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MC908MR32VFUE-NXP NXP USA Inc. FSCLS07124-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908JL3ECDWE MC908JL3ECDWE NXP USA Inc. MC68HC908JL3E.pdf Description: IC MCU 8BIT 4KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 23
DigiKey Programmable: Verified
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.84 EUR
10+8.37 EUR
26+7.73 EUR
104+7.05 EUR
Mindestbestellmenge: 2
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MCF51JM64VLH MCF51JM64VLH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 950 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.72 EUR
10+16.28 EUR
25+15.17 EUR
80+14.11 EUR
230+13.41 EUR
800+12.81 EUR
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PBLS2024D115 PBLS2024D115 NXP USA Inc. PBLS2024D.pdf Description: TRANS PREBIAS 1PNP 1PNP 6-TSOP
Packaging: Bulk
Part Status: Active
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 1 PNP Pre-Biased, 1 PNP
Power - Max: 760mW
Current - Collector (Ic) (Max): 100mA, 1.8A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V
Frequency - Transition: 130MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: 6-TSOP
Produkt ist nicht verfügbar
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MC908QY4AMDTE MC908QY4AMDTE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BCAL S912XEG384BCAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC505713MZP33R2 NXP USA Inc. Description: IC
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC908QY4ACPE MC908QY4ACPE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Bulk
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 44563 Stücke:
Lieferzeit 10-14 Tag (e)
160+5.63 EUR
Mindestbestellmenge: 160
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SC141715VFUER NXP USA Inc. Description: IC
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9306JKZ PCA9306JKZ NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCHC908QT4CDWE MCHC908QT4CDWE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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PZU14DB2,115 NXP USA Inc. PHGLS15472-1.pdf?t.download=true&u=5oefqw Description: ZENER DIODE, 14V V(Z), 2.14%, 0.
Packaging: Bulk
Tolerance: ±2%
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
auf Bestellung 45000 Stücke:
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8876+0.053 EUR
Mindestbestellmenge: 8876
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SPC5607BF1VLU6R SPC5607BF1VLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BF1VLU6R SPC5607BF1VLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN7120A0EV/C10801 NXP USA Inc. PN7120.pdf Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12C32CFAE25 MC9S12C32CFAE25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
auf Bestellung 1195 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.16 EUR
10+17.66 EUR
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MK22FN1M0VMC12R MK22FN1M0VMC12R NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FN1M0VMC12R MK22FN1M0VMC12R NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITPF0100SKTEVBE KITPF0100SKTEVBE NXP USA Inc. KTPF0100SKTUG.pdf Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+327.24 EUR
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S9S08SG16E1WTL S9S08SG16E1WTL NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC8640DTHJ1250HE MC8640DTHJ1250HE NXP USA Inc. Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA1270KEG NXP USA Inc. Description: IC ACCEL COLOSSUS 2.5G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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BCP56-10H,115 BCP56-10H,115 NXP USA Inc. Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC5534JBD100K LPC5534JBD100K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.36 EUR
10+14.42 EUR
80+11.94 EUR
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MIMXRT106ADVL6AR MIMXRT106ADVL6AR NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT106ADVL6A MIMXRT106ADVL6A NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1171AVM8AR MIMXRT1171AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
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MIMXRT1176AVM8AR MIMXRT1176AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
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LPC1769FBD100/P1K LPC1769FBD100/P1K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.12 EUR
10+24.96 EUR
25+23.38 EUR
100+21.73 EUR
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MCF5249LAG120 MCF5249LAG120 NXP USA Inc. MCF5249.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SCF5249LAG120 SCF5249LAG120 NXP USA Inc. Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCAL9539APW,118 PCAL9539APW,118 NXP USA Inc. PCAL9539A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+2.04 EUR
Mindestbestellmenge: 2500
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PCAL9539APW,118 PCAL9539APW,118 NXP USA Inc. PCAL9539A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
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10+2.9 EUR
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100+2.38 EUR
250+2.25 EUR
500+2.17 EUR
1000+2.11 EUR
Mindestbestellmenge: 5
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T1042NSE7PQPB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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SAF7741HV/N118518 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)
55+9.68 EUR
Mindestbestellmenge: 55
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SAF3561EL/V1101,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1103,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1102,51 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF3561EL/V1100K NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1101,55 NXP USA Inc. Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1103,55 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF3560HV/V1100,51 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1102,55 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF3561HV/V1101,51 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF3561HV/V1103,51 NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1106K NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AHCT2G32GD,125 74AHCT2G32GD,125 NXP USA Inc. PHGLS28140-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
auf Bestellung 5387 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.24 EUR
Mindestbestellmenge: 2049
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PRF13750HR9 PRF13750HR9 NXP USA Inc. Description: RF MOSFET LDMOS NI1230
Packaging: Strip
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 105 V
Produkt ist nicht verfügbar
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K32W1480VFTBT K32W1480VFTBT NXP USA Inc. K32W1480.pdf Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.2, Thread, Zigbee®
Current - Receiving: 8.7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
Part Status: Active
auf Bestellung 1258 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.23 EUR
10+9.07 EUR
25+8.65 EUR
40+8.44 EUR
80+8.14 EUR
260+7.92 EUR
Mindestbestellmenge: 2
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74AHCT1G04GV NXP USA Inc. PHGL-S-A0000727970-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AHCT1G04GW-Q100125 NXP USA Inc. 74AHC_AHCT1G04_Q100.pdf Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT1G04GM115 NXP USA Inc. 74AHC_AHCT1G04.pdf Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMW9014KZ NXP USA Inc. Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Produkt ist nicht verfügbar
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MMW9012KZ NXP USA Inc. Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Produkt ist nicht verfügbar
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PCA9634D NXP USA Inc. PHGL-S-A0000133613-1.pdf?t.download=true&u=5oefqw Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9634D118 NXP USA Inc. PCA9634.pdf Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128MPVE MC9S12DB128MPVE NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128CFUE MC9S12DB128CFUE NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F541D,623 N74F541D,623 NXP USA Inc. N74F540%2C541.pdf Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 946 Stücke:
Lieferzeit 10-14 Tag (e)
946+0.53 EUR
Mindestbestellmenge: 946
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PMMA2241KEG NXP USA Inc. Description: IC ACCEL X-LATERAL 10G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC908MR32VFUE-NXP FSCLS07124-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908JL3ECDWE MC68HC908JL3E.pdf
MC908JL3ECDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 23
DigiKey Programmable: Verified
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.84 EUR
10+8.37 EUR
26+7.73 EUR
104+7.05 EUR
Mindestbestellmenge: 2
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MCF51JM64VLH MCF51JM128.pdf
MCF51JM64VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.72 EUR
10+16.28 EUR
25+15.17 EUR
80+14.11 EUR
230+13.41 EUR
800+12.81 EUR
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PBLS2024D115 PBLS2024D.pdf
PBLS2024D115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS 1PNP 1PNP 6-TSOP
Packaging: Bulk
Part Status: Active
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 1 PNP Pre-Biased, 1 PNP
Power - Max: 760mW
Current - Collector (Ic) (Max): 100mA, 1.8A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V
Frequency - Transition: 130MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: 6-TSOP
Produkt ist nicht verfügbar
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MC908QY4AMDTE MC68HC908QY4A.pdf
MC908QY4AMDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BCAL
S912XEG384BCAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC505713MZP33R2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC908QY4ACPE MC68HC908QY4A.pdf
MC908QY4ACPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Bulk
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 44563 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
160+5.63 EUR
Mindestbestellmenge: 160
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SC141715VFUER
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9306JKZ PCA9306.pdf
PCA9306JKZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCHC908QT4CDWE MC68HC908QY4.pdf
MCHC908QT4CDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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PZU14DB2,115 PHGLS15472-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: ZENER DIODE, 14V V(Z), 2.14%, 0.
Packaging: Bulk
Tolerance: ±2%
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8876+0.053 EUR
Mindestbestellmenge: 8876
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SPC5607BF1VLU6R MPC560XBFAMFS.pdf
SPC5607BF1VLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BF1VLU6R MPC560XBFAMFS.pdf
SPC5607BF1VLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN7120A0EV/C10801 PN7120.pdf
Hersteller: NXP USA Inc.
Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12C32CFAE25 MC9S12C128V1.pdf
MC9S12C32CFAE25
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
auf Bestellung 1195 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.16 EUR
10+17.66 EUR
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MK22FN1M0VMC12R K22P121M120SF5.pdf
MK22FN1M0VMC12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FN1M0VMC12R K22P121M120SF5.pdf
MK22FN1M0VMC12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITPF0100SKTEVBE KTPF0100SKTUG.pdf
KITPF0100SKTEVBE
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+327.24 EUR
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S9S08SG16E1WTL MC9S08SG32.pdf
S9S08SG16E1WTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC8640DTHJ1250HE
MC8640DTHJ1250HE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA1270KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL COLOSSUS 2.5G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BCP56-10H,115
BCP56-10H,115
Hersteller: NXP USA Inc.
Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC5534JBD100K LPC553x.pdf
LPC5534JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.36 EUR
10+14.42 EUR
80+11.94 EUR
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MIMXRT106ADVL6AR IMXRT1060CEC_SUPPLEMENT.pdf
MIMXRT106ADVL6AR
Hersteller: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT106ADVL6A IMXRT1060CEC_SUPPLEMENT.pdf
MIMXRT106ADVL6A
Hersteller: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1171AVM8AR IMXRT1170AEC.pdf
MIMXRT1171AVM8AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
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MIMXRT1176AVM8AR IMXRT1170AEC.pdf
MIMXRT1176AVM8AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
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LPC1769FBD100/P1K LPC1769_68_67_66_65_64_63.pdf
LPC1769FBD100/P1K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.12 EUR
10+24.96 EUR
25+23.38 EUR
100+21.73 EUR
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MCF5249LAG120 MCF5249.pdf
MCF5249LAG120
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SCF5249LAG120
SCF5249LAG120
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCAL9539APW,118 PCAL9539A.pdf
PCAL9539APW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+2.04 EUR
Mindestbestellmenge: 2500
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PCAL9539APW,118 PCAL9539A.pdf
PCAL9539APW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2703 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.91 EUR
10+2.9 EUR
25+2.65 EUR
100+2.38 EUR
250+2.25 EUR
500+2.17 EUR
1000+2.11 EUR
Mindestbestellmenge: 5
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T1042NSE7PQPB T1FAMILYFS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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SAF7741HV/N118518 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
55+9.68 EUR
Mindestbestellmenge: 55
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SAF3561EL/V1101,51
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1103,51
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1102,51
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1100K
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561EL/V1101,55
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1103,55
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1100,51 SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1102,55 SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1101,51
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3561HV/V1103,51
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF3560HV/V1106K SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G32GD,125 PHGLS28140-1.pdf?t.download=true&u=5oefqw
74AHCT2G32GD,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
auf Bestellung 5387 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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PRF13750HR9
PRF13750HR9
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI1230
Packaging: Strip
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 105 V
Produkt ist nicht verfügbar
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K32W1480VFTBT K32W1480.pdf
K32W1480VFTBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.2, Thread, Zigbee®
Current - Receiving: 8.7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
Part Status: Active
auf Bestellung 1258 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.23 EUR
10+9.07 EUR
25+8.65 EUR
40+8.44 EUR
80+8.14 EUR
260+7.92 EUR
Mindestbestellmenge: 2
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74AHCT1G04GV PHGL-S-A0000727970-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT1G04GW-Q100125 74AHC_AHCT1G04_Q100.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT1G04GM115 74AHC_AHCT1G04.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMW9014KZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Produkt ist nicht verfügbar
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MMW9012KZ
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Produkt ist nicht verfügbar
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PCA9634D PHGL-S-A0000133613-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9634D118 PCA9634.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128MPVE HCS12DFAMILYPP.pdf
MC9S12DB128MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DB128CFUE HCS12DFAMILYPP.pdf
MC9S12DB128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F541D,623 N74F540%2C541.pdf
N74F541D,623
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 946 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
946+0.53 EUR
Mindestbestellmenge: 946
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PMMA2241KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL X-LATERAL 10G
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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