Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36598) > Seite 304 nach 610
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LTE3401HX | NXP USA Inc. |
 Description: IC AMP LTE 1.452-2.69GHZ 6XSONPackaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.452GHz ~ 2.69GHz RF Type: LTE Voltage - Supply: 1.5V ~ 3.1V Gain: 17.5dB Current - Supply: 13.4mA Noise Figure: 0.75dB P1dB: -7.5dBm Test Frequency: 2.69GHz Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LTE3401LX | NXP USA Inc. |
Description: IC AMP LTE 617MHZ-960MHZ 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 617MHz ~ 960MHz RF Type: LTE Voltage - Supply: 1.5V ~ 3.1V Gain: 18.2dB Current - Supply: 10.3mA Noise Figure: 0.66dB P1dB: -7.4dBm Test Frequency: 943MHz Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MC33AR6000BGWS | NXP USA Inc. |
Description: ALTERNATOR REGULATOR, 14V 12A, L |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 13 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC34PF4210A0ES | NXP USA Inc. |
Description: PF4210 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF4210A0ESR2 | NXP USA Inc. |
Description: PF4210 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC35FS4503CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC35FS4503CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCF51EM256CLLR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6D4AVT10AE | NXP USA Inc. |
Description: I.MX6D ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MCIMX6D4AVT10AER | NXP USA Inc. |
Description: I.MX6D ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCIMX6D5EYM12CE | NXP USA Inc. |
Description: I.MX6DQ 1ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MCIMX6D5EZK08AE | NXP USA Inc. |
Description: IC MPU I.MX6D 800MHZ 569MAPBGA Packaging: Tray Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 189 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MCIMX6D6AVT08AE | NXP USA Inc. |
Description: IC MPU I.MX6D 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MCIMX6D6AVT08AER | NXP USA Inc. |
Description: IC MPU I.MX6D 852MHZ 624FCBGA Packaging: Tape & Reel (TR) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MCIMX6Q4AVT10AER | NXP USA Inc. |
Description: I.MX6Q ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCIMX6Q5EYM12CE | NXP USA Inc. |
Description: I.MX6DQ ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MCIMX6Q6AVT08AE | NXP USA Inc. |
Description: I.MX6Q ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MCIMX6Q6AVT08AER | NXP USA Inc. |
Description: I.MX6Q ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCIMX6S1AVM08AD | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6S1AVM08ADR | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGA Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6Y2CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
auf Bestellung 750 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y2CVM08AB | NXP USA Inc. |
Description: IC MPU I.MX6 792MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 792MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
auf Bestellung 3466 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y2DVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
auf Bestellung 475 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y2DVM09AB | NXP USA Inc. |
Description: IC MPU I.MX6 900MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
auf Bestellung 753 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y7DVK05AB | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CAN, I2C, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MHT2025GNR1 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MHT2025NR1 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MIMX8MD6CVAHZAA | NXP USA Inc. |
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MD6DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Not For New Designs |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MQ5CVAHZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8MQ5DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MIMX8MQ6CVAHZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MIMX8MQ6DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MRF085HR3 | NXP USA Inc. |
Description: WIDEBAND RF POWER LDMOS TRANSIST |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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NCF2952MTT/TPE080J | NXP USA Inc. |
Description: IC PASS ENTRY 125KHZ |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NCF2961MHN2/0212CJ | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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NCF29A4XHN/0500VJ | NXP USA Inc. | Description: IC 32HVQFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NCK2910AHN/00201Y | NXP USA Inc. | Description: RECEIVER + INTEGRATED UC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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OL2385AHN/001A1Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PCA9535HFHP | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN Features: POR Packaging: Tape & Reel (TR) Package / Case: 24-WFQFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HWQFN (4x4) Current - Output Source/Sink: 160mA Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PCA9557BSHP | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN Features: POR Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: No Supplier Device Package: 16-HVQFN (4x4) Current - Output Source/Sink: 10mA, 20mA Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PCF7952ATT/C2BC20J | NXP USA Inc. |
Description: IC PASS ENTRY 125KHZ |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PCF7991AT/1081/UZ | NXP USA Inc. |
Description: READER CHIPS Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PFXPQ3115BVT1 | NXP USA Inc. |
Description: PRESSURE SENSOR, 2.5V, 20/110KPA Packaging: Tape & Reel (TR) Applications: Board Mount Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PFXPS71404T1 | NXP USA Inc. |
Description: PRESSURE SATELLITE, 40-140 KPA, Packaging: Tray Applications: Board Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PN5180A0ET/C3J | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA Packaging: Tape & Reel (TR) Package / Case: 64-TFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C Voltage - Supply: 3.3V Standards: ISO 14443, ISO 15693 Supplier Device Package: 64-TFBGA (5.5x5.5) Part Status: Active |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5180A0ET/C3QL | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA Packaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C Voltage - Supply: 3.3V Standards: ISO 14443, ISO 15693 Supplier Device Package: 64-TFBGA (5.5x5.5) Part Status: Active |
auf Bestellung 2480 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5180A0HN/C3E | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C Voltage - Supply: 3.3V Standards: ISO 14443, ISO 15693 Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 875 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5180A0HN/C3Y | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C Voltage - Supply: 3.3V Standards: ISO 14443, ISO 15693 Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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S32R274RRUEVB | NXP USA Inc. |
Description: S32R274 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: S32R274 Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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S32V234-EVB2 | NXP USA Inc. |
Description: S32V234 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Board Type: Evaluation Platform Utilized IC / Part: S32V234 Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912XDT512J1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912XDT512J1MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVLA96F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SC18IS600IPW/S8HP | NXP USA Inc. |
Description: IC I2C CONTROLLER SPI 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Current - Supply: 11mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Last Time Buy DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SP5745BBK1AMMH6R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA Packaging: Tape & Reel (TR) Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5745BBK1AMMH6 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5748CK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5748CK0AMMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA1999TK/1J | NXP USA Inc. |
Description: FLYBACK SR Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 0V ~ 21V Applications: Active/Synchronous Rectification Controller Supplier Device Package: 8-HVSON (3x3) Current - Supply: 250 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| LTE3401HX |
|
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LTE3401LX |
|
Hersteller: NXP USA Inc.
Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33AR6000BGWS |
|
Hersteller: NXP USA Inc.
Description: ALTERNATOR REGULATOR, 14V 12A, L
Description: ALTERNATOR REGULATOR, 14V 12A, L
Produkt ist nicht verfügbar
Mindestbestellmenge: 13 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF4210A0ES |
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Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.59 EUR |
| 10+ | 16.12 EUR |
| 25+ | 15.01 EUR |
| 100+ | 13.78 EUR |
| MC34PF4210A0ESR2 |
|
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS4503CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS4503CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCF51EM256CLLR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 19.3 EUR |
| MCIMX6D4AVT10AE |
|
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D4AVT10AER |
|
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D5EYM12CE |
|
Hersteller: NXP USA Inc.
Description: I.MX6DQ 1ROM PERF ENHAN
Description: I.MX6DQ 1ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D5EZK08AE |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D6AVT08AE |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D6AVT08AER |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| MCIMX6Q4AVT10AER |
|
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| MCIMX6Q5EYM12CE |
|
Hersteller: NXP USA Inc.
Description: I.MX6DQ ROM PERF ENHAN
Description: I.MX6DQ ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| MCIMX6Q6AVT08AE |
|
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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Stück im Wert von UAH
| MCIMX6Q6AVT08AER |
|
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
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| MCIMX6S1AVM08AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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| MCIMX6S1AVM08ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6Y2CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.83 EUR |
| 10+ | 21.17 EUR |
| 25+ | 19.77 EUR |
| 152+ | 17.85 EUR |
| 304+ | 17.34 EUR |
| 608+ | 16.91 EUR |
| MCIMX6Y2CVM08AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 3466 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.78 EUR |
| 10+ | 27.68 EUR |
| 25+ | 25.89 EUR |
| 152+ | 23.49 EUR |
| 304+ | 22.85 EUR |
| 608+ | 22.31 EUR |
| MCIMX6Y2DVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 475 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.76 EUR |
| 10+ | 23.55 EUR |
| 25+ | 21.99 EUR |
| 152+ | 19.9 EUR |
| 304+ | 19.33 EUR |
| MCIMX6Y2DVM09AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 753 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.92 EUR |
| 10+ | 22.07 EUR |
| 25+ | 20.61 EUR |
| 152+ | 18.62 EUR |
| 304+ | 18.1 EUR |
| 608+ | 17.66 EUR |
| MCIMX6Y7DVK05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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Stück im Wert von UAH
| MHT2025GNR1 |
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MHT2025NR1 |
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MD6CVAHZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 153.08 EUR |
| MIMX8MD6DVAJZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Not For New Designs
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Not For New Designs
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 144.68 EUR |
| MIMX8MQ5CVAHZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MQ5DVAJZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MQ6CVAHZAA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
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| MIMX8MQ6DVAJZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
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| MRF085HR3 |
|
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
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| NCF2952MTT/TPE080J |
|
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
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| NCF2961MHN2/0212CJ |
Produkt ist nicht verfügbar
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| NCF29A4XHN/0500VJ |
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Description: IC 32HVQFN
Produkt ist nicht verfügbar
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| NCK2910AHN/00201Y |
Hersteller: NXP USA Inc.
Description: RECEIVER + INTEGRATED UC
Description: RECEIVER + INTEGRATED UC
Produkt ist nicht verfügbar
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| OL2385AHN/001A1Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| PCA9535HFHP |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 160mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 160mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| PCA9557BSHP |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 20mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 20mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCF7952ATT/C2BC20J |
|
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| PFXPQ3115BVT1 |
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR, 2.5V, 20/110KPA
Packaging: Tape & Reel (TR)
Applications: Board Mount
Part Status: Obsolete
Description: PRESSURE SENSOR, 2.5V, 20/110KPA
Packaging: Tape & Reel (TR)
Applications: Board Mount
Part Status: Obsolete
Produkt ist nicht verfügbar
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| PFXPS71404T1 |
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Packaging: Tray
Applications: Board Mount
Description: PRESSURE SATELLITE, 40-140 KPA,
Packaging: Tray
Applications: Board Mount
Produkt ist nicht verfügbar
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| PN5180A0ET/C3J |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 10.9 EUR |
| PN5180A0ET/C3QL |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 2480 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.55 EUR |
| 10+ | 14.47 EUR |
| 25+ | 13.46 EUR |
| 100+ | 12.33 EUR |
| 490+ | 11.48 EUR |
| 980+ | 11.22 EUR |
| 1470+ | 11.08 EUR |
| PN5180A0HN/C3E |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.55 EUR |
| 10+ | 14.47 EUR |
| 25+ | 13.46 EUR |
| 100+ | 12.33 EUR |
| 490+ | 11.48 EUR |
| PN5180A0HN/C3Y |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 11 EUR |
| S32R274RRUEVB |
|
Hersteller: NXP USA Inc.
Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: S32R274
Part Status: Active
Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: S32R274
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1063.29 EUR |
| S32V234-EVB2 |
|
Hersteller: NXP USA Inc.
Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: S32V234
Part Status: Active
Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: S32V234
Part Status: Active
Produkt ist nicht verfügbar
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| S912XDT512J1MAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Description: IC MCU 16BIT 512KB FLASH 80QFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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| S912XDT512J1MAAR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S912ZVLA96F0MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Produkt ist nicht verfügbar
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| SC18IS600IPW/S8HP |
|
Hersteller: NXP USA Inc.
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SP5745BBK1AMMH6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SPC5745BBK1AMMH6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
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| SPC5748CK0AMMJ6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| SPC5748CK0AMMJ6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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Stück im Wert von UAH
| TEA1999TK/1J |
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Hersteller: NXP USA Inc.
Description: FLYBACK SR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Description: FLYBACK SR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH