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PCA9554DB,118 PCA9554DB,118 NXP USA Inc. PCA9554_9554A.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1X TEA1993TS/1X NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF085HR5 MRF085HR5 NXP USA Inc. MRF085H.pdf Description: RF MOSFET LDMOS 50V NI650
Packaging: Tape & Reel (TR)
Package / Case: NI-650H-4L
Current Rating (Amps): 7µA
Frequency: 1.8MHz ~ 1.215GHz
Configuration: Dual
Power - Output: 85W
Gain: 25.6dB
Technology: LDMOS
Supplier Device Package: NI-650H-4L
Part Status: Obsolete
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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SC18IS602BIPW/S8HP SC18IS602BIPW/S8HP NXP USA Inc. SC18IS602B.pdf Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RK043FN02H-CT RK043FN02H-CT NXP USA Inc. RK043FN02H-CT.pdf Description: GRAPHIC DISPLAY TFT RGB 4.3"
Part Status: Obsolete
Touchscreen: Capacitive
Graphics Color: Red, Green, Blue (RGB)
Diagonal Screen Size: 4.3" (109.22mm)
Dot Pixels: 480 x 272
Viewing Area: 95.04mm W x 53.86mm H
Interface: I2C
Backlight: LED
Display Mode: Transmissive
Display Type: TFT - Color
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13588UL OM13588UL NXP USA Inc. UM11055.pdf Description: USB TYPE C SHIELD BOARD
Part Status: Obsolete
Platform: Arduino
Utilized IC / Part: PTN5110
Contents: Board(s)
Type: Power Management
Function: Power Supply
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19362T/1J TEA19362T/1J NXP USA Inc. TEA19362T.pdf Description: IC OFFLINE SWITCH FLYBACK 10SO
Part Status: Active
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 71kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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10+2.7 EUR
25+2.56 EUR
100+2.11 EUR
250+1.96 EUR
500+1.74 EUR
1000+1.37 EUR
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SBC-S32V234 SBC-S32V234 NXP USA Inc. S32V234_Web.pdf Description: S32V234 EVAL BRD
Utilized IC / Part: S32V234
Core Processor: ARM® Cortex®-A53
Contents: Board(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
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OV10640CSP-S32V OV10640CSP-S32V NXP USA Inc. S32V234FS.pdf Description: OMNIVISION MIPI CAMERA FOR SBC-S
Utilized IC / Part: S32V234
Part Status: Active
Accessory Type: Camera
For Use With/Related Products: S32V234
Packaging: Bulk
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MXOV10635-S32V MXOV10635-S32V NXP USA Inc. S32V234.pdf Description: MAXIM LVDS CAMERA FOR SBC-S32V23
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Part Status: Active
Utilized IC / Part: S32V234
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MRFX1K80HR5 MRFX1K80HR5 NXP USA Inc. MRFX1K80H.pdf Description: RF MOSFET LDMOS 65V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
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MCIMX6D4AVT08AER MCIMX6D4AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D ENHANCED 624FCBGA
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MCIMX6D6AVT10AER MCIMX6D6AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D ENHANCED 624FCBGA
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MCIMX6Q5EYM10AER MCIMX6Q5EYM10AER NXP USA Inc. IMX6DQCEC.pdf Description: IC MPU I.MX6D ENHANCED 624FCBGA
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MCIMX6D4AVT08AE MCIMX6D4AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D ENHANCED 624FCBGA
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MCIMX6D5EYM10AE MCIMX6D5EYM10AE NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6D6AVT10AE MCIMX6D6AVT10AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6Q5EYM10AE MCIMX6Q5EYM10AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6Q6AVT10AE MCIMX6Q6AVT10AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6DP4AVT1AB MCIMX6DP4AVT1AB NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MCIMX6DP4AVT8AB MCIMX6DP4AVT8AB NXP USA Inc. IMX6DQPIEC.pdf Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MCIMX6DP6AVT1AB MCIMX6DP6AVT1AB NXP USA Inc. IMX6DQPIEC.pdf Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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MCIMX6DP7CVT8AB MCIMX6DP7CVT8AB NXP USA Inc. IMX6DQPIEC.pdf Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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1+169.48 EUR
10+141.56 EUR
60+129.41 EUR
120+126.13 EUR
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MCIMX6QP5EYM1AB MCIMX6QP5EYM1AB NXP USA Inc. IMX6DQPIEC.pdf Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6QP7CVT8AB MCIMX6QP7CVT8AB NXP USA Inc. IMX6DQPIEC.pdf Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
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MCZ33897TEFR2 MCZ33897TEFR2 NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
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PCA9535CHF,118 PCA9535CHF,118 NXP USA Inc. PCA9535_PCA9535C.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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7+3.47 EUR
10+2.56 EUR
25+2.33 EUR
100+2.08 EUR
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PTN3460BS/F6Y PTN3460BS/F6Y NXP USA Inc. PTN3460.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
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3+9.57 EUR
10+7.31 EUR
25+6.75 EUR
100+6.12 EUR
250+5.85 EUR
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TJA1022TK,118 TJA1022TK,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
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6+3.77 EUR
10+2.78 EUR
25+2.53 EUR
100+2.26 EUR
250+2.13 EUR
500+2.05 EUR
1000+1.99 EUR
2500+1.92 EUR
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TJA1028TK/5V0/20/J TJA1028TK/5V0/20/J NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 11559 Stücke:
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SC16IS752IBS,128 SC16IS752IBS,128 NXP USA Inc. SC16IS752_SC16IS762.pdf Description: IC UART DUAL I2C/SPI 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
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SC28L92A1A,518 SC28L92A1A,518 NXP USA Inc. SC28L92.pdf Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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PCA9518APW,518 PCA9518APW,518 NXP USA Inc. PCA9518A.pdf Description: IC INTERFACE SPECIALIZED 20TSSOP
Part Status: Active
Supplier Device Package: 20-TSSOP
Applications: Buffer
Voltage - Supply: 3V ~ 3.6V
Interface: I2C, SMBus
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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TJA1027TK/20/1J TJA1027TK/20/1J NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 8647 Stücke:
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LPC812M101JDH20J LPC812M101JDH20J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 2392 Stücke:
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BGU8103X BGU8103X NXP USA Inc. BGU8103.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 1.2mA
Noise Figure: 0.8dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3706 Stücke:
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PCAL6524EVJ PCAL6524EVJ NXP USA Inc. PCAL6524DS.pdf Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539RPW/Q900J NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2500 Stücke
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PCA9540BDP/Q900J PCA9540BDP/Q900J NXP USA Inc. PCA9540B.pdf Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1100HNZ TJA1100HNZ NXP USA Inc. TJA1100.pdf Description: IC TRANSCEIVER FULL 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.1V ~ 3.5V
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6372 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.07 EUR
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250+7.53 EUR
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FXPQ3115BVT1 NXP USA Inc. Description: PRESSURE SENSOR 2.5V 20/110KPA
Produkt ist nicht verfügbar
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NX5P3363UKZ NX5P3363UKZ NXP USA Inc. NX5P3363_Q100.pdf Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP
Features: Fault Condition Indicator
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.2x2.2)
Fault Protection: Over Current, Over Temperature, Reverse Current
Part Status: Active
auf Bestellung 17970 Stücke:
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PCAL6524EVJ PCAL6524EVJ NXP USA Inc. PCAL6524DS.pdf Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539RPW/Q900J NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1653 Stücke:
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5+5.18 EUR
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PCA9540BDP/Q900J PCA9540BDP/Q900J NXP USA Inc. PCA9540B.pdf Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1207 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.69 EUR
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250+2.08 EUR
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A2T23H200W23SR6 NXP USA Inc. A2T23H200W23S.pdf Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 51W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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AFIC31025GNR1 AFIC31025GNR1 NXP USA Inc. AFIC31025N.pdf Description: IC RF AMP TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Voltage - Supply: 32V
Gain: 34.5dB
Supplier Device Package: TO-270WBG-17
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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FS32K144MFT0CLLT FS32K144MFT0CLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.11 EUR
10+32.92 EUR
24+30.95 EUR
80+28.92 EUR
230+27.63 EUR
450+26.99 EUR
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FS32K144MRT0CLLT FS32K144MRT0CLLT NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UAT0MLHT FS32K144UAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 800 Stücke
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FS32K144UAT0VLHR FS32K144UAT0VLHR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UFT0CLLT FS32K144UFT0CLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 450 Stücke
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FS32R372SDK0MMM FS32R372SDK0MMM NXP USA Inc. S32R372DS.pdf Description: 1MB SRAM, 1.3MB FLASH, C
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I²C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Automotive & Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXPS7140D4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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FXPS7140P4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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FXTH87EH116T1 FXTH87EH116T1 NXP USA Inc. FXTH87ERM.pdf Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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LPC802M001JDH16FP LPC802M001JDH16FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 1282 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.93 EUR
10+2.14 EUR
25+1.94 EUR
100+1.73 EUR
250+1.62 EUR
960+1.5 EUR
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LPC802M001JDH20FP LPC802M001JDH20FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 509 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.92 EUR
10+2.14 EUR
75+1.76 EUR
150+1.68 EUR
300+1.61 EUR
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LPC802M001JHI33E LPC802M001JHI33E NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 860 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.53 EUR
15+1.46 EUR
25+1.45 EUR
100+1.44 EUR
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LPC802M011JDH20FP LPC802M011JDH20FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 545 Stücke:
Lieferzeit 10-14 Tag (e)
7+3.03 EUR
10+2.24 EUR
75+1.84 EUR
150+1.75 EUR
300+1.68 EUR
525+1.63 EUR
Mindestbestellmenge: 7 Stücke
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PCA9554DB,118 PCA9554_9554A.pdf
PCA9554DB,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1X TEA1993TS.pdf
TEA1993TS/1X
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF085HR5 MRF085H.pdf
MRF085HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI650
Packaging: Tape & Reel (TR)
Package / Case: NI-650H-4L
Current Rating (Amps): 7µA
Frequency: 1.8MHz ~ 1.215GHz
Configuration: Dual
Power - Output: 85W
Gain: 25.6dB
Technology: LDMOS
Supplier Device Package: NI-650H-4L
Part Status: Obsolete
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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SC18IS602BIPW/S8HP SC18IS602B.pdf
SC18IS602BIPW/S8HP
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RK043FN02H-CT RK043FN02H-CT.pdf
RK043FN02H-CT
Hersteller: NXP USA Inc.
Description: GRAPHIC DISPLAY TFT RGB 4.3"
Part Status: Obsolete
Touchscreen: Capacitive
Graphics Color: Red, Green, Blue (RGB)
Diagonal Screen Size: 4.3" (109.22mm)
Dot Pixels: 480 x 272
Viewing Area: 95.04mm W x 53.86mm H
Interface: I2C
Backlight: LED
Display Mode: Transmissive
Display Type: TFT - Color
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13588UL UM11055.pdf
OM13588UL
Hersteller: NXP USA Inc.
Description: USB TYPE C SHIELD BOARD
Part Status: Obsolete
Platform: Arduino
Utilized IC / Part: PTN5110
Contents: Board(s)
Type: Power Management
Function: Power Supply
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19362T/1J TEA19362T.pdf
TEA19362T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Part Status: Active
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 71kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2410 Stücke:
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7+3.01 EUR
10+2.7 EUR
25+2.56 EUR
100+2.11 EUR
250+1.96 EUR
500+1.74 EUR
1000+1.37 EUR
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SBC-S32V234 S32V234_Web.pdf
SBC-S32V234
Hersteller: NXP USA Inc.
Description: S32V234 EVAL BRD
Utilized IC / Part: S32V234
Core Processor: ARM® Cortex®-A53
Contents: Board(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 21 Stücke:
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1+1881.76 EUR
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OV10640CSP-S32V S32V234FS.pdf
OV10640CSP-S32V
Hersteller: NXP USA Inc.
Description: OMNIVISION MIPI CAMERA FOR SBC-S
Utilized IC / Part: S32V234
Part Status: Active
Accessory Type: Camera
For Use With/Related Products: S32V234
Packaging: Bulk
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1+1599.68 EUR
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MXOV10635-S32V S32V234.pdf
MXOV10635-S32V
Hersteller: NXP USA Inc.
Description: MAXIM LVDS CAMERA FOR SBC-S32V23
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Part Status: Active
Utilized IC / Part: S32V234
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1+1061.47 EUR
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MRFX1K80HR5 MRFX1K80H.pdf
MRFX1K80HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
auf Bestellung 239 Stücke:
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50+612.75 EUR
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MCIMX6D4AVT08AER IMX6DQAEC.pdf
MCIMX6D4AVT08AER
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6D6AVT10AER IMX6DQAEC.pdf
MCIMX6D6AVT10AER
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10AER IMX6DQCEC.pdf
MCIMX6Q5EYM10AER
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6D4AVT08AE IMX6DQAEC.pdf
MCIMX6D4AVT08AE
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D ENHANCED 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6D5EYM10AE IMX6DQIEC.pdf
MCIMX6D5EYM10AE
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 298 Stücke:
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AnzahlPrivatkunde
1+93.31 EUR
10+86.58 EUR
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MCIMX6D6AVT10AE IMX6DQCPOPEC.pdf
MCIMX6D6AVT10AE
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+247.08 EUR
10+208.3 EUR
60+191.44 EUR
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MCIMX6Q5EYM10AE IMX6DQCPOPEC.pdf
MCIMX6Q5EYM10AE
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 54 Stücke:
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AnzahlPrivatkunde
1+225.31 EUR
10+189.5 EUR
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MCIMX6Q6AVT10AE IMX6DQCPOPEC.pdf
MCIMX6Q6AVT10AE
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 67 Stücke:
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AnzahlPrivatkunde
1+304.46 EUR
10+258.12 EUR
60+237.96 EUR
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MCIMX6DP4AVT1AB IMX6DQPAEC.pdf
MCIMX6DP4AVT1AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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MCIMX6DP4AVT8AB IMX6DQPIEC.pdf
MCIMX6DP4AVT8AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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MCIMX6DP6AVT1AB IMX6DQPIEC.pdf
MCIMX6DP6AVT1AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 638 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+247.19 EUR
10+208.4 EUR
60+191.53 EUR
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MCIMX6DP7CVT8AB IMX6DQPIEC.pdf
MCIMX6DP7CVT8AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+169.48 EUR
10+141.56 EUR
60+129.41 EUR
120+126.13 EUR
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MCIMX6QP5EYM1AB IMX6DQPIEC.pdf
MCIMX6QP5EYM1AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+192.68 EUR
10+161.29 EUR
60+147.64 EUR
120+143.94 EUR
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MCIMX6QP7CVT8AB IMX6DQPIEC.pdf
MCIMX6QP7CVT8AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+248.9 EUR
10+210.07 EUR
60+193.17 EUR
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MCZ33897TEFR2 MC33897.pdf
MCZ33897TEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
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PCA9535CHF,118 PCA9535_PCA9535C.pdf
PCA9535CHF,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.47 EUR
10+2.56 EUR
25+2.33 EUR
100+2.08 EUR
Mindestbestellmenge: 7 Stücke
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PTN3460BS/F6Y PTN3460.pdf
PTN3460BS/F6Y
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 1478 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.57 EUR
10+7.31 EUR
25+6.75 EUR
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TJA1022TK,118 TJA1022.pdf
TJA1022TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
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TJA1028TK/5V0/20/J TJA1028.pdf
TJA1028TK/5V0/20/J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 11559 Stücke:
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SC16IS752IBS,128 SC16IS752_SC16IS762.pdf
SC16IS752IBS,128
Hersteller: NXP USA Inc.
Description: IC UART DUAL I2C/SPI 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
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SC28L92A1A,518 SC28L92.pdf
SC28L92A1A,518
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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PCA9518APW,518 PCA9518A.pdf
PCA9518APW,518
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20TSSOP
Part Status: Active
Supplier Device Package: 20-TSSOP
Applications: Buffer
Voltage - Supply: 3V ~ 3.6V
Interface: I2C, SMBus
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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5+4.96 EUR
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TJA1027TK/20/1J TJA1027.pdf
TJA1027TK/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
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10+2.31 EUR
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LPC812M101JDH20J LPC81XM.pdf
LPC812M101JDH20J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 2392 Stücke:
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6+3.8 EUR
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BGU8103X BGU8103.pdf
BGU8103X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 1.2mA
Noise Figure: 0.8dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
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11+2.05 EUR
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PCAL6524EVJ PCAL6524DS.pdf
PCAL6524EVJ
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539_PCA9539R.pdf
PCA9539RPW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9540BDP/Q900J PCA9540B.pdf
PCA9540BDP/Q900J
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1100HNZ TJA1100.pdf
TJA1100HNZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.1V ~ 3.5V
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6372 Stücke:
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2+12.07 EUR
10+9.27 EUR
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FXPQ3115BVT1
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR 2.5V 20/110KPA
Produkt ist nicht verfügbar
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NX5P3363UKZ NX5P3363_Q100.pdf
NX5P3363UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP
Features: Fault Condition Indicator
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.2x2.2)
Fault Protection: Over Current, Over Temperature, Reverse Current
Part Status: Active
auf Bestellung 17970 Stücke:
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6+4.14 EUR
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PCAL6524EVJ PCAL6524DS.pdf
PCAL6524EVJ
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539_PCA9539R.pdf
PCA9539RPW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1653 Stücke:
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5+5.18 EUR
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PCA9540BDP/Q900J PCA9540B.pdf
PCA9540BDP/Q900J
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1207 Stücke:
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6+3.69 EUR
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A2T23H200W23SR6 A2T23H200W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 51W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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AFIC31025GNR1 AFIC31025N.pdf
AFIC31025GNR1
Hersteller: NXP USA Inc.
Description: IC RF AMP TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Voltage - Supply: 32V
Gain: 34.5dB
Supplier Device Package: TO-270WBG-17
Produkt ist nicht verfügbar
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FS32K144MFT0CLLT S32K1xx.pdf
FS32K144MFT0CLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
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AnzahlPrivatkunde
1+41.11 EUR
10+32.92 EUR
24+30.95 EUR
80+28.92 EUR
230+27.63 EUR
450+26.99 EUR
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FS32K144MRT0CLLT
FS32K144MRT0CLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UAT0MLHT S32K1xx.pdf
FS32K144UAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
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FS32K144UAT0VLHR S32K-DS.pdf
FS32K144UAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UFT0CLLT S32K1xx.pdf
FS32K144UFT0CLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R372SDK0MMM S32R372DS.pdf
FS32R372SDK0MMM
Hersteller: NXP USA Inc.
Description: 1MB SRAM, 1.3MB FLASH, C
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I²C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Automotive & Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXPS7140D4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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FXPS7140P4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXTH87EH116T1 FXTH87ERM.pdf
FXTH87EH116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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LPC802M001JDH16FP LPC802.pdf
LPC802M001JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 1282 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
8+2.93 EUR
10+2.14 EUR
25+1.94 EUR
100+1.73 EUR
250+1.62 EUR
960+1.5 EUR
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LPC802M001JDH20FP LPC802.pdf
LPC802M001JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 509 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
8+2.92 EUR
10+2.14 EUR
75+1.76 EUR
150+1.68 EUR
300+1.61 EUR
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LPC802M001JHI33E LPC802.pdf
LPC802M001JHI33E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 860 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.53 EUR
15+1.46 EUR
25+1.45 EUR
100+1.44 EUR
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LPC802M011JDH20FP LPC802.pdf
LPC802M011JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 545 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.03 EUR
10+2.24 EUR
75+1.84 EUR
150+1.75 EUR
300+1.68 EUR
525+1.63 EUR
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