Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36417) > Seite 495 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TEA19032BAAT/1J | NXP USA Inc. |
 Description: IC SMPS CTRLR SMART CHARGE SO10DigiKey Programmable: Not Verified Supplier Device Package: 10-SO Standards: USB 2.0, USB 3.0 Protocol: USB Current - Supply: 3mA Voltage - Supply: 2.9V ~ 21V Operating Temperature: -25°C ~ 125°C (TJ) Interface: USB Function: Controller Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
PDTC114EE,115 | NXP USA Inc. |
 Description: TRANS PREBIAS NPN 50V 0.1A SC75Packaging: Tape & Reel (TR) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 10 kOhms Resistors Included: R1 and R2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
PDTC114EE,115 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 0.1A SC75 Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 10 kOhms Resistors Included: R1 and R2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MIMX8US3DVK08SC | NXP USA Inc. |
Description: I.MX8ULP, SOLO 800MHZ Packaging: Tray Package / Case: 512-VFBGA Mounting Type: Surface Mount Supplier Device Package: 512-VFBGA (9.4x9.4) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MIMX8US3DVP08SC | NXP USA Inc. |
Description: I.MX8ULP,DUAL 800MHZ Packaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A35 Supplier Device Package: 485-LFBGA (15x15) Ethernet: 10/100Mbps USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI, MIPI-DSI Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB |
auf Bestellung 630 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
LPC1224FBD64/121,1 | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
auf Bestellung 115 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MRF6VP21KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Package / Case: NI-1230 Packaging: Tape & Reel (TR) Current - Test: 150 mA Voltage - Test: 50 V Voltage - Rated: 110 V Supplier Device Package: NI-1230 Technology: LDMOS Gain: 24dB Power - Output: 1000W Configuration: Dual Frequency: 225MHz Mounting Type: Chassis Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MRF6VP21KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Current - Test: 150 mA Voltage - Test: 50 V Voltage - Rated: 110 V Supplier Device Package: NI-1230 Technology: LDMOS Gain: 24dB Power - Output: 1000W Configuration: Dual Frequency: 225MHz Mounting Type: Chassis Mount Package / Case: NI-1230 Packaging: Cut Tape (CT) |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
| MRFE6VP5600-225 | NXP USA Inc. |
Description: MRFE6VP5600 REF BOARD - 225 Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||
 |
KTY84/150,153 | NXP USA Inc. |
Description: SENSOR PTC 603OHM DO34 Packaging: Tape & Box (TB) Package / Case: DO-204AG, DO-34, Axial Mounting Type: Through Hole Operating Temperature: -40°C ~ 300°C Supplier Device Package: DO-34 Resistance @ 25°C: 603 Ohms |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| NJJ29C2A9HN5/349Y | NXP USA Inc. |
Description: NJJ29C2A9HN5 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
S912ZVL12AMLFR | NXP USA Inc. |
Description: S12Z CPU, 6128K FLASH Number of I/O: 34 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S912ZVL12AMLF | NXP USA Inc. |
Description: S12Z CPU, 128K FLASH Number of I/O: 34 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MC68HC908QY4VDTE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128 x 8 Program Memory Size: 4KB (4K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PK-HC08QY4 | NXP USA Inc. |
Description: MC68HC908QY4 EVAL BRD Utilized IC / Part: MC68HC908QY4 Core Processor: HC08 Contents: Board(s), Cable(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PSMN2R2-30YLC/GFX | NXP USA Inc. |
Description: PSMN2R2-30YLC/GFX Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
BTS6403CJ | NXP USA Inc. |
Description: RF AMPLIFIER BTS6403C Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
BTS6403UJ | NXP USA Inc. |
Description: 5G MASSIVE MIMO PRE-DRIVER Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: 5G, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 42dB Current - Supply: 100mA Noise Figure: 4.1dB P1dB: 2.9dBm Test Frequency: 3.5GHz Supplier Device Package: 16-HVQFN (3x3) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| OMA1006TL-SKT | NXP USA Inc. |
Description: EVAL BOARD FOR A1006TL Packaging: Bulk Function: Anti Tamper and Security Type: Interface Contents: Board(s) Utilized IC / Part: A1006TL Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
PN7120A0EV/C10801E | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 49VFBGA Supplier Device Package: 49-VFBGA (4x4.3) Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -30°C ~ 85°C (TA) Type: RFID Reader Interface: I2C Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 49-VFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
N74F74D,623 | NXP USA Inc. |
Description: IC D-TYPE POS TRG DUAL 14SOIC Packaging: Bulk |
auf Bestellung 27500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCF51QE32CLH | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 780 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
SC68376BGMAB20R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tape & Reel (TR) Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
FXTH8715116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
FXTH8715116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 1882 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
FXTH870511DT1528 | NXP USA Inc. |
Description: TPMS 7X7 450KPA X&Z AXIS Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| FXTH8718026T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Operating Temperature: -40°C ~ 125°C Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
|
|
FXTH87EG02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
FXTH87EG02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| FXTH87EH226T1 | NXP USA Inc. |
Description: TPMS E 7X7 900KPA X&Z AXIS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| FXTH87EK116T1 | NXP USA Inc. |
Description: SENSOR MULT PRESSURE Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Pressure |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
SPC5674KAVMM2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
SPC5674KAVMM2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
SPC5674KAVMS2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
SPC5674KAVMS2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tape & Reel (TR) Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SPC5674FAMVV3R | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
SPC5674FAMVR3 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
SPC5674FAMVR3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
SPC5674FAMVY3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 516FPBGA Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SPC5674FAMVV3 | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFJ74INTPZA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 516 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFJ74INTPWA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 416 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter Utilized IC / Part: MPC5674F |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBOJ74W1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 422 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBJ74WA | NXP USA Inc. |
Description: QORIVVA MPC5674A 416 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board Utilized IC / Part: MPC5674A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFJ74DBGZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM CA Packaging: Bulk For Use With/Related Products: MPC5674 Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBOJ74Z1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 522 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBJ74ZA | NXP USA Inc. |
Description: QORIVVA MPC5674A 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVCAL32SYNC4 | NXP USA Inc. |
Description: 32 BIT 4MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVCAL32SYNC8 | NXP USA Inc. |
Description: 32 BIT 8MB VERTICAL CALIBRATION Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBSJ74ZZ1A | NXP USA Inc. |
Description: QORIVVA MPC5674 522 PIN 1.0MM VE Utilized IC / Part: MPC5674 Accessory Type: Base Board For Use With/Related Products: MPC5674 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBSJ74ZW1A | NXP USA Inc. |
Description: QORIVVA MPC5674 422 PIN 1.0MM VE Utilized IC / Part: MPC5674 Accessory Type: Base Board For Use With/Related Products: MPC5674 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBSJ74ZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM VE Utilized IC / Part: MPC5674 Accessory Type: Base Board For Use With/Related Products: MPC5674 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBSJ74ZZA | NXP USA Inc. |
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C Accessory Type: Base Board For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPC5674KAVJM2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA DigiKey Programmable: Not Verified Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 384K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPC5674KAVJM2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 384K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tray DigiKey Programmable: Not Verified Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
PCA8575DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24SSOP DigiKey Programmable: Not Verified Current - Output Source/Sink: 100µA, 25mA Supplier Device Package: 24-SSOP Interrupt Output: Yes Clock Frequency: 400 kHz Voltage - Supply: 2.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 16 Interface: I2C Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 24-SSOP (0.209", 5.30mm Width) Features: POR Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
PCA8575DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24SSOP DigiKey Programmable: Not Verified Current - Output Source/Sink: 100µA, 25mA Supplier Device Package: 24-SSOP Interrupt Output: Yes Clock Frequency: 400 kHz Voltage - Supply: 2.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 16 Interface: I2C Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 24-SSOP (0.209", 5.30mm Width) Features: POR Packaging: Cut Tape (CT) |
auf Bestellung 307 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCF52232CAF50 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 680 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
PMV450ENEA215 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL FIELD- Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MPC8555EPXAPF | NXP USA Inc. |
Description: IC MPU MPC85XX 833MHZ 783FCPBGA Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, SDRAM Co-Processors/DSP: Communications; CPM, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 833MHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH |
| TEA19032BAAT/1J |
|
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
DigiKey Programmable: Not Verified
Supplier Device Package: 10-SO
Standards: USB 2.0, USB 3.0
Protocol: USB
Current - Supply: 3mA
Voltage - Supply: 2.9V ~ 21V
Operating Temperature: -25°C ~ 125°C (TJ)
Interface: USB
Function: Controller
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC SMPS CTRLR SMART CHARGE SO10
DigiKey Programmable: Not Verified
Supplier Device Package: 10-SO
Standards: USB 2.0, USB 3.0
Protocol: USB
Current - Supply: 3mA
Voltage - Supply: 2.9V ~ 21V
Operating Temperature: -25°C ~ 125°C (TJ)
Interface: USB
Function: Controller
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 1.87 EUR |
| 5000+ | 1.83 EUR |
| PDTC114EE,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTC114EE,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8US3DVK08SC |
|
Hersteller: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 512-VFBGA (9.4x9.4)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8US3DVP08SC |
|
Hersteller: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 30.73 EUR |
| 10+ | 24.5 EUR |
| 25+ | 22.95 EUR |
| 100+ | 21.24 EUR |
| 250+ | 20.43 EUR |
| 630+ | 19.79 EUR |
| LPC1224FBD64/121,1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.57 EUR |
| 10+ | 5.82 EUR |
| 25+ | 5.66 EUR |
| MRF6VP21KHR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 24dB
Power - Output: 1000W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Description: RF MOSFET LDMOS 50V NI1230
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 24dB
Power - Output: 1000W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6VP21KHR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 24dB
Power - Output: 1000W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 24dB
Power - Output: 1000W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Cut Tape (CT)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 1449.89 EUR |
| MRFE6VP5600-225 |
|
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 1483.1 EUR |
| KTY84/150,153 |
|
Hersteller: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NJJ29C2A9HN5/349Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVL12AMLFR |
Hersteller: NXP USA Inc.
Description: S12Z CPU, 6128K FLASH
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Description: S12Z CPU, 6128K FLASH
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVL12AMLF |
|
Hersteller: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: S12Z CPU, 128K FLASH
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC68HC908QY4VDTE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 2880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PK-HC08QY4 |
|
Hersteller: NXP USA Inc.
Description: MC68HC908QY4 EVAL BRD
Utilized IC / Part: MC68HC908QY4
Core Processor: HC08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: MC68HC908QY4 EVAL BRD
Utilized IC / Part: MC68HC908QY4
Core Processor: HC08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BTS6403CJ |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BTS6403UJ |
|
Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| OMA1006TL-SKT |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR A1006TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Description: EVAL BOARD FOR A1006TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PN7120A0EV/C10801E |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 49VFBGA
Supplier Device Package: 49-VFBGA (4x4.3)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 49-VFBGA
Packaging: Tray
Description: IC RFID READER 13.56MHZ 49VFBGA
Supplier Device Package: 49-VFBGA (4x4.3)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 49-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F74D,623 |
|
auf Bestellung 27500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2049+ | 0.25 EUR |
| MCF51QE32CLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 15.68 EUR |
| 10+ | 12.23 EUR |
| 25+ | 11.37 EUR |
| 100+ | 10.42 EUR |
| 250+ | 9.97 EUR |
| SC68376BGMAB20R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FXTH8715116T1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FXTH8715116T1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1882 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.29 EUR |
| 10+ | 15.44 EUR |
| 25+ | 14.28 EUR |
| 100+ | 12.35 EUR |
| 500+ | 11.58 EUR |
| 1000+ | 10.81 EUR |
| FXTH870511DT1528 |
Hersteller: NXP USA Inc.
Description: TPMS 7X7 450KPA X&Z AXIS
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: TPMS 7X7 450KPA X&Z AXIS
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXTH8718026T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FXTH87EG02DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FXTH87EG02DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXTH87EH226T1 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FXTH87EK116T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR MULT PRESSURE
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Pressure
Description: SENSOR MULT PRESSURE
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Pressure
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674KAVMM2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674KAVMM2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674KAVMS2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674KAVMS2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674FAMVV3R |
|
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674FAMVR3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674FAMVR3R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674FAMVY3R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674FAMVV3 |
|
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LFJ74INTPZA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFJ74INTPWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5674F
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5674F
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBOJ74W1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBJ74WA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Utilized IC / Part: MPC5674A
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Utilized IC / Part: MPC5674A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFJ74DBGZWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBOJ74Z1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBJ74ZA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVCAL32SYNC4 |
Hersteller: NXP USA Inc.
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVCAL32SYNC8 |
Hersteller: NXP USA Inc.
Description: 32 BIT 8MB VERTICAL CALIBRATION
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
Description: 32 BIT 8MB VERTICAL CALIBRATION
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBSJ74ZZ1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBSJ74ZW1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBSJ74ZWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBSJ74ZZA |
Hersteller: NXP USA Inc.
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674KAVJM2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5674KAVJM2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA8575DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Tape & Reel (TR)
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA8575DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Cut Tape (CT)
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Cut Tape (CT)
auf Bestellung 307 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 3.7 EUR |
| 10+ | 2.74 EUR |
| 25+ | 2.5 EUR |
| 100+ | 2.24 EUR |
| 250+ | 2.11 EUR |
| MCF52232CAF50 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 680 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 37.05 EUR |
| 10+ | 29.73 EUR |
| 25+ | 27.9 EUR |
| 100+ | 25.9 EUR |
| 450+ | 24.44 EUR |
| PMV450ENEA215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8555EPXAPF |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH