Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34260) > Seite 315 nach 571
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MC9S08PA4AVSC | NXP USA Inc. |
 Description: IC MCU 8BIT 4KB FLASH 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified |
auf Bestellung 75 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9S08PA4AVTJ | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF0UL2101DUD2A | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die |
Produkt ist nicht verfügbar |
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| MF1P2121DA4/02BJ | NXP USA Inc. | Description: CLHW |
Produkt ist nicht verfügbar |
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| MF1P2121DA6/02BJ | NXP USA Inc. | Description: CLHW |
Produkt ist nicht verfügbar |
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| MF1P2121DUD/02BV | NXP USA Inc. | Description: CLHW |
Produkt ist nicht verfügbar |
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| MF1P2121DUF/02BV | NXP USA Inc. | Description: CLHW |
Produkt ist nicht verfügbar |
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| MF1S5001XDUD2/V1A | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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| MF1S5031XDUD2/V1A | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| MHT2012NT1 | NXP USA Inc. |
Description: RF LDMOS POWER AMPLIFIER FOR CON Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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MIMXRT1020-EVK | NXP USA Inc. |
Description: I.MX RT1020 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT1020 Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 21-28 Tag (e) |
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| MMA2631NKGCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 312G PCM 16QFN Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: PCM Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±312g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 1.64 Part Status: Active |
Produkt ist nicht verfügbar |
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| MMA5124LCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 240G PCM/SPI 16QFN |
Produkt ist nicht verfügbar |
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| MMA5148LCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 480G PCM/SPI 16QFN |
Produkt ist nicht verfügbar |
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| MMA5248LCWR2 | NXP USA Inc. |
Description: PSI5 ACCELEROMETER QFN 16 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MMA6519KCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 80G SPI 16QFN Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±80g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 24 |
Produkt ist nicht verfügbar |
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MMA6525KCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 105G SPI 16QFN |
Produkt ist nicht verfügbar |
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| MMA6555KCWR2 | NXP USA Inc. |
Description: ACCELEROMETER 105G SPI 16QFN |
Produkt ist nicht verfügbar |
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| MMA6813KCWR2 | NXP USA Inc. |
Description: XTRINSIC 10 BITS SPI ACCELEROMET Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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MRF1K50H-TF5 | NXP USA Inc. |
Description: MRF1K50H REF BRD 13.56MHZ 1500W |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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MRF24301HR5 | NXP USA Inc. | Description: RF MOSFET LDMOS NI780H |
Produkt ist nicht verfügbar |
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MRF300AN | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO247 Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Frequency: 27MHz ~ 250MHz Power - Output: 300W Gain: 28dB Technology: LDMOS Supplier Device Package: TO-247 Part Status: Active Voltage - Test: 50 V |
auf Bestellung 147 Stücke: Lieferzeit 21-28 Tag (e) |
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MRF300BN | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO247 Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Frequency: 27MHz ~ 250MHz Power - Output: 300W Gain: 18.7dB Technology: LDMOS Supplier Device Package: TO-247 Part Status: Active Voltage - Test: 50 V |
auf Bestellung 58 Stücke: Lieferzeit 21-28 Tag (e) |
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| MWCT1014SFVLH | NXP USA Inc. |
Description: WCT1014SF 64 LQFP |
Produkt ist nicht verfügbar |
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| NCF2957VHN4/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF29A7EHN3/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
Produkt ist nicht verfügbar |
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| NCF29A7EHN4/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
Produkt ist nicht verfügbar |
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| NCF29A7VHN3/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
Produkt ist nicht verfügbar |
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| NT4H1321G0DUD/06BV | NXP USA Inc. |
Description: IC RFID READER/TRAN 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| NTB0101GS1XL | NXP USA Inc. |
Description: IC PWR 1BIT BIDIRECTION 6X2SON |
Produkt ist nicht verfügbar |
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| NX20P3483UKZ | NXP USA Inc. | Description: IC PWR SWITCH 1:1 42WLCSP |
Produkt ist nicht verfügbar |
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| NX30P6093UKAZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP Packaging: Tape & Reel (TR) Features: Slew Rate Controlled Package / Case: 20-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: I2C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Rds On (Typ): 8.95mOhm Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-WLCSP (2.16x1.7) Fault Protection: Over Temperature, Over Voltage, UVLO Part Status: Active |
Produkt ist nicht verfügbar |
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| NXQ1TXH5DB1402UL | NXP USA Inc. |
Description: NXQ1TXH5 DEMOBOARD 1401 Packaging: Bulk Function: Wireless Power Supply/Charging Type: Power Management Utilized IC / Part: NXQ1TXH5 Supplied Contents: Board(s) Primary Attributes: Transmitter |
Produkt ist nicht verfügbar |
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PCF7900NHN/C0K/UZ | NXP USA Inc. |
Description: IC TRANSMITTER UHF 16HVQFN Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 21-28 Tag (e) |
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PCF7900VHN/C0L/UZ | NXP USA Inc. |
Description: IC TRANSMITTER UHF 16HVQFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 16-HVQFN (3x3) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| QN9083DUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA Packaging: Tape & Reel (TR) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 32MHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Data Rate (Max): 16Mbps Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART, USART, USB Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVL12F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVL12F0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SL2ICS5301EW/V7:00 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SP03245-01UL | NXP USA Inc. |
Description: SP03245-01 Packaging: Bulk Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| SP05127-02UL | NXP USA Inc. |
Description: SP05127-02 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1936x Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| SP05145-02UL | NXP USA Inc. | Description: SP05145-02 |
Produkt ist nicht verfügbar |
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SP5746BBK1AMMH6R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
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SP5746BTK1AVMH6R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
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SP5746CSK1AVKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SP5747CFK0AVMJ6R | NXP USA Inc. | Description: IC MCU 32BIT 4MB FLASH 256MAPBGA |
Produkt ist nicht verfügbar |
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SPC5777CDK3MME4 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA Packaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 197 Stücke: Lieferzeit 21-28 Tag (e) |
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| TEA1716DB1255UL | NXP USA Inc. |
Description: TEA1716 90W / 19.5V RESONANT LLC Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1716 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1721ADB1102UL | NXP USA Inc. |
Description: TEA1721 CUBIC CHARGER 5W DEMO BO Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1721 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1733T/DB/65W,59 | NXP USA Inc. |
Description: TEA1733T 65W 19.5V NOTEBOOK ADAP Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1733 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1738DB01/65W/SL | NXP USA Inc. |
Description: TEA1738 DEMOBOARD 01 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1738 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| TEA1751T/1791/DB/9 | NXP USA Inc. |
Description: TEA1751 DEMOBOARD Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1751 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1752T/1791/DB/9 | NXP USA Inc. |
Description: TEA1752 DEMOBOARD Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1752 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| TEA1755DB1100UL | NXP USA Inc. |
Description: TEA1755 90W / 19.5V QR / DCM FLY Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1755 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1792DB1074,598 | NXP USA Inc. |
Description: TEA1792TS GREENCHIP SR CONTROLLE Packaging: Bulk Type: Power Management Utilized IC / Part: TEA1792 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1833DB1361UL | NXP USA Inc. |
Description: 45W / 19.5V ULTRA BOOK ADAPTER Packaging: Bulk Voltage - Output: 19.5V Voltage - Input: 90 ~ 264 VAC Regulator Topology: Flyback Board Type: Fully Populated Utilized IC / Part: TEA1833 Supplied Contents: Board(s) Main Purpose: AC/DC, Primary Side Outputs and Type: 1, Non-Isolated Part Status: Active Power - Output: 45 W |
Produkt ist nicht verfügbar |
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| TEA1836DB1200UL | NXP USA Inc. |
Description: TEA1836 DEMOBOARD 1200 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1892, TEA18362 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| TEA1892DB1226UL | NXP USA Inc. |
Description: TEA1892TS GREENCHIP SR CONTROLLE Packaging: Bulk Type: Power Management Utilized IC / Part: TEA1892 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA1916DB1262UL | NXP USA Inc. |
Description: TEA1916 DEMOBOARD 1262 Packaging: Bulk Voltage - Output: 12V Voltage - Input: 90 ~ 264 VAC Current - Output: 20A Regulator Topology: Flyback Board Type: Fully Populated Utilized IC / Part: TEA1916 Supplied Contents: Board(s) Main Purpose: AC/DC, Primary Side and PFC Outputs and Type: 1, Non-Isolated |
auf Bestellung 4 Stücke: Lieferzeit 21-28 Tag (e) |
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| TEA1936XDB1475UL | NXP USA Inc. |
Description: TEA1936X DEMOBOARD 1475 |
Produkt ist nicht verfügbar |
| MC9S08PA4AVSC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 4.08 EUR |
| 10+ | 3.17 EUR |
| MC9S08PA4AVTJ |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF0UL2101DUD2A |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
| MF1S5001XDUD2/V1A |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Not For New Designs
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Not For New Designs
Produkt ist nicht verfügbar
| MF1S5031XDUD2/V1A |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| MHT2012NT1 |
Hersteller: NXP USA Inc.
Description: RF LDMOS POWER AMPLIFIER FOR CON
Packaging: Tape & Reel (TR)
Part Status: Active
Description: RF LDMOS POWER AMPLIFIER FOR CON
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| MIMXRT1020-EVK |
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Hersteller: NXP USA Inc.
Description: I.MX RT1020 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1020
Part Status: Active
Description: I.MX RT1020 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1020
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 171.31 EUR |
| MMA2631NKGCWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 312G PCM 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Active
Description: ACCELEROMETER 312G PCM 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Active
Produkt ist nicht verfügbar
| MMA5124LCWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Produkt ist nicht verfügbar
| MMA5148LCWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 480G PCM/SPI 16QFN
Description: ACCELEROMETER 480G PCM/SPI 16QFN
Produkt ist nicht verfügbar
| MMA5248LCWR2 |
Produkt ist nicht verfügbar
| MMA6519KCWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Produkt ist nicht verfügbar
| MMA6525KCWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Description: ACCELEROMETER 105G SPI 16QFN
Produkt ist nicht verfügbar
| MMA6555KCWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Description: ACCELEROMETER 105G SPI 16QFN
Produkt ist nicht verfügbar
| MMA6813KCWR2 |
Hersteller: NXP USA Inc.
Description: XTRINSIC 10 BITS SPI ACCELEROMET
Packaging: Tape & Reel (TR)
Part Status: Active
Description: XTRINSIC 10 BITS SPI ACCELEROMET
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| MRF1K50H-TF5 |
|
Hersteller: NXP USA Inc.
Description: MRF1K50H REF BRD 13.56MHZ 1500W
Description: MRF1K50H REF BRD 13.56MHZ 1500W
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| MRF300AN |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 28dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 28dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
auf Bestellung 147 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 127.43 EUR |
| 10+ | 118.9 EUR |
| 30+ | 113.92 EUR |
| 120+ | 103.24 EUR |
| MRF300BN |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
auf Bestellung 58 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 126.1 EUR |
| 10+ | 117.63 EUR |
| 30+ | 112.7 EUR |
| NCF2957VHN4/0200IY |
Produkt ist nicht verfügbar
| NT4H1321G0DUD/06BV |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER/TRAN 13.56MHZ DIE
Description: IC RFID READER/TRAN 13.56MHZ DIE
Produkt ist nicht verfügbar
| NTB0101GS1XL |
|
Hersteller: NXP USA Inc.
Description: IC PWR 1BIT BIDIRECTION 6X2SON
Description: IC PWR 1BIT BIDIRECTION 6X2SON
Produkt ist nicht verfügbar
| NX20P3483UKZ |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 1:1 42WLCSP
Description: IC PWR SWITCH 1:1 42WLCSP
Produkt ist nicht verfügbar
| NX30P6093UKAZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Part Status: Active
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Part Status: Active
Produkt ist nicht verfügbar
| NXQ1TXH5DB1402UL |
Hersteller: NXP USA Inc.
Description: NXQ1TXH5 DEMOBOARD 1401
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Description: NXQ1TXH5 DEMOBOARD 1401
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
| PCF7900NHN/C0K/UZ |
|
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 3.22 EUR |
| PCF7900VHN/C0L/UZ |
|
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| QN9083DUKZ |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVL12F0MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVL12F0MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SL2ICS5301EW/V7:00 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SP03245-01UL |
Hersteller: NXP USA Inc.
Description: SP03245-01
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Description: SP03245-01
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| SP05127-02UL |
Hersteller: NXP USA Inc.
Description: SP05127-02
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Part Status: Active
Description: SP05127-02
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| SP5746BBK1AMMH6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
| SP5746BTK1AVMH6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
| SP5746CSK1AVKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SP5747CFK0AVMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 256MAPBGA
Description: IC MCU 32BIT 4MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
| SPC5777CDK3MME4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 197 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 163.31 EUR |
| 10+ | 133.39 EUR |
| TEA1716DB1255UL |
|
Hersteller: NXP USA Inc.
Description: TEA1716 90W / 19.5V RESONANT LLC
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1716
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1716 90W / 19.5V RESONANT LLC
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1716
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1721ADB1102UL |
|
Hersteller: NXP USA Inc.
Description: TEA1721 CUBIC CHARGER 5W DEMO BO
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1721 CUBIC CHARGER 5W DEMO BO
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1733T/DB/65W,59 |
Hersteller: NXP USA Inc.
Description: TEA1733T 65W 19.5V NOTEBOOK ADAP
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1733
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1733T 65W 19.5V NOTEBOOK ADAP
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1733
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1738DB01/65W/SL |
Hersteller: NXP USA Inc.
Description: TEA1738 DEMOBOARD 01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1738
Supplied Contents: Board(s)
Description: TEA1738 DEMOBOARD 01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1738
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| TEA1751T/1791/DB/9 |
|
Hersteller: NXP USA Inc.
Description: TEA1751 DEMOBOARD
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1751
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1751 DEMOBOARD
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1751
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1752T/1791/DB/9 |
|
Hersteller: NXP USA Inc.
Description: TEA1752 DEMOBOARD
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1752
Supplied Contents: Board(s)
Description: TEA1752 DEMOBOARD
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1752
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| TEA1755DB1100UL |
|
Hersteller: NXP USA Inc.
Description: TEA1755 90W / 19.5V QR / DCM FLY
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1755
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1755 90W / 19.5V QR / DCM FLY
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1755
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1792DB1074,598 |
|
Hersteller: NXP USA Inc.
Description: TEA1792TS GREENCHIP SR CONTROLLE
Packaging: Bulk
Type: Power Management
Utilized IC / Part: TEA1792
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1792TS GREENCHIP SR CONTROLLE
Packaging: Bulk
Type: Power Management
Utilized IC / Part: TEA1792
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1833DB1361UL |
|
Hersteller: NXP USA Inc.
Description: 45W / 19.5V ULTRA BOOK ADAPTER
Packaging: Bulk
Voltage - Output: 19.5V
Voltage - Input: 90 ~ 264 VAC
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1833
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1, Non-Isolated
Part Status: Active
Power - Output: 45 W
Description: 45W / 19.5V ULTRA BOOK ADAPTER
Packaging: Bulk
Voltage - Output: 19.5V
Voltage - Input: 90 ~ 264 VAC
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1833
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1, Non-Isolated
Part Status: Active
Power - Output: 45 W
Produkt ist nicht verfügbar
| TEA1836DB1200UL |
|
Hersteller: NXP USA Inc.
Description: TEA1836 DEMOBOARD 1200
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1892, TEA18362
Supplied Contents: Board(s)
Description: TEA1836 DEMOBOARD 1200
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1892, TEA18362
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| TEA1892DB1226UL |
|
Hersteller: NXP USA Inc.
Description: TEA1892TS GREENCHIP SR CONTROLLE
Packaging: Bulk
Type: Power Management
Utilized IC / Part: TEA1892
Supplied Contents: Board(s)
Part Status: Active
Description: TEA1892TS GREENCHIP SR CONTROLLE
Packaging: Bulk
Type: Power Management
Utilized IC / Part: TEA1892
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| TEA1916DB1262UL |
|
Hersteller: NXP USA Inc.
Description: TEA1916 DEMOBOARD 1262
Packaging: Bulk
Voltage - Output: 12V
Voltage - Input: 90 ~ 264 VAC
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1916
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side and PFC
Outputs and Type: 1, Non-Isolated
Description: TEA1916 DEMOBOARD 1262
Packaging: Bulk
Voltage - Output: 12V
Voltage - Input: 90 ~ 264 VAC
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1916
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side and PFC
Outputs and Type: 1, Non-Isolated
auf Bestellung 4 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1219.06 EUR |
| TEA1936XDB1475UL |
|
Hersteller: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1475
Description: TEA1936X DEMOBOARD 1475
Produkt ist nicht verfügbar