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MC9S08PL60CLD MC9S08PL60CLD NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL32CLD MC9S08PL32CLD NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 98 Stücke:
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3+7.02 EUR
10+5.47 EUR
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S12ZVMAEVB S12ZVMAEVB NXP USA Inc. S12ZVMAEVB_QSG.pdf Description: S12ZVMA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Utilized IC / Part: S12ZVMA
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1+662.69 EUR
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MRF13750H-1300 MRF13750H-1300 NXP USA Inc. MRF13750H.pdf Description: MRF13750H REF BRD 1300MHZ 700W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 1.3GHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 3 Stücke:
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1+2701.88 EUR
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MCIMX7ULP-EVK MCIMX7ULP-EVK NXP USA Inc. IMX7ULPWSG.pdf Description: I.MX 7ULP EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-A7, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 7ULP
Part Status: Active
auf Bestellung 26 Stücke:
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TJA1128CTK/0Z TJA1128CTK/0Z NXP USA Inc. TJA1128-DS.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
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TJA1128FTK/0Z TJA1128FTK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 14418 Stücke:
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7+3.47 EUR
10+2.56 EUR
25+2.33 EUR
100+2.07 EUR
250+1.95 EUR
500+1.88 EUR
1000+1.82 EUR
2500+1.76 EUR
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TJA1044VTKZ TJA1044VTKZ NXP USA Inc. TJA1044V.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10776 Stücke:
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9+2.51 EUR
12+1.83 EUR
25+1.65 EUR
100+1.46 EUR
250+1.38 EUR
500+1.32 EUR
1000+1.31 EUR
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TJA1044VT/3Z TJA1044VT/3Z NXP USA Inc. TJA1044V.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 813 Stücke:
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11+2.03 EUR
15+1.46 EUR
25+1.32 EUR
100+1.17 EUR
250+1.09 EUR
500+1.05 EUR
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TJA1044VTK/3Z TJA1044VTK/3Z NXP USA Inc. TJA1044V.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 8659 Stücke:
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11+2.03 EUR
15+1.46 EUR
25+1.32 EUR
100+1.17 EUR
250+1.09 EUR
500+1.05 EUR
1000+1.02 EUR
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TJA1044VTZ TJA1044VTZ NXP USA Inc. TJA1044V.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3266 Stücke:
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11+2.03 EUR
15+1.46 EUR
25+1.32 EUR
100+1.17 EUR
250+1.09 EUR
500+1.05 EUR
1000+1.02 EUR
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TJA1046VTKZ TJA1046VTKZ NXP USA Inc. TJA1046V.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 13475 Stücke:
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5+5.07 EUR
10+3.78 EUR
25+3.46 EUR
100+3.11 EUR
250+2.94 EUR
500+2.84 EUR
1000+2.76 EUR
2500+2.67 EUR
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TJA1124AHG/0Z TJA1124AHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5435 Stücke:
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4+5.78 EUR
10+4.32 EUR
25+3.96 EUR
100+3.56 EUR
250+3.37 EUR
500+3.26 EUR
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SJA1124AHG/0Z SJA1124AHG/0Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5363 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.15 EUR
10+6.18 EUR
25+5.68 EUR
100+5.14 EUR
250+4.88 EUR
500+4.78 EUR
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BAP64LX/Z,315 BAP64LX/Z,315 NXP USA Inc. BAP64LX_Rev2018.pdf Description: RF DIODE PIN 60V 150MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Grade: Automotive
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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SPC5602DF1VLH4R SPC5602DF1VLH4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.11 EUR
10+18.99 EUR
25+17.71 EUR
100+16.3 EUR
250+15.64 EUR
500+15.23 EUR
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LPC2134FBD64/01,11 LPC2134FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1835 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.89 EUR
10+24.54 EUR
25+22.94 EUR
100+21.21 EUR
250+20.37 EUR
500+19.87 EUR
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SP5746CSK1AMKU6R SP5746CSK1AMKU6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.35 EUR
10+47.28 EUR
25+44.52 EUR
100+41.47 EUR
250+40.02 EUR
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MCIMX6S5DVM10ACR MCIMX6S5DVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 578 Stücke:
Lieferzeit 10-14 Tag (e)
1+83.97 EUR
10+68.72 EUR
25+64.91 EUR
100+63.26 EUR
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S9S08DZ60F2VLCR S9S08DZ60F2VLCR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 795 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.07 EUR
10+16.52 EUR
25+15.39 EUR
100+14.13 EUR
250+13.86 EUR
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MCIMX283CVM4BR2 MCIMX283CVM4BR2 NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 425 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.65 EUR
10+39.16 EUR
25+36.78 EUR
100+34.62 EUR
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MCF51JM128VLHR MCF51JM128VLHR NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 3193 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.24 EUR
10+26.42 EUR
25+24.7 EUR
100+22.84 EUR
250+22.79 EUR
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PCF7953MTTC1AC2200 PCF7953MTTC1AC2200 NXP USA Inc. 75017275.pdf?fsrch=1&sr=1&pageNum=1 Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2092 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.48 EUR
10+19.24 EUR
25+17.93 EUR
100+16.49 EUR
250+15.82 EUR
500+15.4 EUR
1000+15.36 EUR
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PCF7953XTTC1AC2000 PCF7953XTTC1AC2000 NXP USA Inc. Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7953PTTM1AC1800 PCF7953PTTM1AC1800 NXP USA Inc. Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SH4MTGR MC9S08SH4MTGR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 5300 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.84 EUR
10+6.71 EUR
25+6.19 EUR
100+5.6 EUR
250+5.32 EUR
500+5.15 EUR
1000+5.02 EUR
2500+4.87 EUR
Mindestbestellmenge: 3 Stücke
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S9S08DZ32F2VLCR S9S08DZ32F2VLCR NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
Number of I/O: 25
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX283DVM4BR2 MCIMX283DVM4BR2 NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MRFG35003N6AT1 MRFG35003N6AT1 NXP USA Inc. MRFG35003N6A.pdf Description: RF MOSFET PHEMT FET 6V PLD-1.5
Current - Test: 180 mA
Voltage - Test: 6 V
Voltage - Rated: 8 V
Part Status: Obsolete
Supplier Device Package: PLD-1.5
Technology: pHEMT FET
Gain: 10dB
Power - Output: 450mW
Frequency: 3.55GHz
Mounting Type: Surface Mount
Package / Case: PLD-1.5
Packaging: Cut Tape (CT)
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MRFE6VP61K25HSR5 MRFE6VP61K25HSR5 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MC33984CHFKR2 MC33984CHFKR2 NXP USA Inc. MC33984.pdf Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 16-PowerQFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Cut Tape (CT)
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 16-PQFN (12x12)
Ratio - Input:Output: 1:2
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 6V ~ 27V
Rds On (Typ): 4mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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MCIMX280DVM4BR MCIMX280DVM4BR NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
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PCF7952XTT/C1CC170 PCF7952XTT/C1CC170 NXP USA Inc. Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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1000+11.29 EUR
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UJA1168TK,118 UJA1168TK,118 NXP USA Inc. Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Produkt ist nicht verfügbar
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MC56F82746VLFR MC56F82746VLFR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
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FXTH8709116T1 FXTH8709116T1 NXP USA Inc. www.nxp.com Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 1957 Stücke:
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500+10.66 EUR
1000+9.96 EUR
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S9S12XS128J1CAER S9S12XS128J1CAER NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GA128F0MLFR S9S12GA128F0MLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MCF51EM256CLLR MCF51EM256CLLR NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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MC33981BHFKR2 MC33981BHFKR2 NXP USA Inc. MC33981.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK20DN512VLK10R MK20DN512VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 996 Stücke:
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MC9S08GT16ACFDER MC9S08GT16ACFDER NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Verified
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MC33932VWR2 MC33932VWR2 NXP USA Inc. MC33932.pdf Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Cut Tape (CT)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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TEF6614T/V1,518 TEF6614T/V1,518 NXP USA Inc. TEF6614T_Web.pdf Description: RF RCVR AM/FM/RDS 32SO
Packaging: Cut Tape (CT)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, RDS
Data Interface: PCB, Surface Mount
Voltage - Supply: 8.5V
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF7961XTT/D1AE09J PCF7961XTT/D1AE09J NXP USA Inc. 75017269.pdf Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 91 Stücke:
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S9S12P128J0VFTR S9S12P128J0VFTR NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MK10DN512VLK10R MK10DN512VLK10R NXP USA Inc. K10P81M100SF2V2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 31x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
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PCF7961ATT/D1AC07J PCF7961ATT/D1AC07J NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 20-TSSOP
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TFF1007HN/N1,115 TFF1007HN/N1,115 NXP USA Inc. TFF1007HN.pdf Description: IC FREQ GENERATOR LN 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 15GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
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MC9S08QB8CTGR MC9S08QB8CTGR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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S912XEG128W1VAAR S912XEG128W1VAAR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0VLQ6R SPC5605BK0VLQ6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1048TK,118 TJA1048TK,118 NXP USA Inc. TJA1048.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 9042 Stücke:
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UJA1162TK,118 UJA1162TK,118 NXP USA Inc. UJA1162.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 3.3V ~ 5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Produkt ist nicht verfügbar
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FS32K144HFT0VLLR FS32K144HFT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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S9S12VR48AF0VLCR S9S12VR48AF0VLCR NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12VR48AF0CLFR S9S12VR48AF0CLFR NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKM33Z128ACLH5R MKM33Z128ACLH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 4x24b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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BGS8H5UKZ BGS8H5UKZ NXP USA Inc. RFSAS20EDRM.pdf Description: IC AMP CELL 1.425-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.425GHz ~ 2.69GHz
RF Type: Cellular, LTE
Gain: 13.1dB
Noise Figure: 0.75dB
Supplier Device Package: 6-XSON (1.1x0.7)
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S9S12VR48AF0CLCR S9S12VR48AF0CLCR NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL60CLD MC9S08PL60.pdf
MC9S08PL60CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL32CLD MC9S08PL60.pdf
MC9S08PL32CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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S12ZVMAEVB S12ZVMAEVB_QSG.pdf
S12ZVMAEVB
Hersteller: NXP USA Inc.
Description: S12ZVMA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Utilized IC / Part: S12ZVMA
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MRF13750H-1300 MRF13750H.pdf
MRF13750H-1300
Hersteller: NXP USA Inc.
Description: MRF13750H REF BRD 1300MHZ 700W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 1.3GHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
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MCIMX7ULP-EVK IMX7ULPWSG.pdf
MCIMX7ULP-EVK
Hersteller: NXP USA Inc.
Description: I.MX 7ULP EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-A7, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 7ULP
Part Status: Active
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TJA1128CTK/0Z TJA1128-DS.pdf
TJA1128CTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
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TJA1128FTK/0Z TJA1128.pdf
TJA1128FTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 14418 Stücke:
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TJA1044VTKZ TJA1044V.pdf
TJA1044VTKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10776 Stücke:
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9+2.51 EUR
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TJA1044VT/3Z TJA1044V.pdf
TJA1044VT/3Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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11+2.03 EUR
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TJA1044VTK/3Z TJA1044V.pdf
TJA1044VTK/3Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 8659 Stücke:
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TJA1044VTZ TJA1044V.pdf
TJA1044VTZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3266 Stücke:
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11+2.03 EUR
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TJA1046VTKZ TJA1046V.pdf
TJA1046VTKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 13475 Stücke:
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5+5.07 EUR
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TJA1124AHG/0Z TJA1124.pdf
TJA1124AHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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4+5.78 EUR
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SJA1124AHG/0Z SJA1124.pdf
SJA1124AHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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3+8.15 EUR
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BAP64LX/Z,315 BAP64LX_Rev2018.pdf
BAP64LX/Z,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Grade: Automotive
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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SPC5602DF1VLH4R MPC5602D.pdf
SPC5602DF1VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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1+24.11 EUR
10+18.99 EUR
25+17.71 EUR
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LPC2134FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2134FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
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1+30.89 EUR
10+24.54 EUR
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500+19.87 EUR
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SP5746CSK1AMKU6R MPC5746C.pdf
SP5746CSK1AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
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1+58.35 EUR
10+47.28 EUR
25+44.52 EUR
100+41.47 EUR
250+40.02 EUR
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MCIMX6S5DVM10ACR IMX6SDLAEC.pdf
MCIMX6S5DVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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1+83.97 EUR
10+68.72 EUR
25+64.91 EUR
100+63.26 EUR
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S9S08DZ60F2VLCR MC9S08AC60.pdf
S9S08DZ60F2VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 795 Stücke:
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MCIMX283CVM4BR2 IMX28CEC.pdf
MCIMX283CVM4BR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 425 Stücke:
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MCF51JM128VLHR MCF51JM128.pdf
MCF51JM128VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 3193 Stücke:
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PCF7953MTTC1AC2200 75017275.pdf?fsrch=1&sr=1&pageNum=1
PCF7953MTTC1AC2200
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2092 Stücke:
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1+24.48 EUR
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PCF7953XTTC1AC2000
PCF7953XTTC1AC2000
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7953PTTM1AC1800
PCF7953PTTM1AC1800
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SH4MTGR MC9S08SH8.pdf
MC9S08SH4MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 5300 Stücke:
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3+8.84 EUR
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25+6.19 EUR
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250+5.32 EUR
500+5.15 EUR
1000+5.02 EUR
2500+4.87 EUR
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S9S08DZ32F2VLCR MC9S08DZ60.pdf
S9S08DZ32F2VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
Number of I/O: 25
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX283DVM4BR2 IMX28CEC.pdf
MCIMX283DVM4BR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 1634 Stücke:
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1+44.72 EUR
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MRFG35003N6AT1 MRFG35003N6A.pdf
MRFG35003N6AT1
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 6V PLD-1.5
Current - Test: 180 mA
Voltage - Test: 6 V
Voltage - Rated: 8 V
Part Status: Obsolete
Supplier Device Package: PLD-1.5
Technology: pHEMT FET
Gain: 10dB
Power - Output: 450mW
Frequency: 3.55GHz
Mounting Type: Surface Mount
Package / Case: PLD-1.5
Packaging: Cut Tape (CT)
auf Bestellung 448 Stücke:
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1+36.88 EUR
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MRFE6VP61K25HSR5 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 58 Stücke:
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1+714.19 EUR
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MC33984CHFKR2 MC33984.pdf
MC33984CHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 16-PowerQFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Cut Tape (CT)
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 16-PQFN (12x12)
Ratio - Input:Output: 1:2
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 6V ~ 27V
Rds On (Typ): 4mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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MCIMX280DVM4BR IMX28CEC.pdf
MCIMX280DVM4BR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
auf Bestellung 1780 Stücke:
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1+41.39 EUR
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PCF7952XTT/C1CC170
PCF7952XTT/C1CC170
Hersteller: NXP USA Inc.
Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2495 Stücke:
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2+20.23 EUR
10+15.27 EUR
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250+12.01 EUR
500+11.61 EUR
1000+11.29 EUR
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UJA1168TK,118
UJA1168TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Produkt ist nicht verfügbar
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MC56F82746VLFR MC56F827XXDS.pdf
MC56F82746VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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2+16.28 EUR
10+12.64 EUR
25+11.73 EUR
100+10.73 EUR
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FXTH8709116T1 www.nxp.com
FXTH8709116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 1957 Stücke:
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2+17.78 EUR
10+14.22 EUR
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1000+9.96 EUR
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S9S12XS128J1CAER MC9S12XS256RMV1.pdf
S9S12XS128J1CAER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GA128F0MLFR MC9S12GRMV1.pdf
S9S12GA128F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
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2+16.36 EUR
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MCF51EM256CLLR MCF51EM256.pdf
MCF51EM256CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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1+30.48 EUR
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MC33981BHFKR2 MC33981.pdf
MC33981BHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK20DN512VLK10R K20P81M100SF2V2.pdf
MK20DN512VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 996 Stücke:
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1+28.05 EUR
10+22.18 EUR
25+20.72 EUR
100+19.1 EUR
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MC9S08GT16ACFDER MC9S08AC60.pdf
MC9S08GT16ACFDER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Verified
auf Bestellung 5420 Stücke:
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2+18.79 EUR
10+14.66 EUR
25+13.64 EUR
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MC33932VWR2 MC33932.pdf
MC33932VWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Cut Tape (CT)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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TEF6614T/V1,518 TEF6614T_Web.pdf
TEF6614T/V1,518
Hersteller: NXP USA Inc.
Description: RF RCVR AM/FM/RDS 32SO
Packaging: Cut Tape (CT)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, RDS
Data Interface: PCB, Surface Mount
Voltage - Supply: 8.5V
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF7961XTT/D1AE09J 75017269.pdf
PCF7961XTT/D1AE09J
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 91 Stücke:
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2+13.28 EUR
10+12.01 EUR
25+11.45 EUR
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S9S12P128J0VFTR MC9S12P128RMV1.pdf
S9S12P128J0VFTR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
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MK10DN512VLK10R K10P81M100SF2V2.pdf
MK10DN512VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 31x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 6285 Stücke:
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PCF7961ATT/D1AC07J
PCF7961ATT/D1AC07J
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 20-TSSOP
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TFF1007HN/N1,115 TFF1007HN.pdf
TFF1007HN/N1,115
Hersteller: NXP USA Inc.
Description: IC FREQ GENERATOR LN 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 15GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 1466 Stücke:
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MC9S08QB8CTGR MC9S08AC60.pdf
MC9S08QB8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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S912XEG128W1VAAR
S912XEG128W1VAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0VLQ6R MPC5606B.pdf
SPC5605BK0VLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1048TK,118 TJA1048.pdf
TJA1048TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 9042 Stücke:
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UJA1162TK,118 UJA1162.pdf
UJA1162TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 3.3V ~ 5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Produkt ist nicht verfügbar
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FS32K144HFT0VLLR S32K1xx.pdf
FS32K144HFT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 2924 Stücke:
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S9S12VR48AF0VLCR 15944_MC9S12VRRMV3.pdf
S9S12VR48AF0VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12VR48AF0CLFR 15944_MC9S12VRRMV3.pdf
S9S12VR48AF0CLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKM33Z128ACLH5R MKMxxZxxACxx5.pdf
MKM33Z128ACLH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 4x24b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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BGS8H5UKZ RFSAS20EDRM.pdf
BGS8H5UKZ
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.425-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.425GHz ~ 2.69GHz
RF Type: Cellular, LTE
Gain: 13.1dB
Noise Figure: 0.75dB
Supplier Device Package: 6-XSON (1.1x0.7)
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18+1.19 EUR
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S9S12VR48AF0CLCR 15944_MC9S12VRRMV3.pdf
S9S12VR48AF0CLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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