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TJA1044GTKZ TJA1044GTKZ NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 2202 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
Mindestbestellmenge: 11
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MCZ33903C5EKR2 MCZ33903C5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MCZ33903C3EKR2 MCZ33903C3EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC33975ATEKR2 MC33975ATEKR2 NXP USA Inc. MC33975.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
auf Bestellung 1000 Stücke:
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2+11.60 EUR
Mindestbestellmenge: 2
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S9S12XS128J1CALR S9S12XS128J1CALR NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
auf Bestellung 420 Stücke:
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TJA1029TK/20/1J TJA1029TK/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 8893 Stücke:
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12+1.50 EUR
17+1.08 EUR
25+1.00 EUR
100+0.93 EUR
250+0.92 EUR
500+0.90 EUR
1000+0.88 EUR
2500+0.87 EUR
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TJA1029TK,118 TJA1029TK,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 4880 Stücke:
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9+2.02 EUR
10+1.81 EUR
25+1.72 EUR
100+1.41 EUR
250+1.32 EUR
500+1.17 EUR
1000+0.92 EUR
2500+0.86 EUR
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TEA19161T/2Y TEA19161T/2Y NXP USA Inc. TEA19161T.pdf Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
auf Bestellung 8910 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.52 EUR
10+2.61 EUR
25+2.38 EUR
100+2.13 EUR
250+2.01 EUR
500+1.94 EUR
1000+1.88 EUR
Mindestbestellmenge: 5
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TEA1755LT/1Y TEA1755LT/1Y NXP USA Inc. TEA1755LT.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 155°C (TJ)
Frequency - Switching: 119kHz ~ 159kHz, 110kHz ~ 150kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 13.4V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22.3 V
Part Status: Active
Power (Watts): 250 W
Produkt ist nicht verfügbar
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MC33689DPEWR2 MC33689DPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 377 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.23 EUR
10+9.18 EUR
25+8.68 EUR
100+7.52 EUR
250+7.14 EUR
Mindestbestellmenge: 2
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TDF8590TH/N1TJ TDF8590TH/N1TJ NXP USA Inc. TDF8590TH_2.pdf Description: IC AMP D MONO/STEREO 160W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±14V ~ 29V
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34674CEPR2 MC34674CEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF7941ATSM2AB120, PCF7941ATSM2AB120, NXP USA Inc. UM10473.pdf Description: IC REMOTE KEYLESS ENTRY 20SSOP
Features: PLL Frequency Synthesizer and PA
Packaging: Cut Tape (CT)
Frequency: 315MHz, 434MHz, 868MHz
Modulation or Protocol: ASK, FSK, UHF
Data Interface: RS232
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 9.8dBm
Applications: General Purpose
Data Rate (Max): 4.8kbps
Antenna Connector: Not Included
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10943 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.63 EUR
10+7.38 EUR
25+6.82 EUR
100+6.19 EUR
250+5.90 EUR
500+5.72 EUR
Mindestbestellmenge: 2
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TDF8546TH/N2,118 TDF8546TH/N2,118 NXP USA Inc. TDF8546.pdf Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022T,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 9637 Stücke:
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6+3.17 EUR
10+2.34 EUR
25+2.13 EUR
100+1.90 EUR
250+1.79 EUR
500+1.72 EUR
1000+1.67 EUR
Mindestbestellmenge: 6
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TJA1028TK/5V0/20:1 TJA1028TK/5V0/20:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.73 EUR
10+1.83 EUR
25+1.74 EUR
100+1.62 EUR
250+1.53 EUR
500+1.47 EUR
Mindestbestellmenge: 7
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AFM906NT1 AFM906NT1 NXP USA Inc. AFM906N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 901 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.17 EUR
10+3.11 EUR
25+2.84 EUR
100+2.55 EUR
250+2.41 EUR
500+2.32 EUR
Mindestbestellmenge: 5
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NTS0103GU10,115 NTS0103GU10,115 NXP USA Inc. NTS0103.pdf Description: IC TRANSLTR BIDIRECTIONAL 10XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 1797 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.36 EUR
19+0.97 EUR
25+0.87 EUR
100+0.76 EUR
250+0.71 EUR
500+0.68 EUR
1000+0.66 EUR
Mindestbestellmenge: 13
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TDA1566TH/N2S,118 TDA1566TH/N2S,118 NXP USA Inc. TDA1566.pdf Description: IC AMP AB MONO/STER 150W 24HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6.5V ~ 18V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 75W x 2 @ 2Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901NT1 NXP USA Inc. AFIC901N.pdf Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
auf Bestellung 2361 Stücke:
Lieferzeit 10-14 Tag (e)
3+5.97 EUR
10+5.33 EUR
25+4.79 EUR
100+4.37 EUR
250+3.94 EUR
500+3.54 EUR
Mindestbestellmenge: 3
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PCA8551ATT/AJ PCA8551ATT/AJ NXP USA Inc. PCA8551.pdf Description: IC DRVR 144 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 144 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BGS8H2X BGS8H2X NXP USA Inc. BGS8H2.pdf Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 12.5dB
Current - Supply: 5.8mA
Noise Figure: 1dB
Test Frequency: 2.3GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 4354 Stücke:
Lieferzeit 10-14 Tag (e)
17+1.07 EUR
19+0.95 EUR
25+0.86 EUR
100+0.75 EUR
250+0.66 EUR
500+0.58 EUR
1000+0.46 EUR
Mindestbestellmenge: 17
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TEA1713T/N2,518 TEA1713T/N2,518 NXP USA Inc. TEA1713T.pdf Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 880 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.54 EUR
10+4.17 EUR
25+3.83 EUR
100+3.45 EUR
250+3.27 EUR
500+3.17 EUR
Mindestbestellmenge: 4
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BGU8M1X BGU8M1X NXP USA Inc. BGU8M1.pdf Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
20+0.92 EUR
22+0.82 EUR
25+0.74 EUR
100+0.65 EUR
250+0.57 EUR
500+0.50 EUR
1000+0.40 EUR
Mindestbestellmenge: 20
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TJA1029T/20/1J TJA1029T/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TJA1029T,118 TJA1029T,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2069 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.11 EUR
10+1.89 EUR
25+1.79 EUR
100+1.47 EUR
250+1.37 EUR
500+1.21 EUR
1000+0.96 EUR
Mindestbestellmenge: 9
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TEA19162T/2J TEA19162T/2J NXP USA Inc. TEA19162T.pdf Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
auf Bestellung 4925 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.90 EUR
13+1.38 EUR
25+1.25 EUR
100+1.10 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.96 EUR
Mindestbestellmenge: 10
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TJA1028TK/5V0/10:1 TJA1028TK/5V0/10:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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BF513,215 BF513,215 NXP USA Inc. BF510_511_512_513_CNV.pdf Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050GC6T1 NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSIG 0.13" 2.82V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS8001FTB/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4927 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.81 EUR
26+0.69 EUR
27+0.65 EUR
100+0.60 EUR
250+0.56 EUR
500+0.54 EUR
1000+0.52 EUR
Mindestbestellmenge: 22
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TEA1738T/N1,118 TEA1738T/N1,118 NXP USA Inc. TEA1738T_TEA1738LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 2373 Stücke:
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18+1.02 EUR
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100+0.80 EUR
250+0.75 EUR
500+0.72 EUR
1000+0.69 EUR
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SL2S1512FTBX SL2S1512FTBX NXP USA Inc. SL2S1412_SL2S1512_SL2S1612.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 9720 Stücke:
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26+0.70 EUR
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BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
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BB156,115 BB156,115 NXP USA Inc. BB156.pdf Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS/1,115 NXP USA Inc. TEA1731LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7725 Stücke:
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164+0.11 EUR
250+0.10 EUR
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HTMS8001FTK/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
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PMBFJ308,215 PMBFJ308,215 NXP USA Inc. PMBFJ308_309_310.pdf Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
Produkt ist nicht verfügbar
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4CTG NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3988 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.87 EUR
14+1.35 EUR
96+1.08 EUR
192+1.03 EUR
288+1.00 EUR
576+0.96 EUR
1056+0.93 EUR
2592+0.90 EUR
Mindestbestellmenge: 10
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MC9S08PL60CQH MC9S08PL60CQH NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL8CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL16CTJ NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 898 Stücke:
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5+3.56 EUR
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SPC5775BDK3MME2 SPC5775BDK3MME2 NXP USA Inc. MPC5775BEFS.pdf Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
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1+61.42 EUR
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MPC5775BE-416DS MPC5775BE-416DS NXP USA Inc. MPC5777CEVBUG.pdf Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
auf Bestellung 1 Stücke:
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1+1045.84 EUR
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TEA19051BABTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BACTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB FRDM33771BSPIEVB NXP USA Inc. MC33771B_SDS.pdf Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 1 Stücke:
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K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5 SPC5744PK1MLQ5 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R SPC5744PK1MLQ5R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP MC34PF1550A7EP NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 MC34PF1550A7EPR2 NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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TJA1044GTKZ TJA1044.pdf
TJA1044GTKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 2202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
Mindestbestellmenge: 11
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MCZ33903C5EKR2 MC33903%2C4%2C5.pdf
MCZ33903C5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MCZ33903C3EKR2 MC33903%2C4%2C5.pdf
MCZ33903C3EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC33975ATEKR2 MC33975.pdf
MC33975ATEKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
auf Bestellung 1000 Stücke:
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Anzahl Preis
2+11.60 EUR
Mindestbestellmenge: 2
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S9S12XS128J1CALR S12XSFS.pdf
S9S12XS128J1CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
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TJA1029TK/20/1J TJA1029.pdf
TJA1029TK/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 8893 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.50 EUR
17+1.08 EUR
25+1.00 EUR
100+0.93 EUR
250+0.92 EUR
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TJA1029TK,118 TJA1029.pdf
TJA1029TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 4880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.02 EUR
10+1.81 EUR
25+1.72 EUR
100+1.41 EUR
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500+1.17 EUR
1000+0.92 EUR
2500+0.86 EUR
Mindestbestellmenge: 9
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TEA19161T/2Y TEA19161T.pdf
TEA19161T/2Y
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
auf Bestellung 8910 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.52 EUR
10+2.61 EUR
25+2.38 EUR
100+2.13 EUR
250+2.01 EUR
500+1.94 EUR
1000+1.88 EUR
Mindestbestellmenge: 5
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TEA1755LT/1Y TEA1755LT.pdf
TEA1755LT/1Y
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 155°C (TJ)
Frequency - Switching: 119kHz ~ 159kHz, 110kHz ~ 150kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 13.4V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22.3 V
Part Status: Active
Power (Watts): 250 W
Produkt ist nicht verfügbar
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MC33689DPEWR2 MC33797.pdf
MC33689DPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 377 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.23 EUR
10+9.18 EUR
25+8.68 EUR
100+7.52 EUR
250+7.14 EUR
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TDF8590TH/N1TJ TDF8590TH_2.pdf
TDF8590TH/N1TJ
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 160W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±14V ~ 29V
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34674CEPR2 MC34674.pdf
MC34674CEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF7941ATSM2AB120, UM10473.pdf
PCF7941ATSM2AB120,
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20SSOP
Features: PLL Frequency Synthesizer and PA
Packaging: Cut Tape (CT)
Frequency: 315MHz, 434MHz, 868MHz
Modulation or Protocol: ASK, FSK, UHF
Data Interface: RS232
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 9.8dBm
Applications: General Purpose
Data Rate (Max): 4.8kbps
Antenna Connector: Not Included
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10943 Stücke:
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2+9.63 EUR
10+7.38 EUR
25+6.82 EUR
100+6.19 EUR
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TDF8546TH/N2,118 TDF8546.pdf
TDF8546TH/N2,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022.pdf
TJA1022T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 9637 Stücke:
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6+3.17 EUR
10+2.34 EUR
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TJA1028TK/5V0/20:1 TJA1028.pdf
TJA1028TK/5V0/20:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1370 Stücke:
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7+2.73 EUR
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AFM906NT1 AFM906N.pdf
AFM906NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 901 Stücke:
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5+4.17 EUR
10+3.11 EUR
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 10XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 1797 Stücke:
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13+1.36 EUR
19+0.97 EUR
25+0.87 EUR
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1000+0.66 EUR
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TDA1566TH/N2S,118 TDA1566.pdf
TDA1566TH/N2S,118
Hersteller: NXP USA Inc.
Description: IC AMP AB MONO/STER 150W 24HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6.5V ~ 18V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 75W x 2 @ 2Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901N.pdf
AFIC901NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
auf Bestellung 2361 Stücke:
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3+5.97 EUR
10+5.33 EUR
25+4.79 EUR
100+4.37 EUR
250+3.94 EUR
500+3.54 EUR
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PCA8551ATT/AJ PCA8551.pdf
PCA8551ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 144 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 144 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BGS8H2X BGS8H2.pdf
BGS8H2X
Hersteller: NXP USA Inc.
Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 12.5dB
Current - Supply: 5.8mA
Noise Figure: 1dB
Test Frequency: 2.3GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 4354 Stücke:
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17+1.07 EUR
19+0.95 EUR
25+0.86 EUR
100+0.75 EUR
250+0.66 EUR
500+0.58 EUR
1000+0.46 EUR
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TEA1713T/N2,518 TEA1713T.pdf
TEA1713T/N2,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 880 Stücke:
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4+5.54 EUR
10+4.17 EUR
25+3.83 EUR
100+3.45 EUR
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BGU8M1X BGU8M1.pdf
BGU8M1X
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1370 Stücke:
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20+0.92 EUR
22+0.82 EUR
25+0.74 EUR
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TJA1029T/20/1J TJA1029.pdf
TJA1029T/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TJA1029T,118 TJA1029.pdf
TJA1029T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2069 Stücke:
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Anzahl Preis
9+2.11 EUR
10+1.89 EUR
25+1.79 EUR
100+1.47 EUR
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500+1.21 EUR
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TEA19162T/2J TEA19162T.pdf
TEA19162T/2J
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
auf Bestellung 4925 Stücke:
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10+1.90 EUR
13+1.38 EUR
25+1.25 EUR
100+1.10 EUR
250+1.03 EUR
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TJA1028TK/5V0/10:1 TJA1028.pdf
TJA1028TK/5V0/10:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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BF513,215 BF510_511_512_513_CNV.pdf
BF513,215
Hersteller: NXP USA Inc.
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050.pdf
MP3V5050GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS1X01_8X01.pdf
HTMS8001FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4927 Stücke:
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22+0.81 EUR
26+0.69 EUR
27+0.65 EUR
100+0.60 EUR
250+0.56 EUR
500+0.54 EUR
1000+0.52 EUR
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TEA1738T/N1,118 TEA1738T_TEA1738LT.pdf
TEA1738T/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 2373 Stücke:
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13+1.41 EUR
18+1.02 EUR
25+0.91 EUR
100+0.80 EUR
250+0.75 EUR
500+0.72 EUR
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SL2S1512FTBX SL2S1412_SL2S1512_SL2S1612.pdf
SL2S1512FTBX
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 9720 Stücke:
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19+0.93 EUR
26+0.70 EUR
28+0.63 EUR
100+0.54 EUR
250+0.49 EUR
500+0.46 EUR
1000+0.43 EUR
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BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
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BB156,115 BB156.pdf
BB156,115
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS.pdf
TEA1731LTS/1,115
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7725 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
84+0.21 EUR
121+0.15 EUR
139+0.13 EUR
164+0.11 EUR
250+0.10 EUR
500+0.09 EUR
1000+0.09 EUR
2500+0.08 EUR
5000+0.08 EUR
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HTMS8001FTK/AF,115 HTMS1X01_8X01.pdf
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
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PMBFJ308,215 PMBFJ308_309_310.pdf
PMBFJ308,215
Hersteller: NXP USA Inc.
Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
Produkt ist nicht verfügbar
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4.pdf
MC9S08PL4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3988 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.87 EUR
14+1.35 EUR
96+1.08 EUR
192+1.03 EUR
288+1.00 EUR
576+0.96 EUR
1056+0.93 EUR
2592+0.90 EUR
Mindestbestellmenge: 10
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MC9S08PL60CQH MC9S08PL60.pdf
MC9S08PL60CQH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL8CTG MC9S08PL16.pdf
MC9S08PL8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTG MC9S08PL16.pdf
MC9S08PL16CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PL16CTJ MC9S08PL16.pdf
MC9S08PL16CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 898 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.56 EUR
10+2.62 EUR
75+2.18 EUR
150+2.08 EUR
300+1.99 EUR
525+1.94 EUR
Mindestbestellmenge: 5
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SPC5775BDK3MME2 MPC5775BEFS.pdf
SPC5775BDK3MME2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
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Anzahl Preis
1+61.42 EUR
10+50.29 EUR
25+48.71 EUR
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MPC5775BE-416DS MPC5777CEVBUG.pdf
MPC5775BE-416DS
Hersteller: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
auf Bestellung 1 Stücke:
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1+1045.84 EUR
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TEA19051BABTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BACTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAFTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM33771BSPIEVB MC33771B_SDS.pdf
FRDM33771BSPIEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+343.29 EUR
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K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7730HV/N231D,51 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7730HV/N231D,55 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5
SPC5744PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5744PK1MLQ5R
SPC5744PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC34PF1550A7EP PF1550.pdf
MC34PF1550A7EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC34PF1550A7EPR2 PF1550.pdf
MC34PF1550A7EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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