Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36787) > Seite 314 nach 614
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TEA1713T/N2,518 | NXP USA Inc. |
Description: IC PFC CTRLR DCM 500KHZ 24SOPackaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 70 ~ 276 VAC Frequency - Switching: 500kHz Mode: Discontinuous Conduction (DCM) Supplier Device Package: 24-SO Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
BGU8M1X | NXP USA Inc. |
Description: IC AMP LTE 1.805-2.17GHZ 6XSONPart Status: Active Supplier Device Package: 6-XSON (1.1x0.7) Test Frequency: 1.842GHz Noise Figure: 0.8dB Current - Supply: 5mA Gain: 13.5dB Voltage - Supply: 1.5V ~ 3.1V RF Type: LTE, WiMax Frequency: 1.805GHz ~ 2.17GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Cut Tape (CT) |
auf Bestellung 1370 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
TJA1029T,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOPart Status: Active Receiver Hysteresis: 175 mV Supplier Device Package: 8-SO Protocol: LINbus Number of Drivers/Receivers: 1/1 Voltage - Supply: 5V ~ 18V Operating Temperature: -40°C ~ 150°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 1730 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
TEA19162T/2J | NXP USA Inc. |
Description: IC PFC CTRLR DCM 134KHZ 8SOCurrent - Startup: 800 µA Part Status: Active Supplier Device Package: 8-SO Mode: Discontinuous Conduction (DCM) Frequency - Switching: 134kHz Voltage - Supply: 70 ~ 276 VAC Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 2327 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
BF513,215 | NXP USA Inc. |
Description: RF MOSFET JFET 10V SOT23Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 100MHz Configuration: N-Channel Technology: JFET Noise Figure: 1.5dB Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Voltage - Rated: 20 V Voltage - Test: 10 V Current - Test: 5 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
|
MP3V5050GC6T1 | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" 2.82VPressure Type: Vented Gauge Operating Pressure: 7.25PSI (50kPa) Output: 0.06 V ~ 2.82 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-SMD, Gull Wing, Top Port Features: Temperature Compensated Packaging: Cut Tape (CT) Maximum Pressure: 29.01PSI (200kPa) Port Style: Barbless Applications: Board Mount Port Size: Male - 0.13" (3.17mm) Tube, Dual Voltage - Supply: 2.7V ~ 3.3V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±2.5% |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
HTMS8001FTB/AF,115 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAPPackaging: Cut Tape (CT) Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) |
auf Bestellung 4869 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
TEA1738T/N1,118 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 26.5kHz ~ 78kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 20.6 V Part Status: Active Power (Watts): 75 W |
auf Bestellung 1371 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
SL2S1512FTBX | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 3XSONPart Status: Active Supplier Device Package: 3-XSON (1x1.45) Standards: ISO 18000-6, EPC Voltage - Supply: 1.5V ~ 1.7V Operating Temperature: -40°C ~ 85°C Type: RFID Transponder Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 3-XDFN Packaging: Cut Tape (CT) |
auf Bestellung 9695 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
BAP70AM,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 300MW 6TSSOP |
auf Bestellung 588 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
BB156,115 | NXP USA Inc. |
Description: DIODE VAR CAP 10V 20MA SOD323Capacitance Ratio: 3.9 Voltage - Peak Reverse (Max): 10 V Supplier Device Package: SOD-323 Capacitance Ratio Condition: C1/C7.5 Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
TEA1731LTS/1,115 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
BAP50LX,315 | NXP USA Inc. |
Description: RF DIODE PIN 50V 150MW SOD2Power Dissipation (Max): 150 mW Current - Max: 50 mA Supplier Device Package: SOD2 Voltage - Peak Reverse (Max): 50V Resistance @ If, F: 3Ohm @ 10mA, 100MHz Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - Single Package / Case: SOD-882 Packaging: Cut Tape (CT) |
auf Bestellung 6720 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
BAP70-04W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 260MW SC-70Power Dissipation (Max): 260 mW Current - Max: 100 mA Part Status: Obsolete Supplier Device Package: SC-70 Voltage - Peak Reverse (Max): 50V Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - 1 Pair Series Connection Package / Case: SC-70, SOT-323 Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC9S08PL4CTG | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOPDigiKey Programmable: Not Verified Number of I/O: 14 Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM Connectivity: LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 EEPROM Size: 128 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 4KB (4K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
auf Bestellung 3957 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MC9S08PL60CQH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFPDigiKey Programmable: Not Verified Number of I/O: 57 Part Status: Active Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM Connectivity: LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 60KB (60K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC9S08PL8CTG | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOPDigiKey Programmable: Not Verified Number of I/O: 14 Part Status: Active Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM Connectivity: LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 6x10b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 8KB (8K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC9S08PL16CTG | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOPOperating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 16KB (16K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 14 Part Status: Active Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM Connectivity: LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 6x10b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC9S08PL16CTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOPNumber of I/O: 18 Part Status: Active Supplier Device Package: 20-TSSOP Peripherals: LVD, POR, PWM Connectivity: LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 10x10b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 16KB (16K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tube DigiKey Programmable: Not Verified |
auf Bestellung 868 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
SPC5775BDK3MME2 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416MAPBGANumber of I/O: 293 Part Status: Active Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 40x12b eQADCx2 Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 220MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 112 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MPC5775BE-416DS | NXP USA Inc. |
Description: MPC5775E EVAL BRD ADAPTERPackaging: Bulk Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B, MPC5775E Part Status: Active Mounting Type: Socket |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
| TEA19051BABTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| TEA19051BACTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
|
TEA19051BAFTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
FRDM33771BSPIEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33771Packaging: Bulk Function: Battery Cell Controller Type: Power Management Contents: Board(s) Utilized IC / Part: MC33771 Supplied Contents: Board(s) Primary Attributes: 14-Channel Secondary Attributes: On-Board LEDs Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
| K32W032S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK WLCSP DigiKey Programmable: Not Verified Number of I/O: 104 Supplier Device Package: 191-WLCSP (5.97x5.85) Peripherals: Bluetooth, DMA, PWM, WDT Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D - 12bit; D/A - 12bit Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C RAM Size: 384K x 8 Program Memory Size: 1.25MB (1.25M x 8) Speed: 72MHz Mounting Type: Surface Mount Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| SAF7730HV/N231D,51 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFPPart Status: Obsolete Supplier Device Package: 144-HLQFP (20x20) Clock Rate: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Type: Car Signal Processor Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| SAF7730HV/N231D,55 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
|
SPC5744PK1MLQ5 | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
SPC5744PK1MLQ5R | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1550A7EP | NXP USA Inc. |
Description: PF1550Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1550A7EPR2 | NXP USA Inc. |
Description: PF1550Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC32PF1510A1EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC32PF1510A3EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1510A4EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1510A6EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
FRDM-PF1550EVM | NXP USA Inc. |
Description: EVAL BOARD FOR PF1550Packaging: Bulk Function: Battery Charger Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: PF1550 Supplied Contents: Board(s), Cable(s) Secondary Attributes: On-Board Test Points Embedded: Yes, MCU, 32-Bit |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MC32PF1510A1EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
auf Bestellung 4682 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MC32PF1510A3EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
auf Bestellung 3320 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MC34PF1510A4EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1510A6EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
auf Bestellung 14500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MC32PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
auf Bestellung 4759 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MC32PF1550A3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MC34PF1550A4EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
|
MWCT1003AVLHR | NXP USA Inc. |
Description: 5W MULTI-COIL AUTO 5V PREMIUMSupplier Device Package: 64-LQFP (10x10) Applications: Wireless Power Transmitter Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MKW41Z512VHT4R | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 64VFLGAPackaging: Cut Tape (CT) Package / Case: 64-VFLGA Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.36GHz ~ 2.48GHz Memory Size: 512kB Flash, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Bluetooth v4.2 Current - Receiving: 6.76mA Data Rate (Max): 1Mbps Current - Transmitting: 6.08mA Supplier Device Package: 64-VFLGA (7x7) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1624 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
PCT2075GV/N005X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAFeatures: Output Switch, Programmable Limit, Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-TSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
PCT2075GV/P110X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAFeatures: Output Switch, Programmable Limit, Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-TSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
PCT2075GV/N005X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAMounting Type: Surface Mount Output Type: I2C/SMBus Package / Case: SC-74, SOT-457 Features: Output Switch, Programmable Limit, Shutdown Mode Packaging: Cut Tape (CT) Part Status: Last Time Buy Sensing Temperature - Local: -55°C ~ 125°C Accuracy - Highest (Lowest): ±1°C (±2°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Supplier Device Package: 6-TSOP Resolution: 11 b Sensor Type: Digital, Local Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -55°C ~ 125°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
PCT2075GV/P110X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAPart Status: Last Time Buy Sensing Temperature - Local: -55°C ~ 125°C Accuracy - Highest (Lowest): ±1°C (±2°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Supplier Device Package: 6-TSOP Resolution: 11 b Sensor Type: Digital, Local Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Output Type: I2C/SMBus Package / Case: SC-74, SOT-457 Features: Output Switch, Programmable Limit, Shutdown Mode Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MIMXRT1060-EVK | NXP USA Inc. |
Description: I.MX RT1060 EVAL BRDUtilized IC / Part: i.MX RT1060 Core Processor: ARM® Cortex®-M7 Contents: Board(s) Type: MPU Mounting Type: Fixed Packaging: Bulk |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MIMXRT1062DVL6A | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MIMXRT1062CVL5A | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGASupplier Device Package: 196-LFBGA (10x10) Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 1M x 8 Speed: 528MHz Mounting Type: Surface Mount Package / Case: 196-LFBGA Packaging: Tray Number of I/O: 127 Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MIMXRT1051DVJ6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAProgram Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) RAM Size: 512K x 8 Speed: 600MHz Mounting Type: Surface Mount Package / Case: 196-LFBGA Packaging: Tray Number of I/O: 127 Part Status: Active Supplier Device Package: 196-LFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b Core Processor: ARM® Cortex®-M7 DigiKey Programmable: Not Verified |
auf Bestellung 202 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MIMXRT1052CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGADigiKey Programmable: Not Verified Number of I/O: 127 Supplier Device Package: 196-LFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 512K x 8 Speed: 528MHz Mounting Type: Surface Mount Package / Case: 196-LFBGA Packaging: Tray |
auf Bestellung 709 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MIMXRT1052DVJ6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 1016 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
MIMXRT1061DVL6A | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
MIMXRT1061CVL5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 240 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
FS32R372SDK0MMMT | NXP USA Inc. |
Description: IC MCU RADAR S32R LFBGA257DigiKey Programmable: Not Verified Grade: Automotive Part Status: Active Supplier Device Package: 257-LFBGA (14x14) Core Processor: e200z7 Applications: Industrial Radar Program Memory Type: FLASH (1.3MB) Voltage - Supply: 1.19V ~ 1.31V Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1M x 8 Interface: CAN, I2C, LINFlexD, SPI Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tray |
auf Bestellung 753 Stücke: Lieferzeit 10-14 Tag (e) |
|
| TEA1713T/N2,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.96 EUR |
| 10+ | 6.03 EUR |
| BGU8M1X |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.842GHz
Noise Figure: 0.8dB
Current - Supply: 5mA
Gain: 13.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 1.805GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.842GHz
Noise Figure: 0.8dB
Current - Supply: 5mA
Gain: 13.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 1.805GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 20+ | 1.09 EUR |
| 22+ | 0.98 EUR |
| 25+ | 0.88 EUR |
| 100+ | 0.77 EUR |
| 250+ | 0.68 EUR |
| 500+ | 0.6 EUR |
| 1000+ | 0.48 EUR |
| TJA1029T,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.07 EUR |
| 15+ | 1.49 EUR |
| 25+ | 1.34 EUR |
| 100+ | 1.19 EUR |
| 250+ | 1.12 EUR |
| 500+ | 1.08 EUR |
| TEA19162T/2J |
![]() |
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Current - Startup: 800 µA
Part Status: Active
Supplier Device Package: 8-SO
Mode: Discontinuous Conduction (DCM)
Frequency - Switching: 134kHz
Voltage - Supply: 70 ~ 276 VAC
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: IC PFC CTRLR DCM 134KHZ 8SO
Current - Startup: 800 µA
Part Status: Active
Supplier Device Package: 8-SO
Mode: Discontinuous Conduction (DCM)
Frequency - Switching: 134kHz
Voltage - Supply: 70 ~ 276 VAC
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2327 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.95 EUR |
| 10+ | 2.17 EUR |
| 25+ | 1.96 EUR |
| 100+ | 1.74 EUR |
| 250+ | 1.64 EUR |
| 500+ | 1.57 EUR |
| 1000+ | 1.56 EUR |
| BF513,215 |
![]() |
Hersteller: NXP USA Inc.
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MP3V5050GC6T1 |
![]() |
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Description: SENSOR 7.25PSIG 0.13" 2.82V
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| HTMS8001FTB/AF,115 |
![]() |
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4869 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 20+ | 1.05 EUR |
| 29+ | 0.74 EUR |
| 32+ | 0.65 EUR |
| 100+ | 0.57 EUR |
| 250+ | 0.54 EUR |
| 500+ | 0.51 EUR |
| 1000+ | 0.49 EUR |
| 2500+ | 0.46 EUR |
| TEA1738T/N1,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 1371 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.03 EUR |
| 15+ | 1.46 EUR |
| 25+ | 1.32 EUR |
| 100+ | 1.17 EUR |
| 250+ | 1.09 EUR |
| 500+ | 1.05 EUR |
| 1000+ | 1.02 EUR |
| SL2S1512FTBX |
![]() |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Cut Tape (CT)
Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Cut Tape (CT)
auf Bestellung 9695 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 28+ | 0.75 EUR |
| 33+ | 0.65 EUR |
| 34+ | 0.62 EUR |
| 100+ | 0.56 EUR |
| 250+ | 0.54 EUR |
| 500+ | 0.51 EUR |
| 1000+ | 0.49 EUR |
| BAP70AM,115 |
![]() |
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
| BB156,115 |
![]() |
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Capacitance Ratio: 3.9
Voltage - Peak Reverse (Max): 10 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C7.5
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
Description: DIODE VAR CAP 10V 20MA SOD323
Capacitance Ratio: 3.9
Voltage - Peak Reverse (Max): 10 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C7.5
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1731LTS/1,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAP50LX,315 |
![]() |
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
auf Bestellung 6720 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 77+ | 0.27 EUR |
| 112+ | 0.19 EUR |
| 127+ | 0.17 EUR |
| 150+ | 0.14 EUR |
| 250+ | 0.13 EUR |
| 500+ | 0.12 EUR |
| 1000+ | 0.11 EUR |
| 2500+ | 0.11 EUR |
| 5000+ | 0.1 EUR |
| BAP70-04W,115 |
![]() |
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08PL4CTG |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 1.99 EUR |
| 15+ | 1.44 EUR |
| 96+ | 1.15 EUR |
| 192+ | 1.09 EUR |
| 288+ | 1.07 EUR |
| 576+ | 1.02 EUR |
| 1056+ | 1 EUR |
| 2592+ | 0.95 EUR |
| MC9S08PL60CQH |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08PL8CTG |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 2880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08PL16CTG |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
Mindestbestellmenge: 2880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08PL16CTJ |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
auf Bestellung 868 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.8 EUR |
| 10+ | 2.8 EUR |
| 75+ | 2.33 EUR |
| 150+ | 2.23 EUR |
| 300+ | 2.13 EUR |
| 525+ | 2.07 EUR |
| SPC5775BDK3MME2 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Number of I/O: 293
Part Status: Active
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b eQADCx2
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 220MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Number of I/O: 293
Part Status: Active
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b eQADCx2
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 220MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 101.6 EUR |
| 10+ | 83.6 EUR |
| 25+ | 79.11 EUR |
| MPC5775BE-416DS |
![]() |
Hersteller: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1395.92 EUR |
| TEA19051BABTK/1J |
![]() |
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19051BACTK/1J |
![]() |
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19051BAFTK/1J |
![]() |
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDM33771BSPIEVB |
![]() |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 520.85 EUR |
| K32W032S1M2CAVAR |
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 191-WLCSP (5.97x5.85)
Peripherals: Bluetooth, DMA, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D - 12bit; D/A - 12bit
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Program Memory Size: 1.25MB (1.25M x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Description: MCU KINETIS BT5/FSK WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 191-WLCSP (5.97x5.85)
Peripherals: Bluetooth, DMA, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D - 12bit; D/A - 12bit
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Program Memory Size: 1.25MB (1.25M x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7730HV/N231D,51 |
![]() |
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Part Status: Obsolete
Supplier Device Package: 144-HLQFP (20x20)
Clock Rate: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Type: Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC HD RADIO PROCESSOR 144HLQFP
Part Status: Obsolete
Supplier Device Package: 144-HLQFP (20x20)
Clock Rate: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Type: Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7730HV/N231D,55 |
![]() |
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5744PK1MLQ5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5744PK1MLQ5R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A7EP |
![]() |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A7EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1510A1EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1510A3EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1510A4EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1510A6EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5000+ | 5.58 EUR |
| FRDM-PF1550EVM |
![]() |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 543.63 EUR |
| MC32PF1510A1EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4682 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.25 EUR |
| 10+ | 6.26 EUR |
| 25+ | 5.75 EUR |
| 100+ | 5.2 EUR |
| 250+ | 4.94 EUR |
| 500+ | 4.78 EUR |
| 1000+ | 4.65 EUR |
| 2500+ | 4.52 EUR |
| MC32PF1510A3EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3320 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.36 EUR |
| 10+ | 7.91 EUR |
| 25+ | 7.31 EUR |
| 100+ | 6.64 EUR |
| 250+ | 6.37 EUR |
| MC34PF1510A4EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1510A6EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.95 EUR |
| 10+ | 7.6 EUR |
| 25+ | 7.01 EUR |
| 100+ | 6.37 EUR |
| 250+ | 6.1 EUR |
| MC32PF1550A1EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.72 EUR |
| 10+ | 9.63 EUR |
| 25+ | 9.1 EUR |
| 100+ | 7.89 EUR |
| 250+ | 7.49 EUR |
| 500+ | 6.72 EUR |
| 1000+ | 5.66 EUR |
| 2500+ | 5.38 EUR |
| MC32PF1550A3EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A1EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A4EPR2 |
![]() |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MWCT1003AVLHR |
![]() |
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Supplier Device Package: 64-LQFP (10x10)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Supplier Device Package: 64-LQFP (10x10)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKW41Z512VHT4R |
![]() |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1624 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.07 EUR |
| 10+ | 18.3 EUR |
| 25+ | 17.34 EUR |
| 100+ | 16.02 EUR |
| 250+ | 15.22 EUR |
| 500+ | 14.66 EUR |
| 1000+ | 14.14 EUR |
| PCT2075GV/N005X |
![]() |
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCT2075GV/P110X |
![]() |
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCT2075GV/N005X |
![]() |
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Description: DIGITAL TEMP SENSOR & THERMAL WA
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCT2075GV/P110X |
![]() |
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Description: DIGITAL TEMP SENSOR & THERMAL WA
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1060-EVK |
![]() |
Hersteller: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD
Utilized IC / Part: i.MX RT1060
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: I.MX RT1060 EVAL BRD
Utilized IC / Part: i.MX RT1060
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 227.29 EUR |
| MIMXRT1062DVL6A |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1062CVL5A |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1051DVJ6B |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 512K x 8
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Active
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 512K x 8
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Active
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.16 EUR |
| 10+ | 11.2 EUR |
| MIMXRT1052CVJ5B |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 512K x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 512K x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
auf Bestellung 709 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.04 EUR |
| 10+ | 21.32 EUR |
| 25+ | 19.9 EUR |
| 189+ | 17.79 EUR |
| 378+ | 17.31 EUR |
| 567+ | 17.06 EUR |
| MIMXRT1052DVJ6B |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1016 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.44 EUR |
| 10+ | 15.99 EUR |
| 25+ | 14.88 EUR |
| 189+ | 13.23 EUR |
| 378+ | 12.85 EUR |
| 567+ | 12.66 EUR |
| MIMXRT1061DVL6A |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1061CVL5A |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 240 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FS32R372SDK0MMMT |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU RADAR S32R LFBGA257
DigiKey Programmable: Not Verified
Grade: Automotive
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Description: IC MCU RADAR S32R LFBGA257
DigiKey Programmable: Not Verified
Grade: Automotive
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
auf Bestellung 753 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 107.72 EUR |
| 10+ | 87.38 EUR |
| 80+ | 75.87 EUR |





























