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S912ZVMAL3F0MLF S912ZVMAL3F0MLF NXP USA Inc. S12ZVMAFS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1248 Stücke:
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2+11.82 EUR
10+9.08 EUR
25+8.39 EUR
100+7.64 EUR
250+7.28 EUR
500+7.07 EUR
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S912ZVMAL3F0WLF S912ZVMAL3F0WLF NXP USA Inc. S12ZVMAFS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
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2+17.01 EUR
10+13.2 EUR
25+12.25 EUR
100+11.2 EUR
250+10.7 EUR
500+10.4 EUR
1250+10.09 EUR
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S912ZVMAL3F0MLC S912ZVMAL3F0MLC NXP USA Inc. S12ZVMAFS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 10
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
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2+11.91 EUR
10+9.22 EUR
25+8.54 EUR
100+7.81 EUR
250+7.53 EUR
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NTB0101GS1Z NTB0101GS1Z NXP USA Inc. NTB0101.pdf Description: IC XLTR VL BIDIR 6-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-X2SON (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101GS1Z NTB0101GS1Z NXP USA Inc. NTB0101.pdf Description: IC XLTR VL BIDIR 6-X2SON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-X2SON (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 9618 Stücke:
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23+0.94 EUR
32+0.67 EUR
36+0.6 EUR
100+0.51 EUR
250+0.48 EUR
500+0.45 EUR
1000+0.44 EUR
2500+0.42 EUR
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TJA1128BTK/0Z TJA1128BTK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.49 EUR
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TJA1128CTK/0Z TJA1128CTK/0Z NXP USA Inc. TJA1128-DS.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Produkt ist nicht verfügbar
 Mindestbestellmenge: 6000 Stücke
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TJA1128DTK/0Z TJA1128DTK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 6000 Stücke
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TJA1128FTK/0Z TJA1128FTK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.58 EUR
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TJA1044VTKZ TJA1044VTKZ NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.11 EUR
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TJA1044VT/3Z TJA1044VT/3Z NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2500 Stücke
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TJA1044VTK/3Z TJA1044VTK/3Z NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.05 EUR
12000+1.04 EUR
18000+1.02 EUR
Mindestbestellmenge: 6000 Stücke
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TJA1044VTZ TJA1044VTZ NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
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2500+1 EUR
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TJA1046VTKZ TJA1046VTKZ NXP USA Inc. TJA1046V.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 12000 Stücke:
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6000+2.76 EUR
Mindestbestellmenge: 6000 Stücke
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ADTJA1101-RMII ADTJA1101-RMII NXP USA Inc. ADTJA1101-RMII.pdf Description: EVAL BOARD FOR TJA1101
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: TJA1101
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Produkt ist nicht verfügbar
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TJA1124AHG/0Z TJA1124AHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
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TJA1124BHG/0Z TJA1124BHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124AHG/0Z SJA1124AHG/0Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
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3000+4.44 EUR
Mindestbestellmenge: 3000 Stücke
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RFEP24-300 RFEP24-300 NXP USA Inc. RFEM24-250FS.pdf Description: RF ENERGY PALLET DEV BOARD
auf Bestellung 2 Stücke:
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1+3090.68 EUR
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RFEM24-250 RFEM24-250 NXP USA Inc. RFEM24-250FS.pdf Description: RF ENERGY MODULE SUBSYSTEM
auf Bestellung 7 Stücke:
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RFEL24-500 RFEL24-500 NXP USA Inc. RFEL24-500UG.pdf Description: RF SIGNAL GENERATOR TEST EQUIP
Packaging: Bulk
For Use With/Related Products: Test Equipment
Tool Type: RF Signal Generator
Part Status: Active
auf Bestellung 1 Stücke:
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1+21449.05 EUR
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OM40008UL OM40008UL NXP USA Inc. IoT%20Mini%20Prototype%20Board.pdf Description: DEV BOARD MINI IOT BASEBOARD
Packaging: Bulk
Function: Multiple
Type: Interface
Contents: Board(s)
Utilized IC / Part: MMA8652FC
Part Status: Obsolete
auf Bestellung 1 Stücke:
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1+79.12 EUR
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MC9S08PL60CLD MC9S08PL60CLD NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL32CLD MC9S08PL32CLD NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 98 Stücke:
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3+7.02 EUR
10+5.47 EUR
Mindestbestellmenge: 3 Stücke
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S12ZVMAEVB S12ZVMAEVB NXP USA Inc. S12ZVMAEVB_QSG.pdf Description: S12ZVMA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Utilized IC / Part: S12ZVMA
auf Bestellung 2 Stücke:
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1+662.69 EUR
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MRF13750H-1300 MRF13750H-1300 NXP USA Inc. MRF13750H.pdf Description: MRF13750H REF BRD 1300MHZ 700W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 1.3GHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 3 Stücke:
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1+2701.88 EUR
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MCIMX7ULP-EVK MCIMX7ULP-EVK NXP USA Inc. IMX7ULPWSG.pdf Description: I.MX 7ULP EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-A7, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 7ULP
Part Status: Active
auf Bestellung 26 Stücke:
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1+477.38 EUR
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TJA1128CTK/0Z TJA1128CTK/0Z NXP USA Inc. TJA1128-DS.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
auf Bestellung 5975 Stücke:
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TJA1128FTK/0Z TJA1128FTK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 14418 Stücke:
Lieferzeit 10-14 Tag (e)
7+3.47 EUR
10+2.56 EUR
25+2.33 EUR
100+2.07 EUR
250+1.95 EUR
500+1.88 EUR
1000+1.82 EUR
2500+1.76 EUR
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TJA1044VTKZ TJA1044VTKZ NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 16767 Stücke:
Lieferzeit 10-14 Tag (e)
10+2.31 EUR
13+1.68 EUR
25+1.51 EUR
100+1.34 EUR
250+1.26 EUR
500+1.2 EUR
1000+1.19 EUR
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TJA1044VT/3Z TJA1044VT/3Z NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 718 Stücke:
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11+2.05 EUR
15+1.48 EUR
25+1.33 EUR
100+1.18 EUR
250+1.09 EUR
500+1.06 EUR
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TJA1044VTK/3Z TJA1044VTK/3Z NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 18057 Stücke:
Lieferzeit 10-14 Tag (e)
10+2.2 EUR
14+1.59 EUR
25+1.44 EUR
100+1.27 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.12 EUR
2500+1.06 EUR
Mindestbestellmenge: 10 Stücke
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TJA1044VTZ TJA1044VTZ NXP USA Inc. TJA1044V.pdf Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3124 Stücke:
Lieferzeit 10-14 Tag (e)
11+2.05 EUR
15+1.48 EUR
25+1.33 EUR
100+1.18 EUR
250+1.09 EUR
500+1.06 EUR
1000+1.04 EUR
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TJA1046VTKZ TJA1046VTKZ NXP USA Inc. TJA1046V.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 13342 Stücke:
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TJA1124AHG/0Z TJA1124AHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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SJA1124AHG/0Z SJA1124AHG/0Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5363 Stücke:
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BAP64LX/Z,315 BAP64LX/Z,315 NXP USA Inc. BAP64LX_Rev2018.pdf Description: RF DIODE PIN 60V 150MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Grade: Automotive
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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SPC5602DF1VLH4R SPC5602DF1VLH4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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500+15.23 EUR
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LPC2134FBD64/01,11 LPC2134FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1835 Stücke:
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SP5746CSK1AMKU6R SP5746CSK1AMKU6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
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MCIMX6S5DVM10ACR MCIMX6S5DVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 578 Stücke:
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S9S08DZ60F2VLCR S9S08DZ60F2VLCR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 795 Stücke:
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MCIMX283CVM4BR2 MCIMX283CVM4BR2 NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
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MCF51JM128VLHR MCF51JM128VLHR NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 3193 Stücke:
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PCF7953MTTC1AC2200 PCF7953MTTC1AC2200 NXP USA Inc. 75017275.pdf?fsrch=1&sr=1&pageNum=1 Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2092 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.48 EUR
10+19.24 EUR
25+17.93 EUR
100+16.49 EUR
250+15.82 EUR
500+15.4 EUR
1000+15.36 EUR
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PCF7953XTTC1AC2000 PCF7953XTTC1AC2000 NXP USA Inc. Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7953PTTM1AC1800 PCF7953PTTM1AC1800 NXP USA Inc. Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SH4MTGR MC9S08SH4MTGR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 5300 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.84 EUR
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25+6.19 EUR
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250+5.32 EUR
500+5.15 EUR
1000+5.02 EUR
2500+4.87 EUR
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S9S08DZ32F2VLCR S9S08DZ32F2VLCR NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX283DVM4BR2 MCIMX283DVM4BR2 NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MRFG35003N6AT1 MRFG35003N6AT1 NXP USA Inc. MRFG35003N6A.pdf Description: RF MOSFET PHEMT FET 6V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 450mW
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 8 V
Voltage - Test: 6 V
Current - Test: 180 mA
auf Bestellung 448 Stücke:
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1+40.73 EUR
10+32.55 EUR
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100+28.25 EUR
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MRFE6VP61K25HSR5 MRFE6VP61K25HSR5 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MC33984CHFKR2 MC33984CHFKR2 NXP USA Inc. MC33984.pdf Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:2
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX280DVM4BR MCIMX280DVM4BR NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
auf Bestellung 1780 Stücke:
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PCF7952XTT/C1CC170 PCF7952XTT/C1CC170 NXP USA Inc. Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2495 Stücke:
Lieferzeit 10-14 Tag (e)
2+20.23 EUR
10+15.27 EUR
25+14.03 EUR
100+12.66 EUR
250+12.01 EUR
500+11.61 EUR
1000+11.29 EUR
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UJA1168TK,118 UJA1168TK,118 NXP USA Inc. Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Produkt ist nicht verfügbar
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MC56F82746VLFR MC56F82746VLFR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.45 EUR
10+13.55 EUR
50+12 EUR
100+11.51 EUR
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FXTH8709116T1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Cut Tape (CT)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.48 EUR
5+12.17 EUR
10+11.67 EUR
25+11.08 EUR
50+10.67 EUR
100+10.31 EUR
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S9S12GA128F0MLFR S9S12GA128F0MLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.61 EUR
10+12.88 EUR
50+11.39 EUR
100+10.94 EUR
500+10.21 EUR
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MCF51EM256CLLR MCF51EM256CLLR NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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1+30.48 EUR
10+24.36 EUR
100+20.58 EUR
500+20.44 EUR
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S912ZVMAL3F0MLF S12ZVMAFS.pdf
S912ZVMAL3F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1248 Stücke:
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2+11.82 EUR
10+9.08 EUR
25+8.39 EUR
100+7.64 EUR
250+7.28 EUR
500+7.07 EUR
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S912ZVMAL3F0WLF S12ZVMAFS.pdf
S912ZVMAL3F0WLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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2+17.01 EUR
10+13.2 EUR
25+12.25 EUR
100+11.2 EUR
250+10.7 EUR
500+10.4 EUR
1250+10.09 EUR
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S912ZVMAL3F0MLC S12ZVMAFS.pdf
S912ZVMAL3F0MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 10
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
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AnzahlPrivatkunde
2+11.91 EUR
10+9.22 EUR
25+8.54 EUR
100+7.81 EUR
250+7.53 EUR
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NTB0101GS1Z NTB0101.pdf
NTB0101GS1Z
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-X2SON (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101GS1Z NTB0101.pdf
NTB0101GS1Z
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-X2SON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-X2SON (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 9618 Stücke:
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23+0.94 EUR
32+0.67 EUR
36+0.6 EUR
100+0.51 EUR
250+0.48 EUR
500+0.45 EUR
1000+0.44 EUR
2500+0.42 EUR
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TJA1128BTK/0Z TJA1128.pdf
TJA1128BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 12000 Stücke:
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AnzahlPrivatkunde
6000+1.49 EUR
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TJA1128CTK/0Z TJA1128-DS.pdf
TJA1128CTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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TJA1128DTK/0Z TJA1128.pdf
TJA1128DTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1128FTK/0Z TJA1128.pdf
TJA1128FTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+1.58 EUR
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TJA1044VTKZ TJA1044V.pdf
TJA1044VTKZ
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
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AnzahlPrivatkunde
6000+1.11 EUR
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TJA1044VT/3Z TJA1044V.pdf
TJA1044VT/3Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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TJA1044VTK/3Z TJA1044V.pdf
TJA1044VTK/3Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+1.05 EUR
12000+1.04 EUR
18000+1.02 EUR
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TJA1044VTZ TJA1044V.pdf
TJA1044VTZ
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1 EUR
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TJA1046VTKZ TJA1046V.pdf
TJA1046VTKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+2.76 EUR
Mindestbestellmenge: 6000 Stücke
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ADTJA1101-RMII ADTJA1101-RMII.pdf
ADTJA1101-RMII
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1101
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: TJA1101
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Produkt ist nicht verfügbar
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TJA1124AHG/0Z TJA1124.pdf
TJA1124AHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
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TJA1124BHG/0Z TJA1124.pdf
TJA1124BHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124AHG/0Z SJA1124.pdf
SJA1124AHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+4.44 EUR
Mindestbestellmenge: 3000 Stücke
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RFEP24-300 RFEM24-250FS.pdf
RFEP24-300
Hersteller: NXP USA Inc.
Description: RF ENERGY PALLET DEV BOARD
auf Bestellung 2 Stücke:
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1+3090.68 EUR
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RFEM24-250 RFEM24-250FS.pdf
RFEM24-250
Hersteller: NXP USA Inc.
Description: RF ENERGY MODULE SUBSYSTEM
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RFEL24-500 RFEL24-500UG.pdf
RFEL24-500
Hersteller: NXP USA Inc.
Description: RF SIGNAL GENERATOR TEST EQUIP
Packaging: Bulk
For Use With/Related Products: Test Equipment
Tool Type: RF Signal Generator
Part Status: Active
auf Bestellung 1 Stücke:
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AnzahlPrivatkunde
1+21449.05 EUR
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OM40008UL IoT%20Mini%20Prototype%20Board.pdf
OM40008UL
Hersteller: NXP USA Inc.
Description: DEV BOARD MINI IOT BASEBOARD
Packaging: Bulk
Function: Multiple
Type: Interface
Contents: Board(s)
Utilized IC / Part: MMA8652FC
Part Status: Obsolete
auf Bestellung 1 Stücke:
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1+79.12 EUR
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MC9S08PL60CLD MC9S08PL60.pdf
MC9S08PL60CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL32CLD MC9S08PL60.pdf
MC9S08PL32CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 98 Stücke:
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AnzahlPrivatkunde
3+7.02 EUR
10+5.47 EUR
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S12ZVMAEVB S12ZVMAEVB_QSG.pdf
S12ZVMAEVB
Hersteller: NXP USA Inc.
Description: S12ZVMA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Utilized IC / Part: S12ZVMA
auf Bestellung 2 Stücke:
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1+662.69 EUR
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MRF13750H-1300 MRF13750H.pdf
MRF13750H-1300
Hersteller: NXP USA Inc.
Description: MRF13750H REF BRD 1300MHZ 700W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 1.3GHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
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1+2701.88 EUR
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MCIMX7ULP-EVK IMX7ULPWSG.pdf
MCIMX7ULP-EVK
Hersteller: NXP USA Inc.
Description: I.MX 7ULP EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-A7, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 7ULP
Part Status: Active
auf Bestellung 26 Stücke:
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AnzahlPrivatkunde
1+477.38 EUR
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TJA1128CTK/0Z TJA1128-DS.pdf
TJA1128CTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
auf Bestellung 5975 Stücke:
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TJA1128FTK/0Z TJA1128.pdf
TJA1128FTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 14418 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.47 EUR
10+2.56 EUR
25+2.33 EUR
100+2.07 EUR
250+1.95 EUR
500+1.88 EUR
1000+1.82 EUR
2500+1.76 EUR
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TJA1044VTKZ TJA1044V.pdf
TJA1044VTKZ
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 16767 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.31 EUR
13+1.68 EUR
25+1.51 EUR
100+1.34 EUR
250+1.26 EUR
500+1.2 EUR
1000+1.19 EUR
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TJA1044VT/3Z TJA1044V.pdf
TJA1044VT/3Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 718 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
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100+1.18 EUR
250+1.09 EUR
500+1.06 EUR
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TJA1044VTK/3Z TJA1044V.pdf
TJA1044VTK/3Z
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 18057 Stücke:
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TJA1044VTZ TJA1044V.pdf
TJA1044VTZ
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3124 Stücke:
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11+2.05 EUR
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1000+1.04 EUR
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TJA1046VTKZ TJA1046V.pdf
TJA1046VTKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 13342 Stücke:
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4+5.28 EUR
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TJA1124AHG/0Z TJA1124.pdf
TJA1124AHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5435 Stücke:
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4+5.78 EUR
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SJA1124AHG/0Z SJA1124.pdf
SJA1124AHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5363 Stücke:
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3+8.15 EUR
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BAP64LX/Z,315 BAP64LX_Rev2018.pdf
BAP64LX/Z,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Grade: Automotive
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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SPC5602DF1VLH4R MPC5602D.pdf
SPC5602DF1VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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1+24.11 EUR
10+18.99 EUR
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LPC2134FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2134FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1835 Stücke:
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1+30.89 EUR
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SP5746CSK1AMKU6R MPC5746C.pdf
SP5746CSK1AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
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1+58.35 EUR
10+47.28 EUR
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MCIMX6S5DVM10ACR IMX6SDLAEC.pdf
MCIMX6S5DVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 578 Stücke:
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1+101.36 EUR
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S9S08DZ60F2VLCR MC9S08AC60.pdf
S9S08DZ60F2VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 795 Stücke:
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1+24.66 EUR
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MCIMX283CVM4BR2 IMX28CEC.pdf
MCIMX283CVM4BR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
auf Bestellung 25 Stücke:
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1+55.72 EUR
10+44.96 EUR
25+42.28 EUR
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MCF51JM128VLHR MCF51JM128.pdf
MCF51JM128VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 3193 Stücke:
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1+33.24 EUR
10+26.42 EUR
25+24.7 EUR
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PCF7953MTTC1AC2200 75017275.pdf?fsrch=1&sr=1&pageNum=1
PCF7953MTTC1AC2200
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2092 Stücke:
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1+24.48 EUR
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1000+15.36 EUR
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PCF7953XTTC1AC2000
PCF7953XTTC1AC2000
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7953PTTM1AC1800
PCF7953PTTM1AC1800
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SH4MTGR MC9S08SH8.pdf
MC9S08SH4MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 5300 Stücke:
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3+8.84 EUR
10+6.71 EUR
25+6.19 EUR
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500+5.15 EUR
1000+5.02 EUR
2500+4.87 EUR
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S9S08DZ32F2VLCR MC9S08DZ60.pdf
S9S08DZ32F2VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX283DVM4BR2 IMX28CEC.pdf
MCIMX283DVM4BR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MRFG35003N6AT1 MRFG35003N6A.pdf
MRFG35003N6AT1
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 6V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 450mW
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 8 V
Voltage - Test: 6 V
Current - Test: 180 mA
auf Bestellung 448 Stücke:
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1+40.73 EUR
10+32.55 EUR
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100+28.25 EUR
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MRFE6VP61K25HSR5 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 58 Stücke:
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1+714.19 EUR
10+618.12 EUR
25+594.14 EUR
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MC33984CHFKR2 MC33984.pdf
MC33984CHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:2
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX280DVM4BR IMX28CEC.pdf
MCIMX280DVM4BR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
auf Bestellung 1780 Stücke:
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1+43.67 EUR
10+35.03 EUR
25+32.88 EUR
100+31.09 EUR
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PCF7952XTT/C1CC170
PCF7952XTT/C1CC170
Hersteller: NXP USA Inc.
Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2495 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20.23 EUR
10+15.27 EUR
25+14.03 EUR
100+12.66 EUR
250+12.01 EUR
500+11.61 EUR
1000+11.29 EUR
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UJA1168TK,118
UJA1168TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Produkt ist nicht verfügbar
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MC56F82746VLFR MC56F827XXDS.pdf
MC56F82746VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.45 EUR
10+13.55 EUR
50+12 EUR
100+11.51 EUR
500+10.76 EUR
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FXTH8709116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Cut Tape (CT)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.48 EUR
5+12.17 EUR
10+11.67 EUR
25+11.08 EUR
50+10.67 EUR
100+10.31 EUR
Mindestbestellmenge: 2 Stücke
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S9S12GA128F0MLFR MC9S12GRMV1.pdf
S9S12GA128F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+16.61 EUR
10+12.88 EUR
50+11.39 EUR
100+10.94 EUR
500+10.21 EUR
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MCF51EM256CLLR MCF51EM256.pdf
MCF51EM256CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+30.48 EUR
10+24.36 EUR
100+20.58 EUR
500+20.44 EUR
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