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ON5233,118 ON5233,118 NXP USA Inc. Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Produkt ist nicht verfügbar
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P1010NSN5HFB P1010NSN5HFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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BZX585-C36115 NXP USA Inc. BZX585_SERIES.pdf Description: NOW NEXPERIA BZX585-C36 ZENER DI
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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74ALVCH16843DGG653 NXP USA Inc. 74ALVCH16843.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
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74ALVCH16843DGG518 NXP USA Inc. 74ALVCH16843.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC908JK3EMDWE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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TDF8541JV/N3ZU TDF8541JV/N3ZU NXP USA Inc. TDF8541.PDF Description: IC AUDIO AMP DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Mounting Type: Through Hole
Supplier Device Package: DBS27P
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TJA1103AHN/0Z TJA1103AHN/0Z NXP USA Inc. TJA1103FS.pdf Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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TJA1103AHN/0Z TJA1103AHN/0Z NXP USA Inc. TJA1103FS.pdf Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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10+4.02 EUR
25+3.68 EUR
100+3.3 EUR
250+3.12 EUR
500+3.05 EUR
1000+2.88 EUR
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OM13053UL OM13053UL NXP USA Inc. OM13053_Overview_Web.pdf Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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NCK2910AHN/10203Y NCK2910AHN/10203Y NXP USA Inc. Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
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NCK2910AHN/10203Y NCK2910AHN/10203Y NXP USA Inc. Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
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25+7.52 EUR
50+7.49 EUR
100+6.71 EUR
250+6.69 EUR
500+6.44 EUR
1000+6.13 EUR
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FRDM-XS2410EVB NXP USA Inc. UM11313.pdf Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
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MC34PF8100EREPR2 MC34PF8100EREPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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MC68332GCAG16 MC68332GCAG16 NXP USA Inc. MC68332UM_ZIP.zip Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332GVAG25 MC68332GVAG25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332AMEH16 MC68332AMEH16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332AVEH20 MC68332AVEH20 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332GVEH25 MC68332GVEH25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC33797BPEWR2 MC33797BPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
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MC33797BPEWR2 MC33797BPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
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100+14.23 EUR
250+13.64 EUR
500+13.27 EUR
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MC33797BPEW MC33797BPEW NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
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1+22.1 EUR
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PN7642EV/C100Y PN7642EV/C100Y NXP USA Inc. PN7642.pdf Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader
Interface: I2C, SPI, UART, USB
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tape & Reel (TR)
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Voltage - Supply: 1.8V ~ 3.5V
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PN7642EV/C100K PN7642EV/C100K NXP USA Inc. PN7642.pdf Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Voltage - Supply: 1.8V ~ 3.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader
Interface: I2C, SPI, UART, USB
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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OM27642DB NXP USA Inc. Description: DEVELOPMENT BOARD
Utilized IC / Part: PN7642
Contents: Board(s), Accessories
Supplied Contents: Board(s), Accessories
Type: Near Field Communication (NFC)
For Use With/Related Products: PN7642
Packaging: Bulk
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OM27642EVK OM27642EVK NXP USA Inc. OM27642EVK%20Product%20Information%20_%20NXP%20Semiconductors.pdf Description: DEVELOPMENT KIT
Utilized IC / Part: PN7642
Contents: Board(s), Cable(s)
Supplied Contents: Board(s), Cable(s)
Type: Near Field Communication (NFC)
For Use With/Related Products: PN7642
Packaging: Bulk
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ISI-QMC-DB02 NXP USA Inc. QUADMTRCNTRLGEN2FS.pdf Description: INTERFACE DEVELOPMENT TOOLS ISI-
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
Contents: Board(s)
Type: Interface
Function: Expansion Board
Packaging: Bulk
Produkt ist nicht verfügbar
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XC7SH86GV,125 XC7SH86GV,125 NXP USA Inc. NEXP-S-A0002881988-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
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FRDMDUAL33664EVB FRDMDUAL33664EVB NXP USA Inc. get-started-with-the-frdmdual33664evb:GS-FRDMDUAL33664EVB Description: EVAL BOARD FOR MC33664
Packaging: Bulk
Function: Transceiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
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MC32PF4210A3ESR2 MC32PF4210A3ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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S9S08DV16F2MLF S9S08DV16F2MLF NXP USA Inc. Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MKE16F512VLL16 MKE16F512VLL16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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2+18.68 EUR
10+14.58 EUR
90+12.48 EUR
180+12.05 EUR
270+11.84 EUR
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MCIMX6Y1CVK05AA MCIMX6Y1CVK05AA NXP USA Inc. Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR MIMXRT595SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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SPC5744PK1AMMM9 SPC5744PK1AMMM9 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SPC5746CHK0AMMH6 SPC5746CHK0AMMH6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMJ6 SPC5746CHK0AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1022NSE7WQB T1022NSE7WQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T4161NSN7PQB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MCIMX6G1AVM07AA MCIMX6G1AVM07AA NXP USA Inc. MCIMX6GxAzzzzzA.pdf Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MKV31F512VLL12P MKV31F512VLL12P NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043AXN7QQA LS1043AXN7QQA NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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MRF377HR3 NXP USA Inc. MRF377H.pdf Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
Produkt ist nicht verfügbar
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MCIMX6G1AVM07AA557 NXP USA Inc. PHGL-S-A0003204166-1.pdf?t.download=true&u=5oefqw Description: CORTEX A7 RISC MPU 32 BIT
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6Y1DVM05AA557 NXP USA Inc. NEXP-S-A0003108739-1.pdf?t.download=true&u=5oefqw Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G2DVK05AA557-NXP MCIMX6G2DVK05AA557-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G0DVM05AA557 NXP USA Inc. PHGL-S-A0003204171-1.pdf?t.download=true&u=5oefqw Description: CORTEX A7 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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UBA2024T/N1,518 UBA2024T/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2024T/N1,518 UBA2024T/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
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UBA2024AP/N1,112 UBA2024AP/N1,112 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2024AT/N1,518 UBA2024AT/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2211CP/N1,112 UBA2211CP/N1,112 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Supplier Device Package: 8-DIP
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Output Source/Sink: 1.85A
Dimming: No
Produkt ist nicht verfügbar
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MCIMX6X4EVM10AB MCIMX6X4EVM10AB NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 1GHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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1+82.34 EUR
10+67.43 EUR
84+60.64 EUR
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MIMXRT555SFAWCR MIMXRT555SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 6000 Stücke
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MIMXRT555SFFOCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 249FOWLP
Number of I/O: 136
Supplier Device Package: 249-FOWLP (7x7)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 249-WFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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2000+34.69 EUR
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MIMXRT555SFFOC NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 249FOWLP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 249-FOWLP (7x7)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 249-WFBGA
Packaging: Tray
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1+53.13 EUR
10+42.61 EUR
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MIMXRT595SFFOCR MIMXRT595SFFOCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 249WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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MK10DX256VLL7557 NXP USA Inc. K10P100M72SF1.pdf Description: KINETIS K10: MICROCONTROLLER COR
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9601DPZ PCA9601DPZ NXP USA Inc. PCA9601.pdf Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
auf Bestellung 4344 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.12 EUR
10+6.91 EUR
25+6.37 EUR
100+5.76 EUR
250+5.47 EUR
500+5.31 EUR
1000+5.16 EUR
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MC33814AER2 MC33814AER2 NXP USA Inc. MC33814.pdf Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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ON5233,118
ON5233,118
Hersteller: NXP USA Inc.
Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Produkt ist nicht verfügbar
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P1010NSN5HFB QP1010FS.pdf
P1010NSN5HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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BZX585-C36115 BZX585_SERIES.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C36 ZENER DI
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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74ALVCH16843DGG653 74ALVCH16843.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
423+1.49 EUR
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74ALVCH16843DGG518 74ALVCH16843.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC68HC908Jx(1,3).pdf
MC908JK3EMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 38 Stücke
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TDF8541JV/N3ZU TDF8541.PDF
TDF8541JV/N3ZU
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Mounting Type: Through Hole
Supplier Device Package: DBS27P
Produkt ist nicht verfügbar
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TJA1103AHN/0Z TJA1103FS.pdf
TJA1103AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1103AHN/0Z TJA1103FS.pdf
TJA1103AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2178 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.38 EUR
10+4.02 EUR
25+3.68 EUR
100+3.3 EUR
250+3.12 EUR
500+3.05 EUR
1000+2.88 EUR
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OM13053UL OM13053_Overview_Web.pdf
OM13053UL
Hersteller: NXP USA Inc.
Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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NCK2910AHN/10203Y
NCK2910AHN/10203Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
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6000+5.43 EUR
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NCK2910AHN/10203Y
NCK2910AHN/10203Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
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10+7.69 EUR
25+7.52 EUR
50+7.49 EUR
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250+6.69 EUR
500+6.44 EUR
1000+6.13 EUR
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FRDM-XS2410EVB UM11313.pdf
Hersteller: NXP USA Inc.
Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
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MC34PF8100EREPR2 PF8100_PF8200.pdf
MC34PF8100EREPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC68332GCAG16 MC68332UM_ZIP.zip
MC68332GCAG16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVAG25 MC68332TS.pdf
MC68332GVAG25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AMEH16 MC68332TS.pdf
MC68332AMEH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AVEH20 MC68332TS.pdf
MC68332AVEH20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVEH25 MC68332TS.pdf
MC68332GVEH25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797.pdf
MC33797BPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797.pdf
MC33797BPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
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1+21.19 EUR
10+16.64 EUR
25+15.48 EUR
100+14.23 EUR
250+13.64 EUR
500+13.27 EUR
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MC33797BPEW MC33797.pdf
MC33797BPEW
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
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1+22.1 EUR
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PN7642EV/C100Y PN7642.pdf
PN7642EV/C100Y
Hersteller: NXP USA Inc.
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader
Interface: I2C, SPI, UART, USB
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tape & Reel (TR)
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Voltage - Supply: 1.8V ~ 3.5V
Produkt ist nicht verfügbar
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PN7642EV/C100K PN7642.pdf
PN7642EV/C100K
Hersteller: NXP USA Inc.
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Voltage - Supply: 1.8V ~ 3.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader
Interface: I2C, SPI, UART, USB
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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OM27642DB
Hersteller: NXP USA Inc.
Description: DEVELOPMENT BOARD
Utilized IC / Part: PN7642
Contents: Board(s), Accessories
Supplied Contents: Board(s), Accessories
Type: Near Field Communication (NFC)
For Use With/Related Products: PN7642
Packaging: Bulk
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OM27642EVK OM27642EVK%20Product%20Information%20_%20NXP%20Semiconductors.pdf
OM27642EVK
Hersteller: NXP USA Inc.
Description: DEVELOPMENT KIT
Utilized IC / Part: PN7642
Contents: Board(s), Cable(s)
Supplied Contents: Board(s), Cable(s)
Type: Near Field Communication (NFC)
For Use With/Related Products: PN7642
Packaging: Bulk
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ISI-QMC-DB02 QUADMTRCNTRLGEN2FS.pdf
Hersteller: NXP USA Inc.
Description: INTERFACE DEVELOPMENT TOOLS ISI-
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
Contents: Board(s)
Type: Interface
Function: Expansion Board
Packaging: Bulk
Produkt ist nicht verfügbar
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XC7SH86GV,125 NEXP-S-A0002881988-1.pdf?t.download=true&u=5oefqw
XC7SH86GV,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
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1679+0.38 EUR
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FRDMDUAL33664EVB get-started-with-the-frdmdual33664evb:GS-FRDMDUAL33664EVB
FRDMDUAL33664EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33664
Packaging: Bulk
Function: Transceiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
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MC32PF4210A3ESR2 PF4210.pdf
MC32PF4210A3ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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S9S08DV16F2MLF
S9S08DV16F2MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE16F512VLL16 KE1xFP100M168SF0.pdf
MKE16F512VLL16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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2+18.68 EUR
10+14.58 EUR
90+12.48 EUR
180+12.05 EUR
270+11.84 EUR
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MCIMX6Y1CVK05AA
MCIMX6Y1CVK05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR IMXRT500EC.pdf
MIMXRT595SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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6000+28.12 EUR
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SPC5744PK1AMMM9 MPC5744P.pdf
SPC5744PK1AMMM9
Hersteller: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMH6 MPC5746C.pdf
SPC5746CHK0AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMJ6 MPC5746C.pdf
SPC5746CHK0AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1022NSE7WQB T1FAMILYFS.pdf
T1022NSE7WQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T4161NSN7PQB T4240T4160FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MCIMX6G1AVM07AA MCIMX6GxAzzzzzA.pdf
MCIMX6G1AVM07AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MKV31F512VLL12P KV30P64M100SFA.pdf
MKV31F512VLL12P
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043AXN7QQA LS1043AFS.pdf
LS1043AXN7QQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MRF377HR3 MRF377H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
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MCIMX6G1AVM07AA557 PHGL-S-A0003204166-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: CORTEX A7 RISC MPU 32 BIT
Packaging: Bulk
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MCIMX6Y1DVM05AA557 NEXP-S-A0003108739-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G2DVK05AA557-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G2DVK05AA557-NXP
Hersteller: NXP USA Inc.
Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
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MCIMX6G0DVM05AA557 PHGL-S-A0003204171-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: CORTEX A7 RISC MICROPROCESSOR 32
Packaging: Bulk
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UBA2024T/N1,518 UBA2024.pdf
UBA2024T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
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UBA2024T/N1,518 UBA2024.pdf
UBA2024T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
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AnzahlPrivatkunde
376+1.59 EUR
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UBA2024AP/N1,112 UBA2024.pdf
UBA2024AP/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
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UBA2024AT/N1,518 UBA2024.pdf
UBA2024AT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
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UBA2211CP/N1,112 UBA2211.pdf
UBA2211CP/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Supplier Device Package: 8-DIP
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Output Source/Sink: 1.85A
Dimming: No
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MCIMX6X4EVM10AB IMX6SXIEC.pdf
MCIMX6X4EVM10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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1+82.34 EUR
10+67.43 EUR
84+60.64 EUR
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MIMXRT555SFAWCR IMXRT500EC.pdf
MIMXRT555SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT555SFFOCR IMXRT500EC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Number of I/O: 136
Supplier Device Package: 249-FOWLP (7x7)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 249-WFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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MIMXRT555SFFOC IMXRT500EC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 249-FOWLP (7x7)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 249-WFBGA
Packaging: Tray
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1+53.13 EUR
10+42.61 EUR
80+36.39 EUR
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MIMXRT595SFFOCR IMXRT500EC.pdf
MIMXRT595SFFOCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
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MK10DX256VLL7557 K10P100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: KINETIS K10: MICROCONTROLLER COR
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9601DPZ PCA9601.pdf
PCA9601DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
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3+9.12 EUR
10+6.91 EUR
25+6.37 EUR
100+5.76 EUR
250+5.47 EUR
500+5.31 EUR
1000+5.16 EUR
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MC33814AER2 MC33814.pdf
MC33814AER2
Hersteller: NXP USA Inc.
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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