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SPC5607BF1VLU6R SPC5607BF1VLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN7120A0EV/C10801 NXP USA Inc. PN7120.pdf Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12C32CFAE25 MC9S12C32CFAE25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
auf Bestellung 691 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.42 EUR
10+26.73 EUR
25+25.06 EUR
100+23.22 EUR
250+22.34 EUR
500+21.81 EUR
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MK22FN1M0VMC12R MK22FN1M0VMC12R NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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MK22FN1M0VMC12R MK22FN1M0VMC12R NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITPF0100SKTEVBE KITPF0100SKTEVBE NXP USA Inc. MMPF0100.pdf Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
Utilized IC / Part: PF0x00
auf Bestellung 6 Stücke:
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1+346.79 EUR
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S9S08SG16E1WTL S9S08SG16E1WTL NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
 Mindestbestellmenge: 50 Stücke
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MC8640DTHJ1250HE MC8640DTHJ1250HE NXP USA Inc. Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA1270KEG NXP USA Inc. Description: IC ACCEL COLOSSUS 2.5G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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BCP56-10H,115 BCP56-10H,115 NXP USA Inc. Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC5534JBD100K LPC5534JBD100K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
auf Bestellung 450 Stücke:
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1+18.36 EUR
10+14.42 EUR
80+11.94 EUR
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MIMXRT106ADVL6AR MIMXRT106ADVL6AR NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT106ADVL6A MIMXRT106ADVL6A NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1171AVM8AR MIMXRT1171AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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MIMXRT1176AVM8AR MIMXRT1176AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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LPC1769FBD100/P1K LPC1769FBD100/P1K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
auf Bestellung 321 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.96 EUR
10+25.52 EUR
25+23.91 EUR
100+22.14 EUR
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MCF5249LAG120 MCF5249LAG120 NXP USA Inc. MCF5249.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 300 Stücke
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SCF5249LAG120 SCF5249LAG120 NXP USA Inc. Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 300 Stücke
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PCAL9539APW,118 PCAL9539APW,118 NXP USA Inc. PCAL9539A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
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2500+2.12 EUR
Mindestbestellmenge: 2500 Stücke
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PCAL9539APW,118 PCAL9539APW,118 NXP USA Inc. PCAL9539A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.05 EUR
10+3.02 EUR
25+2.76 EUR
100+2.47 EUR
250+2.34 EUR
500+2.26 EUR
1000+2.24 EUR
Mindestbestellmenge: 5 Stücke
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T1042NSE7PQPB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 60 Stücke
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SAF7741HV/N118518 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)
55+9.68 EUR
Mindestbestellmenge: 55 Stücke
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SAF3561EL/V1101,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF3561EL/V1103,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF3561EL/V1102,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF3561EL/V1100K NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF3561EL/V1101,55 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF3561HV/V1103,55 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1100,51 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1102,55 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1101,51 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1103,51 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1106K NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G32GD,125 74AHCT2G32GD,125 NXP USA Inc. PHGLS28140-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 2CH 2-INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
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PRF13750HR9 PRF13750HR9 NXP USA Inc. Description: RF MOSFET LDMOS NI1230
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Strip
Voltage - Rated: 105 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Produkt ist nicht verfügbar
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K32W1480VFTBT K32W1480VFTBT NXP USA Inc. K32W1480.pdf Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: I2C, I2S, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 22.4mA
Data Rate (Max): 2Mbps
Current - Receiving: 8.7mA
Protocol: Bluetooth v5.2, Thread, Zigbee®
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
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80+8.14 EUR
260+7.92 EUR
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74AHCT1G04GV NXP USA Inc. PHGL-S-A0000727970-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT1G04GW-Q100125 NXP USA Inc. 74AHC_AHCT1G04_Q100.pdf Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT1G04GM115 NXP USA Inc. 74AHC_AHCT1G04.pdf Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MMW9014KZ NXP USA Inc. Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
Produkt ist nicht verfügbar
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MMW9012KZ NXP USA Inc. Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9634D NXP USA Inc. PHGL-S-A0000133613-1.pdf?t.download=true&u=5oefqw Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9634D118 NXP USA Inc. PCA9634.pdf Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128MPVE MC9S12DB128MPVE NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128CFUE MC9S12DB128CFUE NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
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N74F541D,623 N74F541D,623 NXP USA Inc. N74F540%2C541.pdf Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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PMMA2241KEG NXP USA Inc. Description: IC ACCEL X-LATERAL 10G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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LM75BDP/DG,118 LM75BDP/DG,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F83766VLK MC56F83766VLK NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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MPXV2202DP MPXV2202DP NXP USA Inc. MPX2202.pdf description Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08GT8AMFCE MC9S08GT8AMFCE NXP USA Inc. PHGL-S-A0002794559-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
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MKL05Z32VLF4 MKL05Z32VLF4 NXP USA Inc. KL05P48M48SF1.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN8AMFKR S9KEAZN8AMFKR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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S9KEAZN8AMFKR S9KEAZN8AMFKR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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PTN3222CUKZ PTN3222CUKZ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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PTN3222CUKZ PTN3222CUKZ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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74LVC32245AEC,518 74LVC32245AEC,518 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
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MPXHZ6116A6U MPXHZ6116A6U NXP USA Inc. MPXHZ6116A.pdf Description: SENSOR 16.68PSIA 4.645V 8SSOP
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tube
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MPXHZ6116A6T1 MPXHZ6116A6T1 NXP USA Inc. MPXHZ6116A.pdf Description: SENSOR 16.68PSIA 4.645V 8SSOP
Part Status: Active
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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STMP3770XXLAEA2N NXP USA Inc. PHGL-S-A0010067498-1.pdf?t.download=true&u=5oefqw Description: STMP3770 - PMP CONTROLLER
Packaging: Bulk
Part Status: Obsolete
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SPC5607BF1VLU6R MPC560XBFAMFS.pdf
SPC5607BF1VLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN7120A0EV/C10801 PN7120.pdf
Hersteller: NXP USA Inc.
Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12C32CFAE25 MC9S12C128V1.pdf
MC9S12C32CFAE25
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
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1+33.42 EUR
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25+25.06 EUR
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MK22FN1M0VMC12R K22P121M120SF5.pdf
MK22FN1M0VMC12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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MK22FN1M0VMC12R K22P121M120SF5.pdf
MK22FN1M0VMC12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITPF0100SKTEVBE MMPF0100.pdf
KITPF0100SKTEVBE
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
Utilized IC / Part: PF0x00
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+346.79 EUR
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S9S08SG16E1WTL MC9S08SG32.pdf
S9S08SG16E1WTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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MC8640DTHJ1250HE
MC8640DTHJ1250HE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PMMA1270KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL COLOSSUS 2.5G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BCP56-10H,115
BCP56-10H,115
Hersteller: NXP USA Inc.
Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC5534JBD100K LPC553x.pdf
LPC5534JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+18.36 EUR
10+14.42 EUR
80+11.94 EUR
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MIMXRT106ADVL6AR IMXRT1060CEC_SUPPLEMENT.pdf
MIMXRT106ADVL6AR
Hersteller: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT106ADVL6A IMXRT1060CEC_SUPPLEMENT.pdf
MIMXRT106ADVL6A
Hersteller: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1171AVM8AR IMXRT1170AEC.pdf
MIMXRT1171AVM8AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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MIMXRT1176AVM8AR IMXRT1170AEC.pdf
MIMXRT1176AVM8AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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LPC1769FBD100/P1K LPC1769_68_67_66_65_64_63.pdf
LPC1769FBD100/P1K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
auf Bestellung 321 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+31.96 EUR
10+25.52 EUR
25+23.91 EUR
100+22.14 EUR
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MCF5249LAG120 MCF5249.pdf
MCF5249LAG120
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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SCF5249LAG120
SCF5249LAG120
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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PCAL9539APW,118 PCAL9539A.pdf
PCAL9539APW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+2.12 EUR
Mindestbestellmenge: 2500 Stücke
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PCAL9539APW,118 PCAL9539A.pdf
PCAL9539APW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.05 EUR
10+3.02 EUR
25+2.76 EUR
100+2.47 EUR
250+2.34 EUR
500+2.26 EUR
1000+2.24 EUR
Mindestbestellmenge: 5 Stücke
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T1042NSE7PQPB T1FAMILYFS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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SAF7741HV/N118518 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
55+9.68 EUR
Mindestbestellmenge: 55 Stücke
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SAF3561EL/V1101,51
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF3561EL/V1103,51
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF3561EL/V1102,51
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF3561EL/V1100K
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF3561EL/V1101,55
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF3561HV/V1103,55
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1100,51 SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1102,55 SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1101,51
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF3561HV/V1103,51
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1106K SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G32GD,125 PHGLS28140-1.pdf?t.download=true&u=5oefqw
74AHCT2G32GD,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 5387 Stücke:
Lieferzeit 10-14 Tag (e)
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PRF13750HR9
PRF13750HR9
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI1230
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Strip
Voltage - Rated: 105 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Produkt ist nicht verfügbar
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K32W1480VFTBT K32W1480.pdf
K32W1480VFTBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: I2C, I2S, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 22.4mA
Data Rate (Max): 2Mbps
Current - Receiving: 8.7mA
Protocol: Bluetooth v5.2, Thread, Zigbee®
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
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2+10.23 EUR
10+9.07 EUR
25+8.65 EUR
40+8.44 EUR
80+8.14 EUR
260+7.92 EUR
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74AHCT1G04GV PHGL-S-A0000727970-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Part Status: Active
Packaging: Bulk
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74AHCT1G04GW-Q100125 74AHC_AHCT1G04_Q100.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT1G04GM115 74AHC_AHCT1G04.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MMW9014KZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
Produkt ist nicht verfügbar
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MMW9012KZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9634D PHGL-S-A0000133613-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9634D118 PCA9634.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128MPVE HCS12DFAMILYPP.pdf
MC9S12DB128MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128CFUE HCS12DFAMILYPP.pdf
MC9S12DB128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F541D,623 N74F540%2C541.pdf
N74F541D,623
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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946+0.53 EUR
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PMMA2241KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL X-LATERAL 10G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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LM75BDP/DG,118 LM75B.pdf
LM75BDP/DG,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F83766VLK MC56F83XXXFS.pdf
MC56F83766VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPXV2202DP description MPX2202.pdf
MPXV2202DP
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08GT8AMFCE PHGL-S-A0002794559-1.pdf?t.download=true&u=5oefqw
MC9S08GT8AMFCE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 490 Stücke:
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AnzahlPreis
58+7.89 EUR
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MKL05Z32VLF4 KL05P48M48SF1.pdf
MKL05Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN8AMFKR S9KEA8P44M48SF0.pdf
S9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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5000+2 EUR
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S9KEAZN8AMFKR S9KEA8P44M48SF0.pdf
S9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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5+3.92 EUR
10+2.92 EUR
25+2.67 EUR
100+2.39 EUR
250+2.26 EUR
500+2.18 EUR
1000+2.16 EUR
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PTN3222CUKZ PTN3222_CUK.pdf
PTN3222CUKZ
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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8000+1.67 EUR
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PTN3222CUKZ PTN3222_CUK.pdf
PTN3222CUKZ
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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AnzahlPreis
6+3.31 EUR
10+2.45 EUR
25+2.23 EUR
100+1.99 EUR
250+1.88 EUR
500+1.82 EUR
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74LVC32245AEC,518 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
auf Bestellung 80605 Stücke:
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89+5.95 EUR
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MPXHZ6116A6U MPXHZ6116A.pdf
MPXHZ6116A6U
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tube
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MPXHZ6116A6T1 MPXHZ6116A.pdf
MPXHZ6116A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Part Status: Active
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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STMP3770XXLAEA2N PHGL-S-A0010067498-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: STMP3770 - PMP CONTROLLER
Packaging: Bulk
Part Status: Obsolete
auf Bestellung 6836 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
44+10.55 EUR
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