Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (33870) > Seite 304 nach 565
Foto | Bezeichnung | Hersteller | Beschreibung |
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TJA1044GT/3Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 300 mV Duplex: Half Part Status: Active |
auf Bestellung 2500 Stücke: Lieferzeit 21-28 Tag (e) |
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TJA1044GTK/3Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 21-28 Tag (e) |
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TLH5014HN/V1WK | NXP USA Inc. | Description: ALNA FM ONLY |
Produkt ist nicht verfügbar |
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TLH5014HN/V1WY | NXP USA Inc. | Description: ALNA FM ONLY |
Produkt ist nicht verfügbar |
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TLH5016HN/V1WK | NXP USA Inc. |
Description: ALNA2 Packaging: Tray |
Produkt ist nicht verfügbar |
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TLH5016HN/V1WY | NXP USA Inc. | Description: ALNA2 |
Produkt ist nicht verfügbar |
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TLH5018HN/V1WK | NXP USA Inc. | Description: ALNA1 |
Produkt ist nicht verfügbar |
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TLH5018HN/V1WY | NXP USA Inc. |
Description: ALNA1 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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TWR-KM34Z75M | NXP USA Inc. |
Description: TOWER SYSTEM KM3X EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: KM3x Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-SB0410-36EVB | NXP USA Inc. |
Description: EVALUATION KIT - SB0410 SOLENOI Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: MC34SB0410 Platform: Freescale Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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UJA1169LTK/FZ | NXP USA Inc. | Description: IC INTFACE SPECIALIZED 20HVSON |
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UJA1169LTK/X/FZ | NXP USA Inc. | Description: IC INTFACE SPECIALIZED 20HVSON |
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UJA1169LTK/XZ | NXP USA Inc. | Description: IC INTFACE SPECIALIZED 20HVSON |
Produkt ist nicht verfügbar |
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UJA1169LTKZ | NXP USA Inc. | Description: MINI HIGH-SPEED CAN COMPANION SY |
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UJA1169TK/3Z | NXP USA Inc. | Description: MINI HIGH-SPEED CAN SYSTEM BASIS |
Produkt ist nicht verfügbar |
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UJA1169TK/F/3Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 20HVSON Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
Produkt ist nicht verfügbar |
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USB-KW019032 | NXP USA Inc. |
Description: USB-KW019032 USB DONGLE KINETIS Packaging: Bulk For Use With/Related Products: MKW01Z128 Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz Type: Transceiver Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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ZN200-L-CB1 | NXP USA Inc. | Description: CONSUMER VIDEO GRAPHIC HD PROCES |
Produkt ist nicht verfügbar |
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MP3H6115AC6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP Features: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.12 V ~ 2.8 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 2.7V ~ 3.3V Port Size: Male - 0.13" (3.3mm) Tube Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) Part Status: Active |
auf Bestellung 460 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9511AD,118 | NXP USA Inc. |
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, Accelerator Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C - Hotswap Current - Supply: 6mA Data Rate (Max): 400kHz Supplier Device Package: 8-SO Part Status: Active Capacitance - Input: 5 pF |
auf Bestellung 6250 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9554DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-SSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1902 Stücke: Lieferzeit 21-28 Tag (e) |
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TEA1993TS/1X | NXP USA Inc. |
Description: IC CTRLR SYNC RECT SC-74 Packaging: Cut Tape (CT) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: SC-74 Current - Supply: 200 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BAP65LX,315 | NXP USA Inc. |
Description: RF DIODE PIN 30V 135MW SOD2 Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz Resistance @ If, F: 350mOhm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 30V Supplier Device Package: SOD2 Current - Max: 100 mA Power Dissipation (Max): 135 mW |
auf Bestellung 4905 Stücke: Lieferzeit 21-28 Tag (e) |
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MRF085HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI650 Packaging: Tape & Reel (TR) Package / Case: NI-650H-4L Current Rating (Amps): 7µA Frequency: 1.8MHz ~ 1.215GHz Configuration: Dual Power - Output: 85W Gain: 25.6dB Technology: LDMOS Supplier Device Package: NI-650H-4L Part Status: Obsolete Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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SC18IS602BIPW/S8HP | NXP USA Inc. |
Description: IC BRIDGE SPI/I2C 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Current - Supply: 11mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Last Time Buy DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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RK043FN02H-CT | NXP USA Inc. |
Description: 4.3" TFT CAP TOUCH LCD SCREEN Packaging: Bulk Display Type: TFT - Color Display Mode: Transmissive Backlight: LED Interface: I2C Viewing Area: 95.04mm W x 53.86mm H Dot Pixels: 480 x 272 Diagonal Screen Size: 4.3" (109.22mm) Graphics Color: Red, Green, Blue (RGB) Touchscreen: Capacitive Part Status: Obsolete |
Produkt ist nicht verfügbar |
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OM13588UL | NXP USA Inc. |
Description: USB TYPE C SHIELD BOARD Packaging: Bulk Function: Power Supply Type: Power Management Contents: Board(s) Utilized IC / Part: PTN5110 Platform: Arduino Part Status: Obsolete |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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TEA19362T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SO Packaging: Cut Tape (CT) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 71kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 0V ~ 120V Supplier Device Package: 10-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V Part Status: Active |
auf Bestellung 2410 Stücke: Lieferzeit 21-28 Tag (e) |
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TEA1998TS/1X | NXP USA Inc. |
Description: FLYBACK SR Packaging: Cut Tape (CT) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 60V Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: SC-74 Part Status: Obsolete Current - Supply: 250 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PS32V234CMN1AVUB | NXP USA Inc. |
Description: IC MPU 1.0GHZ/133MHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz, 133MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Voltage - I/O: 1.0V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: 1Gbps Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 21-28 Tag (e) |
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SBC-S32V234 | NXP USA Inc. |
Description: S32V234 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A53 Utilized IC / Part: S32V234 |
auf Bestellung 26 Stücke: Lieferzeit 21-28 Tag (e) |
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OV10640CSP-S32V | NXP USA Inc. |
Description: OMNIVISION MIPI CAMERA FOR SBC-S Packaging: Bulk For Use With/Related Products: S32V234 Accessory Type: Camera Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 21-28 Tag (e) |
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MXOV10635-S32V | NXP USA Inc. |
Description: MAXIM LVDS CAMERA FOR SBC-S32V23 Packaging: Bulk For Use With/Related Products: S32V234 Accessory Type: Camera Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 21-28 Tag (e) |
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MAX9286S32V234 | NXP USA Inc. |
Description: MAXIM DESERIALIZER FOR SBC-S32V2 Packaging: Bulk Function: Deserializer Type: Interface Utilized IC / Part: MAX9286 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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MRFX1K80HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI1230 Packaging: Tape & Reel (TR) Package / Case: SOT-979A Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 470MHz Configuration: Dual Power - Output: 1800W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 182 V Voltage - Test: 65 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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MCIMX6D4AVT08AER | NXP USA Inc. | Description: IC MPU I.MX6D ENHANCED 624FCBGA |
Produkt ist nicht verfügbar |
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MCIMX6D6AVT10AER | NXP USA Inc. | Description: IC MPU I.MX6D ENHANCED 624FCBGA |
Produkt ist nicht verfügbar |
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MCIMX6Q5EYM10AER | NXP USA Inc. | Description: IC MPU I.MX6D ENHANCED 624FCBGA |
Produkt ist nicht verfügbar |
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MCIMX6D4AVT08AE | NXP USA Inc. | Description: IC MPU I.MX6D ENHANCED 624FCBGA |
Produkt ist nicht verfügbar |
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MCIMX6D5EYM10AE | NXP USA Inc. |
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6D6AVT10AE | NXP USA Inc. |
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6Q5EYM10AE | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6Q6AVT10AE | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6DP4AVT1AB | NXP USA Inc. |
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) |
Produkt ist nicht verfügbar |
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MCIMX6DP4AVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6DP 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) |
Produkt ist nicht verfügbar |
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MCIMX6DP6AVT1AB | NXP USA Inc. |
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 1076 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6DP7CVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6DP 800MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 300 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6QP5EYM1AB | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 75 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6QP7CVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6QP 800MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9S08AC32CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP Packaging: Cut Tape (CT) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCZ33897TEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Active |
auf Bestellung 2953 Stücke: Lieferzeit 21-28 Tag (e) |
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MPXAZ6115AC6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 0.13" 4.7V Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.7 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) Part Status: Active |
Produkt ist nicht verfügbar |
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MPXV5050GC6T1 | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" 4.7V Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.7 V Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: ±2.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Port Style: Barbless Maximum Pressure: 29.01PSI (200kPa) Part Status: Active |
auf Bestellung 3492 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9535CHF,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN Packaging: Cut Tape (CT) Features: POR Package / Case: 24-WFQFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HWQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 698 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN3460BS/F6Y | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 7738 Stücke: Lieferzeit 21-28 Tag (e) |
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TJA1022TK,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 2/2 14HVSON Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 2/2 Data Rate: 20kBd Protocol: LINbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 175 mV |
auf Bestellung 5734 Stücke: Lieferzeit 21-28 Tag (e) |
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TJA1028TK/5V0/20/J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 21-28 Tag (e) |
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SC16IS752IBS,128 | NXP USA Inc. |
Description: IC UART DUAL I2C/SPI 32-HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Function: Controller Interface: I2C, SPI, UART Operating Temperature: -40°C ~ 95°C Voltage - Supply: 2.5V, 3.3V Current - Supply: 2mA Protocol: RS232, RS485 Supplier Device Package: 32-HVQFN (5x5) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 3488 Stücke: Lieferzeit 21-28 Tag (e) |
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SC28L92A1A,518 | NXP USA Inc. | Description: IC UART DUAL W/FIFO 44-PLCC |
Produkt ist nicht verfügbar |
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PCA9518APW,518 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 20TSSOP Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I²C, SMBus Voltage - Supply: 3V ~ 3.6V Applications: Buffer Supplier Device Package: 20-TSSOP Part Status: Active |
auf Bestellung 536 Stücke: Lieferzeit 21-28 Tag (e) |
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TJA1044GT/3Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.27 EUR |
TJA1044GTK/3Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.21 EUR |
TLH5016HN/V1WK |
Produkt ist nicht verfügbar
TLH5018HN/V1WY |
Produkt ist nicht verfügbar
TWR-KM34Z75M |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KM3X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KM3x
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM KM3X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KM3x
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-SB0410-36EVB |
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - SB0410 SOLENOI
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0410
Platform: Freescale Tower System
Part Status: Active
Description: EVALUATION KIT - SB0410 SOLENOI
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0410
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
UJA1169LTK/FZ |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Description: IC INTFACE SPECIALIZED 20HVSON
Produkt ist nicht verfügbar
UJA1169LTK/X/FZ |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Description: IC INTFACE SPECIALIZED 20HVSON
Produkt ist nicht verfügbar
UJA1169LTK/XZ |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Description: IC INTFACE SPECIALIZED 20HVSON
Produkt ist nicht verfügbar
UJA1169LTKZ |
Hersteller: NXP USA Inc.
Description: MINI HIGH-SPEED CAN COMPANION SY
Description: MINI HIGH-SPEED CAN COMPANION SY
Produkt ist nicht verfügbar
UJA1169TK/3Z |
Hersteller: NXP USA Inc.
Description: MINI HIGH-SPEED CAN SYSTEM BASIS
Description: MINI HIGH-SPEED CAN SYSTEM BASIS
Produkt ist nicht verfügbar
UJA1169TK/F/3Z |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC INTFACE SPECIALIZED 20HVSON
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
USB-KW019032 |
Hersteller: NXP USA Inc.
Description: USB-KW019032 USB DONGLE KINETIS
Packaging: Bulk
For Use With/Related Products: MKW01Z128
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: Transceiver
Supplied Contents: Board(s)
Part Status: Active
Description: USB-KW019032 USB DONGLE KINETIS
Packaging: Bulk
For Use With/Related Products: MKW01Z128
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: Transceiver
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
ZN200-L-CB1 |
Hersteller: NXP USA Inc.
Description: CONSUMER VIDEO GRAPHIC HD PROCES
Description: CONSUMER VIDEO GRAPHIC HD PROCES
Produkt ist nicht verfügbar
MP3H6115AC6T1 |
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 460 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 51.17 EUR |
10+ | 40.51 EUR |
25+ | 38.38 EUR |
100+ | 33.05 EUR |
PCA9511AD,118 |
Hersteller: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 5 pF
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 5 pF
auf Bestellung 6250 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 7.05 EUR |
10+ | 6.32 EUR |
25+ | 5.96 EUR |
100+ | 5.08 EUR |
250+ | 4.77 EUR |
500+ | 4.17 EUR |
1000+ | 3.46 EUR |
PCA9554DB,118 |
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1902 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 4.65 EUR |
10+ | 4.18 EUR |
25+ | 3.94 EUR |
100+ | 3.36 EUR |
250+ | 3.15 EUR |
500+ | 2.76 EUR |
1000+ | 2.29 EUR |
TEA1993TS/1X |
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BAP65LX,315 |
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 30V 135MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
Description: RF DIODE PIN 30V 135MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
auf Bestellung 4905 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
27+ | 0.99 EUR |
36+ | 0.74 EUR |
40+ | 0.67 EUR |
100+ | 0.46 EUR |
250+ | 0.39 EUR |
500+ | 0.32 EUR |
1000+ | 0.24 EUR |
2500+ | 0.22 EUR |
MRF085HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI650
Packaging: Tape & Reel (TR)
Package / Case: NI-650H-4L
Current Rating (Amps): 7µA
Frequency: 1.8MHz ~ 1.215GHz
Configuration: Dual
Power - Output: 85W
Gain: 25.6dB
Technology: LDMOS
Supplier Device Package: NI-650H-4L
Part Status: Obsolete
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI650
Packaging: Tape & Reel (TR)
Package / Case: NI-650H-4L
Current Rating (Amps): 7µA
Frequency: 1.8MHz ~ 1.215GHz
Configuration: Dual
Power - Output: 85W
Gain: 25.6dB
Technology: LDMOS
Supplier Device Package: NI-650H-4L
Part Status: Obsolete
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
SC18IS602BIPW/S8HP |
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
RK043FN02H-CT |
Hersteller: NXP USA Inc.
Description: 4.3" TFT CAP TOUCH LCD SCREEN
Packaging: Bulk
Display Type: TFT - Color
Display Mode: Transmissive
Backlight: LED
Interface: I2C
Viewing Area: 95.04mm W x 53.86mm H
Dot Pixels: 480 x 272
Diagonal Screen Size: 4.3" (109.22mm)
Graphics Color: Red, Green, Blue (RGB)
Touchscreen: Capacitive
Part Status: Obsolete
Description: 4.3" TFT CAP TOUCH LCD SCREEN
Packaging: Bulk
Display Type: TFT - Color
Display Mode: Transmissive
Backlight: LED
Interface: I2C
Viewing Area: 95.04mm W x 53.86mm H
Dot Pixels: 480 x 272
Diagonal Screen Size: 4.3" (109.22mm)
Graphics Color: Red, Green, Blue (RGB)
Touchscreen: Capacitive
Part Status: Obsolete
Produkt ist nicht verfügbar
OM13588UL |
Hersteller: NXP USA Inc.
Description: USB TYPE C SHIELD BOARD
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PTN5110
Platform: Arduino
Part Status: Obsolete
Description: USB TYPE C SHIELD BOARD
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PTN5110
Platform: Arduino
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 225.78 EUR |
TEA19362T/1J |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 71kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Part Status: Active
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 71kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Part Status: Active
auf Bestellung 2410 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 3.85 EUR |
10+ | 3.43 EUR |
25+ | 3.26 EUR |
100+ | 2.68 EUR |
250+ | 2.5 EUR |
500+ | 2.21 EUR |
1000+ | 1.75 EUR |
TEA1998TS/1X |
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Obsolete
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Description: FLYBACK SR
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Obsolete
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PS32V234CMN1AVUB |
Hersteller: NXP USA Inc.
Description: IC MPU 1.0GHZ/133MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz, 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1.0V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Part Status: Active
Description: IC MPU 1.0GHZ/133MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz, 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1.0V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 335.22 EUR |
10+ | 277.7 EUR |
SBC-S32V234 |
Hersteller: NXP USA Inc.
Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: S32V234
Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: S32V234
auf Bestellung 26 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 2415.11 EUR |
OV10640CSP-S32V |
Hersteller: NXP USA Inc.
Description: OMNIVISION MIPI CAMERA FOR SBC-S
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Part Status: Active
Description: OMNIVISION MIPI CAMERA FOR SBC-S
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 2093.78 EUR |
MXOV10635-S32V |
Hersteller: NXP USA Inc.
Description: MAXIM LVDS CAMERA FOR SBC-S32V23
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Part Status: Active
Description: MAXIM LVDS CAMERA FOR SBC-S32V23
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1172.99 EUR |
MAX9286S32V234 |
Hersteller: NXP USA Inc.
Description: MAXIM DESERIALIZER FOR SBC-S32V2
Packaging: Bulk
Function: Deserializer
Type: Interface
Utilized IC / Part: MAX9286
Supplied Contents: Board(s)
Part Status: Active
Description: MAXIM DESERIALIZER FOR SBC-S32V2
Packaging: Bulk
Function: Deserializer
Type: Interface
Utilized IC / Part: MAX9286
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
MRFX1K80HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
MCIMX6D4AVT08AER |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
MCIMX6D6AVT10AER |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
MCIMX6Q5EYM10AER |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
MCIMX6D4AVT08AE |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
MCIMX6D5EYM10AE |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX6D6AVT10AE |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 216.24 EUR |
10+ | 178.65 EUR |
MCIMX6Q5EYM10AE |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX6Q6AVT10AE |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 264.42 EUR |
10+ | 218.08 EUR |
MCIMX6DP4AVT1AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
MCIMX6DP4AVT8AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
MCIMX6DP6AVT1AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 1076 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 253.89 EUR |
10+ | 209.39 EUR |
120+ | 199.42 EUR |
MCIMX6DP7CVT8AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 300 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 218.43 EUR |
10+ | 180.44 EUR |
120+ | 166.19 EUR |
MCIMX6QP5EYM1AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 75 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 229.89 EUR |
10+ | 189.58 EUR |
MCIMX6QP7CVT8AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 264.37 EUR |
10+ | 218.03 EUR |
MC9S08AC32CFGER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCZ33897TEFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
auf Bestellung 2953 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.87 EUR |
10+ | 7.96 EUR |
25+ | 7.53 EUR |
100+ | 6.52 EUR |
250+ | 6.19 EUR |
500+ | 5.55 EUR |
1000+ | 4.68 EUR |
MPXAZ6115AC6T1 |
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 4.7V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Description: SENSOR 16.68PSIA 0.13" 4.7V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Produkt ist nicht verfügbar
MPXV5050GC6T1 |
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 4.7V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
Description: SENSOR 7.25PSIG 0.13" 4.7V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
auf Bestellung 3492 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 54.78 EUR |
10+ | 45.66 EUR |
25+ | 40.44 EUR |
PCA9535CHF,118 |
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 698 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 5.9 EUR |
10+ | 5.3 EUR |
25+ | 5 EUR |
100+ | 4.26 EUR |
250+ | 4 EUR |
500+ | 3.5 EUR |
PTN3460BS/F6Y |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 7738 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 11.49 EUR |
10+ | 10.34 EUR |
25+ | 9.77 EUR |
100+ | 8.47 EUR |
250+ | 8.04 EUR |
500+ | 7.21 EUR |
1000+ | 6.08 EUR |
TJA1022TK,118 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
auf Bestellung 5734 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 5.07 EUR |
10+ | 4.56 EUR |
25+ | 4.3 EUR |
100+ | 3.67 EUR |
250+ | 3.44 EUR |
500+ | 3.01 EUR |
1000+ | 2.5 EUR |
2500+ | 2.32 EUR |
TJA1028TK/5V0/20/J |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 4.42 EUR |
10+ | 3.97 EUR |
25+ | 3.75 EUR |
100+ | 3.19 EUR |
250+ | 3 EUR |
500+ | 2.62 EUR |
1000+ | 2.17 EUR |
2500+ | 2.02 EUR |
SC16IS752IBS,128 |
Hersteller: NXP USA Inc.
Description: IC UART DUAL I2C/SPI 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC UART DUAL I2C/SPI 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3488 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.62 EUR |
10+ | 12.23 EUR |
25+ | 11.56 EUR |
100+ | 10.02 EUR |
250+ | 9.5 EUR |
500+ | 8.53 EUR |
SC28L92A1A,518 |
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
PCA9518APW,518 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 3V ~ 3.6V
Applications: Buffer
Supplier Device Package: 20-TSSOP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 3V ~ 3.6V
Applications: Buffer
Supplier Device Package: 20-TSSOP
Part Status: Active
auf Bestellung 536 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 7.49 EUR |
10+ | 6.73 EUR |
25+ | 6.36 EUR |
100+ | 5.51 EUR |
250+ | 5.23 EUR |
500+ | 4.69 EUR |