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LM75BDP/DG,118 LM75BDP/DG,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F83766VLK MC56F83766VLK NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPXV2202DP MPXV2202DP NXP USA Inc. MPX2202.pdf description Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08GT8AMFCE MC9S08GT8AMFCE NXP USA Inc. PHGL-S-A0002794559-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
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67+7.38 EUR
Mindestbestellmenge: 67
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MKL05Z32VLF4 MKL05Z32VLF4 NXP USA Inc. KL05P48M48SF1.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZN8AMFKR S9KEAZN8AMFKR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
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5000+1.81 EUR
Mindestbestellmenge: 5000
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S9KEAZN8AMFKR S9KEAZN8AMFKR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 9980 Stücke:
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10+2.34 EUR
25+2.24 EUR
100+2.11 EUR
250+2.1 EUR
500+2.07 EUR
1000+1.93 EUR
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PTN3222CUKZ PTN3222CUKZ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN3222CUKZ PTN3222CUKZ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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10+2.03 EUR
25+1.84 EUR
100+1.64 EUR
250+1.55 EUR
500+1.49 EUR
1000+1.44 EUR
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74ABT652AD,118 74ABT652AD,118 NXP USA Inc. 74ABT652A.pdf Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 1000 Stücke:
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452+1.09 EUR
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74LVC32245AEC,518 74LVC32245AEC,518 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
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MPXHZ6116A6U MPXHZ6116A6U NXP USA Inc. MPXHZ6116A.pdf Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPXHZ6116A6T1 MPXHZ6116A6T1 NXP USA Inc. MPXHZ6116A.pdf Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Produkt ist nicht verfügbar
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STMP3770XXLAEA2N NXP USA Inc. PHGL-S-A0010067498-1.pdf?t.download=true&u=5oefqw Description: STMP3770 - PMP CONTROLLER
Packaging: Bulk
Part Status: Obsolete
auf Bestellung 6836 Stücke:
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44+10.55 EUR
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STMP3770XXBJEA3N NXP USA Inc. Description: STMP3770XXBJEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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STMP3770XXLAEA3N NXP USA Inc. Description: STMP3770XXLAEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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LX2160XN72232B LX2160XN72232B NXP USA Inc. LX2160A.pdf Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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MPC8560VTAQFC MPC8560VTAQFC NXP USA Inc. DS_568_mpc8560.pdf Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Produkt ist nicht verfügbar
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MC9S08GT8ACFBE MC9S08GT8ACFBE NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF29A1XHN/0500IJ NCF29A1XHN/0500IJ NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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NCF29A1XHN/0500IJ NCF29A1XHN/0500IJ NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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10+12.09 EUR
25+11.23 EUR
100+10.28 EUR
250+9.83 EUR
500+9.55 EUR
1000+9.33 EUR
Mindestbestellmenge: 2
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PESD5V0L5UV/DG125 PESD5V0L5UV/DG125 NXP USA Inc. PHGLS15257-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No
Produkt ist nicht verfügbar
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KITPF5200SKTEVM KITPF5200SKTEVM NXP USA Inc. getting-started-with-the-kitpf5200sktevm-evaluation-board:GS-KITPF5200SKTEVM Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
Secondary Attributes: On-Board LEDs, Test Points
Contents: Board(s), Cable(s), Accessories
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SAF776DEL/200SK NXP USA Inc. Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
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KC13237CHT NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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PCK351DB,112 PCK351DB,112 NXP USA Inc. PCK351.pdf Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
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212+2.5 EUR
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NT2H1001G0DUDV NXP USA Inc. NT2L1001_NT2H1001.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NCF3340AHN/00330Y NCF3340AHN/00330Y NXP USA Inc. Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 24.12MHz
Interface: I²C, SPI
Type: RFID Reader/Transponder
Voltage - Supply: 2.3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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NCJ3340AHN/00330Y NXP USA Inc. Description: NFC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74ABT74DB,112 74ABT74DB,112 NXP USA Inc. 74ABT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Tube
auf Bestellung 756 Stücke:
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MC56F8013VFAE MC56F8013VFAE NXP USA Inc. MC56F8013.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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1+18.5 EUR
10+14.53 EUR
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100+12.45 EUR
250+11.93 EUR
500+11.62 EUR
1250+11.29 EUR
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LFBGAINTPU3A NXP USA Inc. Description: NXP LEAD FREE 324 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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LFBGAINTPY2A NXP USA Inc. Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPT5A NXP USA Inc. Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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LFBGAINTPS1A NXP USA Inc. Description: 256 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
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LFBGAINTPH1A NXP USA Inc. Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPV1A NXP USA Inc. Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPS2A NXP USA Inc. Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPT3A NXP USA Inc. Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPT4A NXP USA Inc. Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPZ3A NXP USA Inc. Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTJ33QLT NXP USA Inc. Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MPC8270VVUPEA MPC8270VVUPEA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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S912XDG128F2MAL S912XDG128F2MAL NXP USA Inc. 9S12XDP512DGV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1938T/1J TEA1938T/1J NXP USA Inc. Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 17.5 V
Control Features: EN, Soft Start
Produkt ist nicht verfügbar
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HT2ICS2002W/V6F/RZ NXP USA Inc. HT2X_SDS.pdf Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MC908QVY4CDWER NXP USA Inc. PHGL-S-A0002263340-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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132+6.69 EUR
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MC908JL8MDWE MC908JL8MDWE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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MC908JK8MDWE MC908JK8MDWE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908EY8AMFJE MC908EY8AMFJE NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC908LK24CFUE MC908LK24CFUE NXP USA Inc. MC68HC908LJ24.pdf Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MC908JL16CDWE MC908JL16CDWE NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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MC908GT16CFBER MC908GT16CFBER NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC908GT16CFBE MC908GT16CFBE NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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60+14.68 EUR
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MC908AP8CFAE MC908AP8CFAE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BY359-1500,127 BY359-1500,127 NXP USA Inc. BY359X-1500_1500S.pdf Description: DIODE GEN PURP 1.5KV 10A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Produkt ist nicht verfügbar
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BY359X-1500S,127 BY359X-1500S,127 NXP USA Inc. BY359X-1500_1500S.pdf Description: DIODE GEN PURP 1.5KV 7A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 7A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Produkt ist nicht verfügbar
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BY359X-1500,127 BY359X-1500,127 NXP USA Inc. BY359X-1500_1500S.pdf Description: DIODE GEN PURP 1.5KV 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Produkt ist nicht verfügbar
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FRDM665SPIEVB FRDM665SPIEVB NXP USA Inc. Description: MC33665A SPI EVAL BOARD
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
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MC56F82748VLH MC56F82748VLH NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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2+15.4 EUR
10+11.98 EUR
25+11.12 EUR
160+9.94 EUR
320+9.63 EUR
480+9.48 EUR
960+9.25 EUR
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LM75BDP/DG,118 LM75B.pdf
LM75BDP/DG,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F83766VLK MC56F83XXXFS.pdf
MC56F83766VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPXV2202DP description MPX2202.pdf
MPXV2202DP
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08GT8AMFCE PHGL-S-A0002794559-1.pdf?t.download=true&u=5oefqw
MC9S08GT8AMFCE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
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Anzahl Preis
67+7.38 EUR
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MKL05Z32VLF4 KL05P48M48SF1.pdf
MKL05Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZN8AMFKR S9KEA8P44M48SF0.pdf
S9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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5000+1.81 EUR
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S9KEAZN8AMFKR S9KEA8P44M48SF0.pdf
S9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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Anzahl Preis
5+3.73 EUR
10+2.34 EUR
25+2.24 EUR
100+2.11 EUR
250+2.1 EUR
500+2.07 EUR
1000+1.93 EUR
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PTN3222CUKZ PTN3222_CUK.pdf
PTN3222CUKZ
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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PTN3222CUKZ PTN3222_CUK.pdf
PTN3222CUKZ
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
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7+2.76 EUR
10+2.03 EUR
25+1.84 EUR
100+1.64 EUR
250+1.55 EUR
500+1.49 EUR
1000+1.44 EUR
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74ABT652AD,118 74ABT652A.pdf
74ABT652AD,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 1000 Stücke:
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452+1.09 EUR
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74LVC32245AEC,518 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 80605 Stücke:
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89+5.95 EUR
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MPXHZ6116A6U MPXHZ6116A.pdf
MPXHZ6116A6U
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPXHZ6116A6T1 MPXHZ6116A.pdf
MPXHZ6116A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Produkt ist nicht verfügbar
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STMP3770XXLAEA2N PHGL-S-A0010067498-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: STMP3770 - PMP CONTROLLER
Packaging: Bulk
Part Status: Obsolete
auf Bestellung 6836 Stücke:
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Anzahl Preis
44+10.55 EUR
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STMP3770XXBJEA3N
Hersteller: NXP USA Inc.
Description: STMP3770XXBJEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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STMP3770XXLAEA3N
Hersteller: NXP USA Inc.
Description: STMP3770XXLAEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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LX2160XN72232B LX2160A.pdf
LX2160XN72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 33 Stücke:
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Anzahl Preis
1+1031.34 EUR
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MPC8560VTAQFC DS_568_mpc8560.pdf
MPC8560VTAQFC
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Produkt ist nicht verfügbar
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MC9S08GT8ACFBE MC9S08GT16A.pdf
MC9S08GT8ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF29A1XHN/0500IJ
NCF29A1XHN/0500IJ
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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NCF29A1XHN/0500IJ
NCF29A1XHN/0500IJ
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5964 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.54 EUR
10+12.09 EUR
25+11.23 EUR
100+10.28 EUR
250+9.83 EUR
500+9.55 EUR
1000+9.33 EUR
Mindestbestellmenge: 2
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PESD5V0L5UV/DG125 PHGLS15257-1.pdf?t.download=true&u=5oefqw
PESD5V0L5UV/DG125
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No
Produkt ist nicht verfügbar
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KITPF5200SKTEVM getting-started-with-the-kitpf5200sktevm-evaluation-board:GS-KITPF5200SKTEVM
KITPF5200SKTEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
Secondary Attributes: On-Board LEDs, Test Points
Contents: Board(s), Cable(s), Accessories
auf Bestellung 2 Stücke:
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Anzahl Preis
1+582.19 EUR
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SAF776DEL/200SK
Hersteller: NXP USA Inc.
Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
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KC13237CHT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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PCK351DB,112 PCK351.pdf
PCK351DB,112
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
auf Bestellung 654 Stücke:
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Anzahl Preis
212+2.5 EUR
Mindestbestellmenge: 212
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NT2H1001G0DUDV NT2L1001_NT2H1001.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NCF3340AHN/00330Y
NCF3340AHN/00330Y
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 24.12MHz
Interface: I²C, SPI
Type: RFID Reader/Transponder
Voltage - Supply: 2.3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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NCJ3340AHN/00330Y
Hersteller: NXP USA Inc.
Description: NFC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74ABT74DB,112 74ABT74.pdf
74ABT74DB,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Tube
auf Bestellung 756 Stücke:
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Anzahl Preis
523+0.96 EUR
Mindestbestellmenge: 523
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MC56F8013VFAE MC56F8013.pdf
MC56F8013VFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1776 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.5 EUR
10+14.53 EUR
25+13.54 EUR
100+12.45 EUR
250+11.93 EUR
500+11.62 EUR
1250+11.29 EUR
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LFBGAINTPU3A
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 324 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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LFBGAINTPY2A
Hersteller: NXP USA Inc.
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPT5A
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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LFBGAINTPS1A
Hersteller: NXP USA Inc.
Description: 256 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
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LFBGAINTPH1A
Hersteller: NXP USA Inc.
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPV1A
Hersteller: NXP USA Inc.
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPS2A
Hersteller: NXP USA Inc.
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPT3A
Hersteller: NXP USA Inc.
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPT4A
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTPZ3A
Hersteller: NXP USA Inc.
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFBGAINTJ33QLT
Hersteller: NXP USA Inc.
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MPC8270VVUPEA MPC8280EC.pdf
MPC8270VVUPEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+286.21 EUR
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S912XDG128F2MAL 9S12XDP512DGV1.pdf
S912XDG128F2MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1938T/1J
TEA1938T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 17.5 V
Control Features: EN, Soft Start
Produkt ist nicht verfügbar
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HT2ICS2002W/V6F/RZ HT2X_SDS.pdf
Hersteller: NXP USA Inc.
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MC908QVY4CDWER PHGL-S-A0002263340-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
132+6.69 EUR
Mindestbestellmenge: 132
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MC908JL8MDWE MC68HC908JL8.pdf
MC908JL8MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 5092 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
203+4.35 EUR
Mindestbestellmenge: 203
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MC908JK8MDWE MC68HC908JL8.pdf
MC908JK8MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 4522 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
167+5.28 EUR
Mindestbestellmenge: 167
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MC908EY8AMFJE MC68HC908EY16A.pdf
MC908EY8AMFJE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 5439 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
130+6.81 EUR
Mindestbestellmenge: 130
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MC908LK24CFUE MC68HC908LJ24.pdf
MC908LK24CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2688 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
79+11.16 EUR
Mindestbestellmenge: 79
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MC908JL16CDWE MC68HC908JL16.pdf
MC908JL16CDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 1594 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
69+12.92 EUR
Mindestbestellmenge: 69
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MC908GT16CFBER MC68HC908GT16.pdf
MC908GT16CFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
60+14.68 EUR
Mindestbestellmenge: 60
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MC908GT16CFBE MC68HC908GT16.pdf
MC908GT16CFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
60+14.68 EUR
Mindestbestellmenge: 60
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MC908AP8CFAE MC68HC908AP64A.pdf
MC908AP8CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BY359-1500,127 BY359X-1500_1500S.pdf
BY359-1500,127
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 10A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Produkt ist nicht verfügbar
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BY359X-1500S,127 BY359X-1500_1500S.pdf
BY359X-1500S,127
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 7A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 7A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Produkt ist nicht verfügbar
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BY359X-1500,127 BY359X-1500_1500S.pdf
BY359X-1500,127
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V
Produkt ist nicht verfügbar
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FRDM665SPIEVB
FRDM665SPIEVB
Hersteller: NXP USA Inc.
Description: MC33665A SPI EVAL BOARD
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+488.17 EUR
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MC56F82748VLH MC56F827XXDS.pdf
MC56F82748VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1530 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.4 EUR
10+11.98 EUR
25+11.12 EUR
160+9.94 EUR
320+9.63 EUR
480+9.48 EUR
960+9.25 EUR
Mindestbestellmenge: 2
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