Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 480 nach 607
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JN5161/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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JN5161/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC561CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGADigiKey Programmable: Not Verified Number of I/O: 64 Part Status: Not For New Designs Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 40MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Bulk |
auf Bestellung 51 Stücke: Lieferzeit 10-14 Tag (e) |
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| MF3D2301DUD/00Z | NXP USA Inc. |
Description: MF3D2301DUD Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: Wafer Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 34187 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| ASL5008FHNZ | NXP USA Inc. |
Description: IC LED DRVR CTRLR PWM 36HVQFNPart Status: Active Voltage - Supply (Max): 5.5V Voltage - Supply (Min): 4.5V Dimming: PWM Supplier Device Package: 36-HVQFN (6x6) Topology: Switched Capacitor (Charge Pump) Internal Switch(s): Yes Current - Output / Channel: 800mA Applications: Automotive Operating Temperature: -40°C ~ 125°C (TA) Type: DC DC Controller Frequency: 200MHz Number of Outputs: 12 Mounting Type: Surface Mount, Wettable Flank Package / Case: 36-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74LVCH2T45GM125 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVCH2T45GM - BUSDigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NX3L2G384GM125 | NXP USA Inc. |
Description: IC ANALOG SWITCH SPSTDigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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NCX2222GM125 | NXP USA Inc. |
Description: DUAL COMPARATORPart Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74AXP2G14GM125 | NXP USA Inc. |
Description: INVERTER, AXP SERIESPart Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5645CF0VLT1 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP DigiKey Programmable: Not Verified Number of I/O: 177 Part Status: Active Supplier Device Package: 208-TQFP (28x28) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 33x10b, 10x12b Core Processor: e200z4d, e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 80MHz/120MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 180 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5644BK0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 147 Part Status: Active Supplier Device Package: 176-LQFP (24x24) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tray Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1.5MB (1.5M x 8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12ZVL32F0MLCR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12ZVL32F0MLCR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFPPackaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
auf Bestellung 1952 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN32AMLCR | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN32AMLCR | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFPPackaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 3985 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12GN48J1VLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tape & Reel (TR) Number of I/O: 26 Part Status: Active Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA2016DB1519 | NXP USA Inc. |
Description: EVAL BOARD TEA1995T TEA2016AATPackaging: Box Voltage - Output: 12V Current - Output: 20A Regulator Topology: Flyback Board Type: Fully Populated Utilized IC / Part: TEA1995T, TEA2016AAT Supplied Contents: Board(s) Main Purpose: AC/DC, Primary and Secondary Side with PFC Outputs and Type: 1 Non-Isolated Output Part Status: Active Power - Output: 240W Contents: Board(s) |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA2016AAT/1/S30Y | NXP USA Inc. |
Description: DCM/QR PFC + RESONANT POWER SUPPPackaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V Applications: Digital Power Controller Supplier Device Package: 16-SO Part Status: Active Current - Supply: 4.8 mA |
auf Bestellung 2251 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA2095T/1J | NXP USA Inc. |
Description: DUAL SYNCHRONOUS RECTIFICATION CPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 4.75V ~ 38V Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: 8-SO Part Status: Active Current - Supply: 90 µA |
auf Bestellung 1097 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA2017DB1580 | NXP USA Inc. |
Description: EVAL BOARD FOR TEA2017Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA2017 Supplied Contents: Board(s) Primary Attributes: 90 ~ 264VAC Input Voltage Embedded: No Part Status: Active Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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RDK01DB1563 | NXP USA Inc. |
Description: TEA2016 USB-I2C INTERFACEPackaging: Bulk For Use With/Related Products: TEA2016 Type: Programmer Contents: Board(s), Cable(s) Part Status: Active Utilized IC / Part: TEA2016 |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK764R0-75C,118 | NXP USA Inc. |
Description: PFET, 100A I(D), 75V, 0.004OHM,Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V Drain to Source Voltage (Vdss): 75 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Part Status: Active Supplier Device Package: D2PAK Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 333W (Tc) Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 100A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MRF6VP121KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Current - Test: 150 mA Voltage - Test: 50 V Voltage - Rated: 110 V Part Status: Not For New Designs Supplier Device Package: NI-1230 Technology: LDMOS Gain: 20dB Power - Output: 1000W Configuration: Dual Frequency: 1.03GHz Package / Case: NI-1230 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74HCT377D118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SOFunction: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Non-Inverted Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk Number of Bits per Element: 8 Part Status: Active Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Supplier Device Package: 20-SO Input Capacitance: 3.5 pF Clock Frequency: 53 MHz Trigger Type: Positive Edge Current - Output High, Low: 4mA, 5.2mA Current - Quiescent (Iq): 8 µA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Type: D-Type |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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PJF7992ATW/C1C/DJ | NXP USA Inc. |
Description: IMMOBIL BASESTATION IC 20HTSSOP Part Status: Obsolete Mounting Type: Surface Mount Packaging: Cut Tape (CT) |
auf Bestellung 940 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8SL1AVNFZAB | NXP USA Inc. |
Description: I.MX8 DXL 15SQSecurity Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Ethernet: 1Gbps (2) Core Processor: ARM® Cortex®-A35 Part Status: Active Display & Interface Controllers: LCD Graphics Acceleration: No RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Co-Processors/DSP: ARM® Cortex®-M4F Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 + PHY (2) Supplier Device Package: 388-LBGA (15x15) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 388-LFBGA Packaging: Tray Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 126 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8DL1CVNFZAB | NXP USA Inc. |
Description: I.MX 8DUALXLITE 15SQAdditional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Ethernet: 1Gbps (2) Core Processor: ARM® Cortex®-A35 Part Status: Active Display & Interface Controllers: LCD Graphics Acceleration: No RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Co-Processors/DSP: ARM® Cortex®-M4F Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Supplier Device Package: 388-LBGA (15x15) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 388-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8SL1CVNFZAB | NXP USA Inc. |
Description: I.MX 8DUALXLITE 15SQAdditional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Ethernet: 1Gbps (2) Core Processor: ARM® Cortex®-A35 Part Status: Active Display & Interface Controllers: LCD Graphics Acceleration: No RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Co-Processors/DSP: ARM® Cortex®-M4F Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 + PHY (2) Supplier Device Package: 388-LBGA (15x15) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 388-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8DL1AVNFZABR | NXP USA Inc. |
Description: I.MX8 DXL 15SQPart Status: Active Supplier Device Package: 388-LBGA (15x15) Mounting Type: Surface Mount Package / Case: 388-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8DL1AVNFZAB | NXP USA Inc. |
Description: I.MX8 DXL 15SQPart Status: Active Supplier Device Package: 388-LBGA (15x15) Mounting Type: Surface Mount Package / Case: 388-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 126 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S08AW48CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 44LQFPPackaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S08AW48CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 44LQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S08AW48CPUE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 64LQFPProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 48KB (48K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 54 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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P3041NSN7MMC | NXP USA Inc. |
Description: IC MPU QORIQ P3 1.2GHZ 1295BGAPackaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Part Status: Obsolete Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12G48J1VLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Number of I/O: 26 Part Status: Active Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| JN5148/Z01515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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JN5142N/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB ROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 16.5mA Current - Transmitting: 15mA Supplier Device Package: 40-HVQFN (6x6) RF Family/Standard: 802.15.4 Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC240APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
auf Bestellung 37195 Stücke: Lieferzeit 10-14 Tag (e) |
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| P2010NXN2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P2010NSE2HFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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P2010NXE2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689Packaging: Box Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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P2010NXN2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPXAZ4115A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.8VPart Status: Obsolete Maximum Pressure: 58.02PSI (400kPa) Port Style: No Port Applications: Board Mount Voltage - Supply: 4.85V ~ 5.35V Termination Style: SMD (SMT) Tab Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% Pressure Type: Absolute Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Output: 0.2 V ~ 4.8 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-SMD Module Features: Temperature Compensated Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPXAZ4115A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.8VPressure Type: Absolute Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Output: 0.2 V ~ 4.8 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-SMD Module Features: Temperature Compensated Packaging: Cut Tape (CT) Part Status: Obsolete Maximum Pressure: 58.02PSI (400kPa) Port Style: No Port Applications: Board Mount Voltage - Supply: 4.85V ~ 5.35V Termination Style: SMD (SMT) Tab Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCU9661B,118 | NXP USA Inc. |
Description: IC CONTROLLER 48LQFPDigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 48-LQFP (7x7) Standards: IEEE 1149.1 Protocol: I2C Current - Supply: 15mA Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Interface: I2C Function: Controller Package / Case: 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCU9661B,118 | NXP USA Inc. |
Description: IC CONTROLLER 48LQFPDigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 48-LQFP (7x7) Standards: IEEE 1149.1 Protocol: I2C Current - Supply: 15mA Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Interface: I2C Function: Controller Package / Case: 48-LQFP Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PRF13750HR9697 | NXP USA Inc. |
Description: PRF13750HR - RF MOSFET LDMOS (DUDigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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| MF3MOD4101DA4/05,1 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ MOA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 17500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8569ECVJANKGB | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100Mbps (8), 1Gbps (4) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR2, DDR3, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKM14Z64CHH5 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 44MAPLGAPackaging: Tray Package / Case: 44-VFLGA Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 5x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 44-MAPLGA (5x5) Part Status: Not For New Designs Number of I/O: 20 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| A5G35S004NT6 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR,Voltage - Test: 48 V Voltage - Rated: 125 V Part Status: Active Supplier Device Package: 6-PDFN (4x4.5) Gain: 16.9dB Power - Output: 24.5dBm Frequency: 3.3GHz ~ 4.3GHz Mounting Type: Surface Mount Package / Case: 6-LDFN Exposed Pad Packaging: Tape & Reel (TR) Current - Test: 12 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LPC55S69JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASH 64HTQFPNumber of I/O: 36 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC55S69JEV98E | NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASHNumber of I/O: 64 Part Status: Active Supplier Device Package: 98-VFBGA (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 98-VFBGA Packaging: Tray |
auf Bestellung 239 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S69JEV98Y | NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASHNumber of I/O: 64 Part Status: Active Supplier Device Package: 98-VFBGA (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 98-VFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC55S69JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASH 64HTQFPNumber of I/O: 36 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tray |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S69JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASH 100LQFPNumber of I/O: 64 Part Status: Active Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AC60CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 44LQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
auf Bestellung 3555 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AC60MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFPPackaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1222 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AC60MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFPPackaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BZX384-C27/ZLX | NXP USA Inc. |
Description: DIODE ZENER 27V 300MW SOD323Current - Reverse Leakage @ Vr: 50 nA @ 700 mV Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Power - Max: 300 mW Part Status: Obsolete Supplier Device Package: SOD-323 Impedance (Max) (Zzt): 80 Ohms Voltage - Zener (Nom) (Vz): 27 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Tolerance: ±5% Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| JN5161/001,515 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| JN5161/001,515 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC561CZP40 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Bulk
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Bulk
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 121.38 EUR |
| MF3D2301DUD/00Z |
Hersteller: NXP USA Inc.
Description: MF3D2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Part Status: Active
Description: MF3D2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 34187 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ASL5008FHNZ |
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Hersteller: NXP USA Inc.
Description: IC LED DRVR CTRLR PWM 36HVQFN
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 800mA
Applications: Automotive
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC LED DRVR CTRLR PWM 36HVQFN
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 800mA
Applications: Automotive
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH2T45GM125 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVCH2T45GM - BUS
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA 74LVCH2T45GM - BUS
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX3L2G384GM125 |
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Hersteller: NXP USA Inc.
Description: IC ANALOG SWITCH SPST
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: IC ANALOG SWITCH SPST
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5645CF0VLT1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Part Status: Active
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Part Status: Active
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
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| SPC5644BK0MLU1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
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| S9S12ZVL32F0MLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| S9S12ZVL32F0MLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 1952 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.24 EUR |
| 10+ | 6.28 EUR |
| 25+ | 5.8 EUR |
| 100+ | 5.26 EUR |
| 250+ | 5.01 EUR |
| 500+ | 4.99 EUR |
| S9KEAZN32AMLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2000+ | 2.65 EUR |
| S9KEAZN32AMLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 3985 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 4.89 EUR |
| 10+ | 3.68 EUR |
| 25+ | 3.37 EUR |
| 100+ | 3.03 EUR |
| 250+ | 2.87 EUR |
| 500+ | 2.8 EUR |
| S9S12GN48J1VLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| TEA2016DB1519 |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1995T, TEA2016AAT
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 240W
Contents: Board(s)
Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1995T, TEA2016AAT
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 240W
Contents: Board(s)
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 659.67 EUR |
| TEA2016AAT/1/S30Y |
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Hersteller: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 4.8 mA
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 4.8 mA
auf Bestellung 2251 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.07 EUR |
| 10+ | 3.81 EUR |
| 25+ | 3.5 EUR |
| 100+ | 3.15 EUR |
| 250+ | 2.98 EUR |
| 500+ | 2.94 EUR |
| TEA2095T/1J |
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Hersteller: NXP USA Inc.
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 90 µA
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 90 µA
auf Bestellung 1097 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.41 EUR |
| 11+ | 1.75 EUR |
| 25+ | 1.59 EUR |
| 100+ | 1.41 EUR |
| 250+ | 1.33 EUR |
| 500+ | 1.28 EUR |
| 1000+ | 1.27 EUR |
| TEA2017DB1580 |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA2017
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA2017
Supplied Contents: Board(s)
Primary Attributes: 90 ~ 264VAC Input Voltage
Embedded: No
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA2017
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA2017
Supplied Contents: Board(s)
Primary Attributes: 90 ~ 264VAC Input Voltage
Embedded: No
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| RDK01DB1563 |
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Hersteller: NXP USA Inc.
Description: TEA2016 USB-I2C INTERFACE
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: TEA2016
Description: TEA2016 USB-I2C INTERFACE
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: TEA2016
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 366.48 EUR |
| BUK764R0-75C,118 |
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Hersteller: NXP USA Inc.
Description: PFET, 100A I(D), 75V, 0.004OHM,
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Description: PFET, 100A I(D), 75V, 0.004OHM,
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6VP121KHR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Not For New Designs
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 20dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Not For New Designs
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 20dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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| 74HCT377D118 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 53 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Description: IC FF D-TYPE SNGL 8BIT 20SO
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 53 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 0.44 EUR |
| PJF7992ATW/C1C/DJ |
Hersteller: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
Part Status: Obsolete
Mounting Type: Surface Mount
Packaging: Cut Tape (CT)
Description: IMMOBIL BASESTATION IC 20HTSSOP
Part Status: Obsolete
Mounting Type: Surface Mount
Packaging: Cut Tape (CT)
auf Bestellung 940 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.83 EUR |
| 10+ | 6.1 EUR |
| 25+ | 5.49 EUR |
| 100+ | 5 EUR |
| 250+ | 4.51 EUR |
| 500+ | 4.05 EUR |
| MIMX8SL1AVNFZAB |
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Hersteller: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Ethernet: 1Gbps (2)
Core Processor: ARM® Cortex®-A35
Part Status: Active
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: ARM® Cortex®-M4F
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Supplier Device Package: 388-LBGA (15x15)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX8 DXL 15SQ
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Ethernet: 1Gbps (2)
Core Processor: ARM® Cortex®-A35
Part Status: Active
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: ARM® Cortex®-M4F
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Supplier Device Package: 388-LBGA (15x15)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 126 Stücke
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| MIMX8DL1CVNFZAB |
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Hersteller: NXP USA Inc.
Description: I.MX 8DUALXLITE 15SQ
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Ethernet: 1Gbps (2)
Core Processor: ARM® Cortex®-A35
Part Status: Active
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: ARM® Cortex®-M4F
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Supplier Device Package: 388-LBGA (15x15)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Description: I.MX 8DUALXLITE 15SQ
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Ethernet: 1Gbps (2)
Core Processor: ARM® Cortex®-A35
Part Status: Active
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: ARM® Cortex®-M4F
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Supplier Device Package: 388-LBGA (15x15)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| MIMX8SL1CVNFZAB |
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Hersteller: NXP USA Inc.
Description: I.MX 8DUALXLITE 15SQ
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Ethernet: 1Gbps (2)
Core Processor: ARM® Cortex®-A35
Part Status: Active
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: ARM® Cortex®-M4F
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Supplier Device Package: 388-LBGA (15x15)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Description: I.MX 8DUALXLITE 15SQ
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Ethernet: 1Gbps (2)
Core Processor: ARM® Cortex®-A35
Part Status: Active
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: ARM® Cortex®-M4F
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Supplier Device Package: 388-LBGA (15x15)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| MIMX8DL1AVNFZABR |
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Hersteller: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Part Status: Active
Supplier Device Package: 388-LBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tape & Reel (TR)
Description: I.MX8 DXL 15SQ
Part Status: Active
Supplier Device Package: 388-LBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MIMX8DL1AVNFZAB |
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Hersteller: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Part Status: Active
Supplier Device Package: 388-LBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Description: I.MX8 DXL 15SQ
Part Status: Active
Supplier Device Package: 388-LBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 388-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| MC9S08AW48CFGER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC9S08AW48CFGE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC9S08AW48CPUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Produkt ist nicht verfügbar
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| P3041NSN7MMC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P3 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Description: IC MPU QORIQ P3 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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| S9S12G48J1VLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| JN5148/Z01515 |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| JN5142N/001,515 |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| 74LVC240APW/AU118 |
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auf Bestellung 37195 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1902+ | 0.26 EUR |
| P2010NXN2KFC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Active
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Active
Produkt ist nicht verfügbar
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| P2010NSE2HFC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Produkt ist nicht verfügbar
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| P2010NXE2KFC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Box
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Box
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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| P2010NXN2KFC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
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| MPXAZ4115A6T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Output: 0.2 V ~ 4.8 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD Module
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Description: SENSOR 16.68PSIA 4.8V
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Output: 0.2 V ~ 4.8 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD Module
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
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| MPXAZ4115A6T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Pressure Type: Absolute
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Output: 0.2 V ~ 4.8 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD Module
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Description: SENSOR 16.68PSIA 4.8V
Pressure Type: Absolute
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Output: 0.2 V ~ 4.8 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD Module
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
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| PCU9661B,118 |
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Hersteller: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| PCU9661B,118 |
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Hersteller: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Description: IC CONTROLLER 48LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Standards: IEEE 1149.1
Protocol: I2C
Current - Supply: 15mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Controller
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
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| PRF13750HR9697 |
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Hersteller: NXP USA Inc.
Description: PRF13750HR - RF MOSFET LDMOS (DU
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: PRF13750HR - RF MOSFET LDMOS (DU
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 370.36 EUR |
| MF3MOD4101DA4/05,1 |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
Produkt ist nicht verfügbar
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| MPC8569ECVJANKGB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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| MKM14Z64CHH5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| A5G35S004NT6 |
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Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (4x4.5)
Gain: 16.9dB
Power - Output: 24.5dBm
Frequency: 3.3GHz ~ 4.3GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 12 mA
Description: AIRFAST RF POWER GAN TRANSISTOR,
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (4x4.5)
Gain: 16.9dB
Power - Output: 24.5dBm
Frequency: 3.3GHz ~ 4.3GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 12 mA
Produkt ist nicht verfügbar
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| LPC55S69JBD64Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| LPC55S69JEV98E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.29 EUR |
| 10+ | 10.33 EUR |
| 25+ | 9.59 EUR |
| 100+ | 8.78 EUR |
| LPC55S69JEV98Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 640KB FLASH
Number of I/O: 64
Part Status: Active
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| LPC55S69JBD64E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.1 EUR |
| 10+ | 9.42 EUR |
| 25+ | 8.84 EUR |
| LPC55S69JBD100E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 100LQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 640KB FLASH 100LQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 11.21 EUR |
| 10+ | 10.44 EUR |
| MC9S08AC60CFGE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 3555 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 15.89 EUR |
| 10+ | 12.4 EUR |
| 25+ | 11.53 EUR |
| 100+ | 10.57 EUR |
| 250+ | 10.11 EUR |
| 800+ | 9.68 EUR |
| MC9S08AC60MFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1222 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 49+ | 10.05 EUR |
| MC9S08AC60MFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| BZX384-C27/ZLX |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 300MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Part Status: Obsolete
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Description: DIODE ZENER 27V 300MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Part Status: Obsolete
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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