Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35328) > Seite 484 nach 589
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SA606DK/01,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-LSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 150MHz RF Type: Cellular, ASK, FSK, VHF Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 3.5mA Secondary Attributes: Up Converter Noise Figure: 6.2dB Number of Mixers: 2 Supplier Device Package: 20-SSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KW45Z41083AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41082AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41052AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41082AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41053AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41083AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41053AFPBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Number of I/O: 22 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41052AFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 29 Data Converters: A/D 14x16b SAR Connectivity: CANbus, HMI, I2C, SPI, UART/USART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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SAF3560HV/V1106Y | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Memory Size: 512kB SDRAM Type: TxRx Only Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V Supplier Device Package: 144-HLQFP (20x20) Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LX2160XC72232B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075D-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075PW118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 13880 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075PW-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 1911 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC4075DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC4075DB,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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SAF4000EL/101Z233Y | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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TEA2095DB1574 | NXP USA Inc. |
![]() Packaging: Bulk Function: Rectifier Controller Type: Power Management Supplied Contents: Board(s) Embedded: No Part Status: Active Contents: Board(s) |
Produkt ist nicht verfügbar |
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TEA2208DB1576 | NXP USA Inc. |
![]() Packaging: Bulk Function: Rectifier Controller Type: Power Management Supplied Contents: Board(s) Embedded: No Part Status: Active Utilized IC / Part: TEA2208T Contents: Board(s) |
Produkt ist nicht verfügbar |
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LPC1764FBD100K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 592 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1764FBD100,551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Discontinued at Digi-Key Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8006VLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1186 Stücke: Lieferzeit 10-14 Tag (e) |
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A3I35D025WNR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 3.2GHz ~ 4GHz RF Type: General Purpose Voltage - Supply: 28V Gain: 30.5dB P1dB: 42.6dBm Test Frequency: 3.8GHz ~ 4GHz Supplier Device Package: TO-270WB-17 Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1021BT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021BT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3232 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021AT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021AT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO Part Status: Active Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3803 Stücke: Lieferzeit 10-14 Tag (e) |
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P4040NSE7MMC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (8), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BFU520X235 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU520X215 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT3G07GD,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
Produkt ist nicht verfügbar |
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KTY82/121,235 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 990 Ohms |
Produkt ist nicht verfügbar |
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KTY82/121,235 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 990 Ohms |
Produkt ist nicht verfügbar |
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KTY82/110/C1,215 | NXP USA Inc. |
Description: SENSOR PTC 1KOHM SOT23 Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 1 kOhms |
Produkt ist nicht verfügbar |
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KTY82/110/C1,235 | NXP USA Inc. |
Description: SENSOR PTC 1KOHM SOT23 Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 1 kOhms |
Produkt ist nicht verfügbar |
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T4161NXN7TTB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
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TFF1024HN/N1,115 | NXP USA Inc. |
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Output: Clock Frequency - Max: 2.15MHz Input: Clock, Crystal Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Main Purpose: Ku band VSAT applications Ratio - Input:Output: 2:1 Differential - Input:Output: No/No Supplier Device Package: 16-DHVQFN (2.5x3.5) PLL: Yes Part Status: Last Time Buy Number of Circuits: 1 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TFF1024HN/N1,115 | NXP USA Inc. |
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Output: Clock Frequency - Max: 2.15MHz Input: Clock, Crystal Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Main Purpose: Ku band VSAT applications Ratio - Input:Output: 2:1 Differential - Input:Output: No/No Supplier Device Package: 16-DHVQFN (2.5x3.5) PLL: Yes Part Status: Last Time Buy Number of Circuits: 1 DigiKey Programmable: Not Verified |
auf Bestellung 3822 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA6848HL/V3S518 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: 80-LQFP Mounting Type: Surface Mount Function: Tuner Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz RF Type: AM, FM Secondary Attributes: I2C Interface Supplier Device Package: 80-LQFP (12x12) |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF6617T/V1518 | NXP USA Inc. |
Description: IC CAR RADIO SGL CHIP 32SOIC Packaging: Bulk Part Status: Active |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2136FBD64/01EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 16x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF300ANBN-88MHZ | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Supplied Contents: Board(s) Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC56F82313VLC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (8K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF1510A2EP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AACK1VUCT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART |
auf Bestellung 418 Stücke: Lieferzeit 10-14 Tag (e) |
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S32G378AACK1VUCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378ASCK1VUCT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378ASCK1VUCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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OM14500/TJA1101JP | NXP USA Inc. |
![]() Packaging: Bulk Function: Ethernet Type: Interface Utilized IC / Part: TJA1101 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68MH360AI33L | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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BF904,235 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SOT-143R Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 200MHz Configuration: N-Channel Dual Gate Technology: MOSFET Noise Figure: 1dB Supplier Device Package: SOT-143R Part Status: Obsolete Voltage - Rated: 7 V Voltage - Test: 5 V Current - Test: 10 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NVT2002TLH | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Data Rate: 33MHz Supplier Device Package: HXSON8U Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 13703 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC804M101JHI33Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 30 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC804M101JHI33Y | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 30 DigiKey Programmable: Not Verified |
auf Bestellung 10453 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4075N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC13892DJVK | NXP USA Inc. |
Description: IC PWR MGMT I.MX35/51 139BGA Packaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) Part Status: Active |
auf Bestellung 2080 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F8145VFGE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (64K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 128-LQFP (14x20) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC68SEC000AE20 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-LQFP (10x10) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S12E32CFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
SA606DK/01,118 |
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Hersteller: NXP USA Inc.
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41083AFPBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41082AFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41052AFPBT |
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Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41082AFPBT |
![]() |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41053AFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41083AFTBT |
![]() |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KW45Z41053AFPBT |
![]() |
Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Number of I/O: 22
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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KW45Z41052AFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 29
Data Converters: A/D 14x16b SAR
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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SAF3560HV/V1106Y |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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LX2160XC72232B |
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Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 1097.73 EUR |
74HC4075D-Q100118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1076+ | 0.47 EUR |
74HC4075PW118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 13880 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1332+ | 0.38 EUR |
74HC4075PW-Q100118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 1911 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1298+ | 0.38 EUR |
74HC4075N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74HC4075DB,112 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74HC4075DB,118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TEA2095DB1574 |
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Hersteller: NXP USA Inc.
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Contents: Board(s)
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TEA2208DB1576 |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA2208T
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Utilized IC / Part: TEA2208T
Contents: Board(s)
Description: EVAL BOARD FOR TEA2208T
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Utilized IC / Part: TEA2208T
Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LPC1764FBD100K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 592 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.33 EUR |
10+ | 9.61 EUR |
25+ | 9.45 EUR |
100+ | 9.31 EUR |
450+ | 9.07 EUR |
LPC1764FBD100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC56F8006VLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1186 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.56 EUR |
10+ | 8.14 EUR |
25+ | 7.53 EUR |
100+ | 6.87 EUR |
250+ | 6.55 EUR |
500+ | 6.36 EUR |
A3I35D025WNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30.5dB
P1dB: 42.6dBm
Test Frequency: 3.8GHz ~ 4GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30.5dB
P1dB: 42.6dBm
Test Frequency: 3.8GHz ~ 4GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TJA1021BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2500+ | 0.54 EUR |
TJA1021BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3232 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
16+ | 1.16 EUR |
22+ | 0.8 EUR |
25+ | 0.75 EUR |
100+ | 0.66 EUR |
250+ | 0.62 EUR |
500+ | 0.61 EUR |
TJA1021AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2500+ | 0.73 EUR |
TJA1021AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3803 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 1.65 EUR |
17+ | 1.1 EUR |
25+ | 1 EUR |
100+ | 0.91 EUR |
250+ | 0.87 EUR |
500+ | 0.82 EUR |
1000+ | 0.77 EUR |
P4040NSE7MMC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BFU520X235 |
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auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2323+ | 0.21 EUR |
BFU520X215 |
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auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2323+ | 0.21 EUR |
74HCT3G07GD,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
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KTY82/121,235 |
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Hersteller: NXP USA Inc.
Description: SENSOR PTC 990OHM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Description: SENSOR PTC 990OHM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KTY82/121,235 |
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Hersteller: NXP USA Inc.
Description: SENSOR PTC 990OHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Description: SENSOR PTC 990OHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KTY82/110/C1,215 |
Hersteller: NXP USA Inc.
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KTY82/110/C1,235 |
Hersteller: NXP USA Inc.
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
T4161NXN7TTB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TFF1024HN/N1,115 |
Hersteller: NXP USA Inc.
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TFF1024HN/N1,115 |
Hersteller: NXP USA Inc.
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Last Time Buy
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 3822 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.26 EUR |
10+ | 14.69 EUR |
25+ | 14.01 EUR |
100+ | 12.16 EUR |
250+ | 11.62 EUR |
500+ | 10.59 EUR |
1000+ | 9.22 EUR |
TEA6848HL/V3S518 |
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Hersteller: NXP USA Inc.
Description: IC TUNER CAR RADIO 80LQFP
Packaging: Bulk
Part Status: Active
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Function: Tuner
Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
RF Type: AM, FM
Secondary Attributes: I2C Interface
Supplier Device Package: 80-LQFP (12x12)
Description: IC TUNER CAR RADIO 80LQFP
Packaging: Bulk
Part Status: Active
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Function: Tuner
Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
RF Type: AM, FM
Secondary Attributes: I2C Interface
Supplier Device Package: 80-LQFP (12x12)
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
39+ | 12.64 EUR |
TEF6617T/V1518 |
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
55+ | 9.23 EUR |
LPC2136FBD64/01EL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.95 EUR |
10+ | 18.37 EUR |
25+ | 18.17 EUR |
MRF300ANBN-88MHZ |
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Hersteller: NXP USA Inc.
Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC56F82313VLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC34PF1510A2EP |
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Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S32G378AACK1VUCT |
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Hersteller: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
auf Bestellung 418 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 178.09 EUR |
10+ | 150.47 EUR |
25+ | 144.76 EUR |
S32G378AACK1VUCR |
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Hersteller: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S32G378ASCK1VUCT |
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Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S32G378ASCK1VUCR |
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Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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OM14500/TJA1101JP |
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Hersteller: NXP USA Inc.
Description: EVALUATION BOARD
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: TJA1101
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION BOARD
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: TJA1101
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 318.75 EUR |
MC68MH360AI33L |
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Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 199.48 EUR |
BF904,235 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
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NVT2002TLH |
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Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 13703 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
22+ | 0.83 EUR |
30+ | 0.59 EUR |
32+ | 0.55 EUR |
100+ | 0.51 EUR |
250+ | 0.48 EUR |
500+ | 0.46 EUR |
LPC804M101JHI33Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6000+ | 1.72 EUR |
LPC804M101JHI33Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 10453 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 3.91 EUR |
10+ | 3.05 EUR |
100+ | 2.45 EUR |
500+ | 2.32 EUR |
1000+ | 1.92 EUR |
2500+ | 1.79 EUR |
74HCT4075N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC13892DJVK |
Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
auf Bestellung 2080 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.3 EUR |
10+ | 12.76 EUR |
25+ | 11.87 EUR |
100+ | 10.89 EUR |
250+ | 10.43 EUR |
500+ | 10.15 EUR |
MC56F8145VFGE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC68SEC000AE20 |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M680X0 20MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC9S12E32CFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH