Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36413) > Seite 488 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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| SLN-VIZNLC-IOT | NXP USA Inc. |
 Description: NXP EDGEREADY MCU-BASED SOLUTIONPlatform: EdgeReady Utilized IC / Part: RT106F Core Processor: ARM® Cortex®-M7 Contents: Board(s) Type: MPU Mounting Type: Fixed Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74LVCH573BX/S711115 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk |
auf Bestellung 49750 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1062CVL5BR | NXP USA Inc. |
Description: IC MCU 32BIT 128MB ROM 196LFBGA Packaging: Tape & Reel (TR) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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| SLRC61003HNY | NXP USA Inc. |
Description: CL READER IC'S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SLRC61003HNY | NXP USA Inc. |
Description: CL READER IC'S Packaging: Cut Tape (CT) |
auf Bestellung 6452 Stücke: Lieferzeit 10-14 Tag (e) |
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| P60D144PU12/9A201V | NXP USA Inc. |
Description: IC SMART CARD CTLR UNCASED DigiKey Programmable: Not Verified Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC33FS6512CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33FS6512LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC35FS6512NAER2 | NXP USA Inc. |
Description: FS6500 Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC35FS6512CAER2 | NXP USA Inc. |
Description: FS6500 Qualification: AEC-Q100 Grade: Automotive Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33FS6512CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33FS6512LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC35FS6512CAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC35FS6512NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1124AHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN Qualification: AEC-Q100 Grade: Automotive Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Duplex: Half Supplier Device Package: 24-DHVQFN (5.5x3.5) Protocol: LIN Data Rate: 20kBaud Number of Drivers/Receivers: 4/4 Voltage - Supply: 5V ~ 28V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1124AHG/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN Qualification: AEC-Q100 Grade: Automotive Duplex: Half Supplier Device Package: 24-DHVQFN (5.5x3.5) Protocol: LIN Data Rate: 20kBaud Number of Drivers/Receivers: 4/4 Voltage - Supply: 5V ~ 28V Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 1493 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC16240ADGG/C4118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk |
auf Bestellung 6093 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5020CMMACESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34VR500VCESR2 | NXP USA Inc. |
Description: REGULATOR, BUCK, QUAD WITH UP TO Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Processor Current - Supply: 297µA Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MX93AUD-HAT | NXP USA Inc. |
Description: ACCESSORY BOARD:AUDIO HAT Packaging: Box |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL36Z256VMC4 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA DigiKey Programmable: Not Verified Number of I/O: 84 Supplier Device Package: 121-MAPBGA (8x8) Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D - 16bit; D/A - 12bit Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1740 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| T2080NSN8MQB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) Supplier Device Package: 896-FCPBGA (25x25) Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 896-BFBGA, FCBGA Packaging: Tray Core Processor: PowerPC e6500 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 44 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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P3041NSE7NNC | NXP USA Inc. |
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 1295-FCPBGA (37.5x37.5) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.333GHz Mounting Type: Surface Mount Package / Case: 1295-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
.jpg "SCC2692AC1A44,518") |
SCC2692AC1A44,518 | NXP USA Inc. |
Description: SERIAL I/O CONTROLLER, 2 CHANNEL Features: Configurable GPIO, Internal Oscillator, Timer/Counter Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 5V Data Rate (Max): 1Mbps Supplier Device Package: 44-PLCC With Auto Flow Control: Yes With False Start Bit Detection: Yes |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 39 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SCC2692AC1A44,512 | NXP USA Inc. |
Description: UART IC 2, DUART CHANNEL 44-PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Packaging: Tube Package / Case: 44-LCC (J-Lead) Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 5V Data Rate (Max): 1Mbps Supplier Device Package: 44-PLCC With Auto Flow Control: Yes With False Start Bit Detection: Yes |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 35 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC8349EVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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BFT25,215 | NXP USA Inc. |
Description: RF TRANS NPN 5V 2.3GHZ TO236AB Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 30mW Current - Collector (Ic) (Max): 6.5mA Voltage - Collector Emitter Breakdown (Max): 5V DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V Frequency - Transition: 2.3GHz Noise Figure (dB Typ @ f): 5.5dB @ 500MHz Supplier Device Package: SOT-23 (TO-236AB) |
auf Bestellung 4782 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MC33MR3003AXVKR2 | NXP USA Inc. |
Description: RF TXRX MOD ISM>1GHZSMD RF Family/Standard: General ISM > 1GHz Modulation: BPSK Antenna Type: Antenna Not Included Operating Temperature: 125°C Frequency: 76GHz ~ 81GHz Mounting Type: Surface Mount Package / Case: 214-UFBGA, WLCSP Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74AHCT08PW/C1118 | NXP USA Inc. |
Description: AND GATE, AHCT/VHCT/VT SERIES Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPX2010D | NXP USA Inc. |
Description: SENSOR 1.45PSID .025V Features: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Differential Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Applications: Board Mount Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) |
auf Bestellung 1033 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68040FE25V | NXP USA Inc. |
Description: IC MPU M680X0 25MHZ 184CQFP Packaging: Tray Package / Case: 184-BCQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 184-CQFP (31.3x31.3) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC68EC040FE40A | NXP USA Inc. |
Description: IC MPU M680X0 40MHZ 184CQFP Packaging: Tray Package / Case: 184-BCQFP Mounting Type: Surface Mount Speed: 40MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 184-CQFP (31.3x31.3) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PESD5V0C1UZF315 | NXP USA Inc. |
Description: PESD5V0C1UZF - ULTRA LOW CAPACIT Packaging: Bulk |
auf Bestellung 171000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SL8F1MTLR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S08SL8F1MTL | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tube Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC8272CVRMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA1936XDB1530UL | NXP USA Inc. |
Description: TEA1936X DEMOBOARD 1530 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1936x Supplied Contents: Board(s) |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF4000EL/101Z224Y | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4000EL/101Q224Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2240 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S912XEQ512J3VALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5603BK0MLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 45 Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 28K x 8 Program Memory Size: 384KB (384K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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HEF4515BP,652 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1X4:16 24DIP Packaging: Tube Package / Case: 24-DIP (0.600", 15.24mm) Mounting Type: Through Hole Circuit: 1 x 4:16 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 15.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 3mA Voltage Supply Source: Dual Supply Supplier Device Package: 24-DIP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 720 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| 74AUP1T58GF | NXP USA Inc. |
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON Features: Configurable Gate Logic Functions Packaging: Bulk Package / Case: 6-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Supplier Device Package: 6-XSON (1x1) Channel Type: Unidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.8 V ~ 2.7 V Voltage - VCCB: 2.3 V ~ 3.6 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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MCIMX6G2DVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 267 Stücke: Lieferzeit 10-14 Tag (e) |
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| TEA88182HT/1J | NXP USA Inc. |
Description: PFC CONTROLLER Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MF4SAM3X84/9BA6AUJ | NXP USA Inc. |
Description: MF4SAM3X84 Supplier Device Package: PCM1.1 Standards: Mifare, ISO 14443, ISO 7816 Voltage - Supply: 6V Operating Temperature: -25°C ~ 85°C Type: RFID Reader Interface: I2C Mounting Type: Surface Mount Package / Case: Module Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFVBBJ76ZA | NXP USA Inc. |
Description: QORIVVA MPC5676R 516 PIN 1.0MM P Accessory Type: Logic Analyzer For Use With/Related Products: MPC5676R Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFLAIBW1A | NXP USA Inc. |
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFLAIBS1A | NXP USA Inc. |
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO Module/Board Type: Adapter Board Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFVDBVLAIB | NXP USA Inc. |
Description: VERTICAL LOGIC ANALYZER BOARD FO Accessory Type: Logic Analyzer For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFLAIBHT | NXP USA Inc. |
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER Module/Board Type: Adapter Board Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFLAIBLT | NXP USA Inc. |
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
 |
PCA9515AD | NXP USA Inc. |
 Description: PCA9515A DUAL BIDIRECTIONAL I2CPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Applications: I2C Current - Supply: 500µA Data Rate (Max): 400kHz Supplier Device Package: 8-SOIC Capacitance - Input: 7 pF |
auf Bestellung 1509 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K342EHT0MPAST | NXP USA Inc. |
Description: S32K342, 2MB FLASH, ARM M7 Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 375 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K310NHT0VPASR | NXP USA Inc. |
Description: S32K310, 512KB FLASH, ARM M7 Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Number of I/O: 84 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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|
S32K310NHT0VPAST | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100QFP Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Number of I/O: 84 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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|
S32K312NHT0VPASR | NXP USA Inc. |
Description: S32K312, 2MB FLASH, ARM M7 Program Memory Size: 2MB (2M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 100-QFP Packaging: Tape & Reel (TR) Supplier Device Package: 100-MaxQFP (10x10) Peripherals: DMA, I2S, WDT Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 192K x 8 Qualification: AEC-Q100 Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32K312NHT0VPAST | NXP USA Inc. |
Description: S32K312, 2MB FLASH, ARM M7 Package / Case: 100-QFP Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Mounting Type: Surface Mount Supplier Device Package: 100-MaxQFP (10x10) Peripherals: DMA, I2S, WDT Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 192K x 8 Program Memory Size: 2MB (2M x 8) Speed: 120MHz |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
 |
S32K312NHT0VPBST | NXP USA Inc. |
Description: S32K312, 2MB FLASH, ARM M7 Qualification: AEC-Q100 Grade: Automotive Number of I/O: 143 Supplier Device Package: 172-QFP (16x16) Peripherals: DMA, Serial Audio, WDT Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C RAM Size: 192K x 8 Program Memory Size: 2MB (2M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 172-QFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PSMN3R9-60PSQ | NXP USA Inc. |
Description: TRANSISTOR >30MHZ Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 130A (Tc) Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V Power Dissipation (Max): 263W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SLN-VIZNLC-IOT |
|
Hersteller: NXP USA Inc.
Description: NXP EDGEREADY MCU-BASED SOLUTION
Platform: EdgeReady
Utilized IC / Part: RT106F
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: NXP EDGEREADY MCU-BASED SOLUTION
Platform: EdgeReady
Utilized IC / Part: RT106F
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH573BX/S711115 |
|
auf Bestellung 49750 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1332+ | 0.37 EUR |
| MIMXRT1062CVL5BR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 11.39 EUR |
| SLRC61003HNY |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SLRC61003HNY |
|
auf Bestellung 6452 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.24 EUR |
| 10+ | 8.87 EUR |
| 25+ | 8.4 EUR |
| 100+ | 7.74 EUR |
| 250+ | 7.35 EUR |
| 500+ | 7.07 EUR |
| 1000+ | 6.81 EUR |
| P60D144PU12/9A201V |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR UNCASED
DigiKey Programmable: Not Verified
Packaging: Bulk
Description: IC SMART CARD CTLR UNCASED
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS6512CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS6512LAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6512NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Description: FS6500
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6512CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS6512CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS6512LAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6512CAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6512NAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TJA1124AHG/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TJA1124AHG/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1493 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 4.24 EUR |
| 10+ | 3.03 EUR |
| 25+ | 2.89 EUR |
| 100+ | 2.75 EUR |
| 250+ | 2.63 EUR |
| 500+ | 2.54 EUR |
| 1000+ | 2.48 EUR |
| 74LVC16240ADGG/C4118 |
|
auf Bestellung 6093 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 452+ | 1.16 EUR |
| MPF5020CMMACESR2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34VR500VCESR2 |
|
Hersteller: NXP USA Inc.
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MX93AUD-HAT |
|
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 231.12 EUR |
| MKL36Z256VMC4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 84
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 84
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1740 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2080NSN8MQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
Supplier Device Package: 896-FCPBGA (25x25)
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 896-BFBGA, FCBGA
Packaging: Tray
Core Processor: PowerPC e6500
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
Supplier Device Package: 896-FCPBGA (25x25)
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 896-BFBGA, FCBGA
Packaging: Tray
Core Processor: PowerPC e6500
Produkt ist nicht verfügbar
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| P3041NSE7NNC |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| SCC2692AC1A44,518 |
|
Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
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| SCC2692AC1A44,512 |
|
Hersteller: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 44-PLCC
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Description: UART IC 2, DUART CHANNEL 44-PLCC
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
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| MPC8349EVVAJDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Description: IC MPU MPC83XX 533MHZ 672LBGA
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 266.31 EUR |
| 24+ | 220.62 EUR |
| BFT25,215 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
auf Bestellung 4782 Stücke:
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| MC33MR3003AXVKR2 |
Hersteller: NXP USA Inc.
Description: RF TXRX MOD ISM>1GHZSMD
RF Family/Standard: General ISM > 1GHz
Modulation: BPSK
Antenna Type: Antenna Not Included
Operating Temperature: 125°C
Frequency: 76GHz ~ 81GHz
Mounting Type: Surface Mount
Package / Case: 214-UFBGA, WLCSP
Packaging: Bulk
Description: RF TXRX MOD ISM>1GHZSMD
RF Family/Standard: General ISM > 1GHz
Modulation: BPSK
Antenna Type: Antenna Not Included
Operating Temperature: 125°C
Frequency: 76GHz ~ 81GHz
Mounting Type: Surface Mount
Package / Case: 214-UFBGA, WLCSP
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPX2010D |
|
Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSID .025V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Description: SENSOR 1.45PSID .025V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
auf Bestellung 1033 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 22.12 EUR |
| 5+ | 20.14 EUR |
| 10+ | 19.41 EUR |
| 25+ | 18.54 EUR |
| 50+ | 17.94 EUR |
| 125+ | 17.34 EUR |
| MC68040FE25V |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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| MC68EC040FE40A |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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| PESD5V0C1UZF315 |
|
auf Bestellung 171000 Stücke:
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| Anzahl | Preis |
|---|---|
| 8876+ | 0.053 EUR |
| S9S08SL8F1MTLR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S9S08SL8F1MTL |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC8272CVRMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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| TEA1936XDB1530UL |
|
Hersteller: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 568.52 EUR |
| SAF4000EL/101Z224Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAF4000EL/101Q224Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| S912XEQ512J3VALR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SPC5603BK0MLH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 384KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| HEF4515BP,652 |
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
Produkt ist nicht verfügbar
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| 74AUP1T58GF |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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| MCIMX6G2DVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 27.86 EUR |
| 10+ | 22.15 EUR |
| 25+ | 20.72 EUR |
| 152+ | 18.79 EUR |
| TEA88182HT/1J |
Hersteller: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| MF4SAM3X84/9BA6AUJ |
Hersteller: NXP USA Inc.
Description: MF4SAM3X84
Supplier Device Package: PCM1.1
Standards: Mifare, ISO 14443, ISO 7816
Voltage - Supply: 6V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C
Mounting Type: Surface Mount
Package / Case: Module
Packaging: Tape & Reel (TR)
Description: MF4SAM3X84
Supplier Device Package: PCM1.1
Standards: Mifare, ISO 14443, ISO 7816
Voltage - Supply: 6V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C
Mounting Type: Surface Mount
Package / Case: Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| LFVBBJ76ZA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Accessory Type: Logic Analyzer
For Use With/Related Products: MPC5676R
Packaging: Bulk
Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Accessory Type: Logic Analyzer
For Use With/Related Products: MPC5676R
Packaging: Bulk
Produkt ist nicht verfügbar
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| LFLAIBW1A |
Hersteller: NXP USA Inc.
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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| LFLAIBS1A |
Hersteller: NXP USA Inc.
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Module/Board Type: Adapter Board
Packaging: Bulk
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Module/Board Type: Adapter Board
Packaging: Bulk
Produkt ist nicht verfügbar
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| LFVDBVLAIB |
Hersteller: NXP USA Inc.
Description: VERTICAL LOGIC ANALYZER BOARD FO
Accessory Type: Logic Analyzer
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Packaging: Bulk
Description: VERTICAL LOGIC ANALYZER BOARD FO
Accessory Type: Logic Analyzer
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Packaging: Bulk
Produkt ist nicht verfügbar
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| LFLAIBHT |
Hersteller: NXP USA Inc.
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Module/Board Type: Adapter Board
Packaging: Bulk
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Module/Board Type: Adapter Board
Packaging: Bulk
Produkt ist nicht verfügbar
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| LFLAIBLT |
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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| PCA9515AD |
|
Hersteller: NXP USA Inc.
Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
auf Bestellung 1509 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 239+ | 2.13 EUR |
| S32K342EHT0MPAST |
|
Hersteller: NXP USA Inc.
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 30.22 EUR |
| 10+ | 24.09 EUR |
| 25+ | 22.56 EUR |
| 100+ | 20.88 EUR |
| S32K310NHT0VPASR |
|
Hersteller: NXP USA Inc.
Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K310NHT0VPAST |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
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| S32K312NHT0VPASR |
|
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tape & Reel (TR)
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Qualification: AEC-Q100
Grade: Automotive
Description: S32K312, 2MB FLASH, ARM M7
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tape & Reel (TR)
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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| S32K312NHT0VPAST |
|
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Package / Case: 100-QFP
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Description: S32K312, 2MB FLASH, ARM M7
Package / Case: 100-QFP
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S32K312NHT0VPBST |
|
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Qualification: AEC-Q100
Grade: Automotive
Number of I/O: 143
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, Serial Audio, WDT
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 192K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tray
Description: S32K312, 2MB FLASH, ARM M7
Qualification: AEC-Q100
Grade: Automotive
Number of I/O: 143
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, Serial Audio, WDT
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 192K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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| PSMN3R9-60PSQ |
|
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
Produkt ist nicht verfügbar
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