücke:
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3+6.42 EUR
10+4.84 EUR
25+4.45 EUR
80+4.07 EUR
260+3.80 EUR
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LPC5504JHI48QL LPC5504JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S04JHI48QL LPC55S04JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S06JHI48QL LPC55S06JHI48QL NXP USA Inc. LPC55S0x_LPC550x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07GM/S500115 NXP USA Inc. 74LVC1G07.pdf Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
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74LVC1G07GF/S500132 74LVC1G07GF/S500132 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
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74LVC1G07GF/S505125 74LVC1G07GF/S505125 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
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LPC1763FBD100Y LPC1763FBD100Y NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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80+10.39 EUR
230+9.45 EUR
440+8.99 EUR
1000+8.52 EUR
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LPC1765FET100K LPC1765FET100K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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10+16.15 EUR
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80+14.00 EUR
260+13.23 EUR
520+12.89 EUR
1040+12.61 EUR
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BZV85-C7V5133 BZV85-C7V5133 NXP USA Inc. NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
auf Bestellung 1699 Stücke:
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10+7.14 EUR
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100+5.85 EUR
250+5.55 EUR
500+4.98 EUR
1000+4.20 EUR
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TJA1081TS TJA1081TS NXP USA Inc. PHGLS25769-1.pdf?t.download=true&u=5oefqw Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
auf Bestellung 813 Stücke:
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MCF5213CAF66R MCF5213CAF66R NXP USA Inc. MCF5213EC.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC1837JBD144551 LPC1837JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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PMEG4005AESFC315 PMEG4005AESFC315 NXP USA Inc. PMEG4005AEA.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 162000 Stücke:
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PMEG4002ESFC315 PMEG4002ESFC315 NXP USA Inc. PMEG4002ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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PMEG2005ESFC315 PMEG2005ESFC315 NXP USA Inc. PMEG2005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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PMEG4005ESFC315 PMEG4005ESFC315 NXP USA Inc. PMEG4005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
auf Bestellung 63000 Stücke:
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PMEG4002AESFC315 PMEG4002AESFC315 NXP USA Inc. PMEG4002AESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 45000 Stücke:
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PMEG1201AESFC315 PMEG1201AESFC315 NXP USA Inc. Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 36000 Stücke:
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74CBTLV3245DS,118 74CBTLV3245DS,118 NXP USA Inc. 74CBTLV3245_Rev_Feb2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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IP4281CZ10/2115 NXP USA Inc. IP4281CZ10.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
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SC16C554BIB80,557 SC16C554BIB80,557 NXP USA Inc. SC16C554B_554DB.pdf Description: UART INTERFACE IC 16CB 2.5V-5V 4
Packaging: Bulk
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCR908JK3ECPE MCR908JK3ECPE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
auf Bestellung 6513 Stücke:
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MCR908JL3ECDWER MCR908JL3ECDWER NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MCR908JK1ECDWER NXP USA Inc. MC68HC908Jx%281%2C3%29.pdf Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387FBD100K NXP USA Inc. LPC2387.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 678 Stücke:
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10+25.92 EUR
25+24.30 EUR
100+22.51 EUR
450+21.22 EUR
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OM11013598 OM11013598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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LPC4088FET180 LPC408X_7X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4088FBD208K LPC408X_7X.pdf
LPC4088FBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
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Anzahl Preis
1+27.79 EUR
10+22.12 EUR
36+17.33 EUR
108+16.59 EUR
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OM13050UL
Hersteller: NXP USA Inc.
Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
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74LVT16245BBX,518 PHGLS24309-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Packaging: Bulk
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
auf Bestellung 4475 Stücke:
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74LVT162245BDL,112 74LVT162245B.pdf
74LVT162245BDL,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
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Anzahl Preis
494+1.07 EUR
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LPC1817JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1817JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LD6816CX4/16P,315 LD6816.pdf
LD6816CX4/16P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
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Anzahl Preis
3328+0.15 EUR
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LD6816CX4/C14P,315 PHGLS25656-1.pdf?t.download=true&u=5oefqw
LD6816CX4/C14P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
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LD6816CX4/33P,315 LD6816.pdf
LD6816CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 35999 Stücke:
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Anzahl Preis
3328+0.15 EUR
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LD6816CX4/18P,315 LD6816.pdf
LD6816CX4/18P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
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LD6816CX4/25P,315 LD6816.pdf
LD6816CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
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BLF6G20S-45112
Hersteller: NXP USA Inc.
Description: RF POWER TRANSISTORS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6X1EVK10AC IMX6SXCEC.pdf
MCIMX6X1EVK10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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XC540203CZT75A
Hersteller: NXP USA Inc.
Description: PROCESSOR
auf Bestellung 7091 Stücke:
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XC540203CZT75AR2
Hersteller: NXP USA Inc.
Description: INTEGRATED CIRCUIT
auf Bestellung 1000 Stücke:
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MCIMX6S1AVM10AD
MCIMX6S1AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S6AVM10AD
MCIMX6S6AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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PBSM5240PFH115 PBSM5240PFH.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSM5240PFH SMALL S
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Voltage - Rated: 40V
Package / Case: 6-UDFN Exposed Pad
Current Rating (Amps): 1.8A
Mounting Type: Surface Mount
Transistor Type: PNP, N-Channel
Applications: General Purpose
Supplier Device Package: 6-HUSON (2x2)
auf Bestellung 63000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2544+0.19 EUR
Mindestbestellmenge: 2544
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74AHC157D112 74AHC_AHCT157.pdf
74AHC157D112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC157D - MULTIPL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 2000 Stücke:
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Anzahl Preis
2000+0.24 EUR
Mindestbestellmenge: 2000
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CBT3245ADS,112 CBT3245A.pdf
CBT3245ADS,112
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 14604 Stücke:
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Anzahl Preis
1776+0.28 EUR
Mindestbestellmenge: 1776
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CBT3245ADS,118 CBT3245A.pdf
CBT3245ADS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1776+0.28 EUR
Mindestbestellmenge: 1776
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CBT3245APW-Q100118 CBT3245A_Q100.pdf
CBT3245APW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Packaging: Bulk
auf Bestellung 36196 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1528+0.35 EUR
Mindestbestellmenge: 1528
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TEA1723DT/N1118 TEA1723DT.pdf
TEA1723DT/N1118
Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS LOW POWER CONTROL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-B2V7/DG/B3215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B2V7/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
auf Bestellung 69000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.03 EUR
Mindestbestellmenge: 15000
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BZX84-B2V7 PHGLS29437-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B2V7 - ZENER
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 350 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Produkt ist nicht verfügbar
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BZX84-B4V7/DG/B3215 BZX84_SER.pdf
BZX84-B4V7/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.03 EUR
Mindestbestellmenge: 15000
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BZX84-B4V7/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B4V7/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC9S08PT32AVLH MC9S08PT60.pdf
MC9S08PT32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462BT/0Z TJA1462.pdf
TJA1462BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.16 EUR
12+1.56 EUR
Mindestbestellmenge: 9
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LPC55S06-EVK LPC55S06-EVK-QSG.pdf
LPC55S06-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT LPC55
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S06
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 25 Stücke:
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Anzahl Preis
1+80.38 EUR
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LPC55S04JBD64E LPC55S0x_LPC550x.pdf
LPC55S04JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.47 EUR
10+6.45 EUR
25+5.94 EUR
Mindestbestellmenge: 3
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LPC5502JHI48QL LPC55S0x_LPC550x.pdf
LPC5502JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 354 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.42 EUR
10+4.84 EUR
25+4.45 EUR
80+4.07 EUR
260+3.80 EUR
Mindestbestellmenge: 3
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LPC5504JHI48QL LPC55S0x_LPC550x.pdf
LPC5504JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+4.39 EUR
25+4.04 EUR
80+3.71 EUR
Mindestbestellmenge: 4
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LPC55S04JHI48QL LPC55S0x_LPC550x.pdf
LPC55S04JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S06JHI48QL LPC55S0x_LPC550x_DS.pdf
LPC55S06JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07.pdf
74LVC1G07GM/S500115
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
auf Bestellung 3785730 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3883+0.13 EUR
Mindestbestellmenge: 3883
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74LVC1G07GF/S500132 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S500132
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 540000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3129+0.16 EUR
Mindestbestellmenge: 3129
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74LVC1G07GF/S505125 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S505125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 155597 Stücke:
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1210+0.40 EUR
Mindestbestellmenge: 1210
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LPC1763FBD100Y LPC1769_68_67_66_65_64_63.pdf
LPC1763FBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.81 EUR
10+13.22 EUR
25+11.78 EUR
80+10.39 EUR
230+9.45 EUR
440+8.99 EUR
1000+8.52 EUR
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LPC1765FET100K LPC1769_68_67_66_65_64_63.pdf
LPC1765FET100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1514 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.57 EUR
10+16.15 EUR
25+15.05 EUR
80+14.00 EUR
260+13.23 EUR
520+12.89 EUR
1040+12.61 EUR
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BZV85-C7V5133 NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw
BZV85-C7V5133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
auf Bestellung 55000 Stücke:
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Anzahl Preis
9043+0.05 EUR
Mindestbestellmenge: 9043
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
auf Bestellung 1699 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.96 EUR
10+7.14 EUR
25+6.75 EUR
100+5.85 EUR
250+5.55 EUR
500+4.98 EUR
1000+4.20 EUR
Mindestbestellmenge: 3
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TJA1081TS PHGLS25769-1.pdf?t.download=true&u=5oefqw
TJA1081TS
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
auf Bestellung 813 Stücke:
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Anzahl Preis
135+3.98 EUR
Mindestbestellmenge: 135
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MCF5213CAF66R MCF5213EC.pdf
MCF5213CAF66R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC1837JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1837JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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PMEG4005AESFC315 PMEG4005AEA.pdf
PMEG4005AESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 162000 Stücke:
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Anzahl Preis
6662+0.08 EUR
Mindestbestellmenge: 6662
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PMEG4002ESFC315 PMEG4002ESF.pdf
PMEG4002ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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Anzahl Preis
7212+0.07 EUR
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PMEG2005ESFC315 PMEG2005ESF.pdf
PMEG2005ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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7212+0.07 EUR
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PMEG4005ESFC315 PMEG4005ESF.pdf
PMEG4005ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
auf Bestellung 63000 Stücke:
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Anzahl Preis
6662+0.08 EUR
Mindestbestellmenge: 6662
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PMEG4002AESFC315 PMEG4002AESF.pdf
PMEG4002AESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7212+0.07 EUR
Mindestbestellmenge: 7212
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PMEG1201AESFC315
PMEG1201AESFC315
Hersteller: NXP USA Inc.
Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7212+0.07 EUR
Mindestbestellmenge: 7212
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74CBTLV3245DS,118 74CBTLV3245_Rev_Feb2017.pdf
74CBTLV3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 43707 Stücke:
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1332+0.37 EUR
Mindestbestellmenge: 1332
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IP4281CZ10/2115 IP4281CZ10.pdf
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
auf Bestellung 20000 Stücke:
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4121+0.12 EUR
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SC16C554BIB80,557 SC16C554B_554DB.pdf
SC16C554BIB80,557
Hersteller: NXP USA Inc.
Description: UART INTERFACE IC 16CB 2.5V-5V 4
Packaging: Bulk
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCR908JK3ECPE MC68HC908Jx(1,3).pdf
MCR908JK3ECPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
auf Bestellung 6513 Stücke:
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MCR908JL3ECDWER
MCR908JL3ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MC68HC908Jx%281%2C3%29.pdf
MCR908JK1ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387.pdf
LPC2387FBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 678 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.44 EUR
10+25.92 EUR
25+24.30 EUR
100+22.51 EUR
450+21.22 EUR
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OM11013598
OM11013598
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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