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PCF8562TT/2,518 PCF8562TT/2,518 NXP USA Inc. PCF8562.pdf Description: UNIVERSAL LCD DRIVER FOR LOW MUL
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 6 Characters, 8 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
auf Bestellung 4173 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.7 EUR
10+2.75 EUR
25+2.51 EUR
100+2.25 EUR
250+2.12 EUR
500+2.05 EUR
1000+1.98 EUR
Mindestbestellmenge: 5
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RDDRONE-IOT NXP USA Inc. hdib Description: RAPID-IOT TO DRONE INTERFACE BOA
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
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UCANS32K146-01 NXP USA Inc. Description: UCANS32K146 BOARD FOR DRONES, RO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
Produkt ist nicht verfügbar
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RDDRONE-FMUK66L NXP USA Inc. getting-started Description: PX4 ROBOTIC DRONE FMU (RDDRONE-F
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
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SPC5668GF1AVMG SPC5668GF1AVMG NXP USA Inc. MPC5668x.pdf Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1014NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MC9328MX21DVK MC9328MX21DVK NXP USA Inc. MC9328MX21.pdf Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Produkt ist nicht verfügbar
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ASK-RYLT1043-25K NXP USA Inc. Description: ROYALTY PREPAYMENT 25K UNITS - L
Packaging: Bulk
Type: License
Produkt ist nicht verfügbar
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S32K324EHT1MPBST S32K324EHT1MPBST NXP USA Inc. S32K3xx.pdf Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCF85053ATKJ PCF85053ATKJ NXP USA Inc. PCF85053A.pdf Description: IC CPU RTC I2C SOT2413-1
Packaging: Tape & Reel (TR)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 6000 Stücke:
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6000+1.03 EUR
Mindestbestellmenge: 6000
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PCF85053ATKJ PCF85053ATKJ NXP USA Inc. PCF85053A.pdf Description: IC CPU RTC I2C SOT2413-1
Packaging: Cut Tape (CT)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 8018 Stücke:
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9+2.16 EUR
12+1.58 EUR
25+1.43 EUR
100+1.27 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.1 EUR
2500+1.06 EUR
Mindestbestellmenge: 9
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LPC11E68JBD48K LPC11E68JBD48K NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
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2+9.59 EUR
10+5.64 EUR
25+5.6 EUR
100+5.56 EUR
250+5.25 EUR
Mindestbestellmenge: 2
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NMH1000T1 NXP USA Inc. NMH1000.pdf Description: IC MAG SWITCH SENSOR
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
Produkt ist nicht verfügbar
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NMH1000T1 NXP USA Inc. NMH1000.pdf Description: IC MAG SWITCH SENSOR
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
auf Bestellung 1946 Stücke:
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6+2.97 EUR
10+2.3 EUR
25+1.92 EUR
50+1.88 EUR
100+1.71 EUR
500+1.49 EUR
1000+1.32 EUR
Mindestbestellmenge: 6
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MR-CANHUBK344 MR-CANHUBK344 NXP USA Inc. MR-CANHUBK344.pdf Description: EVAL BOARD FOR S32K344
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Accessories
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1+317.82 EUR
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HEF4075BT,653 HEF4075BT,653 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
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HEF4075BT,652 HEF4075BT,652 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
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MCF53016CMJ240J MCF53016CMJ240J NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
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52+17.25 EUR
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MCF53011CQT240 MCF53011CQT240 NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 208TQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 61
DigiKey Programmable: Not Verified
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43+20.54 EUR
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KITPF5300SKTEVM NXP USA Inc. Description: EVAL BOARD FOR MPF5302AMBA0ES
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Contents: Board(s)
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1+293.04 EUR
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S9S12XS128J1VAAR S9S12XS128J1VAAR NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8UD5DVK08SC MIMX8UD5DVK08SC NXP USA Inc. IMX8ULPCEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
Produkt ist nicht verfügbar
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MIMX8UD7DVK08SC MIMX8UD7DVK08SC NXP USA Inc. IMX8ULPCEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
Produkt ist nicht verfügbar
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MIMX8UD5DVP08SC MIMX8UD5DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
auf Bestellung 620 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.86 EUR
10+23.01 EUR
25+21.54 EUR
100+19.94 EUR
250+19.17 EUR
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MIMX8UX5FVOFZAC MIMX8UX5FVOFZAC NXP USA Inc. Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX1FVOFZAC MIMX8DX1FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8UX6FVOFZAC MIMX8UX6FVOFZAC NXP USA Inc. Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX2FVOFZAC MIMX8DX2FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8QX1FVOFZAC MIMX8QX1FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX5AVLFZACR MIMX8DX5AVLFZACR NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX2FVOFZAC MIMX8QX2FVOFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8DX1FVLFZAC MIMX8DX1FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8DX5GVLFZAC MIMX8DX5GVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8DX6GVLFZAC MIMX8DX6GVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8DX2FVLFZAC MIMX8DX2FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX5GVLFZAC MIMX8QX5GVLFZAC NXP USA Inc. Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8DX5FVLFZAC MIMX8DX5FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8UX5FVLFZAC MIMX8UX5FVLFZAC NXP USA Inc. Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX1FVLFZAC MIMX8QX1FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX6GVLFZAC MIMX8QX6GVLFZAC NXP USA Inc. 568_IMX8QXPAEC.pdf Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8DX6FVLFZAC MIMX8DX6FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8UX6FVLFZAC NXP USA Inc. Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX2FVLFZAC MIMX8QX2FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX5FVLFZAC MIMX8QX5FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMX8QX6FVLFZAC MIMX8QX6FVLFZAC NXP USA Inc. Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A7102CGHN1/T0B0AEL A7102CGHN1/T0B0AEL NXP USA Inc. Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC908GR16CFAE MC908GR16CFAE NXP USA Inc. MC68HC08GR32A.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1105 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.61 EUR
10+17.15 EUR
25+16.03 EUR
100+14.81 EUR
250+14.75 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PDTC114TMB315 PDTC114TMB315 NXP USA Inc. PDTC114TMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.048 EUR
Mindestbestellmenge: 11225
Im Einkaufswagen  Stück im Wert von  UAH
MC56F82748VLHR MC56F82748VLHR NXP USA Inc. MC56F82348MLH.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC56F82748VLHR MC56F82748VLHR NXP USA Inc. MC56F82348MLH.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.28 EUR
10+11.89 EUR
25+11.04 EUR
100+10.11 EUR
250+9.66 EUR
500+9.39 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48BVLCR S9S12G48BVLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC32PF3001A5EPR2 MC32PF3001A5EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G64AMLFR S9S12G64AMLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF3001A2EPR2 MC34PF3001A2EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FS32K142HRT0VLHR FS32K142HRT0VLHR NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0VLL6R SPC5607BK0VLL6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1510A6EPR2 MC32PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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FS32K118BRT0VLHR FS32K118BRT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LAT0MLFR FS32K118LAT0MLFR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0MLLR FS32K146HAT0MLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF8562TT/2,518 PCF8562.pdf
PCF8562TT/2,518
Hersteller: NXP USA Inc.
Description: UNIVERSAL LCD DRIVER FOR LOW MUL
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 6 Characters, 8 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
auf Bestellung 4173 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.7 EUR
10+2.75 EUR
25+2.51 EUR
100+2.25 EUR
250+2.12 EUR
500+2.05 EUR
1000+1.98 EUR
Mindestbestellmenge: 5
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RDDRONE-IOT hdib
Hersteller: NXP USA Inc.
Description: RAPID-IOT TO DRONE INTERFACE BOA
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
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UCANS32K146-01
Hersteller: NXP USA Inc.
Description: UCANS32K146 BOARD FOR DRONES, RO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
Produkt ist nicht verfügbar
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RDDRONE-FMUK66L getting-started
Hersteller: NXP USA Inc.
Description: PX4 ROBOTIC DRONE FMU (RDDRONE-F
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
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SPC5668GF1AVMG MPC5668x.pdf
SPC5668GF1AVMG
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1014NXN7MQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MC9328MX21DVK MC9328MX21.pdf
MC9328MX21DVK
Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Produkt ist nicht verfügbar
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ASK-RYLT1043-25K
Hersteller: NXP USA Inc.
Description: ROYALTY PREPAYMENT 25K UNITS - L
Packaging: Bulk
Type: License
Produkt ist nicht verfügbar
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S32K324EHT1MPBST S32K3xx.pdf
S32K324EHT1MPBST
Hersteller: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCF85053ATKJ PCF85053A.pdf
PCF85053ATKJ
Hersteller: NXP USA Inc.
Description: IC CPU RTC I2C SOT2413-1
Packaging: Tape & Reel (TR)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+1.03 EUR
Mindestbestellmenge: 6000
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PCF85053ATKJ PCF85053A.pdf
PCF85053ATKJ
Hersteller: NXP USA Inc.
Description: IC CPU RTC I2C SOT2413-1
Packaging: Cut Tape (CT)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 8018 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.16 EUR
12+1.58 EUR
25+1.43 EUR
100+1.27 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.1 EUR
2500+1.06 EUR
Mindestbestellmenge: 9
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LPC11E68JBD48K LPC11E1X.pdf
LPC11E68JBD48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1144 Stücke:
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Anzahl Preis
2+9.59 EUR
10+5.64 EUR
25+5.6 EUR
100+5.56 EUR
250+5.25 EUR
Mindestbestellmenge: 2
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NMH1000T1 NMH1000.pdf
Hersteller: NXP USA Inc.
Description: IC MAG SWITCH SENSOR
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
Produkt ist nicht verfügbar
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NMH1000T1 NMH1000.pdf
Hersteller: NXP USA Inc.
Description: IC MAG SWITCH SENSOR
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
auf Bestellung 1946 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+2.97 EUR
10+2.3 EUR
25+1.92 EUR
50+1.88 EUR
100+1.71 EUR
500+1.49 EUR
1000+1.32 EUR
Mindestbestellmenge: 6
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MR-CANHUBK344 MR-CANHUBK344.pdf
MR-CANHUBK344
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K344
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Accessories
auf Bestellung 3 Stücke:
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Anzahl Preis
1+317.82 EUR
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HEF4075BT,653 HEF4075B.pdf
HEF4075BT,653
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
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HEF4075BT,652 HEF4075B.pdf
HEF4075BT,652
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
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MCF53016CMJ240J MCF53010-17.pdf
MCF53016CMJ240J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
52+17.25 EUR
Mindestbestellmenge: 52
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MCF53011CQT240 MCF53010-17.pdf
MCF53011CQT240
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208TQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 61
DigiKey Programmable: Not Verified
auf Bestellung 2232 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
43+20.54 EUR
Mindestbestellmenge: 43
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KITPF5300SKTEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MPF5302AMBA0ES
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+293.04 EUR
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S9S12XS128J1VAAR MC9S12XS256RMV1.pdf
S9S12XS128J1VAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8UD5DVK08SC IMX8ULPCEC.pdf
MIMX8UD5DVK08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
Produkt ist nicht verfügbar
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MIMX8UD7DVK08SC IMX8ULPCEC.pdf
MIMX8UD7DVK08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
Produkt ist nicht verfügbar
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MIMX8UD5DVP08SC IMX8ULPIEC.pdf
MIMX8UD5DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
auf Bestellung 620 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.86 EUR
10+23.01 EUR
25+21.54 EUR
100+19.94 EUR
250+19.17 EUR
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MIMX8UX5FVOFZAC
MIMX8UX5FVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX1FVOFZAC IMX8QXPAEC.pdf
MIMX8DX1FVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8UX6FVOFZAC
MIMX8UX6FVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALX 17X17
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX2FVOFZAC IMX8QXPAEC.pdf
MIMX8DX2FVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8QX1FVOFZAC IMX8QXPAEC.pdf
MIMX8QX1FVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX5AVLFZACR IMX8QXPAEC.pdf
MIMX8DX5AVLFZACR
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX2FVOFZAC IMX8QXPAEC.pdf
MIMX8QX2FVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
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MIMX8DX1FVLFZAC IMX8QXPAEC.pdf
MIMX8DX1FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8DX5GVLFZAC IMX8QXPAEC.pdf
MIMX8DX5GVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8DX6GVLFZAC IMX8QXPAEC.pdf
MIMX8DX6GVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8DX2FVLFZAC IMX8QXPAEC.pdf
MIMX8DX2FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX5GVLFZAC
MIMX8QX5GVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8DX5FVLFZAC IMX8QXPAEC.pdf
MIMX8DX5FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8UX5FVLFZAC
MIMX8UX5FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX1FVLFZAC IMX8QXPAEC.pdf
MIMX8QX1FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX6GVLFZAC 568_IMX8QXPAEC.pdf
MIMX8QX6GVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8X FIPS
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8DX6FVLFZAC IMX8QXPAEC.pdf
MIMX8DX6FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8UX6FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX8 QXP 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Produkt ist nicht verfügbar
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MIMX8QX2FVLFZAC IMX8QXPAEC.pdf
MIMX8QX2FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX5FVLFZAC IMX8QXPAEC.pdf
MIMX8QX5FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX6FVLFZAC
MIMX8QX6FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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A7102CGHN1/T0B0AEL
A7102CGHN1/T0B0AEL
Hersteller: NXP USA Inc.
Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GR16CFAE MC68HC08GR32A.pdf
MC908GR16CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1105 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.61 EUR
10+17.15 EUR
25+16.03 EUR
100+14.81 EUR
250+14.75 EUR
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PDTC114TMB315 PDTC114TMB.pdf
PDTC114TMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.048 EUR
Mindestbestellmenge: 11225
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MC56F82748VLHR MC56F82348MLH.pdf
MC56F82748VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F82748VLHR MC56F82348MLH.pdf
MC56F82748VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.28 EUR
10+11.89 EUR
25+11.04 EUR
100+10.11 EUR
250+9.66 EUR
500+9.39 EUR
Mindestbestellmenge: 2
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S9S12G48BVLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BVLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF3001A5EPR2 PF3001.pdf
MC32PF3001A5EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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S9S12G64AMLFR
S9S12G64AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34PF3001A2EPR2 PF3001.pdf
MC34PF3001A2EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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FS32K142HRT0VLHR
FS32K142HRT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0VLL6R MPC560XBFAMFS.pdf
SPC5607BK0VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1510A6EPR2 PF1510.pdf
MC32PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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FS32K118BRT0VLHR S32K1xx.pdf
FS32K118BRT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LAT0MLFR S32K-DS.pdf
FS32K118LAT0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0MLLR S32K1xx.pdf
FS32K146HAT0MLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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