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FXPS7140D4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXPS7140P4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXTH87EH116T1 FXTH87EH116T1 NXP USA Inc. FXTH87ERM.pdf Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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LPC802M001JDH16FP LPC802M001JDH16FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 1282 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.46 EUR
10+1.8 EUR
25+1.63 EUR
100+1.45 EUR
250+1.36 EUR
960+1.26 EUR
Mindestbestellmenge: 8
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LPC802M001JDH20FP LPC802M001JDH20FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 509 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.45 EUR
10+1.8 EUR
75+1.48 EUR
150+1.41 EUR
300+1.35 EUR
Mindestbestellmenge: 8
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LPC802M001JHI33E LPC802M001JHI33E NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 860 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.13 EUR
15+1.23 EUR
25+1.22 EUR
100+1.21 EUR
Mindestbestellmenge: 9
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LPC802M011JDH20FP LPC802M011JDH20FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 545 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.55 EUR
10+1.88 EUR
75+1.55 EUR
150+1.47 EUR
300+1.41 EUR
525+1.37 EUR
Mindestbestellmenge: 7
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LTE3401HX LTE3401HX NXP USA Inc. LTE3401H.pdf Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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LTE3401LX LTE3401LX NXP USA Inc. LTE3401L.pdf Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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MC33AR6000BGWS NXP USA Inc. AR6000.pdf Description: ALTERNATOR REGULATOR, 14V 12A, L
Produkt ist nicht verfügbar
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MC34PF4210A0ES MC34PF4210A0ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.3 EUR
10+13.55 EUR
25+12.61 EUR
100+11.58 EUR
Mindestbestellmenge: 2
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MC34PF4210A0ESR2 MC34PF4210A0ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC35FS4503CAE MC35FS4503CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4503CAER2 MC35FS4503CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Produkt ist nicht verfügbar
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MCF51EM256CLLR MCF51EM256CLLR NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+16.22 EUR
Mindestbestellmenge: 1000
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MCIMX6D4AVT10AE NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D4AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EYM12CE MCIMX6D5EYM12CE NXP USA Inc. IMX6DQCEC.pdf Description: I.MX6DQ 1ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EZK08AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q5EYM12CE MCIMX6Q5EYM12CE NXP USA Inc. IMX6DQCEC.pdf Description: I.MX6DQ ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6S1AVM08AD MCIMX6S1AVM08AD NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ADR MCIMX6S1AVM08ADR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6Y2CVM05AB MCIMX6Y2CVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 972 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.53 EUR
10+17.78 EUR
25+16.6 EUR
152+14.99 EUR
304+14.56 EUR
608+14.21 EUR
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MCIMX6Y2CVM08AB MCIMX6Y2CVM08AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 3682 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.64 EUR
10+19.51 EUR
25+18.23 EUR
152+16.49 EUR
304+16.03 EUR
608+15.64 EUR
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MCIMX6Y2DVM05AB MCIMX6Y2DVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 506 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.61 EUR
10+17.03 EUR
25+15.89 EUR
152+14.34 EUR
304+13.92 EUR
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MCIMX6Y2DVM09AB MCIMX6Y2DVM09AB NXP USA Inc. IMX6ULLCEC.pdf Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.32 EUR
10+19.24 EUR
25+17.96 EUR
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MCIMX6Y7DVK05AB MCIMX6Y7DVK05AB NXP USA Inc. IMX6ULLCEC.pdf Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MHT2025GNR1 NXP USA Inc. Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT2025NR1 NXP USA Inc. Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMX8MD6CVAHZAA MIMX8MD6CVAHZAA NXP USA Inc. i.MX8M-FS.pdf Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 1 Stücke:
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1+90.01 EUR
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MIMX8MD6DVAJZAA MIMX8MD6DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Not For New Designs
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+100.21 EUR
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MIMX8MQ5CVAHZAA MIMX8MQ5CVAHZAA NXP USA Inc. i.MX8M-FS.pdf Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ5DVAJZAA MIMX8MQ5DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ6CVAHZAA MIMX8MQ6CVAHZAA NXP USA Inc. Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ6DVAJZAA MIMX8MQ6DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MRF085HR3 NXP USA Inc. MRF085H.pdf Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
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NCF2952MTT/TPE080J NCF2952MTT/TPE080J NXP USA Inc. KeylessEntry,Go_Leaflet_Apr2012.pdf Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NCF2961MHN2/0212CJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ NCF29A4XHN/0500VJ NXP USA Inc. Description: IC 32HVQFN
Produkt ist nicht verfügbar
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NCK2910AHN/00201Y NXP USA Inc. Description: RECEIVER + INTEGRATED UC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OL2385AHN/001A1Y OL2385AHN/001A1Y NXP USA Inc. OL2385.pdf Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9535HFHP NXP USA Inc. PCA9535_PCA9535C.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 160mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9557BSHP PCA9557BSHP NXP USA Inc. PCA9557.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 20mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7952ATT/C2BC20J NXP USA Inc. KeylessEntry,Go_Leaflet_Apr2012.pdf Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
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PCF7991AT/1081/UZ NXP USA Inc. Description: READER CHIPS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PFXPQ3115BVT1 PFXPQ3115BVT1 NXP USA Inc. Description: PRESSURE SENSOR, 2.5V, 20/110KPA
Packaging: Tape & Reel (TR)
Applications: Board Mount
Part Status: Obsolete
Produkt ist nicht verfügbar
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PFXPS71404T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Packaging: Tray
Applications: Board Mount
Produkt ist nicht verfügbar
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PN5180A0ET/C3J PN5180A0ET/C3J NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+9.16 EUR
Mindestbestellmenge: 4000
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PN5180A0ET/C3QL PN5180A0ET/C3QL NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 2480 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.59 EUR
10+12.16 EUR
25+11.31 EUR
100+10.36 EUR
490+9.65 EUR
980+9.43 EUR
1470+9.31 EUR
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PN5180A0HN/C3E PN5180A0HN/C3E NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.59 EUR
10+12.16 EUR
25+11.31 EUR
100+10.36 EUR
490+9.65 EUR
Mindestbestellmenge: 2
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PN5180A0HN/C3Y PN5180A0HN/C3Y NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+9.16 EUR
Mindestbestellmenge: 4000
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S32R274RRUEVB S32R274RRUEVB NXP USA Inc. PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: S32R274
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+893.52 EUR
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S32V234-EVB2 S32V234-EVB2 NXP USA Inc. S32V234FS.pdf Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: S32V234
Part Status: Active
Produkt ist nicht verfügbar
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S912XDT512J1MAA S912XDT512J1MAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Produkt ist nicht verfügbar
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S912XDT512J1MAAR S912XDT512J1MAAR NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXPS7140D4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXPS7140P4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXTH87EH116T1 FXTH87ERM.pdf
FXTH87EH116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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LPC802M001JDH16FP LPC802.pdf
LPC802M001JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 1282 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.46 EUR
10+1.8 EUR
25+1.63 EUR
100+1.45 EUR
250+1.36 EUR
960+1.26 EUR
Mindestbestellmenge: 8
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LPC802M001JDH20FP LPC802.pdf
LPC802M001JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 509 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+1.8 EUR
75+1.48 EUR
150+1.41 EUR
300+1.35 EUR
Mindestbestellmenge: 8
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LPC802M001JHI33E LPC802.pdf
LPC802M001JHI33E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 860 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.13 EUR
15+1.23 EUR
25+1.22 EUR
100+1.21 EUR
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LPC802M011JDH20FP LPC802.pdf
LPC802M011JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 545 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.55 EUR
10+1.88 EUR
75+1.55 EUR
150+1.47 EUR
300+1.41 EUR
525+1.37 EUR
Mindestbestellmenge: 7
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LTE3401HX LTE3401H.pdf
LTE3401HX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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LTE3401LX LTE3401L.pdf
LTE3401LX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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MC33AR6000BGWS AR6000.pdf
Hersteller: NXP USA Inc.
Description: ALTERNATOR REGULATOR, 14V 12A, L
Produkt ist nicht verfügbar
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MC34PF4210A0ES PF4210.pdf
MC34PF4210A0ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.3 EUR
10+13.55 EUR
25+12.61 EUR
100+11.58 EUR
Mindestbestellmenge: 2
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MC34PF4210A0ESR2 PF4210.pdf
MC34PF4210A0ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC35FS4503CAE 35FS4500-35FS6500SDS.pdf
MC35FS4503CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4503CAER2 35FS4500-35FS6500SDS.pdf
MC35FS4503CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Produkt ist nicht verfügbar
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MCF51EM256CLLR MCF51EM256.pdf
MCF51EM256CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+16.22 EUR
Mindestbestellmenge: 1000
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MCIMX6D4AVT10AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D4AVT10AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EYM12CE IMX6DQCEC.pdf
MCIMX6D5EYM12CE
Hersteller: NXP USA Inc.
Description: I.MX6DQ 1ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EZK08AE IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6D6AVT08AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT10AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q5EYM12CE IMX6DQCEC.pdf
MCIMX6Q5EYM12CE
Hersteller: NXP USA Inc.
Description: I.MX6DQ ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6S1AVM08AD IMX6SDLAEC.pdf
MCIMX6S1AVM08AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ADR IMX6SDLAEC.pdf
MCIMX6S1AVM08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6Y2CVM05AB IMX6ULLIEC.pdf
MCIMX6Y2CVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 972 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.53 EUR
10+17.78 EUR
25+16.6 EUR
152+14.99 EUR
304+14.56 EUR
608+14.21 EUR
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MCIMX6Y2CVM08AB IMX6ULLIEC.pdf
MCIMX6Y2CVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 3682 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.64 EUR
10+19.51 EUR
25+18.23 EUR
152+16.49 EUR
304+16.03 EUR
608+15.64 EUR
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MCIMX6Y2DVM05AB IMX6ULLIEC.pdf
MCIMX6Y2DVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 506 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.61 EUR
10+17.03 EUR
25+15.89 EUR
152+14.34 EUR
304+13.92 EUR
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MCIMX6Y2DVM09AB IMX6ULLCEC.pdf
MCIMX6Y2DVM09AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.32 EUR
10+19.24 EUR
25+17.96 EUR
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MCIMX6Y7DVK05AB IMX6ULLCEC.pdf
MCIMX6Y7DVK05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MHT2025GNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT2025NR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMX8MD6CVAHZAA i.MX8M-FS.pdf
MIMX8MD6CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+90.01 EUR
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MIMX8MD6DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MD6DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Not For New Designs
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+100.21 EUR
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MIMX8MQ5CVAHZAA i.MX8M-FS.pdf
MIMX8MQ5CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ5DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MQ5DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ6CVAHZAA
MIMX8MQ6CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ6DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MQ6DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MRF085HR3 MRF085H.pdf
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
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NCF2952MTT/TPE080J KeylessEntry,Go_Leaflet_Apr2012.pdf
NCF2952MTT/TPE080J
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
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NCF2961MHN2/0212CJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ
NCF29A4XHN/0500VJ
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Produkt ist nicht verfügbar
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NCK2910AHN/00201Y
Hersteller: NXP USA Inc.
Description: RECEIVER + INTEGRATED UC
Produkt ist nicht verfügbar
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OL2385AHN/001A1Y OL2385.pdf
OL2385AHN/001A1Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9535HFHP PCA9535_PCA9535C.pdf
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 160mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9557BSHP PCA9557.pdf
PCA9557BSHP
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 20mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7952ATT/C2BC20J KeylessEntry,Go_Leaflet_Apr2012.pdf
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
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PCF7991AT/1081/UZ
Hersteller: NXP USA Inc.
Description: READER CHIPS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PFXPQ3115BVT1
PFXPQ3115BVT1
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR, 2.5V, 20/110KPA
Packaging: Tape & Reel (TR)
Applications: Board Mount
Part Status: Obsolete
Produkt ist nicht verfügbar
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PFXPS71404T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Packaging: Tray
Applications: Board Mount
Produkt ist nicht verfügbar
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PN5180A0ET/C3J PN5180A0XX_C3_C4.pdf
PN5180A0ET/C3J
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+9.16 EUR
Mindestbestellmenge: 4000
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PN5180A0ET/C3QL PN5180A0XX_C3_C4.pdf
PN5180A0ET/C3QL
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 2480 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.59 EUR
10+12.16 EUR
25+11.31 EUR
100+10.36 EUR
490+9.65 EUR
980+9.43 EUR
1470+9.31 EUR
Mindestbestellmenge: 2
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PN5180A0HN/C3E PN5180A0XX_C3_C4.pdf
PN5180A0HN/C3E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.59 EUR
10+12.16 EUR
25+11.31 EUR
100+10.36 EUR
490+9.65 EUR
Mindestbestellmenge: 2
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PN5180A0HN/C3Y PN5180A0XX_C3_C4.pdf
PN5180A0HN/C3Y
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+9.16 EUR
Mindestbestellmenge: 4000
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S32R274RRUEVB PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw
S32R274RRUEVB
Hersteller: NXP USA Inc.
Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: S32R274
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+893.52 EUR
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S32V234-EVB2 S32V234FS.pdf
S32V234-EVB2
Hersteller: NXP USA Inc.
Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: S32V234
Part Status: Active
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S912XDT512J1MAA MC9S12XDP512RMV2.pdf
S912XDT512J1MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Produkt ist nicht verfügbar
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S912XDT512J1MAAR MC9S12XDP512RMV2.pdf
S912XDT512J1MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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