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NCF29A4XHN/0500VJ NCF29A4XHN/0500VJ NXP USA Inc. Description: IC 32HVQFN
Produkt ist nicht verfügbar
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MCIMX6X2EVN10ABR MCIMX6X2EVN10ABR NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 1000 Stücke:
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1+77.45 EUR
10+63.19 EUR
25+59.63 EUR
100+57.27 EUR
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MCIMX31LCVMN4DR2 MCIMX31LCVMN4DR2 NXP USA Inc. MCIMX31_5.pdf Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Cut Tape (CT)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Part Status: Active
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
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10+76.22 EUR
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MRFE6VP5600HR6 MRFE6VP5600HR6 NXP USA Inc. MRFE6VP5600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 130 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
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1+1493.12 EUR
10+1317.07 EUR
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PN5180A0HN/C2Y PN5180A0HN/C2Y NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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2+18.2 EUR
10+14.2 EUR
25+13.2 EUR
100+12.1 EUR
250+11.92 EUR
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MF1S7030XDA4/V1J MF1S7030XDA4/V1J NXP USA Inc. MF1S50yyX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
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6+3.81 EUR
10+2.81 EUR
25+2.56 EUR
100+2.28 EUR
250+2.15 EUR
500+2.07 EUR
1000+2.01 EUR
2500+1.94 EUR
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MCIMX357CJQ5CR2 MCIMX357CJQ5CR2 NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
auf Bestellung 2100 Stücke:
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1+76.58 EUR
10+62.51 EUR
25+59 EUR
100+56.73 EUR
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A2I25D025GNR1 A2I25D025GNR1 NXP USA Inc. A2I25D025N.pdf Description: IC TRANS RF LDMOS
auf Bestellung 773 Stücke:
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1+71.1 EUR
10+65.57 EUR
25+62.63 EUR
100+55.99 EUR
250+53.42 EUR
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MMPF0100F9ANESR2 MMPF0100F9ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 11272 Stücke:
Lieferzeit 10-14 Tag (e)
2+18.2 EUR
10+14.17 EUR
25+13.17 EUR
100+12.07 EUR
250+11.88 EUR
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NCK2983AHN/T2CY NCK2983AHN/T2CY NXP USA Inc. Description: IC RF TXRX+MCU 48VFQFN
Modulation: ASK, FSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Receiving: 17mA
Voltage - Supply: 2.1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 32kB Flash, 4kB RAM
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Mounting Type: Surface Mount
Sensitivity: -123dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S5030XDA8/V1J MF1S5030XDA8/V1J NXP USA Inc. MF1S70YYX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 26907 Stücke:
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7+3.28 EUR
10+2.4 EUR
25+2.19 EUR
100+1.95 EUR
250+1.83 EUR
500+1.76 EUR
1000+1.7 EUR
2500+1.64 EUR
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MMPF0100F0AEPR2 MMPF0100F0AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 6110 Stücke:
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2+17.11 EUR
10+13.3 EUR
25+12.36 EUR
100+11.32 EUR
250+10.89 EUR
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MMPF0100F1AEPR2 MMPF0100F1AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.15 EUR
10+13.36 EUR
25+12.41 EUR
100+11.36 EUR
250+11.16 EUR
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MMPF0100NPAEPR2 MMPF0100NPAEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 3920 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.15 EUR
10+13.36 EUR
25+12.41 EUR
100+11.36 EUR
250+11.16 EUR
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MKM14Z128CHH5R MKM14Z128CHH5R NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Mounting Type: Surface Mount
Package / Case: 44-VFLGA Exposed Pad
Packaging: Cut Tape (CT)
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
DigiKey Programmable: Not Verified
Number of I/O: 20
Supplier Device Package: 44-MAPLGA (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 5x16b, 4x24b
Core Processor: ARM® Cortex®-M0+
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 MCIMX233DJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR S9S08EL16F1VTJR NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
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2+11.46 EUR
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SPC5606BK0MLL6R SPC5606BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R SPC5605BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 768KB FLASH 100LQFP
Number of I/O: 77
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.3 EUR
10+33.11 EUR
25+31.06 EUR
100+28.8 EUR
250+27.73 EUR
500+27.08 EUR
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PN5120A0ET/C2J PN5120A0ET/C2J NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3040 Stücke:
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2+17.58 EUR
10+15.24 EUR
25+14.43 EUR
100+13.33 EUR
250+12.66 EUR
500+12.2 EUR
1000+11.76 EUR
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MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Cut Tape (CT)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
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1+74.98 EUR
10+61.23 EUR
25+57.79 EUR
100+54.01 EUR
250+52.22 EUR
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Part Status: Obsolete
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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LPC845-BRK LPC845-BRK NXP USA Inc. LPC84x.pdf Description: MCUXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Part Status: Active
auf Bestellung 36 Stücke:
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2+13.48 EUR
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LPC54S016JET100E LPC54S016JET100E NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.76 EUR
10+12.19 EUR
25+11.3 EUR
100+10.32 EUR
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LPC54S018-EVK LPC54S018-EVK NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: LPCXPRESSO LPC54S018 EVAL BRD
Platform: LPCXpresso™
Utilized IC / Part: LPC54S018
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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QN9080-001-M17AZ QN9080-001-M17AZ NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
Part Status: Active
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Power - Output: 2dBm
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9080SIP-DK QN9080SIP-DK NXP USA Inc. QN9080-001-M17.pdf Description: QN9080SIP DEV KIT + DONGLE
Utilized IC / Part: QN908x
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: QN908x
Packaging: Bulk
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QN9080-001-M17AZ QN9080-001-M17AZ NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
Part Status: Active
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Power - Output: 2dBm
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM4DVTLZAA MIMX8MM4DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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MIMX8MM3DVTLZAA MIMX8MM3DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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MIMX8MM1DVTLZAA MIMX8MM1DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
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MIMX8MM1CVTKZAA MIMX8MM1CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
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8MMINILPD4-EVK 8MMINILPD4-EVK NXP USA Inc. IMX8MMINIFS.pdf Description: I.MX 8M MINI EVAL BRD
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAA MIMX8MM6DVTLZAA NXP USA Inc. IMX8MMCEC.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 376 Stücke:
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MIMX8MM6CVTKZAA MIMX8MM6CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
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MIMX8MM5DVTLZAA MIMX8MM5DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 152 Stücke:
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MIMX8MM5CVTKZAA MIMX8MM5CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 140 Stücke:
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TEA1999TK/2J TEA1999TK/2J NXP USA Inc. TEA1999TK.pdf Description: IC CTRLR SYNC RECT HVSON8
DigiKey Programmable: Not Verified
Current - Supply: 250 µA
Supplier Device Package: 8-HVSON (3x3)
Applications: Active/Synchronous Rectification Controller
Voltage - Supply: 0V ~ 21V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 12000 Stücke
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TEA1999TS/2H TEA1999TS/2H NXP USA Inc. TEA1999TS.pdf Description: IC CTRLR SYNC RECT TSOP6
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
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3000+1.29 EUR
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TEA1993TS/1H TEA1993TS/1H NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Active
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
auf Bestellung 5892 Stücke:
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100+1.54 EUR
250+1.44 EUR
500+1.38 EUR
1000+1.36 EUR
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TEA1999TK/2J TEA1999TK/2J NXP USA Inc. TEA1999TK.pdf Description: IC CTRLR SYNC RECT HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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1000+0.82 EUR
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5000+0.77 EUR
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TEA1999TS/2H TEA1999TS/2H NXP USA Inc. TEA1999TS.pdf Description: IC CTRLR SYNC RECT TSOP6
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 6472 Stücke:
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1000+1.34 EUR
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LPC55S69-EVK LPC55S69-EVK NXP USA Inc. LPC55S6x_DS.pdf Description: LPCXPRESSO LPC55S6X EVAL BRD
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC55S6x
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 59 Stücke:
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MKE14Z32VLF4 MKE14Z32VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.43 EUR
10+4.82 EUR
25+4.43 EUR
100+3.99 EUR
250+3.78 EUR
500+3.65 EUR
1000+3.55 EUR
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MKE14Z64VLF4 MKE14Z64VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
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4+5.71 EUR
10+4.31 EUR
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100+3.57 EUR
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MKE16Z32VLF4 MKE16Z32VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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3+7.85 EUR
10+5.94 EUR
25+5.46 EUR
100+4.94 EUR
250+4.69 EUR
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1000+4.41 EUR
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MKE16Z32VLD4 MKE16Z32VLD4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 769 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.94 EUR
10+4.15 EUR
25+4 EUR
160+3.75 EUR
320+3.71 EUR
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MKE16Z64VLF4 MKE16Z64VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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6+3.97 EUR
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MKE16Z64VLD4 MKE16Z64VLD4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 117 Stücke:
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3+7.46 EUR
10+4.36 EUR
25+4.26 EUR
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FRDM-KE16Z FRDM-KE16Z NXP USA Inc. KE1xZ64_Communicator.pdf Description: FREEDOM KE1XZ EVAL BRD
Platform: Freedom
Utilized IC / Part: KE1xZ
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 8 Stücke:
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PCF7900VHN/C0L/UZ PCF7900VHN/C0L/UZ NXP USA Inc. 75017268.pdf Description: IC TRANSMITTER UHF 16HVQFN
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCF7900NHN/C0K/UZ PCF7900NHN/C0K/UZ NXP USA Inc. 75017268.pdf Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.86 EUR
10+4.19 EUR
25+3.96 EUR
100+3.64 EUR
250+3.45 EUR
500+3.31 EUR
1000+3.19 EUR
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MIMXRT1015CAF4A MIMXRT1015CAF4A NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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MIMXRT1015DAF5A MIMXRT1015DAF5A NXP USA Inc. IMXRT1015CEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 128K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015-EVK MIMXRT1015-EVK NXP USA Inc. IMXRT1015CEC.pdf Description: I.MX RT1015 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1015
Part Status: Active
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MIMXRT1062CVJ5A MIMXRT1062CVJ5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062DVJ6A MIMXRT1062DVJ6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVJ5A MIMXRT1061CVJ5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXH3670UK/A1Z NXH3670UK/A1Z NXP USA Inc. NXH3670UK.pdf Description: IC RF TXRX+MCU BLE 34WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ
NCF29A4XHN/0500VJ
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Produkt ist nicht verfügbar
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MCIMX6X2EVN10ABR IMX6SXIEC.pdf
MCIMX6X2EVN10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
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MCIMX31LCVMN4DR2 MCIMX31_5.pdf
MCIMX31LCVMN4DR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Cut Tape (CT)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Part Status: Active
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
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MRFE6VP5600HR6 MRFE6VP5600H.pdf
MRFE6VP5600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 130 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
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PN5180A0HN/C2Y PN5180A0XX-C1-C2.pdf
PN5180A0HN/C2Y
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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MF1S7030XDA4/V1J MF1S50yyX_V1.pdf
MF1S7030XDA4/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
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MCIMX357CJQ5CR2 MCIMX35SR2CEC.pdf
MCIMX357CJQ5CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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A2I25D025GNR1 A2I25D025N.pdf
A2I25D025GNR1
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
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MMPF0100F9ANESR2 MMPF0100.pdf
MMPF0100F9ANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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NCK2983AHN/T2CY
NCK2983AHN/T2CY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Modulation: ASK, FSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Receiving: 17mA
Voltage - Supply: 2.1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 32kB Flash, 4kB RAM
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Mounting Type: Surface Mount
Sensitivity: -123dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S5030XDA8/V1J MF1S70YYX_V1.pdf
MF1S5030XDA8/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
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MMPF0100F0AEPR2 MMPF0100.pdf
MMPF0100F0AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100F1AEPR2 MMPF0100.pdf
MMPF0100F1AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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2+17.15 EUR
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MMPF0100NPAEPR2 MMPF0100.pdf
MMPF0100NPAEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MKM14Z128CHH5R MKMxxZxxCxx5.pdf
MKM14Z128CHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Mounting Type: Surface Mount
Package / Case: 44-VFLGA Exposed Pad
Packaging: Cut Tape (CT)
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
DigiKey Programmable: Not Verified
Number of I/O: 20
Supplier Device Package: 44-MAPLGA (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 5x16b, 4x24b
Core Processor: ARM® Cortex®-M0+
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 IMX233FS.pdf
MCIMX233DJM4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR MC9S08EL32.pdf
S9S08EL16F1VTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
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SPC5606BK0MLL6R MPC5606B.pdf
SPC5606BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R MPC5606B.pdf
SPC5605BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Number of I/O: 77
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 7x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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1+41.3 EUR
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PN5120A0ET/C2J PN512.pdf
PN5120A0ET/C2J
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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2+17.58 EUR
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MCIMX6S5EVM10ACR IMX6SDLAEC.pdf
MCIMX6S5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Cut Tape (CT)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
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AnzahlPrivatkunde
1+74.98 EUR
10+61.23 EUR
25+57.79 EUR
100+54.01 EUR
250+52.22 EUR
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Part Status: Obsolete
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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LPC845-BRK LPC84x.pdf
LPC845-BRK
Hersteller: NXP USA Inc.
Description: MCUXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Part Status: Active
auf Bestellung 36 Stücke:
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2+13.48 EUR
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LPC54S016JET100E LPC540XXMCUFAMFS.pdf
LPC54S016JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
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2+15.76 EUR
10+12.19 EUR
25+11.3 EUR
100+10.32 EUR
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LPC54S018-EVK LPC540XXMCUFAMFS.pdf
LPC54S018-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54S018 EVAL BRD
Platform: LPCXpresso™
Utilized IC / Part: LPC54S018
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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QN9080-001-M17AZ QN9080-001-M17.pdf
QN9080-001-M17AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
Part Status: Active
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Power - Output: 2dBm
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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QN9080SIP-DK QN9080-001-M17.pdf
QN9080SIP-DK
Hersteller: NXP USA Inc.
Description: QN9080SIP DEV KIT + DONGLE
Utilized IC / Part: QN908x
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: QN908x
Packaging: Bulk
auf Bestellung 15 Stücke:
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AnzahlPrivatkunde
1+232.1 EUR
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QN9080-001-M17AZ QN9080-001-M17.pdf
QN9080-001-M17AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
Part Status: Active
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Power - Output: 2dBm
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM4DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM4DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
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AnzahlPrivatkunde
1+70.56 EUR
10+57.36 EUR
25+54.06 EUR
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MIMX8MM3DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM3DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+53.88 EUR
10+43.74 EUR
25+41.75 EUR
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MIMX8MM1DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM1DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 82 Stücke:
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1+62.78 EUR
10+50.96 EUR
25+48 EUR
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MIMX8MM1CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM1CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+59.36 EUR
10+48.06 EUR
25+45.24 EUR
152+41.42 EUR
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8MMINILPD4-EVK IMX8MMINIFS.pdf
8MMINILPD4-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8M MINI EVAL BRD
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAA IMX8MMCEC.pdf
MIMX8MM6DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+58.14 EUR
10+47.04 EUR
25+44.27 EUR
152+40.52 EUR
304+39.51 EUR
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MIMX8MM6CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM6CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 151 Stücke:
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1+63.69 EUR
10+51.66 EUR
25+48.66 EUR
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MIMX8MM5DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM5DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 152 Stücke:
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1+55.98 EUR
10+45.26 EUR
25+42.57 EUR
152+38.94 EUR
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MIMX8MM5CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM5CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+72.4 EUR
10+58.98 EUR
25+55.63 EUR
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TEA1999TK/2J TEA1999TK.pdf
TEA1999TK/2J
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT HVSON8
DigiKey Programmable: Not Verified
Current - Supply: 250 µA
Supplier Device Package: 8-HVSON (3x3)
Applications: Active/Synchronous Rectification Controller
Voltage - Supply: 0V ~ 21V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 12000 Stücke
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TEA1999TS/2H TEA1999TS.pdf
TEA1999TS/2H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT TSOP6
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+1.29 EUR
Mindestbestellmenge: 3000 Stücke
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TEA1993TS/1H TEA1993TS.pdf
TEA1993TS/1H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Active
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
auf Bestellung 5892 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.59 EUR
12+1.9 EUR
25+1.73 EUR
100+1.54 EUR
250+1.44 EUR
500+1.38 EUR
1000+1.36 EUR
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TEA1999TK/2J TEA1999TK.pdf
TEA1999TK/2J
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 11880 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
13+1.68 EUR
18+1.2 EUR
25+1.08 EUR
100+0.95 EUR
250+0.89 EUR
500+0.86 EUR
1000+0.82 EUR
2500+0.79 EUR
5000+0.77 EUR
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TEA1999TS/2H TEA1999TS.pdf
TEA1999TS/2H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT TSOP6
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 6472 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.59 EUR
12+1.88 EUR
25+1.7 EUR
100+1.51 EUR
250+1.42 EUR
500+1.36 EUR
1000+1.34 EUR
Mindestbestellmenge: 9 Stücke
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LPC55S69-EVK LPC55S6x_DS.pdf
LPC55S69-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC55S6X EVAL BRD
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC55S6x
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 59 Stücke:
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AnzahlPrivatkunde
1+87.86 EUR
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MKE14Z32VLF4 KE1xZ64_Communicator.pdf
MKE14Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.43 EUR
10+4.82 EUR
25+4.43 EUR
100+3.99 EUR
250+3.78 EUR
500+3.65 EUR
1000+3.55 EUR
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MKE14Z64VLF4 KE1xZ64_Communicator.pdf
MKE14Z64VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.71 EUR
10+4.31 EUR
25+3.96 EUR
100+3.57 EUR
250+3.53 EUR
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MKE16Z32VLF4 KE1xZ64_Communicator.pdf
MKE16Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1160 Stücke:
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3+7.85 EUR
10+5.94 EUR
25+5.46 EUR
100+4.94 EUR
250+4.69 EUR
500+4.53 EUR
1000+4.41 EUR
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MKE16Z32VLD4 KE1xZ64_Communicator.pdf
MKE16Z32VLD4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 769 Stücke:
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4+6.94 EUR
10+4.15 EUR
25+4 EUR
160+3.75 EUR
320+3.71 EUR
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MKE16Z64VLF4 KE1xZ64_Communicator.pdf
MKE16Z64VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1245 Stücke:
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6+3.97 EUR
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MKE16Z64VLD4 KE1xZ64_Communicator.pdf
MKE16Z64VLD4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 117 Stücke:
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3+7.46 EUR
10+4.36 EUR
25+4.26 EUR
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FRDM-KE16Z KE1xZ64_Communicator.pdf
FRDM-KE16Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE1XZ EVAL BRD
Platform: Freedom
Utilized IC / Part: KE1xZ
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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1+88.51 EUR
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PCF7900VHN/C0L/UZ 75017268.pdf
PCF7900VHN/C0L/UZ
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCF7900NHN/C0K/UZ 75017268.pdf
PCF7900NHN/C0K/UZ
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
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5+4.86 EUR
10+4.19 EUR
25+3.96 EUR
100+3.64 EUR
250+3.45 EUR
500+3.31 EUR
1000+3.19 EUR
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MIMXRT1015CAF4A IMXRT1015IEC.pdf
MIMXRT1015CAF4A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MIMXRT1015DAF5A IMXRT1015CEC.pdf
MIMXRT1015DAF5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 128K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015-EVK IMXRT1015CEC.pdf
MIMXRT1015-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1015 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1015
Part Status: Active
auf Bestellung 37 Stücke:
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1+120.26 EUR
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MIMXRT1062CVJ5A IMXRT1060IEC.pdf
MIMXRT1062CVJ5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062DVJ6A IMXRT1060CEC.pdf
MIMXRT1062DVJ6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVJ5A IMXRT1060IEC.pdf
MIMXRT1061CVJ5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXH3670UK/A1Z NXH3670UK.pdf
NXH3670UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 34WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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