Technische Details XC56309AG100AR2
Description: IC DSP 24BIT 100MHZ 144-LQFP, Packaging: Tape & Reel (TR), Package / Case: 144-LQFP, Mounting Type: Surface Mount, Interface: Host Interface, SSI, SCI, Type: Fixed Point, Operating Temperature: -40°C ~ 105°C (TJ), Non-Volatile Memory: ROM (576B), On-Chip RAM: 24kB, Voltage - I/O: 3.30V, Voltage - Core: 3.30V, Clock Rate: 100MHz, Supplier Device Package: 144-LQFP (20x20).
Weitere Produktangebote XC56309AG100AR2
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
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XC56309AG100AR2 | NXP USA Inc. |
Description: IC DSP 24BIT 100MHZ 144-LQFPPackaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 144-LQFP (20x20) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH |
| XC56309AG100AR2 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH


