Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36000) > Seite 402 nach 600
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| MF1SPLUS1031DUD/0V | NXP USA Inc. |
Description: MF1SPLUS1031DUD/0V Packaging: Bulk |
Produkt ist nicht verfügbar |
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74AUP1G132GF132 | NXP USA Inc. |
Description: IC GATE NAND 1CH 2IN 6XSONPackaging: Bulk Features: Schmitt Trigger Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 0.6V ~ 2.29V Input Logic Level - Low: 0.1V ~ 0.88V Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
auf Bestellung 139950 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA8350Q/N6,112 | NXP USA Inc. |
Description: IC DC COUPLED V-DEFL 13PDBSPackaging: Tube Package / Case: 13-SIP Formed Leads Mounting Type: Through Hole Supplier Device Package: 13-PDBS Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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AFSC5G35D35T2 | NXP USA Inc. |
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFNPackaging: Cut Tape (CT) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz RF Type: 5G, LTE Voltage - Supply: 0V ~ 32V Gain: 26.1dB Supplier Device Package: 26-HLQFN (10x6) |
auf Bestellung 1451 Stücke: Lieferzeit 10-14 Tag (e) |
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NTS0302JKZ | NXP USA Inc. |
Description: IC VOLT TRANSLATOR X2SON8Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Mounting Type: Surface Mount Number of Bits: 2 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 8-X2SON (1.4x1) Part Status: Active |
auf Bestellung 5900 Stücke: Lieferzeit 10-14 Tag (e) |
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BC517,112 | NXP USA Inc. |
Description: TRANS NPN DARL 30V 0.5A TO-92-3Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Transistor Type: NPN - Darlington Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V Frequency - Transition: 220MHz Supplier Device Package: TO-92-3 Part Status: Obsolete Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 625 mW |
Produkt ist nicht verfügbar |
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TDA1308TT/N2,118 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 80MW 8TSSOPPackaging: Tape & Reel (TR) Features: Depop, Short-Circuit Protection Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA1308AUK,027 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 80MW 8WLCSPPackaging: Tape & Reel (TR) Features: Depop, Short-Circuit Protection Package / Case: 8-XFBGA, WLCSP Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-WLCSP (0.61x0.84) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TDA1308T/N2,115 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOPackaging: Tape & Reel (TR) Features: Depop, Short-Circuit Protection Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA1308T/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOPackaging: Tube Features: Depop, Short-Circuit Protection Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA1308AT/N2,115 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOPackaging: Tape & Reel (TR) Features: Depop, Short-Circuit Protection Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA1308T/N1,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOPackaging: Tube Features: Depop, Short-Circuit Protection Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA1308AT/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8SOPackaging: Tube Features: Depop, Short-Circuit Protection Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA1308/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STEREO 80MW 8DIP Packaging: Tube Features: Depop, Short-Circuit Protection Package / Case: 8-DIP (0.300", 7.62mm) Output Type: Headphones, 2-Channel (Stereo) Mounting Type: Through Hole Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm Supplier Device Package: 8-DIP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MIMXRT106FDVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1061CVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 396 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1061CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196LFBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 179 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106SDVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 960 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106FCVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 3856 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1064CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196LFBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 201 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1061DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 364 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9665APW118 | NXP USA Inc. |
Description: I2C BUS CONTROLLERPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PCA9665APW | NXP USA Inc. |
Description: I2C BUS CONTROLLERPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PCA9665PW | NXP USA Inc. |
Description: I2C BUS CONTROLLERPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MMA8225KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±250g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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MMA8205KEG | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±50g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MMA8205KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±50g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| A7001CMHN1/T1AGB39 | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| A7002CMHN1/T1AGB39 | NXP USA Inc. | Description: SECURE AUTHENTICATION MICROCONTR |
auf Bestellung 1098 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BZX84-B22/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk |
auf Bestellung 114000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFS540,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SC-70Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 500mW Current - Collector (Ic) (Max): 120mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz Supplier Device Package: SC-70 |
Produkt ist nicht verfügbar |
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| PMXB120EPE147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
auf Bestellung 648598 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PMXB75UPE147 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V |
auf Bestellung 4088434 Stücke: Lieferzeit 10-14 Tag (e) |
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PMXB75UPE/M5147 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMZB200UNE315 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFETPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Supplier Device Package: DFN1006B-3 |
auf Bestellung 156850 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMXB56EN147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BF904215 | NXP USA Inc. |
Description: RF SMALL SIGNAL FIELD-EFFECT TRA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MKS20FN256VFT12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48QFN |
Produkt ist nicht verfügbar |
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MKL81Z128CBH7R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64WLCSPPackaging: Tape & Reel (TR) Package / Case: 64-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 64-WLCSP (3.48x3.38) Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL81Z128CBH7R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64WLCSPPackaging: Cut Tape (CT) Package / Case: 64-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 64-WLCSP (3.48x3.38) Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
auf Bestellung 1753 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL81Z128VMC7557 | NXP USA Inc. |
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S |
auf Bestellung 144344 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT1166DVM6A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 149 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1166XVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 290 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1160-EVK | NXP USA Inc. |
Description: EVAL KIT I.MX RT1160Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-M4, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT1160 Platform: EdgeVerse™ Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1165DVM6A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 146 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1165CVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1166CVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1165XVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 143 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2213AP/N1112 | NXP USA Inc. |
Description: IC DVR HALF BRIDGE CFL 8DIP |
auf Bestellung 5967 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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UBA20270T/1518 | NXP USA Inc. |
Description: IC CFL LAMP DVR 600V 16-SOICPackaging: Bulk |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PDTC114EMB315 | NXP USA Inc. |
Description: NOW NEXPERIA PDTC114EMB - SMALLPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BAS21LD315 | NXP USA Inc. |
Description: BAS21LD - HIGH-VOLTAGE SWITCHING |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MIMX8QX1AVLFZAC | NXP USA Inc. |
Description: I.MX 8QUADXPLUS 21X21Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1111FHN33/203 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1111FHN33/102K | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 994 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1111FHN33/103K | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1111FHN33/2025 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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A2I20D040GNR1 | NXP USA Inc. |
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBGPackaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz Voltage - Supply: 28V Gain: 32.7dB Current - Supply: 220mA P1dB: 36.3W Test Frequency: 1.8GHz ~ 2.2GHz Supplier Device Package: TO-270WBG-17 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX515DJM8CR2 | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGAPackaging: Bulk Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Part Status: Active Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
auf Bestellung 15532 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K148HAT0MLQR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFPPackaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 74AUP1G132GF132 |
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Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 2IN 6XSON
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC GATE NAND 1CH 2IN 6XSON
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 139950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2533+ | 0.21 EUR |
| TDA8350Q/N6,112 |
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Hersteller: NXP USA Inc.
Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| AFSC5G35D35T2 |
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Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
auf Bestellung 1451 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 67 EUR |
| 10+ | 54.63 EUR |
| 25+ | 51.53 EUR |
| 100+ | 48.14 EUR |
| 250+ | 46.52 EUR |
| NTS0302JKZ |
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Hersteller: NXP USA Inc.
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
auf Bestellung 5900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 16+ | 1.13 EUR |
| 23+ | 0.8 EUR |
| 25+ | 0.72 EUR |
| 100+ | 0.63 EUR |
| 250+ | 0.59 EUR |
| 500+ | 0.56 EUR |
| 1000+ | 0.55 EUR |
| BC517,112 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308TT/N2,118 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8TSSOP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC AMP CLASS AB STER 80MW 8TSSOP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308AUK,027 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 80MW 8WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Description: IC AMP CLASS AB STER 80MW 8WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308T/N2,115 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308T/N2,112 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308AT/N2,115 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308T/N1,112 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308AT/N2,112 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8SO
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA1308/N2,112 |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STEREO 80MW 8DIP
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Description: IC AMP CLASS AB STEREO 80MW 8DIP
Packaging: Tube
Features: Depop, Short-Circuit Protection
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT106FDVL6B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.69 EUR |
| 10+ | 16.39 EUR |
| 25+ | 14.78 EUR |
| 80+ | 14.63 EUR |
| MIMXRT1061CVL5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.79 EUR |
| 10+ | 16.38 EUR |
| 25+ | 15.28 EUR |
| 240+ | 13.52 EUR |
| MIMXRT1061CVJ5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 24.99 EUR |
| 10+ | 19.75 EUR |
| 25+ | 18.45 EUR |
| MIMXRT106SDVL6B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.83 EUR |
| 10+ | 16.26 EUR |
| 25+ | 14.57 EUR |
| 80+ | 12.93 EUR |
| 240+ | 11.8 EUR |
| 480+ | 11.23 EUR |
| 960+ | 10.96 EUR |
| MIMXRT106FCVL5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.6 EUR |
| 10+ | 17.95 EUR |
| 25+ | 16.79 EUR |
| 240+ | 16.45 EUR |
| MIMXRT1064CVJ5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 24.92 EUR |
| 10+ | 19.75 EUR |
| 25+ | 18.46 EUR |
| 189+ | 16.56 EUR |
| MIMXRT1061DVL6B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 364 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 21.16 EUR |
| 10+ | 16.64 EUR |
| 25+ | 15.5 EUR |
| 80+ | 14.43 EUR |
| 240+ | 13.69 EUR |
| MMA8225KEGR2 |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±250g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±250g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA8205KEG |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA8205KEGR2 |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A7001CMHN1/T1AGB39 |
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Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A7002CMHN1/T1AGB39 |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Description: SECURE AUTHENTICATION MICROCONTR
auf Bestellung 1098 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| BZX84-B22/DG/B3215 |
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auf Bestellung 114000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.033 EUR |
| BFS540,115 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMXB120EPE147 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
auf Bestellung 648598 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| PMXB75UPE147 |
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Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
auf Bestellung 4088434 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4729+ | 0.097 EUR |
| PMXB75UPE/M5147 |
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Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.14 EUR |
| PMZB200UNE315 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Supplier Device Package: DFN1006B-3
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Supplier Device Package: DFN1006B-3
auf Bestellung 156850 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4522+ | 0.12 EUR |
| PMXB56EN147 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| BF904215 |
Hersteller: NXP USA Inc.
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKS20FN256VFT12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Description: IC MCU 32BIT 256KB FLASH 48QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKL81Z128CBH7R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKL81Z128CBH7R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Cut Tape (CT)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Cut Tape (CT)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 1753 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 23.88 EUR |
| 10+ | 18.76 EUR |
| 100+ | 15.53 EUR |
| 1000+ | 13.55 EUR |
| MKL81Z128VMC7557 |
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Hersteller: NXP USA Inc.
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S
auf Bestellung 144344 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MIMXRT1166DVM6A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.8 EUR |
| 10+ | 20.48 EUR |
| 25+ | 19.15 EUR |
| MIMXRT1166XVM5A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 290 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 29.92 EUR |
| 10+ | 23.87 EUR |
| 25+ | 22.35 EUR |
| 152+ | 20.3 EUR |
| MIMXRT1160-EVK |
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Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT1160
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1160
Platform: EdgeVerse™
Part Status: Active
Description: EVAL KIT I.MX RT1160
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1160
Platform: EdgeVerse™
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 266.52 EUR |
| MIMXRT1165DVM6A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 146 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 29.09 EUR |
| 10+ | 23.19 EUR |
| 25+ | 21.71 EUR |
| MIMXRT1165CVM5A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 33.02 EUR |
| 10+ | 26.37 EUR |
| 25+ | 24.71 EUR |
| MIMXRT1166CVM5A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 36.63 EUR |
| 10+ | 29.32 EUR |
| 25+ | 27.49 EUR |
| MIMXRT1165XVM5A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 33.18 EUR |
| 10+ | 26.56 EUR |
| 25+ | 24.91 EUR |
| UBA2213AP/N1112 |
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Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Description: IC DVR HALF BRIDGE CFL 8DIP
auf Bestellung 5967 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| UBA20270T/1518 |
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auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 310+ | 1.57 EUR |
| PDTC114EMB315 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC114EMB - SMALL
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PDTC114EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAS21LD315 |
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Hersteller: NXP USA Inc.
Description: BAS21LD - HIGH-VOLTAGE SWITCHING
Description: BAS21LD - HIGH-VOLTAGE SWITCHING
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8QX1AVLFZAC |
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Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1111FHN33/203 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1111FHN33/102K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 994 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 2.94 EUR |
| 10+ | 2 EUR |
| LPC1111FHN33/103K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1111FHN33/2025 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2I20D040GNR1 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
Voltage - Supply: 28V
Gain: 32.7dB
Current - Supply: 220mA
P1dB: 36.3W
Test Frequency: 1.8GHz ~ 2.2GHz
Supplier Device Package: TO-270WBG-17
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
Voltage - Supply: 28V
Gain: 32.7dB
Current - Supply: 220mA
P1dB: 36.3W
Test Frequency: 1.8GHz ~ 2.2GHz
Supplier Device Package: TO-270WBG-17
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX515DJM8CR2 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
auf Bestellung 15532 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7+ | 73.4 EUR |
| FS32K148HAT0MLQR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
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