Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36839) > Seite 315 nach 614
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LX2160A-RDB | NXP USA Inc. |
Description: LX2160A EVAL BRDPart Status: Active Utilized IC / Part: LX2160A Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A72 Contents: Board(s), Cable(s), Accessories Type: MPU Mounting Type: Fixed Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LX2RDBKIT1-10-40 | NXP USA Inc. |
Description: RDB KIT TXRX CABLES 10GE & 40 GEPackaging: Bulk For Use With/Related Products: LX2160A Accessory Type: Accessory Kit Part Status: Active Utilized IC / Part: LX2160A |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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LX2RDBKIT2-25G | NXP USA Inc. |
Description: RDB KIT TXRX CABLES FOR 25GUtilized IC / Part: LX2160A Part Status: Active Accessory Type: Accessory Kit For Use With/Related Products: LX2160A Packaging: Bulk |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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MC10XS6200BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH 32SOICFeatures: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 9A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC10XS6225BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH 32SOICFeatures: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A, 9A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC10XS6325BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH 32SOICFeatures: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A, 9A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC17XS6500CEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Internal PWM Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC22XS4200CEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Internal PWM, Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 22mOhm Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 4.2A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC50XS4200CEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 50mOhm Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 1.65A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC17XS6500CEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Internal PWM Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC25XS6300BEK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32SOICFeatures: Status Flag Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LS1088ARDB-PB | NXP USA Inc. |
Description: LS1088A EVAL BRDPackaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: LS1088A |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MD6CVAHZAB | NXP USA Inc. |
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MD6DVAJZAB | NXP USA Inc. |
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
auf Bestellung 162 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MQ5CVAHZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGAPart Status: Active Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Graphics Acceleration: Yes RAM Controllers: DDR3L, DDR4, LPDDR4 Co-Processors/DSP: ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 3.0 (2) Ethernet: GbE Supplier Device Package: 621-FCPBGA (17x17) Core Processor: ARM® Cortex®-A53 Operating Temperature: -40°C ~ 105°C (TJ) Speed: 1.3GHz Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Packaging: Tray Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MQ5DVAJZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
auf Bestellung 504 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MQ6CVAHZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
auf Bestellung 129 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MQ6DVAJZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
auf Bestellung 370 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F82646VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFPPart Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (32K x 16) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 48-LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Packaging: Tray |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F82643VLC | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F82623VLC | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFPOscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (16K x 16) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 6x12b Core Processor: 56800EX Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NTBMS-FSNXP | NXP USA Inc. |
Description: EVAL BD FS4503C MC33772B S32K144 Packaging: Bulk Function: Battery Monitor, Car Type: Power Management Utilized IC / Part: FS4503C, MC33772B, S32K144 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active Contents: Board(s) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Z0DVM09AB | NXP USA Inc. |
Description: IC MPU I.MX6 900MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 289-MAPBGA (14x14) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB |
auf Bestellung 4101 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K116LAT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 427 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K116LAT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K118LAT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
auf Bestellung 1157 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K118LAT0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 1125 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K118EVB-Q064 | NXP USA Inc. |
Description: S32K118 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: S32K118 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32K116EVB-Q048 | NXP USA Inc. |
Description: S32K116 EVAL BRD |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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IMXAI2ETH-ATH | NXP USA Inc. |
Description: ENET 1GBPS PHY (STD ENET PHY)Packaging: Bulk For Use With/Related Products: i.MX 6 Accessory Type: Interface Board Utilized IC / Part: i.MX 6 Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX8QXP-CPU | NXP USA Inc. |
Description: I.MX 8 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Board Type: Evaluation Platform Utilized IC / Part: i.MX 8 Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX8-8X-BB | NXP USA Inc. |
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAXPackaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board Utilized IC / Part: i.MX 8 Part Status: Active |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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MX8XMIPI4CAM2 | NXP USA Inc. |
Description: 4 CAMERA BOARD MINISAS OV10635Packaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board Utilized IC / Part: i.MX 8 |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K146HAT0MMHT | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100MAPBGAPackaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF101AN | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO220-3Packaging: Tube Package / Case: TO-220-3 Current Rating (Amps): 10µA Frequency: 1.8MHz ~ 250MHz Power - Output: 115W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-220-3 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 358 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF101BN | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO220-3Packaging: Tube Package / Case: TO-220-3 Current Rating (Amps): 10µA Frequency: 1.8MHz ~ 250MHz Power - Output: 115W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-220-3 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF101AN-13MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 13.56MHZ 130WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 13.56MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF101AN-27MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 27MHZ 125WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 27MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF101AN-40MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 40.68MHZ 120WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 40.68MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF101AN-50MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 50MHZ 119WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 50MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF101AN-81MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 81.36MHZ 130WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 81.36MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF101AN-VHF | NXP USA Inc. |
Description: MRF101AN REF BRD 174MHZ 100WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 136MHz ~ 174MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF101AN-230MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 230MHZ 115WPackaging: Bulk For Use With/Related Products: MRF101AN Frequency: 230MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QL8CTJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20TSSOPPackaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QL8CTG | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QL4CTJ | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP |
auf Bestellung 375 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QL4CTG | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33PF8100A0ES | NXP USA Inc. |
Description: IC POWER MANAGEMENTPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33PF8100CCES | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QXPPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 123 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33PF8200A0ES | NXP USA Inc. |
Description: IC POWER MANAGEMENTPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 304 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33PF8101A0ES | NXP USA Inc. |
Description: IC POWER MANAGEMENTPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8 Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 467 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX280CVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAAdditional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad Graphics Acceleration: No RAM Controllers: LVDDR, LVDDR2, DDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX280DVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAAdditional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad Graphics Acceleration: No RAM Controllers: LVDDR, LVDDR2, DDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -20°C ~ 70°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX281AVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX283CVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX283DVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX286DVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SAF1508BET/V1,118 | NXP USA Inc. |
Description: IC RF TXRX USB 2.0 ULPI 36TFBGAPackaging: Tape & Reel (TR) Package / Case: 36-TFBGA Mounting Type: Surface Mount Type: TxRx Only Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 4.5V Supplier Device Package: 36-TFBGA (3.5x3.5) Serial Interfaces: UART, USB DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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TDF8546JV/N2ZU | NXP USA Inc. |
Description: IC AUDIO AMP AB DBS27PPackaging: Tube Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Active |
auf Bestellung 423 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8546AJV/N1ZU | NXP USA Inc. |
Description: IC AUDIO AMP AB DBS27P Packaging: Tube Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 456 Stücke Im Einkaufswagen Stück im Wert von UAH |
| LX2160A-RDB |
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Hersteller: NXP USA Inc.
Description: LX2160A EVAL BRD
Part Status: Active
Utilized IC / Part: LX2160A
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s), Cable(s), Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: LX2160A EVAL BRD
Part Status: Active
Utilized IC / Part: LX2160A
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s), Cable(s), Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LX2RDBKIT1-10-40 |
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Hersteller: NXP USA Inc.
Description: RDB KIT TXRX CABLES 10GE & 40 GE
Packaging: Bulk
For Use With/Related Products: LX2160A
Accessory Type: Accessory Kit
Part Status: Active
Utilized IC / Part: LX2160A
Description: RDB KIT TXRX CABLES 10GE & 40 GE
Packaging: Bulk
For Use With/Related Products: LX2160A
Accessory Type: Accessory Kit
Part Status: Active
Utilized IC / Part: LX2160A
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 365.41 EUR |
| LX2RDBKIT2-25G |
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Hersteller: NXP USA Inc.
Description: RDB KIT TXRX CABLES FOR 25G
Utilized IC / Part: LX2160A
Part Status: Active
Accessory Type: Accessory Kit
For Use With/Related Products: LX2160A
Packaging: Bulk
Description: RDB KIT TXRX CABLES FOR 25G
Utilized IC / Part: LX2160A
Part Status: Active
Accessory Type: Accessory Kit
For Use With/Related Products: LX2160A
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 711.87 EUR |
| MC10XS6200BEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC10XS6225BEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 8.33 EUR |
| MC10XS6325BEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 8.48 EUR |
| MC17XS6500CEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC22XS4200CEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC50XS4200CEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC17XS6500CEK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC25XS6300BEK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS1088ARDB-PB |
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Hersteller: NXP USA Inc.
Description: LS1088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1088A
Description: LS1088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1088A
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4765.15 EUR |
| MIMX8MD6CVAHZAB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 160.35 EUR |
| 10+ | 133.6 EUR |
| 90+ | 120.04 EUR |
| MIMX8MD6DVAJZAB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 144.32 EUR |
| 10+ | 119.89 EUR |
| 90+ | 107.5 EUR |
| MIMX8MQ5CVAHZAB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 160.75 EUR |
| MIMX8MQ5DVAJZAB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 504 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 149.8 EUR |
| 10+ | 124.43 EUR |
| 90+ | 111.57 EUR |
| MIMX8MQ6CVAHZAB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 163.51 EUR |
| 10+ | 136.37 EUR |
| 90+ | 122.63 EUR |
| MIMX8MQ6DVAJZAB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 147.85 EUR |
| 10+ | 122.99 EUR |
| 90+ | 110.37 EUR |
| MC56F82646VLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Packaging: Tray
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.94 EUR |
| 10+ | 9.15 EUR |
| 25+ | 8.46 EUR |
| 100+ | 7.7 EUR |
| MC56F82643VLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F82623VLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NTBMS-FSNXP |
Hersteller: NXP USA Inc.
Description: EVAL BD FS4503C MC33772B S32K144
Packaging: Bulk
Function: Battery Monitor, Car
Type: Power Management
Utilized IC / Part: FS4503C, MC33772B, S32K144
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Description: EVAL BD FS4503C MC33772B S32K144
Packaging: Bulk
Function: Battery Monitor, Car
Type: Power Management
Utilized IC / Part: FS4503C, MC33772B, S32K144
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1960.86 EUR |
| MCIMX6Z0DVM09AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
auf Bestellung 4101 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.65 EUR |
| 10+ | 18.59 EUR |
| 25+ | 17.33 EUR |
| 152+ | 15.61 EUR |
| 304+ | 15.15 EUR |
| 608+ | 14.78 EUR |
| 1064+ | 14.52 EUR |
| FS32K116LAT0MFMT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.86 EUR |
| 10+ | 8.32 EUR |
| 50+ | 7.29 EUR |
| 100+ | 6.97 EUR |
| FS32K116LAT0MLFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.85 EUR |
| 10+ | 12.45 EUR |
| FS32K118LAT0MLFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 1157 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.86 EUR |
| 10+ | 8.32 EUR |
| 25+ | 7.69 EUR |
| 100+ | 6.99 EUR |
| 250+ | 6.65 EUR |
| 500+ | 6.45 EUR |
| 1000+ | 6.28 EUR |
| FS32K118LAT0MLHT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1125 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.43 EUR |
| 10+ | 11.96 EUR |
| 25+ | 11.09 EUR |
| 100+ | 10.14 EUR |
| 250+ | 9.69 EUR |
| 800+ | 9.26 EUR |
| S32K118EVB-Q064 |
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Hersteller: NXP USA Inc.
Description: S32K118 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Description: S32K118 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K116EVB-Q048 |
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Hersteller: NXP USA Inc.
Description: S32K116 EVAL BRD
Description: S32K116 EVAL BRD
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| IMXAI2ETH-ATH |
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Hersteller: NXP USA Inc.
Description: ENET 1GBPS PHY (STD ENET PHY)
Packaging: Bulk
For Use With/Related Products: i.MX 6
Accessory Type: Interface Board
Utilized IC / Part: i.MX 6
Part Status: Active
Description: ENET 1GBPS PHY (STD ENET PHY)
Packaging: Bulk
For Use With/Related Products: i.MX 6
Accessory Type: Interface Board
Utilized IC / Part: i.MX 6
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 424.58 EUR |
| MCIMX8QXP-CPU |
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Hersteller: NXP USA Inc.
Description: I.MX 8 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Part Status: Active
Description: I.MX 8 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 2666.53 EUR |
| MCIMX8-8X-BB |
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Hersteller: NXP USA Inc.
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAX
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Part Status: Active
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAX
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Part Status: Active
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1315.75 EUR |
| MX8XMIPI4CAM2 |
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Hersteller: NXP USA Inc.
Description: 4 CAMERA BOARD MINISAS OV10635
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Description: 4 CAMERA BOARD MINISAS OV10635
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 549.72 EUR |
| FS32K146HAT0MMHT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MRF101AN |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 85.29 EUR |
| 10+ | 69.66 EUR |
| 50+ | 63.42 EUR |
| 100+ | 61.48 EUR |
| 250+ | 59.44 EUR |
| MRF101BN |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 74.96 EUR |
| 10+ | 60.99 EUR |
| 50+ | 55.39 EUR |
| 100+ | 53.67 EUR |
| MRF101AN-13MHZ |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 13.56MHZ 130W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 13.56MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 13.56MHZ 130W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 13.56MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF101AN-27MHZ |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 27MHZ 125W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 27MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 27MHZ 125W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 27MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 589.36 EUR |
| MRF101AN-40MHZ |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 40.68MHZ 120W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 40.68MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 40.68MHZ 120W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 40.68MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF101AN-50MHZ |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 50MHZ 119W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 50MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 50MHZ 119W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 50MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF101AN-81MHZ |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 81.36MHZ 130W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 81.36MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 81.36MHZ 130W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 81.36MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF101AN-VHF |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 174MHZ 100W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 136MHz ~ 174MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 174MHZ 100W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 136MHz ~ 174MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF101AN-230MHZ |
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Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 230MHZ 115W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 230MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 230MHZ 115W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 230MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1657.25 EUR |
| MC9S08QL8CTJ |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.08 EUR |
| 10+ | 2.26 EUR |
| 75+ | 1.87 EUR |
| MC9S08QL8CTG |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.17 EUR |
| 10+ | 2.32 EUR |
| 96+ | 1.88 EUR |
| 192+ | 1.8 EUR |
| 288+ | 1.75 EUR |
| MC9S08QL4CTJ |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.97 EUR |
| 10+ | 3.11 EUR |
| 100+ | 2.5 EUR |
| MC9S08QL4CTG |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33PF8100A0ES |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.31 EUR |
| 10+ | 15.08 EUR |
| 25+ | 14.02 EUR |
| 100+ | 12.85 EUR |
| MC33PF8100CCES |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.68 EUR |
| 10+ | 16.99 EUR |
| 25+ | 15.83 EUR |
| 100+ | 14.54 EUR |
| MC33PF8200A0ES |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 304 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.61 EUR |
| 10+ | 19.35 EUR |
| 25+ | 18.04 EUR |
| 100+ | 16.6 EUR |
| 260+ | 15.89 EUR |
| MC33PF8101A0ES |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 467 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.61 EUR |
| 10+ | 12.92 EUR |
| 25+ | 12 EUR |
| 100+ | 10.98 EUR |
| 260+ | 10.48 EUR |
| MCIMX280CVM4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| MCIMX280DVM4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| MCIMX281AVM4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
Im Einkaufswagen
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| MCIMX283CVM4C |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX283DVM4C |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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Stück im Wert von UAH
| MCIMX286DVM4C |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| SAF1508BET/V1,118 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX USB 2.0 ULPI 36TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 36-TFBGA
Mounting Type: Surface Mount
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 4.5V
Supplier Device Package: 36-TFBGA (3.5x3.5)
Serial Interfaces: UART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX USB 2.0 ULPI 36TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 36-TFBGA
Mounting Type: Surface Mount
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 4.5V
Supplier Device Package: 36-TFBGA (3.5x3.5)
Serial Interfaces: UART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| TDF8546JV/N2ZU |
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Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Active
Description: IC AUDIO AMP AB DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Active
auf Bestellung 423 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 57.57 EUR |
| 10+ | 46.56 EUR |
| 25+ | 43.82 EUR |
| 100+ | 41.42 EUR |
| TDF8546AJV/N1ZU |
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Active
Description: IC AUDIO AMP AB DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Active
Produkt ist nicht verfügbar
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