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OM13221/ASC3112UL NXP USA Inc. Description: DEMO BOARD OM13221/ASC3112
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SL2ICS5311EW/V7,00 NXP USA Inc. SL2ICS53,54.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: EPC, ISO 15693
Supplier Device Package: Wafer
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33MR2001TVK NXP USA Inc. MC33MR2001Txx.pdf Description: IC TX 77GHZ RADAR AUTO 89VFBGA
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PC33MR2001RVK NXP USA Inc. Description: IC RX 77GHZ RADAR AUTO
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PC33MR2001VVK NXP USA Inc. Description: IC VCO 77GHZ RADAR AUTO
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SAF5000EL/V100/S2K NXP USA Inc. Description: MULTI APPLICATION RADIO SYSTEM
Produkt ist nicht verfügbar
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TDA18204HN/C1,557 NXP USA Inc. TDA18204HN.pdf Description: IC TELECOM INTERFACE
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TDA18256HN/C1E NXP USA Inc. Description: IC TELECOM INTERFACE
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TDA18256HN/C1K NXP USA Inc. Description: IC TELECOM INTERFACE
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TDA18264HB/C1,557 NXP USA Inc. Description: IC TELECOM INTERFACE
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TDA18267HB/C1,557 NXP USA Inc. Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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TDA18280HN/C1K NXP USA Inc. Description: IC TELECOM INTERFACE
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF5000EL/V1/S20K NXP USA Inc. Description: WISPA-ITS
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TEF5100EL/V1/S20K NXP USA Inc. Description: WISPA-ITS
Produkt ist nicht verfügbar
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PMMA1210KEG NXP USA Inc. MMA1210.pdf Description: IC ACCEL Z- AXIS 100G
Packaging: Tube
Produkt ist nicht verfügbar
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PMMA1220KEG NXP USA Inc. MMA1220KEG.pdf Description: IC ACCEL LOW G Z-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA1251KEG NXP USA Inc. Description: IC ACCEL Z-AXIS
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PMMA1252KEG NXP USA Inc. Description: IC ACCEL 5G Z-AXIS
Packaging: Tube
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PMMA2204KEG NXP USA Inc. Description: IC ACCEL X-AXIS 100G ROHS
Packaging: Tube
Part Status: Obsolete
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PMMA2244KEG NXP USA Inc. Description: IC ACCEL 20G X-AXIS
Packaging: Tube
Part Status: Obsolete
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PMMA3201KEG NXP USA Inc. Description: IC ACCEL XY AXIS 40G ROHS
Produkt ist nicht verfügbar
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PMMA3202KEG NXP USA Inc. Description: IC ACCEL SMT LN XY SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA3204KEG NXP USA Inc. Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPXM2102AT1 MPXM2102AT1 NXP USA Inc. MPX2102.pdf Description: SENSOR 14.5PSIA .04V 5MPAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
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50+15.15 EUR
100+14.65 EUR
500+13.86 EUR
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MC13892DJVLR2 MC13892DJVLR2 NXP USA Inc. MC13892.pdf Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
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PCA9510AD,118 PCA9510AD,118 NXP USA Inc. PCA9510A.pdf Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
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250+2.87 EUR
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BGU6101,147 BGU6101,147 NXP USA Inc. BGU6101.pdf Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
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250+1.45 EUR
500+1.39 EUR
1000+1.34 EUR
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KMI15/1/V3PX KMI15/1/V3PX NXP USA Inc. KMI15_1.pdf Description: MAGNETIC SWITCH SPEC PURP 2SIP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Produkt ist nicht verfügbar
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SL3S1202FTB1,115 SL3S1202FTB1,115 NXP USA Inc. SL3ICS1002_1202.pdf Description: IC RFID TRANSP 840-960MHZ 3XSON
Produkt ist nicht verfügbar
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PCAL6416AEX1Z PCAL6416AEX1Z NXP USA Inc. PCAL6416A.pdf Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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100+1.54 EUR
250+1.44 EUR
500+1.38 EUR
1000+1.34 EUR
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SC18IS600IPW/S8HP SC18IS600IPW/S8HP NXP USA Inc. SC18IS600.pdf Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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SC18IS602BIPW/S8HP SC18IS602BIPW/S8HP NXP USA Inc. SC18IS602B.pdf Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF13750HR5 MRF13750HR5 NXP USA Inc. MRF13750H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
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SJA1105ELY SJA1105ELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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2+18.96 EUR
10+14.79 EUR
25+13.74 EUR
100+12.6 EUR
250+12.42 EUR
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SJA1105TELY SJA1105TELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 4834 Stücke:
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1+26.1 EUR
10+20.58 EUR
25+19.19 EUR
100+17.68 EUR
250+17.66 EUR
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TFA9891UK/N1AZ TFA9891UK/N1AZ NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
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NX30P6093UKZ NXP USA Inc. NXP_GreenChip_FS.pdf Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1999TK/1J TEA1999TK/1J NXP USA Inc. TEA1999TK.pdf Description: FLYBACK SR
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX8M-EVK MCIMX8M-EVK NXP USA Inc. i.MX8M_Family_FS.pdf Description: I.MX 8M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active
Produkt ist nicht verfügbar
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LPC8N04FHI24E LPC8N04FHI24E NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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10+3.83 EUR
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LPC8N04FHI24Z LPC8N04FHI24Z NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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OM40002UL OM40002UL NXP USA Inc. get-started-with-the-om40002:GS-OM40002 Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
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1+48.99 EUR
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LPC8N04FHI24Z LPC8N04FHI24Z NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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100+2.37 EUR
250+2.36 EUR
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MC33972ATEKR2 MC33972ATEKR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
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100+6.99 EUR
250+6.65 EUR
500+6.45 EUR
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S9KEAZN8AMTGR S9KEAZN8AMTGR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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5+4.25 EUR
10+3.14 EUR
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500+2.33 EUR
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SC16C752BIB48,128 SC16C752BIB48,128 NXP USA Inc. SC16C752B.pdf Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 7993 Stücke:
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2+18.98 EUR
10+14.8 EUR
25+13.77 EUR
100+12.61 EUR
250+12.44 EUR
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PCF8551BTT/AJ PCF8551BTT/AJ NXP USA Inc. PCF8551.pdf Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
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TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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BAP142LX,315 BAP142LX,315 NXP USA Inc. BAP142LX.pdf Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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LPC11A04UK,118 LPC11A04UK,118 NXP USA Inc. LPC11AXX.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZN64AMLHR S9KEAZN64AMLHR NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
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LPC812M101JDH16J LPC812M101JDH16J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified
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GTL2000DGG,118 GTL2000DGG,118 NXP USA Inc. GTL2000.pdf Description: IC TRANSLATOR BIDIR 48TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 48-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 22
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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LPC824M201JHI33Y LPC824M201JHI33Y NXP USA Inc. LPC82X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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LPC1111FHN33/102'5 LPC1111FHN33/102'5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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A2V07H400-04NR3 NXP USA Inc. A2V07H400-04N.pdf Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 595MHz ~ 851MHz
Configuration: Dual
Power - Output: 267W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
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A3T18H455W23SR6 A3T18H455W23SR6 NXP USA Inc. A3T18H455W23S.pdf Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 192W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
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A3T21H360W23SR6 NXP USA Inc. A3T21H360W23S.pdf Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
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FS32K142HAT0MLHT FS32K142HAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K142HAT0MLLT FS32K142HAT0MLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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OM13221/ASC3112UL
Hersteller: NXP USA Inc.
Description: DEMO BOARD OM13221/ASC3112
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SL2ICS5311EW/V7,00 SL2ICS53,54.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: EPC, ISO 15693
Supplier Device Package: Wafer
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33MR2001TVK MC33MR2001Txx.pdf
Hersteller: NXP USA Inc.
Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
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PC33MR2001RVK
Hersteller: NXP USA Inc.
Description: IC RX 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
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PC33MR2001VVK
Hersteller: NXP USA Inc.
Description: IC VCO 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
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SAF5000EL/V100/S2K
Hersteller: NXP USA Inc.
Description: MULTI APPLICATION RADIO SYSTEM
Produkt ist nicht verfügbar
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TDA18204HN/C1,557 TDA18204HN.pdf
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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TDA18256HN/C1E
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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TDA18256HN/C1K
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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TDA18264HB/C1,557
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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TDA18267HB/C1,557
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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TDA18280HN/C1K
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF5000EL/V1/S20K
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Produkt ist nicht verfügbar
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TEF5100EL/V1/S20K
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Produkt ist nicht verfügbar
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PMMA1210KEG MMA1210.pdf
Hersteller: NXP USA Inc.
Description: IC ACCEL Z- AXIS 100G
Packaging: Tube
Produkt ist nicht verfügbar
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PMMA1220KEG MMA1220KEG.pdf
Hersteller: NXP USA Inc.
Description: IC ACCEL LOW G Z-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA1251KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL Z-AXIS
Produkt ist nicht verfügbar
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PMMA1252KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL 5G Z-AXIS
Packaging: Tube
Produkt ist nicht verfügbar
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PMMA2204KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL X-AXIS 100G ROHS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA2244KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL 20G X-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA3201KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL XY AXIS 40G ROHS
Produkt ist nicht verfügbar
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PMMA3202KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL SMT LN XY SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMMA3204KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPXM2102AT1 MPX2102.pdf
MPXM2102AT1
Hersteller: NXP USA Inc.
Description: SENSOR 14.5PSIA .04V 5MPAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 1006 Stücke:
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MC13892DJVLR2 MC13892.pdf
MC13892DJVLR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
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PCA9510AD,118 PCA9510A.pdf
PCA9510AD,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
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5+4.94 EUR
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BGU6101,147 BGU6101.pdf
BGU6101,147
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
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11+2.07 EUR
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KMI15/1/V3PX KMI15_1.pdf
KMI15/1/V3PX
Hersteller: NXP USA Inc.
Description: MAGNETIC SWITCH SPEC PURP 2SIP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Produkt ist nicht verfügbar
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SL3S1202FTB1,115 SL3ICS1002_1202.pdf
SL3S1202FTB1,115
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 3XSON
Produkt ist nicht verfügbar
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PCAL6416AEX1Z PCAL6416A.pdf
PCAL6416AEX1Z
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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8+2.62 EUR
12+1.9 EUR
25+1.73 EUR
100+1.54 EUR
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500+1.38 EUR
1000+1.34 EUR
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SC18IS600IPW/S8HP SC18IS600.pdf
SC18IS600IPW/S8HP
Hersteller: NXP USA Inc.
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC18IS602BIPW/S8HP SC18IS602B.pdf
SC18IS602BIPW/S8HP
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF13750HR5 MRF13750H.pdf
MRF13750HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
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SJA1105ELY SJA1105.pdf
SJA1105ELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SJA1105TELY SJA1105.pdf
SJA1105TELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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TFA9891UK/N1AZ
TFA9891UK/N1AZ
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
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NX30P6093UKZ NXP_GreenChip_FS.pdf
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1999TK/1J TEA1999TK.pdf
TEA1999TK/1J
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX8M-EVK i.MX8M_Family_FS.pdf
MCIMX8M-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active
Produkt ist nicht verfügbar
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LPC8N04FHI24E LPC8N04.pdf
LPC8N04FHI24E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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LPC8N04FHI24Z LPC8N04.pdf
LPC8N04FHI24Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM40002UL get-started-with-the-om40002:GS-OM40002
OM40002UL
Hersteller: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
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LPC8N04FHI24Z LPC8N04.pdf
LPC8N04FHI24Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MC33972ATEKR2
MC33972ATEKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
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S9KEAZN8AMTGR S9KEA8P44M48SF0.pdf
S9KEAZN8AMTGR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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SC16C752BIB48,128 SC16C752B.pdf
SC16C752BIB48,128
Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
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PCF8551BTT/AJ PCF8551.pdf
PCF8551BTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
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TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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BAP142LX,315 BAP142LX.pdf
BAP142LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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LPC11A04UK,118 LPC11AXX.pdf
LPC11A04UK,118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZN64AMLHR S9KEA64P64M20SF0.pdf
S9KEAZN64AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 2191 Stücke:
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3+8 EUR
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LPC812M101JDH16J LPC81XM.pdf
LPC812M101JDH16J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified
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7+3.2 EUR
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GTL2000DGG,118 GTL2000.pdf
GTL2000DGG,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 48-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 22
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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LPC824M201JHI33Y LPC82X.pdf
LPC824M201JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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LPC1111FHN33/102'5 LPC111X.pdf
LPC1111FHN33/102'5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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A2V07H400-04NR3 A2V07H400-04N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 595MHz ~ 851MHz
Configuration: Dual
Power - Output: 267W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
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A3T18H455W23SR6 A3T18H455W23S.pdf
A3T18H455W23SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 192W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
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A3T21H360W23SR6 A3T21H360W23S.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
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FS32K142HAT0MLHT S32K1xx.pdf
FS32K142HAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K142HAT0MLLT S32K1xx.pdf
FS32K142HAT0MLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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2+16.26 EUR
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