Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35729) > Seite 491 nach 596
| Foto | Bezeichnung | Hersteller | Beschreibung |
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FRDM665SPIEVB | NXP USA Inc. |
Description: MC33665A SPI EVAL BOARD Packaging: Box Function: CANbus Type: Interface Utilized IC / Part: MC33665A Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F82748VLH | NXP USA Inc. |
 Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 16x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1519 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFT18HW355SR5,178 | NXP USA Inc. |
Description: RF POWER FIELD-EFFECT TRANSISTOR Packaging: Bulk |
Produkt ist nicht verfügbar |
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| AFT18HW355SR5 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4387CX4/P,315 | NXP USA Inc. |
Description: TVS DIODE 8VWM 13VC 4WLCSP Packaging: Bulk Package / Case: 4-WFBGA, WLCSP Mounting Type: Surface Mount Type: Zener Operating Temperature: -35°C ~ 85°C (TA) Applications: General Purpose Capacitance @ Frequency: 290pF @ 1MHz Current - Peak Pulse (10/1000µs): 33A (8/20µs) Voltage - Reverse Standoff (Typ): 8V (Max) Supplier Device Package: 4-WLCSP (0.76x0.76) Unidirectional Channels: 1 Voltage - Breakdown (Min): 10V Voltage - Clamping (Max) @ Ipp: 13V Power Line Protection: No |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B24/LF1R | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW SOT23 Tolerance: ±2% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 70 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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MRF6V3090NBR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO272-4 Packaging: Tape & Reel (TR) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 18W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 350 mA |
Produkt ist nicht verfügbar |
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74ABT2245DB,118 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20SSOP Packaging: Bulk Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 12mA Supplier Device Package: 20-SSOP |
auf Bestellung 3988 Stücke: Lieferzeit 10-14 Tag (e) |
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MC32PF3000A3EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5675KFK0MJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF7755HV/N205W/CY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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TEA2017DK1007 | NXP USA Inc. |
Description: TEA2017AAT/3 PROGRAM BOARD Packaging: Bulk For Use With/Related Products: TEA2017 Type: Programmer Contents: Board(s) Utilized IC / Part: TEA2017 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA2016DK1008 | NXP USA Inc. |
Description: TEA20XX SOCKET DB1586 BOARD Packaging: Bulk For Use With/Related Products: TEA2016 Type: Programmer Contents: Board(s), Accessories Utilized IC / Part: TEA2016 |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5775BSK3MME2R | NXP USA Inc. |
Description: NXP 32-BIT MCU, 4MB FLASH FCACS Packaging: Tape & Reel (TR) Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI Peripherals: DMA, LVD, POR Supplier Device Package: 416-MAPBGA (27x27) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SPC5775BSK3MME2 | NXP USA Inc. |
Description: NXP 32-BIT MCU, 4MB FLASH FCACS Packaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI Peripherals: DMA, LVD, POR Supplier Device Package: 416-MAPBGA (27x27) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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SPC5775EDK3MME3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA Packaging: Tape & Reel (TR) Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 40x12b eQADCx2 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Number of I/O: 293 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SAF775DHN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/KY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF7751HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHN/N208W/MP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208WY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF7754HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF7751HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/DY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHN/N208WAMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/CY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHN/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/DK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/AY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/CK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF7754HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/AK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF775DHV/N208W/BY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MHW8188AN | NXP USA Inc. |
Description: IC AMP CATV 7-CATV MODULE Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: 7-CATV Module Number of Circuits: 1 Current - Supply: 425 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| BSC9131NSE1KHKB | NXP USA Inc. |
Description: QORIQ QONVERGE MULTICORE BASEBAN Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294KCK0MJDT | NXP USA Inc. |
Description: IC MCU Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294KAK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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FS32R294KCK0MJDR | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| FS32R294KAK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294JCK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 269LFBGA Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount RAM Size: 5.5M x 8 Program Memory Type: ROMless Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Peripherals: Temp Sensor Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
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| FS32R294JAK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294JAK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294JCK0MJDR | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294HBK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294HBK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294LBK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294LBK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294LAK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 3MB 269LFBGA Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FS32R294LAK0MJDR | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| OM5578/PN7150ARD | NXP USA Inc. |
Description: DEV KIT PN7150 PLUG/PLAY NFC CTL Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MC9S08AC128CFUE | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9RS08KA8CPJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20DIP Packaging: Bulk Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-DIP Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 518 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XDG128F2CAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MFS8623BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 36V Applications: Camera Supplier Device Package: 48-QFN (7x7) |
Produkt ist nicht verfügbar |
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MCF5280CVF66 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 142 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S32G378ASAK1VUCT | NXP USA Inc. |
Description: MICROPROCESSORS - MPU 4X CORTEX- Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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S32G378ASAK1VUCR | NXP USA Inc. |
Description: MICROPROCESSORS - MPU 4X CORTEX- Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| FRDM665SPIEVB |
Hersteller: NXP USA Inc.
Description: MC33665A SPI EVAL BOARD
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Description: MC33665A SPI EVAL BOARD
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 488.17 EUR |
| MC56F82748VLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1519 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.81 EUR |
| 10+ | 9.18 EUR |
| 25+ | 8.53 EUR |
| 160+ | 7.62 EUR |
| 320+ | 7.59 EUR |
| AFT18HW355SR5 |
|
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 432.12 EUR |
| IP4387CX4/P,315 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 8VWM 13VC 4WLCSP
Packaging: Bulk
Package / Case: 4-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -35°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 290pF @ 1MHz
Current - Peak Pulse (10/1000µs): 33A (8/20µs)
Voltage - Reverse Standoff (Typ): 8V (Max)
Supplier Device Package: 4-WLCSP (0.76x0.76)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 13V
Power Line Protection: No
Description: TVS DIODE 8VWM 13VC 4WLCSP
Packaging: Bulk
Package / Case: 4-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -35°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 290pF @ 1MHz
Current - Peak Pulse (10/1000µs): 33A (8/20µs)
Voltage - Reverse Standoff (Typ): 8V (Max)
Supplier Device Package: 4-WLCSP (0.76x0.76)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 13V
Power Line Protection: No
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3806+ | 0.13 EUR |
| BZX84-B24/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6V3090NBR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT2245DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 12mA
Supplier Device Package: 20-SSOP
Description: IC TXRX NON-INVERT 5.5V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 12mA
Supplier Device Package: 20-SSOP
auf Bestellung 3988 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1110+ | 0.45 EUR |
| MC32PF3000A3EP |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.83 EUR |
| 10+ | 9.13 EUR |
| 25+ | 8.46 EUR |
| 100+ | 7.71 EUR |
| SPC5675KFK0MJM2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA2017DK1007 |
|
Hersteller: NXP USA Inc.
Description: TEA2017AAT/3 PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Utilized IC / Part: TEA2017
Description: TEA2017AAT/3 PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Utilized IC / Part: TEA2017
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 82.68 EUR |
| TEA2016DK1008 |
|
Hersteller: NXP USA Inc.
Description: TEA20XX SOCKET DB1586 BOARD
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Accessories
Utilized IC / Part: TEA2016
Description: TEA20XX SOCKET DB1586 BOARD
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Accessories
Utilized IC / Part: TEA2016
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 82.68 EUR |
| SPC5775BSK3MME2R |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5775BSK3MME2 |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5775EDK3MME3R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MHW8188AN |
|
Hersteller: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294KCK0MJDT |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294KAK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294KCK0MJDR |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294KAK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294JCK0MJDT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294JAK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294JAK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294HBK0MJDT |
|
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294HBK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294LBK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294LBK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R294LAK0MJDT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
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| FS32R294LAK0MJDR |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
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| MC9S08AC128CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC9RS08KA8CPJ |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 518+ | 1.71 EUR |
| S912XDG128F2CAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MFS8623BMBA0ES |
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF5280CVF66 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S32G378ASAK1VUCT |
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Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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| S32G378ASAK1VUCR |
|
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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