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FS32R372SEK0MMMT NXP USA Inc. Description: S32R RADAR MICROCONTROLLER - S32
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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S32R372141EVB NXP USA Inc. S32R372DS.pdf Description: S32R372 EVAL BRD
Part Status: Active
Utilized IC / Part: S32R372
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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S32R372RRSEVB S32R372RRSEVB NXP USA Inc. S32R372DS.pdf Description: S32R372 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S32R372
Contents: Board(s)
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PN7360AUEV/C300E PN7360AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
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PN7362AUEV/C300E PN7362AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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PN7462AUEV/C300E PN7462AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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PNEV7462C PNEV7462C NXP USA Inc. PN7462.pdf Description: EVAL BOARD FOR PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN7462
Supplied Contents: Board(s)
Part Status: Active
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A7101CHUK/T0BC2HAZ A7101CHUK/T0BC2HAZ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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A7102CHUK/T0BC2VAZ A7102CHUK/T0BC2VAZ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC EXT TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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A7101CHTK2/T0BC2BJ A7101CHTK2/T0BC2BJ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC STD TEMP HVSON8
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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A7102CHTK2/T0BC2CJ A7102CHTK2/T0BC2CJ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC EXT TEMP HVSON8
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF0MOU2101DA8,118 MF0MOU2101DA8,118 NXP USA Inc. MF0ICU2.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Strip
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Active
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21+1.04 EUR
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100+0.89 EUR
250+0.84 EUR
500+0.81 EUR
1000+0.77 EUR
5000+0.7 EUR
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A7101CHUK/T0BC2HAZ A7101CHUK/T0BC2HAZ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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250+3.71 EUR
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1000+3.49 EUR
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A7101CHTK2/T0BC2BJ A7101CHTK2/T0BC2BJ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC STD TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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MRFX600HR5 MRFX600HR5 NXP USA Inc. MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MRFX600HSR5 MRFX600HSR5 NXP USA Inc. MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MRFX600GSR5 MRFX600GSR5 NXP USA Inc. MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MRFX600HR5 MRFX600HR5 NXP USA Inc. MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
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MRFX600HSR5 MRFX600HSR5 NXP USA Inc. MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: NI-780S-4L
Packaging: Cut Tape (CT)
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MRFX600GSR5 MRFX600GSR5 NXP USA Inc. MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Current Rating (Amps): 10µA
Package / Case: NI-780GS-4L
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
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MRFX1K80GNR5 MRFX1K80GNR5 NXP USA Inc. MRFX1K80N.pdf Description: RF MOSFET LDMOS 65V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Test: 65 V
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MIMXRT1064DVL6A MIMXRT1064DVL6A NXP USA Inc. IMXRT1064CEC.pdf Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MIMXRT1064CVL5A MIMXRT1064CVL5A NXP USA Inc. IMXRT1064IEC.pdf Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Part Status: Discontinued at Digi-Key
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MIMXRT1064-EVK MIMXRT1064-EVK NXP USA Inc. getting-started-with-the-mimxrt1064-evk-evaluation-board:GS-MIMXRT1064-EVK Description: I.MX RT1064 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1064
Part Status: Active
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KITPF8200FRDMEVM KITPF8200FRDMEVM NXP USA Inc. PF8100_PF8200.pdf Description: EVAL BOARD FOR PF8200
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8200
Supplied Contents: Board(s)
Primary Attributes: 12-Channel
Part Status: Active
Contents: Board(s)
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LX2160A-RDB LX2160A-RDB NXP USA Inc. LX2160A-RDB-FS.pdf Description: LX2160A EVAL BRD
Part Status: Active
Utilized IC / Part: LX2160A
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s), Cable(s), Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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LX2RDBKIT1-10-40 LX2RDBKIT1-10-40 NXP USA Inc. LX2160A-RDB-FS.pdf Description: RDB KIT TXRX CABLES 10GE & 40 GE
Packaging: Bulk
For Use With/Related Products: LX2160A
Accessory Type: Accessory Kit
Part Status: Active
Utilized IC / Part: LX2160A
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LX2RDBKIT2-25G LX2RDBKIT2-25G NXP USA Inc. LX2160A-RDB-FS.pdf Description: RDB KIT TXRX CABLES FOR 25G
Utilized IC / Part: LX2160A
Part Status: Active
Accessory Type: Accessory Kit
For Use With/Related Products: LX2160A
Packaging: Bulk
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MC10XS6200BEKR2 MC10XS6200BEKR2 NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC10XS6225BEKR2 MC10XS6225BEKR2 NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
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MC10XS6325BEKR2 MC10XS6325BEKR2 NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
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1000+8.48 EUR
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MC17XS6500CEKR2 MC17XS6500CEKR2 NXP USA Inc. MC12XS6D1.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC22XS4200CEKR2 MC22XS4200CEKR2 NXP USA Inc. MC22XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC50XS4200CEKR2 MC50XS4200CEKR2 NXP USA Inc. MC50XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC17XS6500CEK MC17XS6500CEK NXP USA Inc. MC12XS6D1.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC25XS6300BEK MC25XS6300BEK NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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LS1088ARDB-PB LS1088ARDB-PB NXP USA Inc. LS1088AFS.pdf Description: LS1088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1088A
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
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MIMX8MD6CVAHZAB MIMX8MD6CVAHZAB NXP USA Inc. IMX8MDQLQIEC.pdf Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
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MIMX8MD6DVAJZAB MIMX8MD6DVAJZAB NXP USA Inc. IMX8MDQLQCEC.pdf Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
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MIMX8MQ5CVAHZAB MIMX8MQ5CVAHZAB NXP USA Inc. IMX8MDQLQIEC.pdf Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
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MIMX8MQ5DVAJZAB MIMX8MQ5DVAJZAB NXP USA Inc. IMX8MDQLQCEC.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 504 Stücke:
Lieferzeit 10-14 Tag (e)
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90+107.5 EUR
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MIMX8MQ6CVAHZAB MIMX8MQ6CVAHZAB NXP USA Inc. IMX8MDQLQIEC.pdf Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
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1+167 EUR
10+139.29 EUR
90+125.26 EUR
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MIMX8MQ6DVAJZAB MIMX8MQ6DVAJZAB NXP USA Inc. IMX8MDQLQCEC.pdf Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
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90+112.74 EUR
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MC56F82646VLF MC56F82646VLF NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Packaging: Tray
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.94 EUR
10+9.15 EUR
25+8.46 EUR
100+7.7 EUR
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MC56F82643VLC MC56F82643VLC NXP USA Inc. MC56F826XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC56F82623VLC MC56F82623VLC NXP USA Inc. MC56F826XXDS.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1250 Stücke
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NTBMS-FSNXP NXP USA Inc. Description: EVAL BD FS4503C MC33772B S32K144
Packaging: Bulk
Function: Battery Monitor, Car
Type: Power Management
Utilized IC / Part: FS4503C, MC33772B, S32K144
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
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MCIMX6Z0DVM09AB MCIMX6Z0DVM09AB NXP USA Inc. IMX6ULZCEC.pdf Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
auf Bestellung 4101 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.15 EUR
10+18.98 EUR
25+17.7 EUR
152+15.95 EUR
304+15.48 EUR
608+15.09 EUR
1064+14.83 EUR
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FS32K116LAT0MFMT FS32K116LAT0MFMT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.86 EUR
10+8.32 EUR
50+7.29 EUR
100+6.97 EUR
Mindestbestellmenge: 2 Stücke
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FS32K116LAT0MLFT FS32K116LAT0MLFT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
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2+15.85 EUR
10+12.45 EUR
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FS32K118LAT0MLFT FS32K118LAT0MLFT NXP USA Inc. S32K-PB.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 1157 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.86 EUR
10+8.32 EUR
25+7.69 EUR
100+6.99 EUR
250+6.65 EUR
500+6.45 EUR
1000+6.28 EUR
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FS32K118LAT0MLHT FS32K118LAT0MLHT NXP USA Inc. S32K-PB.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1125 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.43 EUR
10+11.96 EUR
25+11.09 EUR
100+10.14 EUR
250+9.69 EUR
800+9.26 EUR
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S32K118EVB-Q064 S32K118EVB-Q064 NXP USA Inc. S32K118EVB-QSG.pdf Description: S32K118 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Produkt ist nicht verfügbar
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S32K116EVB-Q048 S32K116EVB-Q048 NXP USA Inc. S32K116EVB-QSG.pdf Description: S32K116 EVAL BRD
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IMXAI2ETH-ATH IMXAI2ETH-ATH NXP USA Inc. IMXSABREAI2FS.pdf Description: ENET 1GBPS PHY (STD ENET PHY)
Packaging: Bulk
For Use With/Related Products: i.MX 6
Accessory Type: Interface Board
Utilized IC / Part: i.MX 6
Part Status: Active
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MCIMX8QXP-CPU MCIMX8QXP-CPU NXP USA Inc. IMX8QADXPLUSFS.pdf Description: I.MX 8 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Part Status: Active
auf Bestellung 29 Stücke:
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MCIMX8-8X-BB MCIMX8-8X-BB NXP USA Inc. IMX8QADXPLUSFS.pdf Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAX
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Part Status: Active
auf Bestellung 42 Stücke:
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MX8XMIPI4CAM2 MX8XMIPI4CAM2 NXP USA Inc. SVAUG Description: 4 CAMERA BOARD MINISAS OV10635
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
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FS32K146HAT0MMHT FS32K146HAT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 880 Stücke
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MRF101AN MRF101AN NXP USA Inc. MRF101AN.pdf Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
1+85.29 EUR
10+69.66 EUR
50+63.42 EUR
100+61.48 EUR
250+59.44 EUR
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FS32R372SEK0MMMT
Hersteller: NXP USA Inc.
Description: S32R RADAR MICROCONTROLLER - S32
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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S32R372141EVB S32R372DS.pdf
Hersteller: NXP USA Inc.
Description: S32R372 EVAL BRD
Part Status: Active
Utilized IC / Part: S32R372
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 4 Stücke:
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AnzahlPrivatkunde
1+819.29 EUR
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S32R372RRSEVB S32R372DS.pdf
S32R372RRSEVB
Hersteller: NXP USA Inc.
Description: S32R372 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S32R372
Contents: Board(s)
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1+723.42 EUR
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PN7360AUEV/C300E PN7462.pdf
PN7360AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
auf Bestellung 1470 Stücke:
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PN7362AUEV/C300E PN7462.pdf
PN7362AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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PN7462AUEV/C300E PN7462.pdf
PN7462AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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PNEV7462C PN7462.pdf
PNEV7462C
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN7462
Supplied Contents: Board(s)
Part Status: Active
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A7101CHUK/T0BC2HAZ A71CH-LEAFLET.pdf
A7101CHUK/T0BC2HAZ
Hersteller: NXP USA Inc.
Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7102CHUK/T0BC2VAZ A71CH-LEAFLET.pdf
A7102CHUK/T0BC2VAZ
Hersteller: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CHTK2/T0BC2BJ A71CH-LEAFLET.pdf
A7101CHTK2/T0BC2BJ
Hersteller: NXP USA Inc.
Description: SECURITY IC STD TEMP HVSON8
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7102CHTK2/T0BC2CJ A71CH-LEAFLET.pdf
A7102CHTK2/T0BC2CJ
Hersteller: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF0MOU2101DA8,118 MF0ICU2.pdf
MF0MOU2101DA8,118
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Strip
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Active
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18+1.21 EUR
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A7101CHUK/T0BC2HAZ A71CH-LEAFLET.pdf
A7101CHUK/T0BC2HAZ
Hersteller: NXP USA Inc.
Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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A7101CHTK2/T0BC2BJ A71CH-LEAFLET.pdf
A7101CHTK2/T0BC2BJ
Hersteller: NXP USA Inc.
Description: SECURITY IC STD TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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4+6.56 EUR
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MRFX600HR5 MRFX600H.pdf
MRFX600HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MRFX600HSR5 MRFX600H.pdf
MRFX600HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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50+263.37 EUR
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MRFX600GSR5 MRFX600H.pdf
MRFX600GSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFX600HR5 MRFX600H.pdf
MRFX600HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
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MRFX600HSR5 MRFX600H.pdf
MRFX600HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: NI-780S-4L
Packaging: Cut Tape (CT)
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MRFX600GSR5 MRFX600H.pdf
MRFX600GSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Current Rating (Amps): 10µA
Package / Case: NI-780GS-4L
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
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MRFX1K80GNR5 MRFX1K80N.pdf
MRFX1K80GNR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Test: 65 V
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MIMXRT1064DVL6A IMXRT1064CEC.pdf
MIMXRT1064DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MIMXRT1064CVL5A IMXRT1064IEC.pdf
MIMXRT1064CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Part Status: Discontinued at Digi-Key
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MIMXRT1064-EVK getting-started-with-the-mimxrt1064-evk-evaluation-board:GS-MIMXRT1064-EVK
MIMXRT1064-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1064 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1064
Part Status: Active
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1+323.31 EUR
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KITPF8200FRDMEVM PF8100_PF8200.pdf
KITPF8200FRDMEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF8200
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8200
Supplied Contents: Board(s)
Primary Attributes: 12-Channel
Part Status: Active
Contents: Board(s)
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LX2160A-RDB LX2160A-RDB-FS.pdf
LX2160A-RDB
Hersteller: NXP USA Inc.
Description: LX2160A EVAL BRD
Part Status: Active
Utilized IC / Part: LX2160A
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s), Cable(s), Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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LX2RDBKIT1-10-40 LX2160A-RDB-FS.pdf
LX2RDBKIT1-10-40
Hersteller: NXP USA Inc.
Description: RDB KIT TXRX CABLES 10GE & 40 GE
Packaging: Bulk
For Use With/Related Products: LX2160A
Accessory Type: Accessory Kit
Part Status: Active
Utilized IC / Part: LX2160A
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1+365.41 EUR
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LX2RDBKIT2-25G LX2160A-RDB-FS.pdf
LX2RDBKIT2-25G
Hersteller: NXP USA Inc.
Description: RDB KIT TXRX CABLES FOR 25G
Utilized IC / Part: LX2160A
Part Status: Active
Accessory Type: Accessory Kit
For Use With/Related Products: LX2160A
Packaging: Bulk
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1+711.87 EUR
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MC10XS6200BEKR2 MC12XS6D2.pdf
MC10XS6200BEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC10XS6225BEKR2 MC12XS6D2.pdf
MC10XS6225BEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 1000 Stücke:
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AnzahlPrivatkunde
1000+8.33 EUR
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MC10XS6325BEKR2 MC12XS6D2.pdf
MC10XS6325BEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 1000 Stücke:
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1000+8.48 EUR
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MC17XS6500CEKR2 MC12XS6D1.pdf
MC17XS6500CEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC22XS4200CEKR2 MC22XS4200.pdf
MC22XS4200CEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC50XS4200CEKR2 MC50XS4200.pdf
MC50XS4200CEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC17XS6500CEK MC12XS6D1.pdf
MC17XS6500CEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC25XS6300BEK MC12XS6D2.pdf
MC25XS6300BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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LS1088ARDB-PB LS1088AFS.pdf
LS1088ARDB-PB
Hersteller: NXP USA Inc.
Description: LS1088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1088A
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+4765.15 EUR
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MIMX8MD6CVAHZAB IMX8MDQLQIEC.pdf
MIMX8MD6CVAHZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 90 Stücke:
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AnzahlPrivatkunde
1+160.35 EUR
10+133.6 EUR
90+120.04 EUR
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MIMX8MD6DVAJZAB IMX8MDQLQCEC.pdf
MIMX8MD6DVAJZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 162 Stücke:
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1+144.32 EUR
10+119.89 EUR
90+107.5 EUR
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MIMX8MQ5CVAHZAB IMX8MDQLQIEC.pdf
MIMX8MQ5CVAHZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 9 Stücke:
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AnzahlPrivatkunde
1+160.75 EUR
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MIMX8MQ5DVAJZAB IMX8MDQLQCEC.pdf
MIMX8MQ5DVAJZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 504 Stücke:
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AnzahlPrivatkunde
1+144.32 EUR
10+119.89 EUR
90+107.5 EUR
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MIMX8MQ6CVAHZAB IMX8MDQLQIEC.pdf
MIMX8MQ6CVAHZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 129 Stücke:
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AnzahlPrivatkunde
1+167 EUR
10+139.29 EUR
90+125.26 EUR
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MIMX8MQ6DVAJZAB IMX8MDQLQCEC.pdf
MIMX8MQ6DVAJZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 370 Stücke:
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1+151.01 EUR
10+125.62 EUR
90+112.74 EUR
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MC56F82646VLF MC56F827XXDS.pdf
MC56F82646VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Packaging: Tray
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
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2+11.94 EUR
10+9.15 EUR
25+8.46 EUR
100+7.7 EUR
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MC56F82643VLC MC56F826XXDS.pdf
MC56F82643VLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC56F82623VLC MC56F826XXDS.pdf
MC56F82623VLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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NTBMS-FSNXP
Hersteller: NXP USA Inc.
Description: EVAL BD FS4503C MC33772B S32K144
Packaging: Bulk
Function: Battery Monitor, Car
Type: Power Management
Utilized IC / Part: FS4503C, MC33772B, S32K144
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
auf Bestellung 1 Stücke:
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1+1946.66 EUR
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MCIMX6Z0DVM09AB IMX6ULZCEC.pdf
MCIMX6Z0DVM09AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
auf Bestellung 4101 Stücke:
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1+24.15 EUR
10+18.98 EUR
25+17.7 EUR
152+15.95 EUR
304+15.48 EUR
608+15.09 EUR
1064+14.83 EUR
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FS32K116LAT0MFMT S32K1xx.pdf
FS32K116LAT0MFMT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.86 EUR
10+8.32 EUR
50+7.29 EUR
100+6.97 EUR
Mindestbestellmenge: 2 Stücke
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FS32K116LAT0MLFT S32K-DS.pdf
FS32K116LAT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 21 Stücke:
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AnzahlPrivatkunde
2+15.85 EUR
10+12.45 EUR
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FS32K118LAT0MLFT S32K-PB.pdf
FS32K118LAT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 1157 Stücke:
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AnzahlPrivatkunde
2+10.86 EUR
10+8.32 EUR
25+7.69 EUR
100+6.99 EUR
250+6.65 EUR
500+6.45 EUR
1000+6.28 EUR
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FS32K118LAT0MLHT S32K-PB.pdf
FS32K118LAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1125 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.43 EUR
10+11.96 EUR
25+11.09 EUR
100+10.14 EUR
250+9.69 EUR
800+9.26 EUR
Mindestbestellmenge: 2 Stücke
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S32K118EVB-Q064 S32K118EVB-QSG.pdf
S32K118EVB-Q064
Hersteller: NXP USA Inc.
Description: S32K118 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Produkt ist nicht verfügbar
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S32K116EVB-Q048 S32K116EVB-QSG.pdf
S32K116EVB-Q048
Hersteller: NXP USA Inc.
Description: S32K116 EVAL BRD
auf Bestellung 33 Stücke:
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IMXAI2ETH-ATH IMXSABREAI2FS.pdf
IMXAI2ETH-ATH
Hersteller: NXP USA Inc.
Description: ENET 1GBPS PHY (STD ENET PHY)
Packaging: Bulk
For Use With/Related Products: i.MX 6
Accessory Type: Interface Board
Utilized IC / Part: i.MX 6
Part Status: Active
auf Bestellung 2 Stücke:
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1+424.58 EUR
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MCIMX8QXP-CPU IMX8QADXPLUSFS.pdf
MCIMX8QXP-CPU
Hersteller: NXP USA Inc.
Description: I.MX 8 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Part Status: Active
auf Bestellung 29 Stücke:
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1+2666.53 EUR
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MCIMX8-8X-BB IMX8QADXPLUSFS.pdf
MCIMX8-8X-BB
Hersteller: NXP USA Inc.
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAX
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Part Status: Active
auf Bestellung 42 Stücke:
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1+1315.75 EUR
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MX8XMIPI4CAM2 SVAUG
MX8XMIPI4CAM2
Hersteller: NXP USA Inc.
Description: 4 CAMERA BOARD MINISAS OV10635
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
auf Bestellung 5 Stücke:
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1+549.72 EUR
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FS32K146HAT0MMHT S32K1xx.pdf
FS32K146HAT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF101AN MRF101AN.pdf
MRF101AN
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+85.29 EUR
10+69.66 EUR
50+63.42 EUR
100+61.48 EUR
250+59.44 EUR
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