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BGU8M1X BGU8M1X NXP USA Inc. BGU8M1.pdf Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1370 Stücke:
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20+0.92 EUR
22+0.82 EUR
25+0.74 EUR
100+0.65 EUR
250+0.57 EUR
500+0.5 EUR
1000+0.4 EUR
Mindestbestellmenge: 20
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TJA1029T/20/1J TJA1029T/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TJA1029T,118 TJA1029T,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2069 Stücke:
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9+2.11 EUR
10+1.89 EUR
25+1.79 EUR
100+1.47 EUR
250+1.37 EUR
500+1.21 EUR
1000+0.96 EUR
Mindestbestellmenge: 9
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TEA19162T/2J TEA19162T/2J NXP USA Inc. TEA19162T.pdf Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
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250+0.93 EUR
500+0.89 EUR
1000+0.86 EUR
Mindestbestellmenge: 11
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MP3V5050GC6T1 MP3V5050GC6T1 NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS8001FTB/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4897 Stücke:
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28+0.65 EUR
29+0.61 EUR
100+0.56 EUR
250+0.53 EUR
500+0.51 EUR
1000+0.48 EUR
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TEA1738T/N1,118 TEA1738T/N1,118 NXP USA Inc. TEA1738T_TEA1738LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 1371 Stücke:
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250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
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SL2S1512FTBX SL2S1512FTBX NXP USA Inc. SL2S1412_SL2S1512_SL2S1612.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 9695 Stücke:
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33+0.55 EUR
34+0.52 EUR
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250+0.45 EUR
500+0.43 EUR
1000+0.41 EUR
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BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
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BB156,115 BB156,115 NXP USA Inc. BB156.pdf Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS/1,115 NXP USA Inc. TEA1731LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
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124+0.14 EUR
141+0.13 EUR
167+0.11 EUR
250+0.097 EUR
500+0.091 EUR
1000+0.087 EUR
2500+0.082 EUR
5000+0.079 EUR
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4CTG NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3957 Stücke:
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11+1.67 EUR
15+1.21 EUR
96+0.97 EUR
192+0.92 EUR
288+0.9 EUR
576+0.86 EUR
1056+0.84 EUR
2592+0.8 EUR
Mindestbestellmenge: 11
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MC9S08PL60CQH MC9S08PL60CQH NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL8CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL16CTJ NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 868 Stücke:
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6+3.19 EUR
10+2.35 EUR
75+1.96 EUR
150+1.87 EUR
300+1.79 EUR
525+1.74 EUR
Mindestbestellmenge: 6
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SPC5775BDK3MME2 SPC5775BDK3MME2 NXP USA Inc. MPC5775BEFS.pdf Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
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1+61.42 EUR
10+50.29 EUR
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MPC5775BE-416DS MPC5775BE-416DS NXP USA Inc. MPC5777CEVBUG.pdf Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
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1+1129.67 EUR
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TEA19051BABTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BACTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BAFTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB FRDM33771BSPIEVB NXP USA Inc. MC33771B_SDS.pdf Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
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1+376.29 EUR
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K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5 SPC5744PK1MLQ5 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R SPC5744PK1MLQ5R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP MC34PF1550A7EP NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 MC34PF1550A7EPR2 NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+4.69 EUR
Mindestbestellmenge: 5000
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FRDM-PF1550EVM FRDM-PF1550EVM NXP USA Inc. PF1550.pdf Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4682 Stücke:
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100+4.37 EUR
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500+4.02 EUR
1000+3.91 EUR
2500+3.8 EUR
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3320 Stücke:
Lieferzeit 10-14 Tag (e)
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MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 14500 Stücke:
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100+5.35 EUR
250+5.13 EUR
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MC32PF1550A1EPR2 MC32PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
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10+8.09 EUR
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1000+4.76 EUR
2500+4.52 EUR
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MC32PF1550A3EPR2 MC32PF1550A3EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF1550A1EPR2 MC34PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A4EPR2 MC34PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1003AVLHR MWCT1003AVLHR NXP USA Inc. MWCT1001A3AFS.pdf Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MKW41Z512VHT4R MKW41Z512VHT4R NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.69 EUR
10+10.63 EUR
25+9.87 EUR
100+9.03 EUR
250+8.76 EUR
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PCT2075GV/N005X PCT2075GV/N005X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075GV/P110X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/N005X PCT2075GV/N005X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075GV/P110X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 23 Stücke:
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17+1.09 EUR
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Mindestbestellmenge: 17
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MIMXRT1060-EVK MIMXRT1060-EVK NXP USA Inc. IMXRT1060IEC.pdf Description: I.MX RT1060 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
auf Bestellung 3 Stücke:
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1+191 EUR
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MIMXRT1062DVL6A MIMXRT1062DVL6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062CVL5A MIMXRT1062CVL5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1051DVJ6B MIMXRT1051DVJ6B NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.9 EUR
10+9.41 EUR
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MIMXRT1052CVJ5B MIMXRT1052CVJ5B NXP USA Inc. IMXRT1050IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 932 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.25 EUR
10+14.4 EUR
25+13.44 EUR
189+13.02 EUR
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MIMXRT1052DVJ6B MIMXRT1052DVJ6B NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1016 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.18 EUR
10+13.44 EUR
25+12.5 EUR
189+11.12 EUR
378+10.8 EUR
567+10.64 EUR
Mindestbestellmenge: 2
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MIMXRT1061DVL6A MIMXRT1061DVL6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVL5A MIMXRT1061CVL5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
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FS32R372SDK0MMMT FS32R372SDK0MMMT NXP USA Inc. S32R372.pdf Description: IC MCU RADAR S32R LFBGA257
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
auf Bestellung 753 Stücke:
Lieferzeit 10-14 Tag (e)
1+90.52 EUR
10+73.43 EUR
80+63.76 EUR
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FS32R372SEK0MMMT FS32R372SEK0MMMT NXP USA Inc. Description: S32R RADAR MICROCONTROLLER - S32
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
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BGU8M1X BGU8M1.pdf
BGU8M1X
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
20+0.92 EUR
22+0.82 EUR
25+0.74 EUR
100+0.65 EUR
250+0.57 EUR
500+0.5 EUR
1000+0.4 EUR
Mindestbestellmenge: 20
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TJA1029T/20/1J TJA1029.pdf
TJA1029T/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TJA1029T,118 TJA1029.pdf
TJA1029T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2069 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.11 EUR
10+1.89 EUR
25+1.79 EUR
100+1.47 EUR
250+1.37 EUR
500+1.21 EUR
1000+0.96 EUR
Mindestbestellmenge: 9
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TEA19162T/2J TEA19162T.pdf
TEA19162T/2J
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
auf Bestellung 4845 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.71 EUR
15+1.24 EUR
25+1.12 EUR
100+0.99 EUR
250+0.93 EUR
500+0.89 EUR
1000+0.86 EUR
Mindestbestellmenge: 11
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MP3V5050GC6T1 MP3V5050.pdf
MP3V5050GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS1X01_8X01.pdf
HTMS8001FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4897 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+0.76 EUR
28+0.65 EUR
29+0.61 EUR
100+0.56 EUR
250+0.53 EUR
500+0.51 EUR
1000+0.48 EUR
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TEA1738T/N1,118 TEA1738T_TEA1738LT.pdf
TEA1738T/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 1371 Stücke:
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11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
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SL2S1512FTBX SL2S1412_SL2S1512_SL2S1612.pdf
SL2S1512FTBX
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 9695 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
28+0.63 EUR
33+0.55 EUR
34+0.52 EUR
100+0.47 EUR
250+0.45 EUR
500+0.43 EUR
1000+0.41 EUR
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BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
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BB156,115 BB156.pdf
BB156,115
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS.pdf
TEA1731LTS/1,115
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7720 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
84+0.21 EUR
124+0.14 EUR
141+0.13 EUR
167+0.11 EUR
250+0.097 EUR
500+0.091 EUR
1000+0.087 EUR
2500+0.082 EUR
5000+0.079 EUR
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4.pdf
MC9S08PL4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.67 EUR
15+1.21 EUR
96+0.97 EUR
192+0.92 EUR
288+0.9 EUR
576+0.86 EUR
1056+0.84 EUR
2592+0.8 EUR
Mindestbestellmenge: 11
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MC9S08PL60CQH MC9S08PL60.pdf
MC9S08PL60CQH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL16.pdf
MC9S08PL8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16.pdf
MC9S08PL16CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL4.pdf
MC9S08PL16CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 868 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.19 EUR
10+2.35 EUR
75+1.96 EUR
150+1.87 EUR
300+1.79 EUR
525+1.74 EUR
Mindestbestellmenge: 6
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SPC5775BDK3MME2 MPC5775BEFS.pdf
SPC5775BDK3MME2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+61.42 EUR
10+50.29 EUR
25+48.71 EUR
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MPC5775BE-416DS MPC5777CEVBUG.pdf
MPC5775BE-416DS
Hersteller: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1129.67 EUR
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TEA19051BABTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BACTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BTK.pdf
TEA19051BAFTK/1J
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB MC33771B_SDS.pdf
FRDM33771BSPIEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+376.29 EUR
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K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5
SPC5744PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R
SPC5744PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP PF1550.pdf
MC34PF1550A7EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 PF1550.pdf
MC34PF1550A7EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+4.69 EUR
Mindestbestellmenge: 5000
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FRDM-PF1550EVM PF1550.pdf
FRDM-PF1550EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+456.83 EUR
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4682 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.93 EUR
10+5.26 EUR
25+4.83 EUR
100+4.37 EUR
250+4.15 EUR
500+4.02 EUR
1000+3.91 EUR
2500+3.8 EUR
Mindestbestellmenge: 3
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3320 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.69 EUR
10+5.86 EUR
25+5.4 EUR
100+4.9 EUR
250+4.65 EUR
500+4.58 EUR
Mindestbestellmenge: 3
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MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.36 EUR
10+6.39 EUR
25+5.89 EUR
100+5.35 EUR
250+5.13 EUR
Mindestbestellmenge: 3
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MC32PF1550A1EPR2 PF1550.pdf
MC32PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.01 EUR
10+8.09 EUR
25+7.65 EUR
100+6.63 EUR
250+6.29 EUR
500+5.65 EUR
1000+4.76 EUR
2500+4.52 EUR
Mindestbestellmenge: 2
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MC32PF1550A3EPR2 PF1550.pdf
MC32PF1550A3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A1EPR2 PF1550.pdf
MC34PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A4EPR2 PF1550.pdf
MC34PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1003AVLHR MWCT1001A3AFS.pdf
MWCT1003AVLHR
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MKW41Z512VHT4R MKW41Z512.pdf
MKW41Z512VHT4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.69 EUR
10+10.63 EUR
25+9.87 EUR
100+9.03 EUR
250+8.76 EUR
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PCT2075GV/N005X PCT2075.pdf
PCT2075GV/N005X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075.pdf
PCT2075GV/P110X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/N005X PCT2075.pdf
PCT2075GV/N005X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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PCT2075GV/P110X PCT2075.pdf
PCT2075GV/P110X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
17+1.09 EUR
20+0.92 EUR
21+0.86 EUR
Mindestbestellmenge: 17
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MIMXRT1060-EVK IMXRT1060IEC.pdf
MIMXRT1060-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+191 EUR
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MIMXRT1062DVL6A IMXRT1060CEC.pdf
MIMXRT1062DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062CVL5A IMXRT1060IEC.pdf
MIMXRT1062CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1051DVJ6B IMXRT1050CEC.pdf
MIMXRT1051DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.9 EUR
10+9.41 EUR
Mindestbestellmenge: 2
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MIMXRT1052CVJ5B IMXRT1050IEC.pdf
MIMXRT1052CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 932 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.25 EUR
10+14.4 EUR
25+13.44 EUR
189+13.02 EUR
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MIMXRT1052DVJ6B IMXRT1050CEC.pdf
MIMXRT1052DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1016 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.18 EUR
10+13.44 EUR
25+12.5 EUR
189+11.12 EUR
378+10.8 EUR
567+10.64 EUR
Mindestbestellmenge: 2
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MIMXRT1061DVL6A IMXRT1060CEC.pdf
MIMXRT1061DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVL5A IMXRT1060IEC.pdf
MIMXRT1061CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
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FS32R372SDK0MMMT S32R372.pdf
FS32R372SDK0MMMT
Hersteller: NXP USA Inc.
Description: IC MCU RADAR S32R LFBGA257
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
auf Bestellung 753 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+90.52 EUR
10+73.43 EUR
80+63.76 EUR
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FS32R372SEK0MMMT
FS32R372SEK0MMMT
Hersteller: NXP USA Inc.
Description: S32R RADAR MICROCONTROLLER - S32
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
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