Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34508) > Seite 497 nach 576
Foto | Bezeichnung | Hersteller | Beschreibung |
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FS32K116BRT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BA891,115 | NXP USA Inc. |
Description: DIODE STANDARD 35V 715MW SOD523 Packaging: Tape & Reel (TR) Package / Case: SC-79, SOD-523 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-523 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 715 mW |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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BA891,115 | NXP USA Inc. |
Description: DIODE STANDARD 35V 715MW SOD523 Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-523 Part Status: Active Current - Max: 100 mA Power Dissipation (Max): 715 mW |
auf Bestellung 10942 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8343CZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8343CZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
Produkt ist nicht verfügbar |
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S912XEP768W1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS2088AXN7TTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SATA: SATA 6Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
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MMA25312BT1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN Packaging: Tape & Reel (TR) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax, WLAN Voltage - Supply: 3V ~ 5V Gain: 26dB Current - Supply: 124mA Noise Figure: 3.8dB P1dB: 31dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MMA25312BT1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN Packaging: Cut Tape (CT) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax, WLAN Voltage - Supply: 3V ~ 5V Gain: 26dB Current - Supply: 124mA Noise Figure: 3.8dB P1dB: 31dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC56F83783AVLHA | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I²C, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F83783AMLHA | NXP USA Inc. |
Description: 32-BIT DSC, 56800EX CORE, 256KB Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
Produkt ist nicht verfügbar |
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FXLS93733AESR2 | NXP USA Inc. |
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) Part Status: Active |
Produkt ist nicht verfügbar |
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FS32K116LIT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128MB FLASH 32VFQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 43 |
Produkt ist nicht verfügbar |
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FX32K116LAT0MFMT | NXP USA Inc. |
Description: S32K116 ARM CORTEX-M0+, 48 MHZ, Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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FB32K116BFT0MFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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FH32K116LAT0MFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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FB32K116BRT0MFMT | NXP USA Inc. |
Description: S32K116, M0+, FLASH 128K, RAM 17 Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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FH32K116LFT0MFMT | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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NCX2200GS125 | NXP USA Inc. |
Description: SINGLE LOW VOLTAGE COMPARATOR Packaging: Bulk Part Status: Active |
auf Bestellung 744606 Stücke: Lieferzeit 10-14 Tag (e) |
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NCX2202GM | NXP USA Inc. |
Description: LOW VOLTAGE COMPARATOR; OPEN-DRA Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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NCX2220GU,115 | NXP USA Inc. |
Description: IC COMPARATOR 2 GEN PUR 8DFN Packaging: Bulk Package / Case: 8-XFDFN Exposed Pad Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: DFN1714-8 Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Obsolete |
auf Bestellung 81829 Stücke: Lieferzeit 10-14 Tag (e) |
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NCX2220GT,115 | NXP USA Inc. |
Description: IC COMPARATOR 2 GEN PUR 8XSON Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): 68mA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 9mV Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MKM34Z128ACLL5557 | NXP USA Inc. |
Description: KINETIS KM34: 50MHZ CORTEX-M0+ M Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SA606DK/01,118 | NXP USA Inc. |
Description: IC MIXER 150MHZ UP CONVRT 20SSOP Packaging: Tape & Reel (TR) Package / Case: 20-LSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 150MHz RF Type: Cellular, ASK, FSK, VHF Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 3.5mA Secondary Attributes: Up Converter Noise Figure: 6.2dB Number of Mixers: 2 Supplier Device Package: 20-SSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KW45Z41083AFPBT | NXP USA Inc. |
Description: K4W1 HVQFN40 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Part Status: Active Number of I/O: 22 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41082AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41052AFPBT | NXP USA Inc. |
Description: K4W1 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Part Status: Active Number of I/O: 22 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41082AFPBT | NXP USA Inc. |
Description: K4W1 HVQFN40 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Part Status: Active Number of I/O: 22 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41053AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41083AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41053AFPBT | NXP USA Inc. |
Description: K4W1 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Part Status: Active Number of I/O: 22 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KW45Z41052AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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SAF3560HV/V1106Y | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Memory Size: 512kB SDRAM Type: TxRx Only Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V Supplier Device Package: 144-HLQFP (20x20) Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LX2160XC72232B | NXP USA Inc. |
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Part Status: Active |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075D-Q100118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075PW118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 13880 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075PW-Q100118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 1911 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075N,652 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC4075DB,112 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 5398 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075DB,112 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC4075DB,118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SSOP Packaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC4075DB,118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SSOP Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK663R7-75C,118 | NXP USA Inc. |
Description: PFET, 120A I(D), 75V, 0.0058OHM, Packaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V Power Dissipation (Max): 306W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: D2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 75 V Gate Charge (Qg) (Max) @ Vgs: 234 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 15450 pF @ 25 V |
Produkt ist nicht verfügbar |
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SAF4000EL/101Z233Y | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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TEA2095DB1574 | NXP USA Inc. |
Description: TEA2095DB1574 Packaging: Bulk Function: Rectifier Controller Type: Power Management Supplied Contents: Board(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
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TEA2208DB1576 | NXP USA Inc. |
Description: IC POWER MGMT Packaging: Bulk Function: Rectifier Controller Type: Power Management Utilized IC / Part: TEA2208T Supplied Contents: Board(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
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LPC1764FBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 1785 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1764FBD100,551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Discontinued at Digi-Key Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8006VLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1027 Stücke: Lieferzeit 10-14 Tag (e) |
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A3I35D025WNR1 | NXP USA Inc. |
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB Packaging: Cut Tape (CT) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 3.2GHz ~ 4GHz RF Type: General Purpose Voltage - Supply: 28V Gain: 30.5dB P1dB: 42.6dBm Test Frequency: 3.8GHz ~ 4GHz Supplier Device Package: TO-270WB-17 Part Status: Active |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJA1021BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJA1021AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 4949 Stücke: Lieferzeit 10-14 Tag (e) |
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P4040NSE7MMC | NXP USA Inc. |
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (8), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BFU520X235 | NXP USA Inc. |
Description: NPN RF TRANSISTOR Packaging: Bulk Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU520X215 | NXP USA Inc. |
Description: NPN RF TRANSISTOR Packaging: Bulk Part Status: Active |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT3G07GD,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
Produkt ist nicht verfügbar |
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KTY82/121,235 | NXP USA Inc. |
Description: THERMISTOR PTC 990 OHM TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 990 Ohms |
Produkt ist nicht verfügbar |
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KTY82/121,235 | NXP USA Inc. |
Description: THERMISTOR PTC 990 OHM TO236AB Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 990 Ohms |
Produkt ist nicht verfügbar |
FS32K116BRT0MLFT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BA891,115 |
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 0.1 EUR |
6000+ | 0.09 EUR |
BA891,115 |
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
auf Bestellung 10942 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
30+ | 0.6 EUR |
37+ | 0.48 EUR |
44+ | 0.4 EUR |
100+ | 0.26 EUR |
250+ | 0.2 EUR |
500+ | 0.17 EUR |
1000+ | 0.11 EUR |
MPC8343CZQADDB |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 80.83 EUR |
MPC8343CZQADDB |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
S912XEP768W1CAG |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LS2088AXN7TTB |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
MMA25312BT1 |
Hersteller: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
MMA25312BT1 |
Hersteller: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC56F83783AVLHA |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F83783AMLHA |
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Produkt ist nicht verfügbar
FXLS93733AESR2 |
Hersteller: NXP USA Inc.
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Produkt ist nicht verfügbar
FS32K116LIT0MFMT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 43
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 43
Produkt ist nicht verfügbar
FX32K116LAT0MFMT |
Hersteller: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Part Status: Active
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FB32K116BFT0MFMT |
Hersteller: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FH32K116LAT0MFMT |
Hersteller: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FB32K116BRT0MFMT |
Hersteller: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FH32K116LFT0MFMT |
Hersteller: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Part Status: Active
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
NCX2200GS125 |
Hersteller: NXP USA Inc.
Description: SINGLE LOW VOLTAGE COMPARATOR
Packaging: Bulk
Part Status: Active
Description: SINGLE LOW VOLTAGE COMPARATOR
Packaging: Bulk
Part Status: Active
auf Bestellung 744606 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2240+ | 0.23 EUR |
NCX2202GM |
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE COMPARATOR; OPEN-DRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LOW VOLTAGE COMPARATOR; OPEN-DRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NCX2220GU,115 |
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
auf Bestellung 81829 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
751+ | 0.66 EUR |
NCX2220GT,115 |
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
MKM34Z128ACLL5557 |
Hersteller: NXP USA Inc.
Description: KINETIS KM34: 50MHZ CORTEX-M0+ M
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: KINETIS KM34: 50MHZ CORTEX-M0+ M
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SA606DK/01,118 |
Hersteller: NXP USA Inc.
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
KW45Z41083AFPBT |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41082AFTBT |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41052AFPBT |
Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41082AFPBT |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41053AFTBT |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFTBT |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41053AFPBT |
Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41052AFTBT |
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
SAF3560HV/V1106Y |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LX2160XC72232B |
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1444.4 EUR |
74HC4075D-Q100118 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1076+ | 0.47 EUR |
74HC4075PW118 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 13880 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1332+ | 0.38 EUR |
74HC4075PW-Q100118 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 1911 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1298+ | 0.38 EUR |
74HC4075N,652 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,112 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 5398 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
952+ | 0.53 EUR |
74HC4075DB,112 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,118 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,118 |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
952+ | 0.53 EUR |
BUK663R7-75C,118 |
Hersteller: NXP USA Inc.
Description: PFET, 120A I(D), 75V, 0.0058OHM,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 234 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15450 pF @ 25 V
Description: PFET, 120A I(D), 75V, 0.0058OHM,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 234 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15450 pF @ 25 V
Produkt ist nicht verfügbar
SAF4000EL/101Z233Y |
Produkt ist nicht verfügbar
TEA2095DB1574 |
Hersteller: NXP USA Inc.
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
TEA2208DB1576 |
Hersteller: NXP USA Inc.
Description: IC POWER MGMT
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Utilized IC / Part: TEA2208T
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: IC POWER MGMT
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Utilized IC / Part: TEA2208T
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
LPC1764FBD100K |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1785 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.33 EUR |
10+ | 16.76 EUR |
80+ | 13.87 EUR |
LPC1764FBD100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F8006VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1027 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.27 EUR |
10+ | 10.42 EUR |
80+ | 8.63 EUR |
A3I35D025WNR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30.5dB
P1dB: 42.6dBm
Test Frequency: 3.8GHz ~ 4GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30.5dB
P1dB: 42.6dBm
Test Frequency: 3.8GHz ~ 4GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 84.27 EUR |
10+ | 78.61 EUR |
25+ | 75.32 EUR |
100+ | 68.25 EUR |
TJA1021BT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1021BT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1021AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 0.88 EUR |
TJA1021AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 4949 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.08 EUR |
10+ | 1.85 EUR |
25+ | 1.76 EUR |
100+ | 1.44 EUR |
250+ | 1.35 EUR |
500+ | 1.19 EUR |
1000+ | 0.94 EUR |
P4040NSE7MMC |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
Produkt ist nicht verfügbar
BFU520X235 |
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2323+ | 0.21 EUR |
BFU520X215 |
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2323+ | 0.21 EUR |
74HCT3G07GD,125 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
KTY82/121,235 |
Hersteller: NXP USA Inc.
Description: THERMISTOR PTC 990 OHM TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Description: THERMISTOR PTC 990 OHM TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Produkt ist nicht verfügbar
KTY82/121,235 |
Hersteller: NXP USA Inc.
Description: THERMISTOR PTC 990 OHM TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Description: THERMISTOR PTC 990 OHM TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Produkt ist nicht verfügbar