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S9S12XS128J1CALR S9S12XS128J1CALR NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
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TJA1029TK/20/1J TJA1029TK/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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TJA1029TK,118 TJA1029TK,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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TEA19161T/2Y TEA19161T/2Y NXP USA Inc. TEA19161T.pdf Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
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MC33689DPEWR2 MC33689DPEWR2 NXP USA Inc. MC33689.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
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TDF8590TH/N1TJ TDF8590TH/N1TJ NXP USA Inc. TDF8590TH_2.pdf Description: IC AMP D MONO/STEREO 160W 24HSOP
Part Status: Obsolete
Supplier Device Package: 24-HSOP
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Voltage - Supply: ±14V ~ 29V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
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MC34674CEPR2 MC34674CEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Mounting Type: Surface Mount
Number of Cells: 1
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Obsolete
Current - Charging: Constant - Programmable
Battery Pack Voltage: 4.2V
Voltage - Supply (Max): 10V
Fault Protection: Over Voltage
Programmable Features: Timer
Charge Current - Max: 650mA
Supplier Device Package: 8-UDFN (3x2)
Battery Chemistry: Lithium Ion/Polymer
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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PCF7941ATSM2AB120, PCF7941ATSM2AB120, NXP USA Inc. UM10473.pdf Description: IC REMOTE KEYLESS ENTRY 20SSOP
Antenna Connector: Not Included
Power - Output: 9.8dBm
Data Interface: RS232
Frequency: 315MHz, 434MHz, 868MHz
Part Status: Active
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Data Rate (Max): 4.8kbps
Applications: General Purpose
Voltage - Supply: 2.1V ~ 3.6V
Modulation or Protocol: ASK, FSK, UHF
Features: PLL Frequency Synthesizer and PA
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TJA1022T,118 TJA1022T,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14SO
Data Rate: 20kBd
Number of Drivers/Receivers: 2/2
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 14-SO
Protocol: LINbus
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TJA1028TK/5V0/20:1 TJA1028TK/5V0/20:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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AFM906NT1 AFM906NT1 NXP USA Inc. AFM906N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
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BGS8H2X BGS8H2X NXP USA Inc. BGS8H2.pdf Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 2.3GHz
Noise Figure: 1dB
Current - Supply: 5.8mA
Gain: 12.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Cellular
Frequency: 2.3GHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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TEA1713T/N2,518 TEA1713T/N2,518 NXP USA Inc. TEA1713T.pdf Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
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BGU8M1X BGU8M1X NXP USA Inc. BGU8M1.pdf Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.842GHz
Noise Figure: 0.8dB
Current - Supply: 5mA
Gain: 13.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 1.805GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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TJA1029T/20/1J TJA1029T/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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TJA1029T,118 TJA1029T,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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TEA19162T/2J TEA19162T/2J NXP USA Inc. TEA19162T.pdf Description: IC PFC CTRLR DCM 134KHZ 8SO
Current - Startup: 800 µA
Part Status: Active
Supplier Device Package: 8-SO
Mode: Discontinuous Conduction (DCM)
Frequency - Switching: 134kHz
Voltage - Supply: 70 ~ 276 VAC
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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BF513,215 BF513,215 NXP USA Inc. BF510_511_512_513_CNV.pdf Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050GC6T1 NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSIG 0.13" 2.82V
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS8001FTB/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
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TEA1738T/N1,118 TEA1738T/N1,118 NXP USA Inc. TEA1738T_TEA1738LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
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SL2S1512FTBX SL2S1512FTBX NXP USA Inc. SL2S1412_SL2S1512_SL2S1612.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Cut Tape (CT)
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BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
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BB156,115 BB156,115 NXP USA Inc. BB156.pdf Description: DIODE VAR CAP 10V 20MA SOD323
Capacitance Ratio: 3.9
Voltage - Peak Reverse (Max): 10 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C7.5
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
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TEA1731LTS/1,115 TEA1731LTS/1,115 NXP USA Inc. TEA1731LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
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MC9S08PL4CTG MC9S08PL4CTG NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC9S08PL60CQH MC9S08PL60CQH NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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MC9S08PL8CTG MC9S08PL8CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL16CTJ NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
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300+2.13 EUR
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SPC5775BDK3MME2 SPC5775BDK3MME2 NXP USA Inc. MPC5777C-Datasheet.pdf Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Number of I/O: 293
Part Status: Active
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b eQADCx2
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 220MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
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MPC5775BE-416DS MPC5775BE-416DS NXP USA Inc. MPC5777CEVBUG.pdf Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
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TEA19051BABTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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TEA19051BACTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BAFTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB FRDM33771BSPIEVB NXP USA Inc. MC33771B_SDS.pdf Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
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K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 191-WLCSP (5.97x5.85)
Peripherals: Bluetooth, DMA, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D - 12bit; D/A - 12bit
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Program Memory Size: 1.25MB (1.25M x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Part Status: Obsolete
Supplier Device Package: 144-HLQFP (20x20)
Clock Rate: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Type: Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5 SPC5744PK1MLQ5 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
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SPC5744PK1MLQ5R SPC5744PK1MLQ5R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
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MC34PF1550A7EP MC34PF1550A7EP NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 MC34PF1550A7EPR2 NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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FRDM-PF1550EVM FRDM-PF1550EVM NXP USA Inc. PF1550.pdf Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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MC32PF1550A1EPR2 MC32PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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MC32PF1550A3EPR2 MC32PF1550A3EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A1EPR2 MC34PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A4EPR2 MC34PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1003AVLHR MWCT1003AVLHR NXP USA Inc. MWCT1001A3AFS.pdf Description: 5W MULTI-COIL AUTO 5V PREMIUM
Supplier Device Package: 64-LQFP (10x10)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MKW41Z512VHT4R MKW41Z512VHT4R NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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S9S12XS128J1CALR S12XSFS.pdf
S9S12XS128J1CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
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TJA1029TK/20/1J TJA1029.pdf
TJA1029TK/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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TJA1029TK,118 TJA1029.pdf
TJA1029TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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TEA19161T/2Y TEA19161T.pdf
TEA19161T/2Y
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
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5+4.44 EUR
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25+3 EUR
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MC33689DPEWR2 MC33689.pdf
MC33689DPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
Produkt ist nicht verfügbar
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TDF8590TH/N1TJ TDF8590TH_2.pdf
TDF8590TH/N1TJ
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 160W 24HSOP
Part Status: Obsolete
Supplier Device Package: 24-HSOP
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Voltage - Supply: ±14V ~ 29V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC34674CEPR2 MC34674.pdf
MC34674CEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Mounting Type: Surface Mount
Number of Cells: 1
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Obsolete
Current - Charging: Constant - Programmable
Battery Pack Voltage: 4.2V
Voltage - Supply (Max): 10V
Fault Protection: Over Voltage
Programmable Features: Timer
Charge Current - Max: 650mA
Supplier Device Package: 8-UDFN (3x2)
Battery Chemistry: Lithium Ion/Polymer
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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PCF7941ATSM2AB120, UM10473.pdf
PCF7941ATSM2AB120,
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20SSOP
Antenna Connector: Not Included
Power - Output: 9.8dBm
Data Interface: RS232
Frequency: 315MHz, 434MHz, 868MHz
Part Status: Active
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Data Rate (Max): 4.8kbps
Applications: General Purpose
Voltage - Supply: 2.1V ~ 3.6V
Modulation or Protocol: ASK, FSK, UHF
Features: PLL Frequency Synthesizer and PA
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TJA1022T,118 TJA1022.pdf
TJA1022T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Data Rate: 20kBd
Number of Drivers/Receivers: 2/2
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 14-SO
Protocol: LINbus
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TJA1028TK/5V0/20:1 TJA1028.pdf
TJA1028TK/5V0/20:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Part Status: Active
Duplex: Half
Receiver Hysteresis: 200 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.9V ~ 5.1V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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AFM906NT1 AFM906N.pdf
AFM906NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
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BGS8H2X BGS8H2.pdf
BGS8H2X
Hersteller: NXP USA Inc.
Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 2.3GHz
Noise Figure: 1dB
Current - Supply: 5.8mA
Gain: 12.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Cellular
Frequency: 2.3GHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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TEA1713T/N2,518 TEA1713T.pdf
TEA1713T/N2,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
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BGU8M1X BGU8M1.pdf
BGU8M1X
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.842GHz
Noise Figure: 0.8dB
Current - Supply: 5mA
Gain: 13.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 1.805GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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20+1.09 EUR
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TJA1029T/20/1J TJA1029.pdf
TJA1029T/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TJA1029T,118 TJA1029.pdf
TJA1029T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 1730 Stücke:
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TEA19162T/2J TEA19162T.pdf
TEA19162T/2J
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Current - Startup: 800 µA
Part Status: Active
Supplier Device Package: 8-SO
Mode: Discontinuous Conduction (DCM)
Frequency - Switching: 134kHz
Voltage - Supply: 70 ~ 276 VAC
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 4845 Stücke:
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11+2.03 EUR
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BF513,215 BF510_511_512_513_CNV.pdf
BF513,215
Hersteller: NXP USA Inc.
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050.pdf
MP3V5050GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS1X01_8X01.pdf
HTMS8001FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4869 Stücke:
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22+0.99 EUR
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27+0.79 EUR
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TEA1738T/N1,118 TEA1738T_TEA1738LT.pdf
TEA1738T/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 1371 Stücke:
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SL2S1512FTBX SL2S1412_SL2S1512_SL2S1612.pdf
SL2S1512FTBX
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Cut Tape (CT)
auf Bestellung 9695 Stücke:
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28+0.75 EUR
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BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
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BB156,115 BB156.pdf
BB156,115
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Capacitance Ratio: 3.9
Voltage - Peak Reverse (Max): 10 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C7.5
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
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TEA1731LTS/1,115 TEA1731LTS.pdf
TEA1731LTS/1,115
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
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84+0.25 EUR
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
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MC9S08PL4CTG MC9S08PL4.pdf
MC9S08PL4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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11+1.99 EUR
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96+1.15 EUR
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MC9S08PL60CQH MC9S08AC60.pdf
MC9S08PL60CQH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL16.pdf
MC9S08PL8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16.pdf
MC9S08PL16CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL4.pdf
MC9S08PL16CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
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6+3.8 EUR
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75+2.33 EUR
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SPC5775BDK3MME2 MPC5777C-Datasheet.pdf
SPC5775BDK3MME2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Number of I/O: 293
Part Status: Active
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b eQADCx2
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 220MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
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1+101.6 EUR
10+83.6 EUR
25+79.11 EUR
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MPC5775BE-416DS MPC5777CEVBUG.pdf
MPC5775BE-416DS
Hersteller: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
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1+1344.31 EUR
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TEA19051BABTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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TEA19051BACTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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TEA19051BAFTK/1J TEA19051BTK.pdf
TEA19051BAFTK/1J
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB MC33771B_SDS.pdf
FRDM33771BSPIEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
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AnzahlPrivatkunde
1+510.3 EUR
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K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 191-WLCSP (5.97x5.85)
Peripherals: Bluetooth, DMA, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D - 12bit; D/A - 12bit
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Program Memory Size: 1.25MB (1.25M x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Part Status: Obsolete
Supplier Device Package: 144-HLQFP (20x20)
Clock Rate: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Type: Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5
SPC5744PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R
SPC5744PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP PF1550.pdf
MC34PF1550A7EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 PF1550.pdf
MC34PF1550A7EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+5.58 EUR
Mindestbestellmenge: 5000 Stücke
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FRDM-PF1550EVM PF1550.pdf
FRDM-PF1550EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+543.63 EUR
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4682 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.25 EUR
10+6.26 EUR
25+5.75 EUR
100+5.2 EUR
250+4.94 EUR
500+4.78 EUR
1000+4.65 EUR
2500+4.52 EUR
Mindestbestellmenge: 3 Stücke
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3320 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.15 EUR
10+6.97 EUR
25+6.43 EUR
100+5.83 EUR
250+5.53 EUR
500+5.45 EUR
Mindestbestellmenge: 3 Stücke
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MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.95 EUR
10+7.6 EUR
25+7.01 EUR
100+6.37 EUR
250+6.1 EUR
Mindestbestellmenge: 3 Stücke
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MC32PF1550A1EPR2 PF1550.pdf
MC32PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.72 EUR
10+9.63 EUR
25+9.1 EUR
100+7.89 EUR
250+7.49 EUR
500+6.72 EUR
1000+5.66 EUR
2500+5.38 EUR
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MC32PF1550A3EPR2 PF1550.pdf
MC32PF1550A3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A1EPR2 PF1550.pdf
MC34PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A4EPR2 PF1550.pdf
MC34PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1003AVLHR MWCT1001A3AFS.pdf
MWCT1003AVLHR
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Supplier Device Package: 64-LQFP (10x10)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MKW41Z512VHT4R MKW41Z512.pdf
MKW41Z512VHT4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+16.8 EUR
10+13.04 EUR
25+12.11 EUR
100+11.08 EUR
250+10.76 EUR
Mindestbestellmenge: 2 Stücke
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