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MP3V5050GC6T1 MP3V5050GC6T1 NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSIG 0.13" 2.82V
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS8001FTB/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4869 Stücke:
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22+0.83 EUR
26+0.7 EUR
27+0.66 EUR
100+0.6 EUR
250+0.57 EUR
500+0.55 EUR
1000+0.52 EUR
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TEA1738T/N1,118 TEA1738T/N1,118 NXP USA Inc. TEA1738T_TEA1738LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 1371 Stücke:
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11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
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SL2S1512FTBX SL2S1512FTBX NXP USA Inc. SL2S1412_SL2S1512_SL2S1612.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Cut Tape (CT)
auf Bestellung 9695 Stücke:
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28+0.63 EUR
33+0.55 EUR
34+0.52 EUR
100+0.47 EUR
250+0.45 EUR
500+0.43 EUR
1000+0.41 EUR
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BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
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BB156,115 BB156,115 NXP USA Inc. BB156.pdf Description: DIODE VAR CAP 10V 20MA SOD323
Capacitance Ratio: 3.9
Voltage - Peak Reverse (Max): 10 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C7.5
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
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TEA1731LTS/1,115 TEA1731LTS/1,115 NXP USA Inc. TEA1731LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
auf Bestellung 7720 Stücke:
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84+0.21 EUR
124+0.14 EUR
141+0.13 EUR
167+0.11 EUR
250+0.097 EUR
500+0.091 EUR
1000+0.087 EUR
2500+0.082 EUR
5000+0.079 EUR
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4CTG NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 3957 Stücke:
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11+1.67 EUR
15+1.21 EUR
96+0.97 EUR
192+0.92 EUR
288+0.9 EUR
576+0.86 EUR
1056+0.84 EUR
2592+0.8 EUR
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MC9S08PL60CQH MC9S08PL60CQH NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL8CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL16CTJ NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
auf Bestellung 868 Stücke:
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6+3.19 EUR
10+2.35 EUR
75+1.96 EUR
150+1.87 EUR
300+1.79 EUR
525+1.74 EUR
Mindestbestellmenge: 6 Stücke
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SPC5775BDK3MME2 SPC5775BDK3MME2 NXP USA Inc. MPC5777C-Datasheet.pdf Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Number of I/O: 293
Part Status: Active
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b eQADCx2
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 220MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 112 Stücke:
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1+85.38 EUR
10+70.25 EUR
25+66.48 EUR
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MPC5775BE-416DS MPC5775BE-416DS NXP USA Inc. MPC5777CEVBUG.pdf Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
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1+1129.67 EUR
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TEA19051BABTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BACTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BAFTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB FRDM33771BSPIEVB NXP USA Inc. MC33771B_SDS.pdf Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
auf Bestellung 1 Stücke:
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1+376.29 EUR
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K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 191-WLCSP (5.97x5.85)
Peripherals: Bluetooth, DMA, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D - 12bit; D/A - 12bit
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Program Memory Size: 1.25MB (1.25M x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Part Status: Obsolete
Supplier Device Package: 144-HLQFP (20x20)
Clock Rate: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Type: Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5 SPC5744PK1MLQ5 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R SPC5744PK1MLQ5R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP MC34PF1550A7EP NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 MC34PF1550A7EPR2 NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+4.69 EUR
Mindestbestellmenge: 5000 Stücke
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FRDM-PF1550EVM FRDM-PF1550EVM NXP USA Inc. PF1550.pdf Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
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1+456.83 EUR
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4682 Stücke:
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3+6.93 EUR
10+5.26 EUR
25+4.83 EUR
100+4.37 EUR
250+4.15 EUR
500+4.02 EUR
1000+3.91 EUR
2500+3.8 EUR
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3320 Stücke:
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3+7.69 EUR
10+5.86 EUR
25+5.4 EUR
100+4.9 EUR
250+4.65 EUR
500+4.58 EUR
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MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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10+6.39 EUR
25+5.89 EUR
100+5.35 EUR
250+5.13 EUR
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MC32PF1550A1EPR2 MC32PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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Lieferzeit 10-14 Tag (e)
2+9.01 EUR
10+8.09 EUR
25+7.65 EUR
100+6.63 EUR
250+6.29 EUR
500+5.65 EUR
1000+4.76 EUR
2500+4.52 EUR
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MC32PF1550A3EPR2 MC32PF1550A3EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A1EPR2 MC34PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A4EPR2 MC34PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1003AVLHR MWCT1003AVLHR NXP USA Inc. MWCT1001A3AFS.pdf Description: 5W MULTI-COIL AUTO 5V PREMIUM
Supplier Device Package: 64-LQFP (10x10)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MKW41Z512VHT4R MKW41Z512VHT4R NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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2+13.69 EUR
10+10.63 EUR
25+9.87 EUR
100+9.03 EUR
250+8.76 EUR
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PCT2075GV/N005X PCT2075GV/N005X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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PCT2075GV/P110X PCT2075GV/P110X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/N005X PCT2075GV/N005X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075GV/P110X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
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MIMXRT1060-EVK MIMXRT1060-EVK NXP USA Inc. IMXRT1060IEC.pdf Description: I.MX RT1060 EVAL BRD
Utilized IC / Part: i.MX RT1060
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
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MIMXRT1062DVL6A MIMXRT1062DVL6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062CVL5A MIMXRT1062CVL5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1051DVJ6B MIMXRT1051DVJ6B NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 512K x 8
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Active
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
DigiKey Programmable: Not Verified
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2+11.9 EUR
10+9.41 EUR
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MIMXRT1052CVJ5B MIMXRT1052CVJ5B NXP USA Inc. IMXRT1050IEC.pdf Description: IC MCU 32BIT 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 512K x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
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1+18.25 EUR
10+14.4 EUR
25+13.44 EUR
189+13.02 EUR
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MIMXRT1052DVJ6B MIMXRT1052DVJ6B NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
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2+17.18 EUR
10+13.44 EUR
25+12.5 EUR
189+11.12 EUR
378+10.8 EUR
567+10.64 EUR
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MIMXRT1061DVL6A MIMXRT1061DVL6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVL5A MIMXRT1061CVL5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 240 Stücke
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FS32R372SDK0MMMT FS32R372SDK0MMMT NXP USA Inc. S32R372.pdf Description: IC MCU RADAR S32R LFBGA257
DigiKey Programmable: Not Verified
Grade: Automotive
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
auf Bestellung 753 Stücke:
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10+73.43 EUR
80+63.76 EUR
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FS32R372SEK0MMMT FS32R372SEK0MMMT NXP USA Inc. Description: S32R RADAR MICROCONTROLLER - S32
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 760 Stücke
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S32R372141EVB NXP USA Inc. S32R372DS.pdf Description: S32R372 EVAL BRD
Part Status: Active
Utilized IC / Part: S32R372
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 4 Stücke:
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1+688.48 EUR
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S32R372RRSEVB S32R372RRSEVB NXP USA Inc. S32R372DS.pdf Description: S32R372 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S32R372
Contents: Board(s)
auf Bestellung 4 Stücke:
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1+607.92 EUR
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PN7360AUEV/C300E PN7360AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
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2+13.87 EUR
10+12.04 EUR
25+11.4 EUR
100+10.53 EUR
490+9.65 EUR
980+9.31 EUR
1470+9.11 EUR
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PN7362AUEV/C300E PN7362AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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1+19.54 EUR
10+16.98 EUR
25+16.09 EUR
100+14.87 EUR
490+13.64 EUR
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MP3V5050GC6T1 MP3V5050.pdf
MP3V5050GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS1X01_8X01.pdf
HTMS8001FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4869 Stücke:
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22+0.83 EUR
26+0.7 EUR
27+0.66 EUR
100+0.6 EUR
250+0.57 EUR
500+0.55 EUR
1000+0.52 EUR
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TEA1738T/N1,118 TEA1738T_TEA1738LT.pdf
TEA1738T/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
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11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
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SL2S1512FTBX SL2S1412_SL2S1512_SL2S1612.pdf
SL2S1512FTBX
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Cut Tape (CT)
auf Bestellung 9695 Stücke:
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28+0.63 EUR
33+0.55 EUR
34+0.52 EUR
100+0.47 EUR
250+0.45 EUR
500+0.43 EUR
1000+0.41 EUR
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BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
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BB156,115 BB156.pdf
BB156,115
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Capacitance Ratio: 3.9
Voltage - Peak Reverse (Max): 10 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C7.5
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS.pdf
TEA1731LTS/1,115
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
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AnzahlPreis
84+0.21 EUR
124+0.14 EUR
141+0.13 EUR
167+0.11 EUR
250+0.097 EUR
500+0.091 EUR
1000+0.087 EUR
2500+0.082 EUR
5000+0.079 EUR
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
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MC9S08PL4CTG MC9S08PL4.pdf
MC9S08PL4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 3957 Stücke:
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AnzahlPreis
11+1.67 EUR
15+1.21 EUR
96+0.97 EUR
192+0.92 EUR
288+0.9 EUR
576+0.86 EUR
1056+0.84 EUR
2592+0.8 EUR
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MC9S08PL60CQH MC9S08PL60.pdf
MC9S08PL60CQH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL16.pdf
MC9S08PL8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16.pdf
MC9S08PL16CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL4.pdf
MC9S08PL16CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
auf Bestellung 868 Stücke:
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AnzahlPreis
6+3.19 EUR
10+2.35 EUR
75+1.96 EUR
150+1.87 EUR
300+1.79 EUR
525+1.74 EUR
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SPC5775BDK3MME2 MPC5777C-Datasheet.pdf
SPC5775BDK3MME2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Number of I/O: 293
Part Status: Active
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b eQADCx2
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 220MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 112 Stücke:
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1+85.38 EUR
10+70.25 EUR
25+66.48 EUR
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MPC5775BE-416DS MPC5777CEVBUG.pdf
MPC5775BE-416DS
Hersteller: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
auf Bestellung 1 Stücke:
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1+1129.67 EUR
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TEA19051BABTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BACTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BTK.pdf
TEA19051BAFTK/1J
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB MC33771B_SDS.pdf
FRDM33771BSPIEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
auf Bestellung 1 Stücke:
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AnzahlPreis
1+376.29 EUR
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K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 191-WLCSP (5.97x5.85)
Peripherals: Bluetooth, DMA, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D - 12bit; D/A - 12bit
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Program Memory Size: 1.25MB (1.25M x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Part Status: Obsolete
Supplier Device Package: 144-HLQFP (20x20)
Clock Rate: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Type: Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5
SPC5744PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R
SPC5744PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP PF1550.pdf
MC34PF1550A7EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 PF1550.pdf
MC34PF1550A7EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5000+4.69 EUR
Mindestbestellmenge: 5000 Stücke
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FRDM-PF1550EVM PF1550.pdf
FRDM-PF1550EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
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AnzahlPreis
1+456.83 EUR
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4682 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+6.93 EUR
10+5.26 EUR
25+4.83 EUR
100+4.37 EUR
250+4.15 EUR
500+4.02 EUR
1000+3.91 EUR
2500+3.8 EUR
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3320 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.69 EUR
10+5.86 EUR
25+5.4 EUR
100+4.9 EUR
250+4.65 EUR
500+4.58 EUR
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MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.36 EUR
10+6.39 EUR
25+5.89 EUR
100+5.35 EUR
250+5.13 EUR
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MC32PF1550A1EPR2 PF1550.pdf
MC32PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.01 EUR
10+8.09 EUR
25+7.65 EUR
100+6.63 EUR
250+6.29 EUR
500+5.65 EUR
1000+4.76 EUR
2500+4.52 EUR
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MC32PF1550A3EPR2 PF1550.pdf
MC32PF1550A3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A1EPR2 PF1550.pdf
MC34PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A4EPR2 PF1550.pdf
MC34PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1003AVLHR MWCT1001A3AFS.pdf
MWCT1003AVLHR
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Supplier Device Package: 64-LQFP (10x10)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MKW41Z512VHT4R MKW41Z512.pdf
MKW41Z512VHT4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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AnzahlPreis
2+13.69 EUR
10+10.63 EUR
25+9.87 EUR
100+9.03 EUR
250+8.76 EUR
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PCT2075GV/N005X PCT2075.pdf
PCT2075GV/N005X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075.pdf
PCT2075GV/P110X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/N005X PCT2075.pdf
PCT2075GV/N005X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075.pdf
PCT2075GV/P110X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 6-TSOP
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: SC-74, SOT-457
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
auf Bestellung 23 Stücke:
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AnzahlPreis
17+1.09 EUR
20+0.92 EUR
21+0.86 EUR
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MIMXRT1060-EVK IMXRT1060IEC.pdf
MIMXRT1060-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD
Utilized IC / Part: i.MX RT1060
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
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1+191 EUR
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MIMXRT1062DVL6A IMXRT1060CEC.pdf
MIMXRT1062DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062CVL5A IMXRT1060IEC.pdf
MIMXRT1062CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1051DVJ6B IMXRT1050CEC.pdf
MIMXRT1051DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 512K x 8
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Number of I/O: 127
Part Status: Active
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
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2+11.9 EUR
10+9.41 EUR
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MIMXRT1052CVJ5B IMXRT1050IEC.pdf
MIMXRT1052CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 512K x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
auf Bestellung 932 Stücke:
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AnzahlPreis
1+18.25 EUR
10+14.4 EUR
25+13.44 EUR
189+13.02 EUR
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MIMXRT1052DVJ6B IMXRT1050CEC.pdf
MIMXRT1052DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1016 Stücke:
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AnzahlPreis
2+17.18 EUR
10+13.44 EUR
25+12.5 EUR
189+11.12 EUR
378+10.8 EUR
567+10.64 EUR
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MIMXRT1061DVL6A IMXRT1060CEC.pdf
MIMXRT1061DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVL5A IMXRT1060IEC.pdf
MIMXRT1061CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 240 Stücke
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FS32R372SDK0MMMT S32R372.pdf
FS32R372SDK0MMMT
Hersteller: NXP USA Inc.
Description: IC MCU RADAR S32R LFBGA257
DigiKey Programmable: Not Verified
Grade: Automotive
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
auf Bestellung 753 Stücke:
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1+90.52 EUR
10+73.43 EUR
80+63.76 EUR
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FS32R372SEK0MMMT
FS32R372SEK0MMMT
Hersteller: NXP USA Inc.
Description: S32R RADAR MICROCONTROLLER - S32
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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S32R372141EVB S32R372DS.pdf
Hersteller: NXP USA Inc.
Description: S32R372 EVAL BRD
Part Status: Active
Utilized IC / Part: S32R372
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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1+688.48 EUR
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S32R372RRSEVB S32R372DS.pdf
S32R372RRSEVB
Hersteller: NXP USA Inc.
Description: S32R372 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S32R372
Contents: Board(s)
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1+607.92 EUR
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PN7360AUEV/C300E PN7462.pdf
PN7360AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.87 EUR
10+12.04 EUR
25+11.4 EUR
100+10.53 EUR
490+9.65 EUR
980+9.31 EUR
1470+9.11 EUR
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PN7362AUEV/C300E PN7462.pdf
PN7362AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 581 Stücke:
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AnzahlPreis
1+19.54 EUR
10+16.98 EUR
25+16.09 EUR
100+14.87 EUR
490+13.64 EUR
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