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PCA9551D,118 PCA9551D,118 NXP USA Inc. PCA9551.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Number of Outputs: 8
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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LPC844M201JHI33Y LPC844M201JHI33Y NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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TJA1044GTK/3Z TJA1044GTK/3Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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KMA310/A NXP USA Inc. Description: SENSOR ANGLE 180 DEG PC PIN
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 3-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 3-SIP Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMA321/A NXP USA Inc. Description: SENSOR ANGLE 180DEG PC PIN
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMA320/A NXP USA Inc. Description: SENSOR ANGLE 180DEG PC PIN
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-K32L2B NXP USA Inc. Description: FREEDOM EVAL BOARD K32L2
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MC56F83783VLH MC56F83783VLH NXP USA Inc. MC56F837XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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AFSC5G23D37T2 NXP USA Inc. AFSC5G23D37.pdf Description: AIRFAST PWR AMP 5G 27DB HLQFN26
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AFSC5G35D37-EVB AFSC5G35D37-EVB NXP USA Inc. AFSC5G35D37.pdf Description: AFSC5G35D37 REF BOARD 3400-3600
Packaging: Bulk
For Use With/Related Products: AFSC5G35D37
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G35D37
Supplied Contents: Board(s)
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AFSC5G35D35T2 AFSC5G35D35T2 NXP USA Inc. AFSC5G35D35.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G26D37-EVB AFSC5G26D37-EVB NXP USA Inc. AFSC5G26D37.pdf Description: AFSC5G26D37 REF BOARD 2496-2690
Packaging: Bulk
For Use With/Related Products: AFSC5G26D37
Frequency: 2.545GHz ~ 2.655GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G26D37
Supplied Contents: Board(s)
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MC56F83683VLH MC56F83683VLH NXP USA Inc. MC56F836XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
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MC56F83763VLH MC56F83763VLH NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 128KB/48KB LQFP64
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MC56F83663VLH MC56F83663VLH NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
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MC56F83769VLL MC56F83769VLL NXP USA Inc. MC56F836XXDS.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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TJA1055T/3/2Z TJA1055T/3/2Z NXP USA Inc. TJA1055.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Part Status: Obsolete
Duplex: Half
Supplier Device Package: 14-SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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LPC55S69JBD64K LPC55S69JBD64K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC55S26JBD64K LPC55S26JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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100+6.51 EUR
250+6.24 EUR
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LPC5526JEV98K LPC5526JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S26JBD100K LPC55S26JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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80+7.72 EUR
230+7.65 EUR
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LPC5528JBD64K LPC5528JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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800+6.7 EUR
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LPC55S28-EVK LPC55S28-EVK NXP USA Inc. LPC552xFAMFS.pdf Description: LPCXPRESSO 55S28 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S28
Platform: LPCXpresso™
Part Status: Active
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MRF24G300HSR5 NXP USA Inc. MRF24G300HS.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Produkt ist nicht verfügbar
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LPC5526JBD64K LPC5526JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC5528JEV98K LPC5528JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S28JEV98K LPC55S28JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24G300HSR5 NXP USA Inc. MRF24G300HS.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
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KIT-HGDRONEK66 KIT-HGDRONEK66 NXP USA Inc. hovergames Description: HOVERGAMES DRONE KIT
Packaging: Bulk
Configuration: Robot Components
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8MN1DVTJZAA MIMX8MN1DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.11 EUR
10+33.08 EUR
25+31.07 EUR
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MIMX8MN6CVTIZAA MIMX8MN6CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)
1+55.25 EUR
10+44.59 EUR
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152+38.31 EUR
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MIMX8MN5DVTJZAA MIMX8MN5DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
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MIMX8MN4DVTJZAA MIMX8MN4DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
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1+50.9 EUR
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MIMX8MN4CVTIZAA MIMX8MN4CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 402 Stücke:
Lieferzeit 10-14 Tag (e)
1+57.81 EUR
10+46.77 EUR
25+44.01 EUR
152+40.27 EUR
304+39.27 EUR
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MIMX8MN6DVTJZAA MIMX8MN6DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 226 Stücke:
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1+47.23 EUR
10+37.96 EUR
25+35.65 EUR
152+32.52 EUR
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MIMX8MN1CVTIZAA MIMX8MN1CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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Lieferzeit 10-14 Tag (e)
1+44.53 EUR
10+35.72 EUR
25+33.53 EUR
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HGD-TELEM433 HGD-TELEM433 NXP USA Inc. Description: TELEMETRY RADIO DRONE 433MHZ EU
Part Status: Active
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+78.21 EUR
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MIMX8MN5CVTIZAA MIMX8MN5CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.11 EUR
10+47.85 EUR
25+45.03 EUR
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MIMX8MN3DVTJZAA MIMX8MN3DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.75 EUR
10+33.43 EUR
25+31.34 EUR
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MIMX8MN2CVTIZAA MIMX8MN2CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 171 Stücke:
Lieferzeit 10-14 Tag (e)
1+54.84 EUR
10+44.29 EUR
25+41.66 EUR
152+38.09 EUR
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MIMX8MN3CVTIZAA MIMX8MN3CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 381 Stücke:
Lieferzeit 10-14 Tag (e)
1+55.14 EUR
10+44.55 EUR
25+41.9 EUR
152+38.32 EUR
304+37.35 EUR
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AFSC5G26D37T1 NXP USA Inc. Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D35T1 NXP USA Inc. AFSC5G26D37.pdf Description: AIRFAST PWR AMP 5G 26DB HLQFN26
Produkt ist nicht verfügbar
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K32L2B31VFT0A K32L2B31VFT0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 3070 Stücke:
Lieferzeit 10-14 Tag (e)
3+10.14 EUR
10+7.74 EUR
25+7.13 EUR
80+6.56 EUR
230+6.18 EUR
520+5.95 EUR
1040+5.8 EUR
2600+5.63 EUR
Mindestbestellmenge: 3 Stücke
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K32L2B11VLH0A K32L2B11VLH0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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K32L2B11VFT0A K32L2B11VFT0A NXP USA Inc. K32L2Ax.pdf Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
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 Mindestbestellmenge: 520 Stücke
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K32L2B31VFM0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.72 EUR
10+7.38 EUR
25+6.81 EUR
80+6.26 EUR
Mindestbestellmenge: 3 Stücke
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K32L2B31VLH0A K32L2B31VLH0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.64 EUR
10+8.13 EUR
25+7.5 EUR
160+6.63 EUR
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K32L2B21VLH0A K32L2B21VLH0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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FRDMPT2001EVM FRDMPT2001EVM NXP USA Inc. FRDMPT2001EVM.pdf Description: EVAL BOARD FOR PT2001
Packaging: Bulk
Function: Solenoid Control
Type: Power Management
Utilized IC / Part: PT2001
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+531.31 EUR
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PN7150B0HN/C11004E PN7150B0HN/C11004E NXP USA Inc. isl2821314msopeval2z-evaluation-board-user-guide Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PN7150B0HN/C11004Y PN7150B0HN/C11004Y NXP USA Inc. isl282x7soiceval2z-user-guide Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I²C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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QN9030THN/001K QN9030THN/001K NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.15 EUR
10+7.06 EUR
25+6.68 EUR
100+6.15 EUR
250+5.83 EUR
500+5.6 EUR
2450+5.14 EUR
Mindestbestellmenge: 3 Stücke
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SP5744BBK1AVKU2R SP5744BBK1AVKU2R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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SAF775DHV/N208Q/AK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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SP5746BHK1AMMH6R SP5746BHK1AMMH6R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BK0MLH6R SPC5602BK0MLH6R NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 45
Part Status: Active
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775CHN/N208Z/MP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/BY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF775DHN/N208ZAMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Produkt ist nicht verfügbar
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PCA9551D,118 PCA9551.pdf
PCA9551D,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Number of Outputs: 8
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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LPC844M201JHI33Y LPC84x.pdf
LPC844M201JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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TJA1044GTK/3Z TJA1044.pdf
TJA1044GTK/3Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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KMA310/A
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180 DEG PC PIN
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 3-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 3-SIP Module
Packaging: Tape & Reel (TR)
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KMA321/A
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
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KMA320/A
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-K32L2B
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD K32L2
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MC56F83783VLH MC56F837XXDS.pdf
MC56F83783VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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AFSC5G23D37T2 AFSC5G23D37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37-EVB AFSC5G35D37.pdf
AFSC5G35D37-EVB
Hersteller: NXP USA Inc.
Description: AFSC5G35D37 REF BOARD 3400-3600
Packaging: Bulk
For Use With/Related Products: AFSC5G35D37
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G35D37
Supplied Contents: Board(s)
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AFSC5G35D35T2 AFSC5G35D35.pdf
AFSC5G35D35T2
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26D37-EVB AFSC5G26D37.pdf
AFSC5G26D37-EVB
Hersteller: NXP USA Inc.
Description: AFSC5G26D37 REF BOARD 2496-2690
Packaging: Bulk
For Use With/Related Products: AFSC5G26D37
Frequency: 2.545GHz ~ 2.655GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G26D37
Supplied Contents: Board(s)
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MC56F83683VLH MC56F836XXDS.pdf
MC56F83683VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Produkt ist nicht verfügbar
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MC56F83763VLH MC56F83XXXFS.pdf
MC56F83763VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB/48KB LQFP64
Produkt ist nicht verfügbar
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MC56F83663VLH MC56F83XXXFS.pdf
MC56F83663VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC56F83769VLL MC56F836XXDS.pdf
MC56F83769VLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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TJA1055T/3/2Z TJA1055.pdf
TJA1055T/3/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Part Status: Obsolete
Duplex: Half
Supplier Device Package: 14-SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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LPC55S69JBD64K LPC55S6x.pdf
LPC55S69JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC55S26JBD64K LPC55S2x_LPC552x.pdf
LPC55S26JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC5526JEV98K LPC552xFAMFS.pdf
LPC5526JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S26JBD100K LPC55S2x_LPC552x.pdf
LPC55S26JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+11.04 EUR
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LPC5528JBD64K LPC55S2x_LPC552x.pdf
LPC5528JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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2+11.65 EUR
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LPC55S28-EVK LPC552xFAMFS.pdf
LPC55S28-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO 55S28 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S28
Platform: LPCXpresso™
Part Status: Active
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MRF24G300HSR5 MRF24G300HS.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
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LPC5526JBD64K LPC55S2x_LPC552x.pdf
LPC5526JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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3+10.33 EUR
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100+5.88 EUR
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LPC5528JEV98K LPC552xFAMFS.pdf
LPC5528JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1179 Stücke:
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2+16.86 EUR
10+13.24 EUR
80+10.96 EUR
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LPC55S28JEV98K LPC552xFAMFS.pdf
LPC55S28JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24G300HSR5 MRF24G300HS.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
auf Bestellung 16 Stücke:
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1+325.43 EUR
10+276.14 EUR
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KIT-HGDRONEK66 hovergames
KIT-HGDRONEK66
Hersteller: NXP USA Inc.
Description: HOVERGAMES DRONE KIT
Packaging: Bulk
Configuration: Robot Components
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8MN1DVTJZAA IMX8MNCEC.pdf
MIMX8MN1DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
auf Bestellung 138 Stücke:
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AnzahlPrivatkunde
1+41.11 EUR
10+33.08 EUR
25+31.07 EUR
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MIMX8MN6CVTIZAA IMX8MNIEC.pdf
MIMX8MN6CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 164 Stücke:
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1+55.25 EUR
10+44.59 EUR
25+41.92 EUR
152+38.31 EUR
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MIMX8MN5DVTJZAA IMX8MNCEC.pdf
MIMX8MN5DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 152 Stücke:
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1+45.05 EUR
10+36.16 EUR
25+33.95 EUR
152+30.94 EUR
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MIMX8MN4DVTJZAA IMX8MNCEC.pdf
MIMX8MN4DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
auf Bestellung 107 Stücke:
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1+50.9 EUR
10+41.04 EUR
25+38.59 EUR
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MIMX8MN4CVTIZAA IMX8MNIEC.pdf
MIMX8MN4CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 402 Stücke:
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AnzahlPrivatkunde
1+57.81 EUR
10+46.77 EUR
25+44.01 EUR
152+40.27 EUR
304+39.27 EUR
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MIMX8MN6DVTJZAA IMX8MNCEC.pdf
MIMX8MN6DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 226 Stücke:
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AnzahlPrivatkunde
1+47.23 EUR
10+37.96 EUR
25+35.65 EUR
152+32.52 EUR
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MIMX8MN1CVTIZAA IMX8MNIEC.pdf
MIMX8MN1CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
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1+44.53 EUR
10+35.72 EUR
25+33.53 EUR
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HGD-TELEM433
HGD-TELEM433
Hersteller: NXP USA Inc.
Description: TELEMETRY RADIO DRONE 433MHZ EU
Part Status: Active
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+78.21 EUR
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MIMX8MN5CVTIZAA IMX8MNIEC.pdf
MIMX8MN5CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 127 Stücke:
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1+59.11 EUR
10+47.85 EUR
25+45.03 EUR
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MIMX8MN3DVTJZAA IMX8MNCEC.pdf
MIMX8MN3DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 149 Stücke:
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AnzahlPrivatkunde
1+41.75 EUR
10+33.43 EUR
25+31.34 EUR
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MIMX8MN2CVTIZAA IMX8MNIEC.pdf
MIMX8MN2CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 171 Stücke:
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AnzahlPrivatkunde
1+54.84 EUR
10+44.29 EUR
25+41.66 EUR
152+38.09 EUR
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MIMX8MN3CVTIZAA IMX8MNIEC.pdf
MIMX8MN3CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 381 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+55.14 EUR
10+44.55 EUR
25+41.9 EUR
152+38.32 EUR
304+37.35 EUR
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AFSC5G26D37T1
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D35T1 AFSC5G26D37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 26DB HLQFN26
Produkt ist nicht verfügbar
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K32L2B31VFT0A K32-L2-FS.pdf
K32L2B31VFT0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 3070 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.14 EUR
10+7.74 EUR
25+7.13 EUR
80+6.56 EUR
230+6.18 EUR
520+5.95 EUR
1040+5.8 EUR
2600+5.63 EUR
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K32L2B11VLH0A K32-L2-FS.pdf
K32L2B11VLH0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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K32L2B11VFT0A K32L2Ax.pdf
K32L2B11VFT0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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K32L2B31VFM0A K32-L2-FS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.72 EUR
10+7.38 EUR
25+6.81 EUR
80+6.26 EUR
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K32L2B31VLH0A K32-L2-FS.pdf
K32L2B31VLH0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.64 EUR
10+8.13 EUR
25+7.5 EUR
160+6.63 EUR
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K32L2B21VLH0A K32-L2-FS.pdf
K32L2B21VLH0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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FRDMPT2001EVM FRDMPT2001EVM.pdf
FRDMPT2001EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PT2001
Packaging: Bulk
Function: Solenoid Control
Type: Power Management
Utilized IC / Part: PT2001
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+531.31 EUR
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PN7150B0HN/C11004E isl2821314msopeval2z-evaluation-board-user-guide
PN7150B0HN/C11004E
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PN7150B0HN/C11004Y isl282x7soiceval2z-user-guide
PN7150B0HN/C11004Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I²C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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QN9030THN/001K QN9090(T)QN9030(T).pdf
QN9030THN/001K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.15 EUR
10+7.06 EUR
25+6.68 EUR
100+6.15 EUR
250+5.83 EUR
500+5.6 EUR
2450+5.14 EUR
Mindestbestellmenge: 3 Stücke
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SP5744BBK1AVKU2R
SP5744BBK1AVKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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SAF775DHV/N208Q/AK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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SP5746BHK1AMMH6R MPC5646C.pdf
SP5746BHK1AMMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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SPC5602BK0MLH6R MPC5604BC.pdf
SPC5602BK0MLH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 45
Part Status: Active
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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SAF775CHN/N208Z/MP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/BY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF775DHN/N208ZAMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Produkt ist nicht verfügbar
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