Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (37102) > Seite 490 nach 619
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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FS32K116LIT0VFMT | NXP USA Inc. |
 Description: IC MCU 32BIT 128KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| FD32K116BRT0VFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FH32K116BRT0VFMR | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FD32K116BRT0VFMR | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FH32K116LFT0MFMR | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K116BFT0MFMR | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FB32K116BRT0MFMR | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FH32K116BRT0VFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FH32K116LFT0VLFR | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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SPC5602SF2VLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 105 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912XES384F1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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IP4253CZ8-4-TTL132 | NXP USA Inc. |
Description: DATA LINE FILTER Packaging: Bulk |
auf Bestellung 5860 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S12ZVLS1AMFMR | NXP USA Inc. |
Description: S12Z CPU, 16K FLASH Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S9S12ZVLS1AMFM | NXP USA Inc. |
Description: S12Z CPU, 16K FLASH Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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S9S12ZVLS3AMFMR | NXP USA Inc. |
Description: S12Z CPU, 32K FLASH Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 18 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12ZVLS3AMFM | NXP USA Inc. |
Description: S12Z CPU, 32K FLASH Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 18 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| S912ZVLA12AMFM | NXP USA Inc. |
Description: S12Z CPU, 128K FLASH Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S912ZVLA12AMFMR | NXP USA Inc. |
Description: S12Z CPU, 128K FLASH Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S912ZVLA64AMFM | NXP USA Inc. |
Description: S12Z CPU, 64K FLASH Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S912ZVLA64AMFMR | NXP USA Inc. |
Description: S12Z CPU, 64K FLASH Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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74LVC14APW | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC14APW - INVERT Features: Schmitt Trigger Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 40 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MMA5248KW | NXP USA Inc. |
Description: IC SENSOR ACCELEROMETER 16QFN Packaging: Tube Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount Axis: X Acceleration Range: ±480g Voltage - Supply: 4.2V ~ 17V Bandwidth: 400Hz Supplier Device Package: 16-QFN (6x6) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MK10FN1M0VLQ12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 66x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 964 Stücke: Lieferzeit 10-14 Tag (e) |
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| MF1P2230DA8/00J | NXP USA Inc. |
Description: MIFARE PLUS EV1 Packaging: Tape & Reel (TR) Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Standards: Mifare, NFC Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 30000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MF1P2230DA4/00J | NXP USA Inc. |
Description: MIFARE PLUS EV1 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Standards: Mifare, NFC Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 17500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S912ZVMC25F1WKK557 | NXP USA Inc. |
Description: MAGNIV 16 BIT MCU, S12Z CORE, 25 Packaging: Bulk Package / Case: 80-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 80-TQFP-EP (12x12) Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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S912ZVMC25F1MKK557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| S912ZVMC25F1MKKR | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12Z CORE, 25 Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 80-TQFP-EP (12x12) Number of I/O: 31 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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S912ZVMC25F1VKK | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80TQFP Packaging: Tray Package / Case: 80-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 80-TQFP-EP (12x12) Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912ZVMC25F1MKK | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80TQFP Packaging: Tray Package / Case: 80-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 80-TQFP-EP (12x12) Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S12XS128J1CAE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912XEQ384J3MAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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PCA9306DC1/DG,125 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-VSSOP Features: Auto-Direction Sensing Packaging: Tape & Reel (TR) Package / Case: 8-VFSOP (0.091", 2.30mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-VSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S12XA512CAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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LS1046AXE8Q1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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UBA2024AT/N1,518 | NXP USA Inc. |
Description: HALF BRIDGE BASED PERIPHERAL DRI Packaging: Bulk |
auf Bestellung 2428 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2024AP_N1112 | NXP USA Inc. |
Description: HALF-BRIDGE POWER FOR CFL LAMPS Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| UBA2024BT/N1118 | NXP USA Inc. |
Description: HALF-BRIDGE POWER FOR CFL LAMPS Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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LS1012ASE7EKA | NXP USA Inc. |
Description: IC MPU QORIQ 600MHZ 211FCLGA Packaging: Tray Package / Case: 211-VFLGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 211-FCLGA (9.6x9.6) Ethernet: GbE (2) USB: USB 2.0 (1), USB 3.0 + PHY Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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BLF7G24LS-140,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V SOT502B Packaging: Bulk Package / Case: SOT-502B Current Rating (Amps): 28A Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.4GHz Power - Output: 30W Gain: 18.5dB Technology: LDMOS Supplier Device Package: SOT502B Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.3 A |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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MC44BC375UAEF | NXP USA Inc. |
Description: IC VIDEO MODULATOR 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Function: Modulator Voltage - Supply: 4.5V ~ 5.5V Applications: Consumer Video Standards: NTSC Supplier Device Package: 16-SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC44BC375UAEFR2 | NXP USA Inc. |
Description: IC VIDEO MODULATOR 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Function: Modulator Voltage - Supply: 4.5V ~ 5.5V Applications: Consumer Video Standards: NTSC Supplier Device Package: 16-SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33PF8200DEESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PR Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33PF8200DFESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PR Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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FS32K146HFT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33PF8200DFES | NXP USA Inc. |
Description: I.MX8QXP WITH DDR3L Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC56F8246MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 48KB (24K x 16) RAM Size: 3K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 10x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MC33FS8510B6KSR2 | NXP USA Inc. |
Description: FS8500 C0 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33FS8510C4KSR2 | NXP USA Inc. |
Description: FS8500 C0 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33FS8510A2ESR2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8500 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33FS8500A0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
 |
MC33FS8500A0ES | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MC33FS8530A0ESR2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8500 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33FS8510C4KS | NXP USA Inc. |
Description: FS8500 C0 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33FS8510B6KS | NXP USA Inc. |
Description: FS8500 C0 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MC33FS8510A2ES | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8500 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
 |
LPC5512JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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 |
LPC5512JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64TQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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 |
LPC5512JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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 |
MC34PF1550A6EPR2 | NXP USA Inc. |
Description: PF1550 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| FS32K116LIT0VFMT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FD32K116BRT0VFMT |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FD32K116BRT0VFMR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FH32K116LFT0MFMR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FB32K116BFT0MFMR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FB32K116BRT0MFMR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FH32K116LFT0VLFR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5602SF2VLQ6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XES384F1MAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| IP4253CZ8-4-TTL132 |
|
auf Bestellung 5860 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.19 EUR |
| S9S12ZVLS1AMFMR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12ZVLS1AMFM |
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
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| S9S12ZVLS3AMFMR |
|
Hersteller: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 4.49 EUR |
| S9S12ZVLS3AMFM |
|
Hersteller: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Description: S12Z CPU, 32K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVLA12AMFM |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVLA12AMFMR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVLA64AMFM |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVLA64AMFMR |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
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| 74LVC14APW |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA5248KW |
|
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±480g
Voltage - Supply: 4.2V ~ 17V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±480g
Voltage - Supply: 4.2V ~ 17V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Produkt ist nicht verfügbar
Mindestbestellmenge: 75 Stücke
Im Einkaufswagen
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| MK10FN1M0VLQ12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 66x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 66x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 964 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.13 EUR |
| 10+ | 22.48 EUR |
| 60+ | 21.57 EUR |
| 120+ | 21.27 EUR |
| MF1P2230DA8/00J |
|
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Mindestbestellmenge: 30000 Stücke
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| MF1P2230DA4/00J |
|
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Mindestbestellmenge: 17500 Stücke
Im Einkaufswagen
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| S912ZVMC25F1WKK557 |
Hersteller: NXP USA Inc.
Description: MAGNIV 16 BIT MCU, S12Z CORE, 25
Packaging: Bulk
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: MAGNIV 16 BIT MCU, S12Z CORE, 25
Packaging: Bulk
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S912ZVMC25F1MKK557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S912ZVMC25F1MKKR |
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 25
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
Description: MAGNIV 16-BIT MCU, S12Z CORE, 25
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| S912ZVMC25F1VKK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S912ZVMC25F1MKK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S9S12XS128J1CAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S912XEQ384J3MAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| PCA9306DC1/DG,125 |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9S12XA512CAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| LS1046AXE8Q1A |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| UBA2024AT/N1,518 |
|
auf Bestellung 2428 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 325+ | 1.83 EUR |
| LS1012ASE7EKA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 600MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 600MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BLF7G24LS-140,112 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V SOT502B
Packaging: Bulk
Package / Case: SOT-502B
Current Rating (Amps): 28A
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 30W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.3 A
Description: RF MOSFET LDMOS 28V SOT502B
Packaging: Bulk
Package / Case: SOT-502B
Current Rating (Amps): 28A
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 30W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.3 A
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 134.82 EUR |
| MC44BC375UAEF |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MODULATOR 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: Modulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Consumer Video
Standards: NTSC
Supplier Device Package: 16-SOIC
Description: IC VIDEO MODULATOR 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: Modulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Consumer Video
Standards: NTSC
Supplier Device Package: 16-SOIC
Produkt ist nicht verfügbar
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| MC44BC375UAEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MODULATOR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: Modulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Consumer Video
Standards: NTSC
Supplier Device Package: 16-SOIC
Description: IC VIDEO MODULATOR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: Modulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Consumer Video
Standards: NTSC
Supplier Device Package: 16-SOIC
Produkt ist nicht verfügbar
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| MC33PF8200DEESR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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| MC33PF8200DFESR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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| FS32K146HFT0VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC33PF8200DFES |
|
Hersteller: NXP USA Inc.
Description: I.MX8QXP WITH DDR3L
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: I.MX8QXP WITH DDR3L
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC56F8246MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC33FS8510B6KSR2 |
|
Hersteller: NXP USA Inc.
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MC33FS8510C4KSR2 |
|
Hersteller: NXP USA Inc.
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MC33FS8510A2ESR2 |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MC33FS8500A0KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC33FS8500A0ES |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC33FS8530A0ESR2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MC33FS8510C4KS |
|
Hersteller: NXP USA Inc.
Description: FS8500 C0
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: FS8500 C0
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC33FS8510B6KS |
|
Hersteller: NXP USA Inc.
Description: FS8500 C0
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: FS8500 C0
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC33FS8510A2ES |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| LPC5512JBD64Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 4.97 EUR |
| LPC5512JBD64K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.4 EUR |
| 10+ | 6.38 EUR |
| 50+ | 5.57 EUR |
| 100+ | 5.32 EUR |
| 500+ | 4.89 EUR |
| LPC5512JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 5.8 EUR |
| MC34PF1550A6EPR2 |
|
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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