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SL2ICS5311EW/V7,00 NXP USA Inc. SL2ICS53,54.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: EPC, ISO 15693
Supplier Device Package: Wafer
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33MR2001TVK NXP USA Inc. MC33MR2001Txx.pdf Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
PC33MR2001RVK NXP USA Inc. Description: IC RX 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
PC33MR2001VVK NXP USA Inc. Description: IC VCO 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
SAF5000EL/V100/S2K NXP USA Inc. Description: MULTI APPLICATION RADIO SYSTEM
Produkt ist nicht verfügbar
TDA18204HN/C1,557 NXP USA Inc. TDA18204HN.pdf Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18256HN/C1E NXP USA Inc. Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18256HN/C1K NXP USA Inc. Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18264HB/C1,557 NXP USA Inc. Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18267HB/C1,557 NXP USA Inc. Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18280HN/C1K NXP USA Inc. Description: IC TELECOM INTERFACE
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
TEF5000EL/V1/S20K NXP USA Inc. Description: WISPA-ITS
Produkt ist nicht verfügbar
TEF5100EL/V1/S20K NXP USA Inc. Description: WISPA-ITS
Produkt ist nicht verfügbar
PMMA1210KEG NXP USA Inc. MMA1210.pdf Description: IC ACCEL Z- AXIS 100G
Packaging: Tube
Produkt ist nicht verfügbar
PMMA1220KEG NXP USA Inc. MMA1220KEG.pdf Description: IC ACCEL LOW G Z-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA1251KEG NXP USA Inc. Description: IC ACCEL Z-AXIS
Produkt ist nicht verfügbar
PMMA1252KEG NXP USA Inc. Description: IC ACCEL 5G Z-AXIS
Packaging: Tube
Produkt ist nicht verfügbar
PMMA2204KEG NXP USA Inc. Description: IC ACCEL X-AXIS 100G ROHS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA2244KEG NXP USA Inc. Description: IC ACCEL 20G X-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA3201KEG NXP USA Inc. Description: IC ACCEL XY AXIS 40G ROHS
Produkt ist nicht verfügbar
PMMA3202KEG NXP USA Inc. Description: IC ACCEL SMT LN XY SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA3204KEG NXP USA Inc. Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
AFV10700HSR5 AFV10700HSR5 NXP USA Inc. AFV10700H.pdf Description: RF MOSFET LDMOS DL 50V NI780S-4L
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MPXM2102AT1 MPXM2102AT1 NXP USA Inc. MPX2102.pdf Description: SENSOR 14.5PSIA .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 640 Stücke:
Lieferzeit 21-28 Tag (e)
1+29.41 EUR
10+ 23.26 EUR
25+ 22.04 EUR
100+ 18.98 EUR
500+ 17.75 EUR
MC13892DJVLR2 MC13892DJVLR2 NXP USA Inc. MC13892.pdf Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
auf Bestellung 797 Stücke:
Lieferzeit 21-28 Tag (e)
1+27.72 EUR
10+ 25.04 EUR
25+ 23.87 EUR
100+ 20.73 EUR
250+ 19.8 EUR
500+ 18.05 EUR
PCA9510AD,118 PCA9510AD,118 NXP USA Inc. PCA9510A.pdf Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
auf Bestellung 3276 Stücke:
Lieferzeit 21-28 Tag (e)
4+6.97 EUR
10+ 6.25 EUR
25+ 5.91 EUR
100+ 5.12 EUR
250+ 4.86 EUR
500+ 4.36 EUR
1000+ 3.68 EUR
Mindestbestellmenge: 4
BGU6101,147 BGU6101,147 NXP USA Inc. BGU6101.pdf Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
auf Bestellung 3591 Stücke:
Lieferzeit 21-28 Tag (e)
10+2.86 EUR
11+ 2.52 EUR
25+ 2.28 EUR
100+ 2 EUR
250+ 1.75 EUR
500+ 1.55 EUR
1000+ 1.22 EUR
Mindestbestellmenge: 10
KMI15/1/V3PX KMI15/1/V3PX NXP USA Inc. KMI15_1.pdf Description: MAGNETIC SWITCH SPEC PURP 2SIP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Produkt ist nicht verfügbar
SL3S1202FTB1,115 SL3S1202FTB1,115 NXP USA Inc. SL3ICS1002_1202.pdf Description: IC RFID TRANSP 840-960MHZ 3XSON
Produkt ist nicht verfügbar
PCAL6416AEX1Z PCAL6416AEX1Z NXP USA Inc. PCAL6416A.pdf Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4200 Stücke:
Lieferzeit 21-28 Tag (e)
7+3.95 EUR
10+ 3.54 EUR
25+ 3.36 EUR
100+ 2.76 EUR
250+ 2.58 EUR
500+ 2.28 EUR
1000+ 1.8 EUR
2500+ 1.68 EUR
Mindestbestellmenge: 7
SC18IS600IPW/S8HP SC18IS600IPW/S8HP NXP USA Inc. SC18IS600.pdf Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 13023 Stücke:
Lieferzeit 21-28 Tag (e)
3+11.99 EUR
10+ 10.77 EUR
25+ 10.18 EUR
100+ 8.82 EUR
250+ 8.37 EUR
500+ 7.51 EUR
1000+ 6.33 EUR
Mindestbestellmenge: 3
SC18IS602BIPW/S8HP SC18IS602BIPW/S8HP NXP USA Inc. SC18IS602B.pdf Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MRF13750HR5 MRF13750HR5 NXP USA Inc. MRF13750H.pdf Description: RF MOSFET LDMOS DL 50V NI-1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
SJA1105ELY SJA1105ELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 3139 Stücke:
Lieferzeit 21-28 Tag (e)
2+21.11 EUR
10+ 19.07 EUR
25+ 18.18 EUR
100+ 15.78 EUR
250+ 15.07 EUR
500+ 13.74 EUR
Mindestbestellmenge: 2
SJA1105TELY SJA1105TELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Produkt ist nicht verfügbar
TFA9892AUK/N1BZ TFA9892AUK/N1BZ NXP USA Inc. Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.63x3.13)
Part Status: Active
auf Bestellung 973 Stücke:
Lieferzeit 21-28 Tag (e)
4+7.38 EUR
10+ 6.63 EUR
25+ 6.27 EUR
100+ 5.43 EUR
250+ 5.15 EUR
500+ 4.62 EUR
Mindestbestellmenge: 4
TFA9896UK/N1Z TFA9896UK/N1Z NXP USA Inc. Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 30-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Supplier Device Package: 30-WLCSP (2.72x2.06)
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 21-28 Tag (e)
6+4.52 EUR
10+ 4.07 EUR
25+ 3.84 EUR
100+ 3.27 EUR
Mindestbestellmenge: 6
TFA9891UK/N1AZ TFA9891UK/N1AZ NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 21-28 Tag (e)
NX30P6093UKZ NXP USA Inc. NXP_GreenChip_FS.pdf Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Cut Tape (CT)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1999TK/1J TEA1999TK/1J NXP USA Inc. TEA1999TK.pdf Description: FLYBACK SR
Produkt ist nicht verfügbar
MCIMX8M-EVK MCIMX8M-EVK NXP USA Inc. i.MX8M_Family_FS.pdf Description: I.MX 8M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active
Produkt ist nicht verfügbar
LPC8N04FHI24E LPC8N04FHI24E NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 310 Stücke:
Lieferzeit 21-28 Tag (e)
4+7.75 EUR
10+ 6.06 EUR
80+ 4.97 EUR
Mindestbestellmenge: 4
LPC8N04FHI24Z LPC8N04FHI24Z NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 21-28 Tag (e)
1500+4.06 EUR
Mindestbestellmenge: 1500
OM40002UL OM40002UL NXP USA Inc. get-started-with-the-om40002:GS-OM40002 Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)
1+62.27 EUR
LPC8N04FHI24Z LPC8N04FHI24Z NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 21-28 Tag (e)
4+7.67 EUR
10+ 6 EUR
100+ 4.91 EUR
500+ 4.81 EUR
Mindestbestellmenge: 4
MPXV7002GC6T1 MPXV7002GC6T1 NXP USA Inc. MPXV7002.pdf Description: SENSOR PRESSURE 8SOP AXIAL PORT
Produkt ist nicht verfügbar
MC33972ATEKR2 MC33972ATEKR2 NXP USA Inc. www.nxp.com Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
2+14.46 EUR
10+ 12.99 EUR
25+ 12.28 EUR
100+ 10.64 EUR
250+ 10.1 EUR
500+ 9.06 EUR
Mindestbestellmenge: 2
S9KEAZN8AMTGR S9KEAZN8AMTGR NXP USA Inc. Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 4900 Stücke:
Lieferzeit 21-28 Tag (e)
4+6.53 EUR
10+ 5.1 EUR
100+ 4.1 EUR
500+ 3.87 EUR
1000+ 3.21 EUR
Mindestbestellmenge: 4
MC9S08SH8CWJR MC9S08SH8CWJR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC34674DEPR2 MC34674DEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
auf Bestellung 2649 Stücke:
Lieferzeit 21-28 Tag (e)
MPXM2053GST1 MPXM2053GST1 NXP USA Inc. MPX2053.pdf Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
auf Bestellung 2798 Stücke:
Lieferzeit 21-28 Tag (e)
1+31.46 EUR
10+ 24.91 EUR
25+ 23.6 EUR
100+ 20.32 EUR
SC16C752BIB48,128 SC16C752BIB48,128 NXP USA Inc. SC16C752B.pdf Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 621 Stücke:
Lieferzeit 21-28 Tag (e)
2+16.12 EUR
10+ 14.55 EUR
25+ 13.87 EUR
100+ 12.04 EUR
250+ 11.5 EUR
500+ 10.49 EUR
Mindestbestellmenge: 2
PCF8551BTT/AJ PCF8551BTT/AJ NXP USA Inc. PCF8551.pdf Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 3641 Stücke:
Lieferzeit 21-28 Tag (e)
9+2.99 EUR
10+ 2.68 EUR
25+ 2.55 EUR
100+ 2.09 EUR
250+ 1.95 EUR
500+ 1.73 EUR
1000+ 1.36 EUR
2500+ 1.27 EUR
Mindestbestellmenge: 9
BAP142LX,315 BAP142LX,315 NXP USA Inc. BAP142LX.pdf Description: RF DIODE PIN 50V 130MW SOD2
Produkt ist nicht verfügbar
LPC11A04UK,118 LPC11A04UK,118 NXP USA Inc. LPC11AXX.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 56081 Stücke:
Lieferzeit 21-28 Tag (e)
2+16.28 EUR
10+ 12.71 EUR
100+ 10.41 EUR
500+ 10.19 EUR
1000+ 8.6 EUR
Mindestbestellmenge: 2
TDA8551T/N1,118 TDA8551T/N1,118 NXP USA Inc. TDA8551.pdf Description: IC AMP CLASS AB MONO 1.4W 8SO
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 1.4W x 1 @ 8Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
S9KEAZN64AMLHR S9KEAZN64AMLHR NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 9984 Stücke:
Lieferzeit 21-28 Tag (e)
3+12.25 EUR
10+ 9.56 EUR
100+ 7.83 EUR
500+ 7.67 EUR
Mindestbestellmenge: 3
LPC812M101JDH16J LPC812M101JDH16J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified
auf Bestellung 4119 Stücke:
Lieferzeit 21-28 Tag (e)
6+4.86 EUR
10+ 3.8 EUR
100+ 3.05 EUR
500+ 2.88 EUR
1000+ 2.39 EUR
Mindestbestellmenge: 6
GTL2000DGG,118 GTL2000DGG,118 NXP USA Inc. GTL2000.pdf Description: IC TRANSLATOR BIDIR 48TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 48-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 22
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
SL2ICS5311EW/V7,00 SL2ICS53,54.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: EPC, ISO 15693
Supplier Device Package: Wafer
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33MR2001TVK MC33MR2001Txx.pdf
Hersteller: NXP USA Inc.
Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
PC33MR2001RVK
Hersteller: NXP USA Inc.
Description: IC RX 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
PC33MR2001VVK
Hersteller: NXP USA Inc.
Description: IC VCO 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
SAF5000EL/V100/S2K
Hersteller: NXP USA Inc.
Description: MULTI APPLICATION RADIO SYSTEM
Produkt ist nicht verfügbar
TDA18204HN/C1,557 TDA18204HN.pdf
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18256HN/C1E
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18256HN/C1K
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18264HB/C1,557
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18267HB/C1,557
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
TDA18280HN/C1K
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
TEF5000EL/V1/S20K
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Produkt ist nicht verfügbar
TEF5100EL/V1/S20K
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Produkt ist nicht verfügbar
PMMA1210KEG MMA1210.pdf
Hersteller: NXP USA Inc.
Description: IC ACCEL Z- AXIS 100G
Packaging: Tube
Produkt ist nicht verfügbar
PMMA1220KEG MMA1220KEG.pdf
Hersteller: NXP USA Inc.
Description: IC ACCEL LOW G Z-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA1251KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL Z-AXIS
Produkt ist nicht verfügbar
PMMA1252KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL 5G Z-AXIS
Packaging: Tube
Produkt ist nicht verfügbar
PMMA2204KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL X-AXIS 100G ROHS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA2244KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL 20G X-AXIS
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA3201KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL XY AXIS 40G ROHS
Produkt ist nicht verfügbar
PMMA3202KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL SMT LN XY SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
PMMA3204KEG
Hersteller: NXP USA Inc.
Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
AFV10700HSR5 AFV10700H.pdf
AFV10700HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS DL 50V NI780S-4L
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MPXM2102AT1 MPX2102.pdf
MPXM2102AT1
Hersteller: NXP USA Inc.
Description: SENSOR 14.5PSIA .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 640 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+29.41 EUR
10+ 23.26 EUR
25+ 22.04 EUR
100+ 18.98 EUR
500+ 17.75 EUR
MC13892DJVLR2 MC13892.pdf
MC13892DJVLR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
auf Bestellung 797 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+27.72 EUR
10+ 25.04 EUR
25+ 23.87 EUR
100+ 20.73 EUR
250+ 19.8 EUR
500+ 18.05 EUR
PCA9510AD,118 PCA9510A.pdf
PCA9510AD,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
auf Bestellung 3276 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+6.97 EUR
10+ 6.25 EUR
25+ 5.91 EUR
100+ 5.12 EUR
250+ 4.86 EUR
500+ 4.36 EUR
1000+ 3.68 EUR
Mindestbestellmenge: 4
BGU6101,147 BGU6101.pdf
BGU6101,147
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
auf Bestellung 3591 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
10+2.86 EUR
11+ 2.52 EUR
25+ 2.28 EUR
100+ 2 EUR
250+ 1.75 EUR
500+ 1.55 EUR
1000+ 1.22 EUR
Mindestbestellmenge: 10
KMI15/1/V3PX KMI15_1.pdf
KMI15/1/V3PX
Hersteller: NXP USA Inc.
Description: MAGNETIC SWITCH SPEC PURP 2SIP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Produkt ist nicht verfügbar
SL3S1202FTB1,115 SL3ICS1002_1202.pdf
SL3S1202FTB1,115
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 3XSON
Produkt ist nicht verfügbar
PCAL6416AEX1Z PCAL6416A.pdf
PCAL6416AEX1Z
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4200 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
7+3.95 EUR
10+ 3.54 EUR
25+ 3.36 EUR
100+ 2.76 EUR
250+ 2.58 EUR
500+ 2.28 EUR
1000+ 1.8 EUR
2500+ 1.68 EUR
Mindestbestellmenge: 7
SC18IS600IPW/S8HP SC18IS600.pdf
SC18IS600IPW/S8HP
Hersteller: NXP USA Inc.
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 13023 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+11.99 EUR
10+ 10.77 EUR
25+ 10.18 EUR
100+ 8.82 EUR
250+ 8.37 EUR
500+ 7.51 EUR
1000+ 6.33 EUR
Mindestbestellmenge: 3
SC18IS602BIPW/S8HP SC18IS602B.pdf
SC18IS602BIPW/S8HP
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MRF13750HR5 MRF13750H.pdf
MRF13750HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS DL 50V NI-1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
SJA1105ELY SJA1105.pdf
SJA1105ELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 3139 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+21.11 EUR
10+ 19.07 EUR
25+ 18.18 EUR
100+ 15.78 EUR
250+ 15.07 EUR
500+ 13.74 EUR
Mindestbestellmenge: 2
SJA1105TELY SJA1105.pdf
SJA1105TELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Produkt ist nicht verfügbar
TFA9892AUK/N1BZ
TFA9892AUK/N1BZ
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.63x3.13)
Part Status: Active
auf Bestellung 973 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+7.38 EUR
10+ 6.63 EUR
25+ 6.27 EUR
100+ 5.43 EUR
250+ 5.15 EUR
500+ 4.62 EUR
Mindestbestellmenge: 4
TFA9896UK/N1Z
TFA9896UK/N1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 30-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Supplier Device Package: 30-WLCSP (2.72x2.06)
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
6+4.52 EUR
10+ 4.07 EUR
25+ 3.84 EUR
100+ 3.27 EUR
Mindestbestellmenge: 6
TFA9891UK/N1AZ
TFA9891UK/N1AZ
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 21-28 Tag (e)
NX30P6093UKZ NXP_GreenChip_FS.pdf
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Cut Tape (CT)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1999TK/1J TEA1999TK.pdf
TEA1999TK/1J
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Produkt ist nicht verfügbar
MCIMX8M-EVK i.MX8M_Family_FS.pdf
MCIMX8M-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active
Produkt ist nicht verfügbar
LPC8N04FHI24E LPC8N04.pdf
LPC8N04FHI24E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 310 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+7.75 EUR
10+ 6.06 EUR
80+ 4.97 EUR
Mindestbestellmenge: 4
LPC8N04FHI24Z LPC8N04.pdf
LPC8N04FHI24Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1500+4.06 EUR
Mindestbestellmenge: 1500
OM40002UL get-started-with-the-om40002:GS-OM40002
OM40002UL
Hersteller: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+62.27 EUR
LPC8N04FHI24Z LPC8N04.pdf
LPC8N04FHI24Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+7.67 EUR
10+ 6 EUR
100+ 4.91 EUR
500+ 4.81 EUR
Mindestbestellmenge: 4
MPXV7002GC6T1 MPXV7002.pdf
MPXV7002GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR PRESSURE 8SOP AXIAL PORT
Produkt ist nicht verfügbar
MC33972ATEKR2 www.nxp.com
MC33972ATEKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+14.46 EUR
10+ 12.99 EUR
25+ 12.28 EUR
100+ 10.64 EUR
250+ 10.1 EUR
500+ 9.06 EUR
Mindestbestellmenge: 2
S9KEAZN8AMTGR
S9KEAZN8AMTGR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 4900 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+6.53 EUR
10+ 5.1 EUR
100+ 4.1 EUR
500+ 3.87 EUR
1000+ 3.21 EUR
Mindestbestellmenge: 4
MC9S08SH8CWJR MC9S08SH8.pdf
MC9S08SH8CWJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC34674DEPR2 MC34674.pdf
MC34674DEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
auf Bestellung 2649 Stücke:
Lieferzeit 21-28 Tag (e)
MPXM2053GST1 MPX2053.pdf
MPXM2053GST1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
auf Bestellung 2798 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+31.46 EUR
10+ 24.91 EUR
25+ 23.6 EUR
100+ 20.32 EUR
SC16C752BIB48,128 SC16C752B.pdf
SC16C752BIB48,128
Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 621 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+16.12 EUR
10+ 14.55 EUR
25+ 13.87 EUR
100+ 12.04 EUR
250+ 11.5 EUR
500+ 10.49 EUR
Mindestbestellmenge: 2
PCF8551BTT/AJ PCF8551.pdf
PCF8551BTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 3641 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
9+2.99 EUR
10+ 2.68 EUR
25+ 2.55 EUR
100+ 2.09 EUR
250+ 1.95 EUR
500+ 1.73 EUR
1000+ 1.36 EUR
2500+ 1.27 EUR
Mindestbestellmenge: 9
BAP142LX,315 BAP142LX.pdf
BAP142LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Produkt ist nicht verfügbar
LPC11A04UK,118 LPC11AXX.pdf
LPC11A04UK,118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 56081 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+16.28 EUR
10+ 12.71 EUR
100+ 10.41 EUR
500+ 10.19 EUR
1000+ 8.6 EUR
Mindestbestellmenge: 2
TDA8551T/N1,118 TDA8551.pdf
TDA8551T/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 1.4W 8SO
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 1.4W x 1 @ 8Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
S9KEAZN64AMLHR S9KEA64P64M20SF0.pdf
S9KEAZN64AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 9984 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+12.25 EUR
10+ 9.56 EUR
100+ 7.83 EUR
500+ 7.67 EUR
Mindestbestellmenge: 3
LPC812M101JDH16J LPC81XM.pdf
LPC812M101JDH16J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified
auf Bestellung 4119 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
6+4.86 EUR
10+ 3.8 EUR
100+ 3.05 EUR
500+ 2.88 EUR
1000+ 2.39 EUR
Mindestbestellmenge: 6
GTL2000DGG,118 GTL2000.pdf
GTL2000DGG,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 48-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 22
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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