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MCIMX6D4AVT10AE NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6D ROM PERF ENHAN
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MCIMX6D4AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6D ROM PERF ENHAN
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MCIMX6D5EYM12CE MCIMX6D5EYM12CE NXP USA Inc. IMX6DQCEC.pdf Description: I.MX6DQ 1ROM PERF ENHAN
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MCIMX6D5EZK08AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6D6AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6D6AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6Q4AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
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MCIMX6Q5EYM12CE MCIMX6Q5EYM12CE NXP USA Inc. IMX6DQCEC.pdf Description: I.MX6DQ ROM PERF ENHAN
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MCIMX6Q6AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
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MCIMX6Q6AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
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MCIMX6S1AVM08AD MCIMX6S1AVM08AD NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6S1AVM08ADR MCIMX6S1AVM08ADR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6Y2CVM05AB MCIMX6Y2CVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.11 EUR
10+24.66 EUR
25+23.04 EUR
152+20.86 EUR
304+20.27 EUR
608+19.79 EUR
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MCIMX6Y2CVM08AB MCIMX6Y2CVM08AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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Lieferzeit 10-14 Tag (e)
1+34.7 EUR
10+27.61 EUR
25+25.83 EUR
152+23.43 EUR
304+22.79 EUR
608+22.25 EUR
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MCIMX6Y2DVM05AB MCIMX6Y2DVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 474 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.68 EUR
10+23.49 EUR
25+21.94 EUR
152+19.85 EUR
304+19.29 EUR
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MCIMX6Y2DVM09AB MCIMX6Y2DVM09AB NXP USA Inc. IMX6ULLCEC.pdf Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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Lieferzeit 10-14 Tag (e)
1+32.38 EUR
10+25.7 EUR
25+24.03 EUR
152+21.77 EUR
304+21.16 EUR
608+20.66 EUR
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MCIMX6Y7DVK05AB MCIMX6Y7DVK05AB NXP USA Inc. IMX6ULLCEC.pdf Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
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MHT2025GNR1 NXP USA Inc. Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT2025NR1 NXP USA Inc. Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMX8MD6CVAHZAA MIMX8MD6CVAHZAA NXP USA Inc. i.MX8M-FS.pdf Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
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1+153.08 EUR
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MIMX8MD6DVAJZAA MIMX8MD6DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Not For New Designs
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MIMX8MQ5CVAHZAA MIMX8MQ5CVAHZAA NXP USA Inc. i.MX8M-FS.pdf Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
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MIMX8MQ5DVAJZAA MIMX8MQ5DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
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MIMX8MQ6CVAHZAA NXP USA Inc. Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8MQ6DVAJZAA MIMX8MQ6DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
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MRF085HR3 NXP USA Inc. MRF085H.pdf Description: WIDEBAND RF POWER LDMOS TRANSIST
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NCF2952MTT/TPE080J NCF2952MTT/TPE080J NXP USA Inc. KeylessEntry,Go_Leaflet_Apr2012.pdf Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
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NCF2961MHN2/0212CJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
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NCF29A4XHN/0500VJ NCF29A4XHN/0500VJ NXP USA Inc. Description: IC 32HVQFN
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NCK2910AHN/00201Y NXP USA Inc. Description: RECEIVER + INTEGRATED UC
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OL2385AHN/001A1Y OL2385AHN/001A1Y NXP USA Inc. OL2385.pdf Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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PCA9535HFHP NXP USA Inc. PCA9535_PCA9535C.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 160mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9557BSHP PCA9557BSHP NXP USA Inc. PCA9557.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 20mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCF7952ATT/C2BC20J NXP USA Inc. KeylessEntry,Go_Leaflet_Apr2012.pdf Description: IC PASS ENTRY 125KHZ
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PCF7991AT/1081/UZ NXP USA Inc. Description: READER CHIPS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PFXPQ3115BVT1 PFXPQ3115BVT1 NXP USA Inc. Description: PRESSURE SENSOR, 2.5V, 20/110KPA
Packaging: Tape & Reel (TR)
Applications: Board Mount
Part Status: Obsolete
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PFXPS71404T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Packaging: Tray
Applications: Board Mount
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PN5180A0ET/C3J PN5180A0ET/C3J NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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PN5180A0ET/C3QL PN5180A0ET/C3QL NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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PN5180A0HN/C3E PN5180A0HN/C3E NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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PN5180A0HN/C3Y PN5180A0HN/C3Y NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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S32R274RRUEVB S32R274RRUEVB NXP USA Inc. PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: S32R274
Part Status: Active
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S32V234-EVB2 S32V234-EVB2 NXP USA Inc. S32V234FS.pdf Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: S32V234
Part Status: Active
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S912XDT512J1MAA S912XDT512J1MAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
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S912XDT512J1MAAR S912XDT512J1MAAR NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912ZVLA96F0MLF S912ZVLA96F0MLF NXP USA Inc. S12ZVLFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
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SC18IS600IPW/S8HP SC18IS600IPW/S8HP NXP USA Inc. SC18IS600.pdf Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5745BBK1AMMH6R SP5745BBK1AMMH6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5745BBK1AMMH6 SPC5745BBK1AMMH6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5748CK0AMMJ6 SPC5748CK0AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SPC5748CK0AMMJ6R SPC5748CK0AMMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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TEA1999TK/1J TEA1999TK/1J NXP USA Inc. TEA1999TK.pdf Description: FLYBACK SR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1028T/3V3/10/2Z TJA1028T/3V3/10/2Z NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/5V0/10/2Z TJA1028T/5V0/10/2Z NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6L2EVN10AC MCIMX6L2EVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC MCIMX6L3DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6S5DVM10AD MCIMX6S5DVM10AD NXP USA Inc. IMX6SDLIEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S5DVM10ADR MCIMX6S5DVM10ADR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX6U5DVM10ADR MCIMX6U5DVM10ADR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX6U8DVM10AD MCIMX6U8DVM10AD NXP USA Inc. Description: I.MX 6DL ROM PERF ENHAN
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MCIMX6D4AVT10AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
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MCIMX6D4AVT10AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EYM12CE IMX6DQCEC.pdf
MCIMX6D5EYM12CE
Hersteller: NXP USA Inc.
Description: I.MX6DQ 1ROM PERF ENHAN
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MCIMX6D5EZK08AE IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6D6AVT08AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6D6AVT08AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6Q4AVT10AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
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MCIMX6Q5EYM12CE IMX6DQCEC.pdf
MCIMX6Q5EYM12CE
Hersteller: NXP USA Inc.
Description: I.MX6DQ ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6S1AVM08AD IMX6SDLAEC.pdf
MCIMX6S1AVM08AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ADR IMX6SDLAEC.pdf
MCIMX6S1AVM08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Y2CVM05AB IMX6ULLIEC.pdf
MCIMX6Y2CVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 750 Stücke:
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AnzahlPrivatkunde
1+31.11 EUR
10+24.66 EUR
25+23.04 EUR
152+20.86 EUR
304+20.27 EUR
608+19.79 EUR
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MCIMX6Y2CVM08AB IMX6ULLIEC.pdf
MCIMX6Y2CVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 3431 Stücke:
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AnzahlPrivatkunde
1+34.7 EUR
10+27.61 EUR
25+25.83 EUR
152+23.43 EUR
304+22.79 EUR
608+22.25 EUR
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MCIMX6Y2DVM05AB IMX6ULLIEC.pdf
MCIMX6Y2DVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 474 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+29.68 EUR
10+23.49 EUR
25+21.94 EUR
152+19.85 EUR
304+19.29 EUR
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MCIMX6Y2DVM09AB IMX6ULLCEC.pdf
MCIMX6Y2DVM09AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 723 Stücke:
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AnzahlPrivatkunde
1+32.38 EUR
10+25.7 EUR
25+24.03 EUR
152+21.77 EUR
304+21.16 EUR
608+20.66 EUR
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MCIMX6Y7DVK05AB IMX6ULLCEC.pdf
MCIMX6Y7DVK05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MHT2025GNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT2025NR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMX8MD6CVAHZAA i.MX8M-FS.pdf
MIMX8MD6CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 1 Stücke:
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1+153.08 EUR
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MIMX8MD6DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MD6DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Not For New Designs
auf Bestellung 2 Stücke:
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1+144.68 EUR
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MIMX8MQ5CVAHZAA i.MX8M-FS.pdf
MIMX8MQ5CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ5DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MQ5DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ6CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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MIMX8MQ6DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MQ6DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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MRF085HR3 MRF085H.pdf
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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NCF2952MTT/TPE080J KeylessEntry,Go_Leaflet_Apr2012.pdf
NCF2952MTT/TPE080J
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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NCF2961MHN2/0212CJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ
NCF29A4XHN/0500VJ
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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NCK2910AHN/00201Y
Hersteller: NXP USA Inc.
Description: RECEIVER + INTEGRATED UC
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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OL2385AHN/001A1Y OL2385.pdf
OL2385AHN/001A1Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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PCA9535HFHP PCA9535_PCA9535C.pdf
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 160mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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PCA9557BSHP PCA9557.pdf
PCA9557BSHP
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 20mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7952ATT/C2BC20J KeylessEntry,Go_Leaflet_Apr2012.pdf
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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PCF7991AT/1081/UZ
Hersteller: NXP USA Inc.
Description: READER CHIPS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PFXPQ3115BVT1
PFXPQ3115BVT1
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR, 2.5V, 20/110KPA
Packaging: Tape & Reel (TR)
Applications: Board Mount
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PFXPS71404T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Packaging: Tray
Applications: Board Mount
Produkt ist nicht verfügbar
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PN5180A0ET/C3J PN5180A0XX_C3_C4.pdf
PN5180A0ET/C3J
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4000+10.9 EUR
Mindestbestellmenge: 4000 Stücke
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PN5180A0ET/C3QL PN5180A0XX_C3_C4.pdf
PN5180A0ET/C3QL
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 2480 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.55 EUR
10+14.47 EUR
25+13.46 EUR
100+12.33 EUR
490+11.48 EUR
980+11.22 EUR
1470+11.08 EUR
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PN5180A0HN/C3E PN5180A0XX_C3_C4.pdf
PN5180A0HN/C3E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.55 EUR
10+14.47 EUR
25+13.46 EUR
100+12.33 EUR
490+11.48 EUR
Mindestbestellmenge: 2 Stücke
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PN5180A0HN/C3Y PN5180A0XX_C3_C4.pdf
PN5180A0HN/C3Y
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Standards: ISO 14443, ISO 15693
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 8000 Stücke:
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4000+11 EUR
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S32R274RRUEVB PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw
S32R274RRUEVB
Hersteller: NXP USA Inc.
Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: S32R274
Part Status: Active
auf Bestellung 1 Stücke:
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S32V234-EVB2 S32V234FS.pdf
S32V234-EVB2
Hersteller: NXP USA Inc.
Description: S32V234 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: S32V234
Part Status: Active
Produkt ist nicht verfügbar
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S912XDT512J1MAA MC9S12XDP512RMV2.pdf
S912XDT512J1MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Produkt ist nicht verfügbar
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S912XDT512J1MAAR MC9S12XDP512RMV2.pdf
S912XDT512J1MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVLA96F0MLF S12ZVLFS.pdf
S912ZVLA96F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Produkt ist nicht verfügbar
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SC18IS600IPW/S8HP SC18IS600.pdf
SC18IS600IPW/S8HP
Hersteller: NXP USA Inc.
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5745BBK1AMMH6R MPC5746C.pdf
SP5745BBK1AMMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BBK1AMMH6 MPC5746C.pdf
SPC5745BBK1AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5748CK0AMMJ6 MPC5746C.pdf
SPC5748CK0AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5748CK0AMMJ6R MPC5746C.pdf
SPC5748CK0AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1999TK/1J TEA1999TK.pdf
TEA1999TK/1J
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1028T/3V3/10/2Z TJA1028.pdf
TJA1028T/3V3/10/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/5V0/10/2Z TJA1028.pdf
TJA1028T/5V0/10/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6L2EVN10AC IMX6SLCEC.pdf
MCIMX6L2EVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC IMX6SLCEC.pdf
MCIMX6L3DVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S5DVM10AD IMX6SDLIEC.pdf
MCIMX6S5DVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S5DVM10ADR IMX6SDLCEC.pdf
MCIMX6S5DVM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6U5DVM10ADR IMX6SDLCEC.pdf
MCIMX6U5DVM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6U8DVM10AD
MCIMX6U8DVM10AD
Hersteller: NXP USA Inc.
Description: I.MX 6DL ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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