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BGA2712,115 BGA2712,115 NXP USA Inc. BGA2712_Rev_Nov2010.pdf Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK51DX256CLK7 NXP USA Inc. FSCLS07731-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
28+19.22 EUR
Mindestbestellmenge: 28
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PCA9509D,118 PCA9509D,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCA9509D,118 PCA9509D,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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SPC5607BAVLQ6R SPC5607BAVLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32G398ASCK1VUCR S32G398ASCK1VUCR NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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S32G399ASCK1VUCT NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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S32G398ASCK1VUCT S32G398ASCK1VUCT NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MKL04Z8VLC4R MKL04Z8VLC4R NXP USA Inc. KL04P48M48SF1.pdf Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
145+3.49 EUR
Mindestbestellmenge: 145
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MC9S08QD2CSC MC9S08QD2CSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 7350 Stücke:
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4+5.02 EUR
10+3.92 EUR
98+3.21 EUR
588+3.14 EUR
1078+2.65 EUR
2548+2.52 EUR
5096+2.42 EUR
Mindestbestellmenge: 4
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S912ZVML64F1WKH557 S912ZVML64F1WKH557 NXP USA Inc. FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0CLH S9S08LG32J0CLH NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UBA2024P/N1,112 UBA2024P/N1,112 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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295+1.71 EUR
Mindestbestellmenge: 295
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UBA2024P/N1,112 UBA2024P/N1,112 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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AFT05MP075N-54M NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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P1016NSE5DFB NXP USA Inc. Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
auf Bestellung 2155 Stücke:
Lieferzeit 10-14 Tag (e)
5+127.21 EUR
Mindestbestellmenge: 5
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MC9S08AC96MFUE MC9S08AC96MFUE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P82B96DPZ P82B96DPZ NXP USA Inc. P82B96.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 2266 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.60 EUR
10+5.00 EUR
25+4.60 EUR
100+4.16 EUR
250+3.95 EUR
500+3.82 EUR
1000+3.72 EUR
Mindestbestellmenge: 3
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PCA9671PW118 PCA9671PW118 NXP USA Inc. PCA9671.pdf Description: IC I/O EXPANDER I2C 16B 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9501D,118 PCA9501D,118 NXP USA Inc. PCA9501.pdf Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Packaging: Tape & Reel (TR)
Features: EEPROM, POR
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 20440 Stücke:
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374+2.36 EUR
Mindestbestellmenge: 374
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PCA9509AGM,125 PCA9509AGM,125 NXP USA Inc. PCA9509A.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCF85053ATK-ARD PCF85053ATK-ARD NXP USA Inc. PCF85053ATK-ARD.pdf Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
auf Bestellung 8 Stücke:
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1+162.76 EUR
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74ABT827D,623 74ABT827D,623 NXP USA Inc. 74ABT827.pdf Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ABT827D,623 74ABT827D,623 NXP USA Inc. 74ABT827.pdf Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX258CJM4A557 NXP USA Inc. IMX25CEC.pdf Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX258CVM4 MCIMX258CVM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Produkt ist nicht verfügbar
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FS32K118LFT0MLFT FS32K118LFT0MLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6D7CVT08AD MCIMX6D7CVT08AD NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 634 Stücke:
Lieferzeit 10-14 Tag (e)
1+129.25 EUR
10+107.46 EUR
60+97.97 EUR
120+95.40 EUR
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SC550372MFU42R2 NXP USA Inc. Description: IC
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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WPR1500-HV NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Utilized IC / Part: WPR1516
Contents: Board(s)
Produkt ist nicht verfügbar
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WPR1500-LDO WPR1500-LDO NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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WPR1500-BUCK NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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MCIMX512CJM6C MCIMX512CJM6C NXP USA Inc. IMX51CONINDFS.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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S912ZVML32F3WKHR S912ZVML32F3WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HTMS1001FUG/AM,026 NXP USA Inc. HTMS1x01,%20HTMS8x01_Web.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MKM33Z64CLL5 MKM33Z64CLL5 NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKM35Z512VLL7R MKM35Z512VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
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MKM35Z256VLL7R MKM35Z256VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
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SPC5747CK1CMJ2 SPC5747CK1CMJ2 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5747CK1CMJ2R SPC5747CK1CMJ2R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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MC56F82743VFM MC56F82743VFM NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MMA5212AKWR2 NXP USA Inc. MMA52xxAKW.pdf Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
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MC9S12E256VPVE MC9S12E256VPVE NXP USA Inc. FSCLS07687-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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MRF6V2010NBR5 MRF6V2010NBR5 NXP USA Inc. MRF6V2010N.pdf Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
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S32G274ASBK1VUCR S32G274ASBK1VUCR NXP USA Inc. S32G2.pdf Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Part Status: Active
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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LPC865M201JBD64/0E LPC865M201JBD64/0E NXP USA Inc. LPC86x.pdf Description: IC MCU CORTEX M0+ LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
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PN5120A0HN/C2,551 PN5120A0HN/C2,551 NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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S9S08SG4E2CSC S9S08SG4E2CSC NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
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MC34PF1550A6EP MC34PF1550A6EP NXP USA Inc. PF1550DS.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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LPC1114FHN33/301:5 LPC1114FHN33/301:5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1114FHN33/301:5 LPC1114FHN33/301:5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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74LVCH16541ADGG112 74LVCH16541ADGG112 NXP USA Inc. 74LVCH16541A.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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LPC5516JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
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LPC5516JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
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TDF19972AEL/C1E NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19972BEL/C1Y NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
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TDF19972BEL/C1E NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MSC8151SAG1000B MSC8151SAG1000B NXP USA Inc. MSC8151.pdf Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9675PW,118 PCA9675PW,118 NXP USA Inc. PCA9675.pdf Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9675PW,118 PCA9675PW,118 NXP USA Inc. PCA9675.pdf Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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BGA2712,115 BGA2712_Rev_Nov2010.pdf
BGA2712,115
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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MK51DX256CLK7 FSCLS07731-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
28+19.22 EUR
Mindestbestellmenge: 28
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PCA9509D,118 PCA9509.pdf
PCA9509D,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCA9509D,118 PCA9509.pdf
PCA9509D,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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SPC5607BAVLQ6R MPC560XBFAMFS.pdf
SPC5607BAVLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32G398ASCK1VUCR S32G2.pdf
S32G398ASCK1VUCR
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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S32G399ASCK1VUCT S32G2.pdf
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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S32G398ASCK1VUCT S32G2.pdf
S32G398ASCK1VUCT
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MKL04Z8VLC4R KL04P48M48SF1.pdf
MKL04Z8VLC4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
145+3.49 EUR
Mindestbestellmenge: 145
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MC9S08QD2CSC MC9S08QD4.pdf
MC9S08QD2CSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 7350 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.02 EUR
10+3.92 EUR
98+3.21 EUR
588+3.14 EUR
1078+2.65 EUR
2548+2.52 EUR
5096+2.42 EUR
Mindestbestellmenge: 4
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S912ZVML64F1WKH557 FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw
S912ZVML64F1WKH557
Hersteller: NXP USA Inc.
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0CLH MC9S08LG32.pdf
S9S08LG32J0CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UBA2024P/N1,112 UBA2024.pdf
UBA2024P/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
auf Bestellung 335266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
295+1.71 EUR
Mindestbestellmenge: 295
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UBA2024P/N1,112 UBA2024.pdf
UBA2024P/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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AFT05MP075N-54M AFT05MP075N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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P1016NSE5DFB
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
auf Bestellung 2155 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+127.21 EUR
Mindestbestellmenge: 5
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MC9S08AC96MFUE MC9S08AC128.pdf
MC9S08AC96MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P82B96DPZ P82B96.pdf
P82B96DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 2266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.60 EUR
10+5.00 EUR
25+4.60 EUR
100+4.16 EUR
250+3.95 EUR
500+3.82 EUR
1000+3.72 EUR
Mindestbestellmenge: 3
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PCA9671PW118 PCA9671.pdf
PCA9671PW118
Hersteller: NXP USA Inc.
Description: IC I/O EXPANDER I2C 16B 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9501D,118 PCA9501.pdf
PCA9501D,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Packaging: Tape & Reel (TR)
Features: EEPROM, POR
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 20440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
374+2.36 EUR
Mindestbestellmenge: 374
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PCA9509AGM,125 PCA9509A.pdf
PCA9509AGM,125
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCF85053ATK-ARD PCF85053ATK-ARD.pdf
PCF85053ATK-ARD
Hersteller: NXP USA Inc.
Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+162.76 EUR
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74ABT827D,623 74ABT827.pdf
74ABT827D,623
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ABT827D,623 74ABT827.pdf
74ABT827D,623
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX258CJM4A557 IMX25CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX258CVM4 IMX25CEC.pdf
MCIMX258CVM4
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Produkt ist nicht verfügbar
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FS32K118LFT0MLFT S32K1xx.pdf
FS32K118LFT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6D7CVT08AD IMX6DQIEC.pdf
MCIMX6D7CVT08AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 634 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+129.25 EUR
10+107.46 EUR
60+97.97 EUR
120+95.40 EUR
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SC550372MFU42R2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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WPR1500-HV
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Utilized IC / Part: WPR1516
Contents: Board(s)
Produkt ist nicht verfügbar
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WPR1500-LDO
WPR1500-LDO
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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WPR1500-BUCK
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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MCIMX512CJM6C IMX51CONINDFS.pdf
MCIMX512CJM6C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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S912ZVML32F3WKHR S12ZVMFS.pdf
S912ZVML32F3WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HTMS1001FUG/AM,026 HTMS1x01,%20HTMS8x01_Web.pdf
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MKM33Z64CLL5 MKMxxZxxCxx5.pdf
MKM33Z64CLL5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKM35Z512VLL7R KM35P144M75SF0.pdf
MKM35Z512VLL7R
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+11.11 EUR
Mindestbestellmenge: 1000
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MKM35Z256VLL7R KM35P144M75SF0.pdf
MKM35Z256VLL7R
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Produkt ist nicht verfügbar
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SPC5747CK1CMJ2 MPC5748G.pdf
SPC5747CK1CMJ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5747CK1CMJ2R MPC5748G.pdf
SPC5747CK1CMJ2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F82743VFM MC56F827XXDS.pdf
MC56F82743VFM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.60 EUR
10+8.99 EUR
25+8.34 EUR
100+7.62 EUR
490+7.38 EUR
Mindestbestellmenge: 2
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MMA5212AKWR2 MMA52xxAKW.pdf
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S12E256VPVE FSCLS07687-1.pdf?t.download=true&u=5oefqw
MC9S12E256VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+40.78 EUR
Mindestbestellmenge: 13
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MRF6V2010NBR5 MRF6V2010N.pdf
MRF6V2010NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
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S32G274ASBK1VUCR S32G2.pdf
S32G274ASBK1VUCR
Hersteller: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Part Status: Active
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC865M201JBD64/0E LPC86x.pdf
LPC865M201JBD64/0E
Hersteller: NXP USA Inc.
Description: IC MCU CORTEX M0+ LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.38 EUR
10+2.72 EUR
25+2.57 EUR
160+2.27 EUR
Mindestbestellmenge: 5
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PN5120A0HN/C2,551 PN512.pdf
PN5120A0HN/C2,551
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 337 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.36 EUR
10+14.27 EUR
25+13.03 EUR
80+11.74 EUR
230+10.78 EUR
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S9S08SG4E2CSC MC9S08SG8.pdf
S9S08SG4E2CSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34PF1550A6EP PF1550DS.pdf
MC34PF1550A6EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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LPC1114FHN33/301:5 LPC111X.pdf
LPC1114FHN33/301:5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+3.51 EUR
Mindestbestellmenge: 4000
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LPC1114FHN33/301:5 LPC111X.pdf
LPC1114FHN33/301:5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 5224 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.53 EUR
10+4.94 EUR
25+4.54 EUR
100+4.10 EUR
250+3.90 EUR
500+3.77 EUR
1000+3.67 EUR
Mindestbestellmenge: 3
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74LVCH16541ADGG112 74LVCH16541A.pdf
74LVCH16541ADGG112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 312 Stücke:
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Anzahl Preis
312+1.62 EUR
Mindestbestellmenge: 312
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LPC5516JBD100Y LPC55S1x_LPC551x_DS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Produkt ist nicht verfügbar
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LPC5516JBD100Y LPC55S1x_LPC551x_DS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.94 EUR
10+9.07 EUR
25+8.89 EUR
50+8.83 EUR
100+7.92 EUR
250+7.89 EUR
500+7.40 EUR
Mindestbestellmenge: 2
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TDF19972AEL/C1E
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19972BEL/C1Y
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19972BEL/C1E
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MSC8151SAG1000B MSC8151.pdf
MSC8151SAG1000B
Hersteller: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1671 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.40 EUR
10+3.28 EUR
25+3.00 EUR
100+2.69 EUR
250+2.55 EUR
500+2.46 EUR
1000+2.38 EUR
Mindestbestellmenge: 4
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