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A3M39SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
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A5M39TG140T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
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A5M36TG140T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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74AUP1G885GN115 NXP USA Inc. 74AUP1G885.pdf Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCF85103C-2T/00:11 PCF85103C-2T/00:11 NXP USA Inc. PCF85103C-2.pdf Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68030CRC25C MC68030CRC25C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030CRC33C MC68030CRC33C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030FE16C MC68030FE16C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030FE20C MC68030FE20C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC16C MC68030RC16C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030RC25C MC68030RC25C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68030RC50C MC68030RC50C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68040RC25V NXP USA Inc. MC68040UM.pdf Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC33FS8500A0KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC33FS8500A0ESR2 MC33FS8500A0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MFS8600BMBA0ESR2 MFS8600BMBA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MFS8600BMDA0ESR2 MFS8600BMDA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MFS8600BMBA0ES MFS8600BMBA0ES NXP USA Inc. FS8600_SDS.pdf Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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10+12.84 EUR
25+11.9 EUR
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MFS8600BMDA0ES MFS8600BMDA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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PTN3393BS/F1Y PTN3393BS/F1Y NXP USA Inc. PTN3393.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Applications: DisplayPort
Voltage - Supply: 3.3V
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PTN3393BS/F1Y PTN3393BS/F1Y NXP USA Inc. PTN3393.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Applications: DisplayPort
Voltage - Supply: 3.3V
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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100+4.65 EUR
250+4.41 EUR
500+3.96 EUR
1000+3.34 EUR
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MC33FS6511CAER2 MC33FS6511CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6511CAE MC33FS6511CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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SPC5741PK1AKLQ8R SPC5741PK1AKLQ8R NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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T1014NXE7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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S912XEQ512J3VAG S912XEQ512J3VAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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LPC2290FBD144/01,5 LPC2290FBD144/01,5 NXP USA Inc. LPC2290.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
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BGA2802,115 BGA2802,115 NXP USA Inc. BGA2802.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
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BGA2802,115 BGA2802,115 NXP USA Inc. BGA2802.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
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BGA2800,115 BGA2800,115 NXP USA Inc. BGA2800.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
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BGA2800,115 BGA2800,115 NXP USA Inc. BGA2800.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
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BGA2874,115 BGA2874,115 NXP USA Inc. BGA2874.pdf Description: IC RF AMP GPS 0HZ-750MHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 750MHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 2.7V
Gain: 31dB
Current - Supply: 16.5mA
Noise Figure: 3.1dB
P1dB: 5dBm
Test Frequency: 500MHz
Supplier Device Package: 6-TSSOP
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MCTPTX1AK324 MCTPTX1AK324 NXP USA Inc. S32K3xx.pdf Description: S32K324 MOTOR CTRL REF DESING BO
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32K324
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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S32K324NHT1VMMST S32K324NHT1VMMST NXP USA Inc. S32K3xx.pdf Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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S32K324EHT1VMMSR NXP USA Inc. S32K3xx.pdf Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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S32K324NHT1VPBST NXP USA Inc. S32K3xx.pdf Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1VMMST S32K324EHT1VMMST NXP USA Inc. S32K3xx.pdf Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MMMST NXP USA Inc. S32K3xx.pdf Description: S32K324, 4MB FLASH, ARM M7 MULTI
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MPBST S32K324NHT1MPBST NXP USA Inc. S32K3xx.pdf Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1VPBST S32K324EHT1VPBST NXP USA Inc. S32K3xx.pdf Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1MMMST S32K324EHT1MMMST NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 4MB FLASH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1MPBSR S32K324EHT1MPBSR NXP USA Inc. S32K3xx.pdf Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MMMSR NXP USA Inc. S32K3xx.pdf Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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S32K324NHT1MPBIT NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MPBIR NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCSPTE1AK344 MCSPTE1AK344 NXP USA Inc. S32K3xx.pdf Description: EVAL BOARD FOR S32K344
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, MCU
auf Bestellung 3 Stücke:
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1+1868.84 EUR
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S32K322NHT0VPBST S32K322NHT0VPBST NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
auf Bestellung 385 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.84 EUR
10+24.5 EUR
25+22.92 EUR
100+22.11 EUR
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S32K322EHT0MPAST S32K322EHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K322, 2MB FLASH, 256K SRAM
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.59 EUR
10+26.73 EUR
25+25 EUR
100+23.12 EUR
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S32K341EHT0MPAST S32K341EHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K341, 1MB FLASH, LOCKSTEP COR
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
1+34.03 EUR
10+27.08 EUR
25+25.35 EUR
100+23.43 EUR
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S32K344-WB S32K344-WB NXP USA Inc. S32K3xx.pdf Description: S32K344-WB
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
auf Bestellung 2 Stücke:
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1+1799.64 EUR
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S32K311NHT0MLFST S32K311NHT0MLFST NXP USA Inc. S32K3xx.pdf Description: S32K311, CES, 48 LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1195 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.78 EUR
10+10.64 EUR
25+9.85 EUR
100+8.98 EUR
250+8.57 EUR
500+8.32 EUR
Mindestbestellmenge: 2 Stücke
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S32K311NHT0VLFSR S32K311NHT0VLFSR NXP USA Inc. S32K3xx.pdf Description: IC MCU 48LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K311NHT0VLFST NXP USA Inc. S32K3xx.pdf Description: IC MCU 48LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S32K311NHT0MPAST S32K311NHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K311, CES, 100 MAXQFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.32 EUR
10+11.84 EUR
50+10.46 EUR
100+10.03 EUR
480+9.32 EUR
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S32K312NHT0MPAST S32K312NHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K312 ARM CORTEX-M7, 120 MHZ,
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0VPBSR S32K312NHT0VPBSR NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0MPAIT S32K312NHT0MPAIT NXP USA Inc. S32K3xx.pdf Description: S32K312, 2MB FLASH, ISELED
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NVT0MPBST S32K312NVT0MPBST NXP USA Inc. S32K3xx.pdf Description: S32K312, 2MB FLASH, SINGLECORE
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K341NHT0VPASR S32K341NHT0VPASR NXP USA Inc. S32K3xx.pdf Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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A3M39SL039IAAT2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A5M39TG140T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A5M36TG140T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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74AUP1G885GN115 74AUP1G885.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCF85103C-2T/00:11 PCF85103C-2.pdf
PCF85103C-2T/00:11
Hersteller: NXP USA Inc.
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68030CRC25C MC68030UM.pdf
MC68030CRC25C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030CRC33C MC68030UM.pdf
MC68030CRC33C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030FE16C MC68030UM.pdf
MC68030FE16C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030FE20C MC68030UM.pdf
MC68030FE20C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC16C MC68030UM.pdf
MC68030RC16C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC25C MC68030UM.pdf
MC68030RC25C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC50C MC68030UM.pdf
MC68030RC50C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68040RC25V MC68040UM.pdf
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC33FS8500A0KSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS8500A0ESR2 FS84_FS85C_DS.pdf
MC33FS8500A0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS8600BMBA0ESR2 FS8600_SDS.pdf
MFS8600BMBA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8600BMDA0ESR2 FS8600_SDS.pdf
MFS8600BMDA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8600BMBA0ES FS8600_SDS.pdf
MFS8600BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+16.56 EUR
10+12.84 EUR
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MFS8600BMDA0ES FS8600_SDS.pdf?pspll=1
MFS8600BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+17.41 EUR
10+13.52 EUR
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PTN3393BS/F1Y PTN3393.pdf
PTN3393BS/F1Y
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Applications: DisplayPort
Voltage - Supply: 3.3V
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3393BS/F1Y PTN3393.pdf
PTN3393BS/F1Y
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Applications: DisplayPort
Voltage - Supply: 3.3V
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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4+6.33 EUR
10+5.68 EUR
25+5.37 EUR
100+4.65 EUR
250+4.41 EUR
500+3.96 EUR
1000+3.34 EUR
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MC33FS6511CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6511CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS6511CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6511CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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SPC5741PK1AKLQ8R MPC574xPFS.pdf
SPC5741PK1AKLQ8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1014NXE7KQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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S912XEQ512J3VAG MC9S12XEP100RMV1.pdf
S912XEQ512J3VAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2290FBD144/01,5 LPC2290.pdf
LPC2290FBD144/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGA2802,115 BGA2802.pdf
BGA2802,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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BGA2802,115 BGA2802.pdf
BGA2802,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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BGA2800,115 BGA2800.pdf
BGA2800,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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BGA2800,115 BGA2800.pdf
BGA2800,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
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53+0.39 EUR
63+0.33 EUR
67+0.32 EUR
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BGA2874,115 BGA2874.pdf
BGA2874,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-750MHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 750MHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 2.7V
Gain: 31dB
Current - Supply: 16.5mA
Noise Figure: 3.1dB
P1dB: 5dBm
Test Frequency: 500MHz
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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MCTPTX1AK324 S32K3xx.pdf
MCTPTX1AK324
Hersteller: NXP USA Inc.
Description: S32K324 MOTOR CTRL REF DESING BO
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32K324
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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1+986.24 EUR
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S32K324NHT1VMMST S32K3xx.pdf
S32K324NHT1VMMST
Hersteller: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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S32K324EHT1VMMSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1VPBST S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1VPBSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1VMMST S32K3xx.pdf
S32K324EHT1VMMST
Hersteller: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MMMST S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K324, 4MB FLASH, ARM M7 MULTI
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MPBST S32K3xx.pdf
S32K324NHT1MPBST
Hersteller: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1VPBST S32K3xx.pdf
S32K324EHT1VPBST
Hersteller: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1MMMST S32K3xx.pdf
S32K324EHT1MMMST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324EHT1MPBSR S32K3xx.pdf
S32K324EHT1MPBSR
Hersteller: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MMMSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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S32K324NHT1MPBIT S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K324NHT1MPBIR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCSPTE1AK344 S32K3xx.pdf
MCSPTE1AK344
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K344
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, MCU
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1868.84 EUR
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S32K322NHT0VPBST S32K3xx.pdf
S32K322NHT0VPBST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
auf Bestellung 385 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+30.84 EUR
10+24.5 EUR
25+22.92 EUR
100+22.11 EUR
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S32K322EHT0MPAST S32K3xx.pdf
S32K322EHT0MPAST
Hersteller: NXP USA Inc.
Description: S32K322, 2MB FLASH, 256K SRAM
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+33.59 EUR
10+26.73 EUR
25+25 EUR
100+23.12 EUR
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S32K341EHT0MPAST S32K3xx.pdf
S32K341EHT0MPAST
Hersteller: NXP USA Inc.
Description: S32K341, 1MB FLASH, LOCKSTEP COR
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 303 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+34.03 EUR
10+27.08 EUR
25+25.35 EUR
100+23.43 EUR
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S32K344-WB S32K3xx.pdf
S32K344-WB
Hersteller: NXP USA Inc.
Description: S32K344-WB
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1799.64 EUR
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S32K311NHT0MLFST S32K3xx.pdf
S32K311NHT0MLFST
Hersteller: NXP USA Inc.
Description: S32K311, CES, 48 LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1195 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.78 EUR
10+10.64 EUR
25+9.85 EUR
100+8.98 EUR
250+8.57 EUR
500+8.32 EUR
Mindestbestellmenge: 2 Stücke
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S32K311NHT0VLFSR S32K3xx.pdf
S32K311NHT0VLFSR
Hersteller: NXP USA Inc.
Description: IC MCU 48LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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S32K311NHT0VLFST S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 48LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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S32K311NHT0MPAST S32K3xx.pdf
S32K311NHT0MPAST
Hersteller: NXP USA Inc.
Description: S32K311, CES, 100 MAXQFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.32 EUR
10+11.84 EUR
50+10.46 EUR
100+10.03 EUR
480+9.32 EUR
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S32K312NHT0MPAST S32K3xx.pdf
S32K312NHT0MPAST
Hersteller: NXP USA Inc.
Description: S32K312 ARM CORTEX-M7, 120 MHZ,
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0VPBSR S32K3xx.pdf
S32K312NHT0VPBSR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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S32K312NHT0MPAIT S32K3xx.pdf
S32K312NHT0MPAIT
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ISELED
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NVT0MPBST S32K3xx.pdf
S32K312NVT0MPBST
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, SINGLECORE
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 143
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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S32K341NHT0VPASR S32K3xx.pdf
S32K341NHT0VPASR
Hersteller: NXP USA Inc.
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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