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SC28L92A1A,518 SC28L92A1A,518 NXP USA Inc. SC28L92.pdf Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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PCA9518APW,518 PCA9518APW,518 NXP USA Inc. PCA9518A.pdf Description: IC INTERFACE SPECIALIZED 20TSSOP
Part Status: Active
Supplier Device Package: 20-TSSOP
Applications: Buffer
Voltage - Supply: 3V ~ 3.6V
Interface: I2C, SMBus
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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10+4.38 EUR
25+4.01 EUR
100+3.61 EUR
250+3.42 EUR
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TJA1027TK/20/1J TJA1027TK/20/1J NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
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1000+1.21 EUR
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LPC812M101JDH20J LPC812M101JDH20J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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BGU8103X BGU8103X NXP USA Inc. BGU8103.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 1.2mA
Noise Figure: 0.8dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
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250+1.44 EUR
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1000+1.33 EUR
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PCAL6524EVJ PCAL6524EVJ NXP USA Inc. PCAL6524DS.pdf Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539RPW/Q900J NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9540BDP/Q900J PCA9540BDP/Q900J NXP USA Inc. PCA9540B.pdf Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1100HNZ TJA1100HNZ NXP USA Inc. TJA1100.pdf Description: IC TRANSCEIVER FULL 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.1V ~ 3.5V
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6372 Stücke:
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100+7.79 EUR
250+7.53 EUR
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FXPQ3115BVT1 NXP USA Inc. Description: PRESSURE SENSOR 2.5V 20/110KPA
Produkt ist nicht verfügbar
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NX5P3363UKZ NX5P3363UKZ NXP USA Inc. NX5P3363_Q100.pdf Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP
Features: Fault Condition Indicator
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.2x2.2)
Fault Protection: Over Current, Over Temperature, Reverse Current
Part Status: Active
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PCAL6524EVJ PCAL6524EVJ NXP USA Inc. PCAL6524DS.pdf Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539RPW/Q900J NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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5+5.18 EUR
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100+3.18 EUR
250+3.01 EUR
500+2.95 EUR
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PCA9540BDP/Q900J PCA9540BDP/Q900J NXP USA Inc. PCA9540B.pdf Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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6+3.8 EUR
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A2T23H200W23SR6 NXP USA Inc. A2T23H200W23S.pdf Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 51W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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AFIC31025GNR1 AFIC31025GNR1 NXP USA Inc. AFIC31025N.pdf Description: IC RF AMP TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Voltage - Supply: 32V
Gain: 34.5dB
Supplier Device Package: TO-270WBG-17
Produkt ist nicht verfügbar
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FS32K144MFT0CLLT FS32K144MFT0CLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 420 Stücke:
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10+33.22 EUR
24+31.24 EUR
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FS32K144MRT0CLLT FS32K144MRT0CLLT NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UAT0MLHT FS32K144UAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
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FS32K144UAT0VLHR FS32K144UAT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UFT0CLLT FS32K144UFT0CLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R372SDK0MMM FS32R372SDK0MMM NXP USA Inc. S32R372DS.pdf Description: 1MB SRAM, 1.3MB FLASH, C
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I²C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Automotive & Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXPS7140D4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXPS7140P4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
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FXTH87EH116T1 FXTH87EH116T1 NXP USA Inc. FXTH87ERM.pdf Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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LPC802M001JDH16FP LPC802M001JDH16FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 1282 Stücke:
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8+2.93 EUR
10+2.14 EUR
25+1.94 EUR
100+1.73 EUR
250+1.62 EUR
960+1.5 EUR
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LPC802M001JDH20FP LPC802M001JDH20FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 509 Stücke:
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8+2.92 EUR
10+2.14 EUR
75+1.76 EUR
150+1.68 EUR
300+1.61 EUR
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LPC802M001JHI33E LPC802M001JHI33E NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
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15+1.46 EUR
25+1.45 EUR
100+1.44 EUR
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LPC802M011JDH20FP LPC802M011JDH20FP NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 345 Stücke:
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6+3.56 EUR
10+2.62 EUR
75+2.17 EUR
150+2.07 EUR
300+1.98 EUR
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LTE3401HX LTE3401HX NXP USA Inc. LTE3401H.pdf Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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LTE3401LX LTE3401LX NXP USA Inc. LTE3401L.pdf Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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MC33AR6000BGWS NXP USA Inc. AR6000.pdf Description: ALTERNATOR REGULATOR, 14V 12A, L
Produkt ist nicht verfügbar
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MC34PF4210A0ES MC34PF4210A0ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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10+16.12 EUR
25+15.01 EUR
100+13.78 EUR
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MC34PF4210A0ESR2 MC34PF4210A0ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC35FS4503CAE MC35FS4503CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4503CAER2 MC35FS4503CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
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MCF51EM256CLLR MCF51EM256CLLR NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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1000+19.3 EUR
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MCIMX6D4AVT10AE NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6D ROM PERF ENHAN
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MCIMX6D4AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6D ROM PERF ENHAN
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MCIMX6D5EYM12CE MCIMX6D5EYM12CE NXP USA Inc. IMX6DQCEC.pdf Description: I.MX6DQ 1ROM PERF ENHAN
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MCIMX6D5EZK08AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6D6AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6D6AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6Q4AVT10AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
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MCIMX6Q5EYM12CE MCIMX6Q5EYM12CE NXP USA Inc. IMX6DQCEC.pdf Description: I.MX6DQ ROM PERF ENHAN
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MCIMX6Q6AVT08AE NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
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MCIMX6Q6AVT08AER NXP USA Inc. IMX6DQAEC.pdf Description: I.MX6Q ROM PERF ENHAN
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MCIMX6S1AVM08AD MCIMX6S1AVM08AD NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6S1AVM08ADR MCIMX6S1AVM08ADR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6Y2CVM08AB MCIMX6Y2CVM08AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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Lieferzeit 10-14 Tag (e)
1+33.97 EUR
10+27.04 EUR
25+25.3 EUR
152+22.94 EUR
304+22.31 EUR
608+21.79 EUR
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MCIMX6Y2DVM05AB MCIMX6Y2DVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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1+29.07 EUR
10+22.99 EUR
25+21.48 EUR
152+19.43 EUR
304+18.89 EUR
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MCIMX6Y2DVM09AB MCIMX6Y2DVM09AB NXP USA Inc. IMX6ULLCEC.pdf Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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Lieferzeit 10-14 Tag (e)
1+33.59 EUR
10+26.67 EUR
25+24.94 EUR
152+22.59 EUR
304+21.96 EUR
608+21.44 EUR
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MCIMX6Y7DVK05AB MCIMX6Y7DVK05AB NXP USA Inc. IMX6ULLCEC.pdf Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MHT2025GNR1 NXP USA Inc. Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT2025NR1 NXP USA Inc. Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMX8MD6CVAHZAA MIMX8MD6CVAHZAA NXP USA Inc. i.MX8M-FS.pdf Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
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MIMX8MD6DVAJZAA MIMX8MD6DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Not For New Designs
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MIMX8MQ5CVAHZAA MIMX8MQ5CVAHZAA NXP USA Inc. i.MX8M-FS.pdf Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ5DVAJZAA MIMX8MQ5DVAJZAA NXP USA Inc. MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
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MIMX8MQ6CVAHZAA NXP USA Inc. Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92.pdf
SC28L92A1A,518
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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PCA9518APW,518 PCA9518A.pdf
PCA9518APW,518
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20TSSOP
Part Status: Active
Supplier Device Package: 20-TSSOP
Applications: Buffer
Voltage - Supply: 3V ~ 3.6V
Interface: I2C, SMBus
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 5414 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.84 EUR
10+4.38 EUR
25+4.01 EUR
100+3.61 EUR
250+3.42 EUR
500+3.37 EUR
Mindestbestellmenge: 4 Stücke
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TJA1027TK/20/1J TJA1027.pdf
TJA1027TK/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.34 EUR
13+1.7 EUR
25+1.55 EUR
100+1.37 EUR
250+1.29 EUR
500+1.23 EUR
1000+1.21 EUR
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LPC812M101JDH20J LPC81XM.pdf
LPC812M101JDH20J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.83 EUR
10+2.82 EUR
50+2.42 EUR
100+2.3 EUR
500+2.08 EUR
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BGU8103X BGU8103.pdf
BGU8103X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 1.2mA
Noise Figure: 0.8dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
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11+2.05 EUR
12+1.76 EUR
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100+1.52 EUR
250+1.44 EUR
500+1.38 EUR
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PCAL6524EVJ PCAL6524DS.pdf
PCAL6524EVJ
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539_PCA9539R.pdf
PCA9539RPW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9540BDP/Q900J PCA9540B.pdf
PCA9540BDP/Q900J
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1100HNZ TJA1100.pdf
TJA1100HNZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.1V ~ 3.5V
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6372 Stücke:
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2+12.07 EUR
10+9.27 EUR
25+8.57 EUR
100+7.79 EUR
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FXPQ3115BVT1
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR 2.5V 20/110KPA
Produkt ist nicht verfügbar
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NX5P3363UKZ NX5P3363_Q100.pdf
NX5P3363UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP
Features: Fault Condition Indicator
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.2x2.2)
Fault Protection: Over Current, Over Temperature, Reverse Current
Part Status: Active
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6+4.05 EUR
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PCAL6524EVJ PCAL6524DS.pdf
PCAL6524EVJ
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 36VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 36-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 24
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 36-VFBGA (2.6x2.6)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9539RPW/Q900J PCA9539_PCA9539R.pdf
PCA9539RPW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1653 Stücke:
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5+5.18 EUR
10+3.87 EUR
25+3.55 EUR
100+3.18 EUR
250+3.01 EUR
500+2.95 EUR
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PCA9540BDP/Q900J PCA9540B.pdf
PCA9540BDP/Q900J
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1200 Stücke:
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6+3.8 EUR
10+2.8 EUR
25+2.55 EUR
100+2.27 EUR
250+2.14 EUR
500+2.06 EUR
1000+2.02 EUR
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A2T23H200W23SR6 A2T23H200W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 51W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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AFIC31025GNR1 AFIC31025N.pdf
AFIC31025GNR1
Hersteller: NXP USA Inc.
Description: IC RF AMP TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Voltage - Supply: 32V
Gain: 34.5dB
Supplier Device Package: TO-270WBG-17
Produkt ist nicht verfügbar
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FS32K144MFT0CLLT S32K1xx.pdf
FS32K144MFT0CLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 420 Stücke:
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1+41.51 EUR
10+33.22 EUR
24+31.24 EUR
80+29.19 EUR
230+27.89 EUR
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FS32K144MRT0CLLT
FS32K144MRT0CLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UAT0MLHT S32K1xx.pdf
FS32K144UAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
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FS32K144UAT0VLHR S32K1xx.pdf
FS32K144UAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UFT0CLLT S32K1xx.pdf
FS32K144UFT0CLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R372SDK0MMM S32R372DS.pdf
FS32R372SDK0MMM
Hersteller: NXP USA Inc.
Description: 1MB SRAM, 1.3MB FLASH, C
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I²C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Automotive & Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXPS7140D4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXPS7140P4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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FXTH87EH116T1 FXTH87ERM.pdf
FXTH87EH116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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LPC802M001JDH16FP LPC802.pdf
LPC802M001JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 1282 Stücke:
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8+2.93 EUR
10+2.14 EUR
25+1.94 EUR
100+1.73 EUR
250+1.62 EUR
960+1.5 EUR
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LPC802M001JDH20FP LPC802.pdf
LPC802M001JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 509 Stücke:
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8+2.92 EUR
10+2.14 EUR
75+1.76 EUR
150+1.68 EUR
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LPC802M001JHI33E LPC802.pdf
LPC802M001JHI33E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 860 Stücke:
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9+2.53 EUR
15+1.46 EUR
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LPC802M011JDH20FP LPC802.pdf
LPC802M011JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 345 Stücke:
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6+3.56 EUR
10+2.62 EUR
75+2.17 EUR
150+2.07 EUR
300+1.98 EUR
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LTE3401HX LTE3401H.pdf
LTE3401HX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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LTE3401LX LTE3401L.pdf
LTE3401LX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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MC33AR6000BGWS AR6000.pdf
Hersteller: NXP USA Inc.
Description: ALTERNATOR REGULATOR, 14V 12A, L
Produkt ist nicht verfügbar
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MC34PF4210A0ES PF4210.pdf
MC34PF4210A0ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 225 Stücke:
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2+20.59 EUR
10+16.12 EUR
25+15.01 EUR
100+13.78 EUR
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MC34PF4210A0ESR2 PF4210.pdf
MC34PF4210A0ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC35FS4503CAE 35FS4500-35FS6500SDS.pdf
MC35FS4503CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4503CAER2 35FS4500-35FS6500SDS.pdf
MC35FS4503CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Produkt ist nicht verfügbar
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MCF51EM256CLLR MCF51EM256.pdf
MCF51EM256CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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AnzahlPrivatkunde
1000+19.3 EUR
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MCIMX6D4AVT10AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D4AVT10AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6D ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EYM12CE IMX6DQCEC.pdf
MCIMX6D5EYM12CE
Hersteller: NXP USA Inc.
Description: I.MX6DQ 1ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6D5EZK08AE IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6D6AVT08AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT10AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q5EYM12CE IMX6DQCEC.pdf
MCIMX6Q5EYM12CE
Hersteller: NXP USA Inc.
Description: I.MX6DQ ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AE IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AER IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX6Q ROM PERF ENHAN
Produkt ist nicht verfügbar
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MCIMX6S1AVM08AD IMX6SDLAEC.pdf
MCIMX6S1AVM08AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ADR IMX6SDLAEC.pdf
MCIMX6S1AVM08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Y2CVM08AB IMX6ULLIEC.pdf
MCIMX6Y2CVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 3431 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+33.97 EUR
10+27.04 EUR
25+25.3 EUR
152+22.94 EUR
304+22.31 EUR
608+21.79 EUR
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MCIMX6Y2DVM05AB IMX6ULLIEC.pdf
MCIMX6Y2DVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 474 Stücke:
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AnzahlPrivatkunde
1+29.07 EUR
10+22.99 EUR
25+21.48 EUR
152+19.43 EUR
304+18.89 EUR
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MCIMX6Y2DVM09AB IMX6ULLCEC.pdf
MCIMX6Y2DVM09AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 701 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+33.59 EUR
10+26.67 EUR
25+24.94 EUR
152+22.59 EUR
304+21.96 EUR
608+21.44 EUR
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MCIMX6Y7DVK05AB IMX6ULLCEC.pdf
MCIMX6Y7DVK05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MHT2025GNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT2025NR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMX8MD6CVAHZAA i.MX8M-FS.pdf
MIMX8MD6CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
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1+153.08 EUR
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MIMX8MD6DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MD6DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Not For New Designs
auf Bestellung 2 Stücke:
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AnzahlPrivatkunde
1+144.68 EUR
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MIMX8MQ5CVAHZAA i.MX8M-FS.pdf
MIMX8MQ5CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ5DVAJZAA MIMX8MxxDVAJZA%28A%2CB%29_DS.pdf
MIMX8MQ5DVAJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Produkt ist nicht verfügbar
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MIMX8MQ6CVAHZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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