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LPC55S69JBD64K LPC55S69JBD64K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 758 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.74 EUR
10+9.86 EUR
25+9.14 EUR
100+8.35 EUR
250+7.98 EUR
Mindestbestellmenge: 2 Stücke
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LPC55S26JBD64K LPC55S26JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 3444 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.45 EUR
10+6.5 EUR
25+6.01 EUR
100+5.47 EUR
250+5.24 EUR
Mindestbestellmenge: 3 Stücke
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LPC5526JEV98K LPC5526JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 986 Stücke:
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2+12.13 EUR
10+9.53 EUR
80+7.89 EUR
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LPC55S26JBD100K LPC55S26JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.28 EUR
10+6.83 EUR
24+6.69 EUR
80+6.49 EUR
230+6.43 EUR
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LPC5528JBD64K LPC5528JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 890 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.79 EUR
10+5.77 EUR
25+5.71 EUR
100+5.65 EUR
250+5.64 EUR
800+5.63 EUR
Mindestbestellmenge: 2 Stücke
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LPC55S28-EVK LPC55S28-EVK NXP USA Inc. LPC552xFAMFS.pdf Description: LPCXPRESSO 55S28 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S28
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+73.39 EUR
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MRF24G300HSR5 NXP USA Inc. MRF24G300HS.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Produkt ist nicht verfügbar
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LPC5526JBD64K LPC5526JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.68 EUR
10+5.22 EUR
25+5.04 EUR
100+4.94 EUR
250+4.93 EUR
800+4.88 EUR
Mindestbestellmenge: 3 Stücke
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LPC5528JEV98K LPC5528JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1179 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.17 EUR
10+11.13 EUR
80+9.21 EUR
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LPC55S28JEV98K LPC55S28JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1300 Stücke
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MRF24G300HSR5 NXP USA Inc. MRF24G300HS.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+273.47 EUR
10+232.05 EUR
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KIT-HGDRONEK66 KIT-HGDRONEK66 NXP USA Inc. hovergames Description: HOVERGAMES DRONE KIT
Packaging: Bulk
Configuration: Robot Components
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8MN1DVTJZAA MIMX8MN1DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.55 EUR
10+27.8 EUR
25+26.11 EUR
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MIMX8MN6CVTIZAA MIMX8MN6CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.43 EUR
10+37.47 EUR
25+35.23 EUR
152+32.19 EUR
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MIMX8MN5DVTJZAA MIMX8MN5DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
1+37.86 EUR
10+30.39 EUR
25+28.53 EUR
152+26 EUR
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MIMX8MN4DVTJZAA MIMX8MN4DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)
1+42.77 EUR
10+34.49 EUR
25+32.43 EUR
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MIMX8MN4CVTIZAA MIMX8MN4CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 402 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.58 EUR
10+39.3 EUR
25+36.98 EUR
152+33.84 EUR
304+33 EUR
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MIMX8MN6DVTJZAA MIMX8MN6DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 226 Stücke:
Lieferzeit 10-14 Tag (e)
1+39.69 EUR
10+31.9 EUR
25+29.96 EUR
152+27.33 EUR
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MIMX8MN1CVTIZAA MIMX8MN1CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
1+37.42 EUR
10+30.02 EUR
25+28.18 EUR
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HGD-TELEM433 HGD-TELEM433 NXP USA Inc. Description: TELEMETRY RADIO DRONE 433MHZ EU
Part Status: Active
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+65.72 EUR
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MIMX8MN5CVTIZAA MIMX8MN5CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
1+49.67 EUR
10+40.21 EUR
25+37.84 EUR
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MIMX8MN3DVTJZAA MIMX8MN3DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.08 EUR
10+28.09 EUR
25+26.34 EUR
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MIMX8MN2CVTIZAA MIMX8MN2CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 171 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.08 EUR
10+37.22 EUR
25+35.01 EUR
152+32.01 EUR
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MIMX8MN3CVTIZAA MIMX8MN3CVTIZAA NXP USA Inc. IMX8MNIEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 381 Stücke:
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AFSC5G26D37T1 NXP USA Inc. Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D35T1 NXP USA Inc. AFSC5G26D37.pdf Description: AIRFAST PWR AMP 5G 26DB HLQFN26
Produkt ist nicht verfügbar
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K32L2B31VFT0A K32L2B31VFT0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 3070 Stücke:
Lieferzeit 10-14 Tag (e)
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25+5.99 EUR
80+5.51 EUR
230+5.19 EUR
520+5 EUR
1040+4.87 EUR
2600+4.73 EUR
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K32L2B11VLH0A K32L2B11VLH0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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K32L2B11VFT0A K32L2B11VFT0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
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K32L2B31VFM0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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K32L2B31VLH0A K32L2B31VLH0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
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K32L2B21VLH0A K32L2B21VLH0A NXP USA Inc. K32-L2-FS.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FRDMPT2001EVM FRDMPT2001EVM NXP USA Inc. FRDMPT2001EVM.pdf Description: EVAL BOARD FOR PT2001
Packaging: Bulk
Function: Solenoid Control
Type: Power Management
Utilized IC / Part: PT2001
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
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PN7150B0HN/C11004E PN7150B0HN/C11004E NXP USA Inc. isl2821314msopeval2z-evaluation-board-user-guide Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PN7150B0HN/C11004Y PN7150B0HN/C11004Y NXP USA Inc. isl282x7soiceval2z-user-guide Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I²C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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QN9030THN/001K QN9030THN/001K NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
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25+5.61 EUR
100+5.17 EUR
250+4.9 EUR
500+4.71 EUR
2450+4.32 EUR
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SP5744BBK1AVKU2R SP5744BBK1AVKU2R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/AK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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SP5746BHK1AMMH6R SP5746BHK1AMMH6R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BK0MLH6R SPC5602BK0MLH6R NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 45
Part Status: Active
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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SAF775CHN/N208Z/MP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/BY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF775DHN/N208ZAMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Produkt ist nicht verfügbar
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QN9030HN/001Z QN9030HN/001Z NXP USA Inc. QN9090(T)QN9030(T).pdf Description: QN9030 BLE SOC
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: Bluetooth
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11dBm
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Type: TxRx + MCU
Memory Size: 320kB Flash, 88kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -97dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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S9S12G48AVLF S9S12G48AVLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: CPU12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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QN9030HN/001Y QN9030HN/001Y NXP USA Inc. Description: QN9030 BLE SOC
Produkt ist nicht verfügbar
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TFA9894AUK/N1Z NXP USA Inc. Description: 5.6W/CLASS D/ I2S/TDM 10V BOOST
Packaging: Tape & Reel (TR)
Package / Case: 48-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.2W x 1 @ 4Ohm; 5.6W x 2 @ 8Ohm
Supplier Device Package: 48-WLCSP (2.51x3.55)
Part Status: Active
Produkt ist nicht verfügbar
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MC33PF8100CCESR2 MC33PF8100CCESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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OMA100X-SHLD-EVB NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: OMA100X-SHLD-EVB
Packaging: Bulk
Function: Arduino Shield
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: LPC11U37H
Platform: Arduino
Produkt ist nicht verfügbar
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TJA1049T/3/1Z TJA1049T/3/1Z NXP USA Inc. TJA1049.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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QN9090THN/001Z QN9090THN/001Z NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
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1000+6.19 EUR
Mindestbestellmenge: 1000 Stücke
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TEA18362T/2J TEA18362T/2J NXP USA Inc. TEA18362T.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
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SAF775CHV/N208Q/KY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08PL16CLC MC9S08PL16CLC NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 1240 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.8 EUR
10+2.82 EUR
25+2.58 EUR
100+2.31 EUR
250+2.18 EUR
500+2.11 EUR
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SPC5605BK0VLL4R SPC5605BK0VLL4R NXP USA Inc. Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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S9S12GN16BMTJ S9S12GN16BMTJ NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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FS32K116BRT0VLFR FS32K116BRT0VLFR NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ASL5108SHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRVR CTRLR PWM 36HVQFN
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 800mA
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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TEA18362LT/2J TEA18362LT/2J NXP USA Inc. TEA18362LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Power (Watts): 75 W
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 8-SO
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25kHz ~ 132.5kHz
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2500 Stücke
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LPC55S69JBD64K LPC55S6x.pdf
LPC55S69JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 758 Stücke:
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AnzahlPreis
2+12.74 EUR
10+9.86 EUR
25+9.14 EUR
100+8.35 EUR
250+7.98 EUR
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LPC55S26JBD64K LPC55S2x_LPC552x.pdf
LPC55S26JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 3444 Stücke:
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3+8.45 EUR
10+6.5 EUR
25+6.01 EUR
100+5.47 EUR
250+5.24 EUR
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LPC5526JEV98K LPC552xFAMFS.pdf
LPC5526JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 986 Stücke:
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AnzahlPreis
2+12.13 EUR
10+9.53 EUR
80+7.89 EUR
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LPC55S26JBD100K LPC55S2x_LPC552x.pdf
LPC55S26JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
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AnzahlPreis
2+9.28 EUR
10+6.83 EUR
24+6.69 EUR
80+6.49 EUR
230+6.43 EUR
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LPC5528JBD64K LPC55S2x_LPC552x.pdf
LPC5528JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 890 Stücke:
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AnzahlPreis
2+9.79 EUR
10+5.77 EUR
25+5.71 EUR
100+5.65 EUR
250+5.64 EUR
800+5.63 EUR
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LPC55S28-EVK LPC552xFAMFS.pdf
LPC55S28-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO 55S28 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S28
Platform: LPCXpresso™
Part Status: Active
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1+73.39 EUR
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MRF24G300HSR5 MRF24G300HS.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Produkt ist nicht verfügbar
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LPC5526JBD64K LPC55S2x_LPC552x.pdf
LPC5526JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.68 EUR
10+5.22 EUR
25+5.04 EUR
100+4.94 EUR
250+4.93 EUR
800+4.88 EUR
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LPC5528JEV98K LPC552xFAMFS.pdf
LPC5528JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1179 Stücke:
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AnzahlPreis
2+14.17 EUR
10+11.13 EUR
80+9.21 EUR
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LPC55S28JEV98K LPC552xFAMFS.pdf
LPC55S28JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
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MRF24G300HSR5 MRF24G300HS.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel (Dual)
Power - Output: 300W
Gain: 15.3dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
auf Bestellung 16 Stücke:
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AnzahlPreis
1+273.47 EUR
10+232.05 EUR
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KIT-HGDRONEK66 hovergames
KIT-HGDRONEK66
Hersteller: NXP USA Inc.
Description: HOVERGAMES DRONE KIT
Packaging: Bulk
Configuration: Robot Components
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8MN1DVTJZAA IMX8MNCEC.pdf
MIMX8MN1DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
auf Bestellung 138 Stücke:
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AnzahlPreis
1+34.55 EUR
10+27.8 EUR
25+26.11 EUR
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MIMX8MN6CVTIZAA IMX8MNIEC.pdf
MIMX8MN6CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+46.43 EUR
10+37.47 EUR
25+35.23 EUR
152+32.19 EUR
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MIMX8MN5DVTJZAA IMX8MNCEC.pdf
MIMX8MN5DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+37.86 EUR
10+30.39 EUR
25+28.53 EUR
152+26 EUR
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MIMX8MN4DVTJZAA IMX8MNCEC.pdf
MIMX8MN4DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 486-LFBGA, FCBGA
Packaging: Tray
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE
Supplier Device Package: 486-LFBGA (14x14)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
auf Bestellung 107 Stücke:
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AnzahlPreis
1+42.77 EUR
10+34.49 EUR
25+32.43 EUR
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MIMX8MN4CVTIZAA IMX8MNIEC.pdf
MIMX8MN4CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 402 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+48.58 EUR
10+39.3 EUR
25+36.98 EUR
152+33.84 EUR
304+33 EUR
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MIMX8MN6DVTJZAA IMX8MNCEC.pdf
MIMX8MN6DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 226 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+39.69 EUR
10+31.9 EUR
25+29.96 EUR
152+27.33 EUR
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MIMX8MN1CVTIZAA IMX8MNIEC.pdf
MIMX8MN1CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+37.42 EUR
10+30.02 EUR
25+28.18 EUR
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HGD-TELEM433
HGD-TELEM433
Hersteller: NXP USA Inc.
Description: TELEMETRY RADIO DRONE 433MHZ EU
Part Status: Active
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+65.72 EUR
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MIMX8MN5CVTIZAA IMX8MNIEC.pdf
MIMX8MN5CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+49.67 EUR
10+40.21 EUR
25+37.84 EUR
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MIMX8MN3DVTJZAA IMX8MNCEC.pdf
MIMX8MN3DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 149 Stücke:
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1+35.08 EUR
10+28.09 EUR
25+26.34 EUR
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MIMX8MN2CVTIZAA IMX8MNIEC.pdf
MIMX8MN2CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 171 Stücke:
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AnzahlPreis
1+46.08 EUR
10+37.22 EUR
25+35.01 EUR
152+32.01 EUR
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MIMX8MN3CVTIZAA IMX8MNIEC.pdf
MIMX8MN3CVTIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 381 Stücke:
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AnzahlPreis
1+46.34 EUR
10+37.44 EUR
25+35.21 EUR
152+32.2 EUR
304+31.39 EUR
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AFSC5G26D37T1
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D35T1 AFSC5G26D37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 26DB HLQFN26
Produkt ist nicht verfügbar
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K32L2B31VFT0A K32-L2-FS.pdf
K32L2B31VFT0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 3070 Stücke:
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3+8.52 EUR
10+6.5 EUR
25+5.99 EUR
80+5.51 EUR
230+5.19 EUR
520+5 EUR
1040+4.87 EUR
2600+4.73 EUR
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K32L2B11VLH0A K32-L2-FS.pdf
K32L2B11VLH0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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K32L2B11VFT0A K32-L2-FS.pdf
K32L2B11VFT0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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K32L2B31VFM0A K32-L2-FS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
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3+8.17 EUR
10+6.2 EUR
25+5.72 EUR
80+5.26 EUR
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K32L2B31VLH0A K32-L2-FS.pdf
K32L2B31VLH0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
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AnzahlPreis
2+8.94 EUR
10+6.83 EUR
25+6.3 EUR
160+5.57 EUR
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K32L2B21VLH0A K32-L2-FS.pdf
K32L2B21VLH0A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.2V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FRDMPT2001EVM FRDMPT2001EVM.pdf
FRDMPT2001EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PT2001
Packaging: Bulk
Function: Solenoid Control
Type: Power Management
Utilized IC / Part: PT2001
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s)
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1+446.48 EUR
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PN7150B0HN/C11004E isl2821314msopeval2z-evaluation-board-user-guide
PN7150B0HN/C11004E
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PN7150B0HN/C11004Y isl282x7soiceval2z-user-guide
PN7150B0HN/C11004Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: ISO 14443, ISO 15693, FeliCa, Mifare, NFC
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I²C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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QN9030THN/001K QN9090(T)QN9030(T).pdf
QN9030THN/001K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
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AnzahlPreis
3+6.85 EUR
10+5.93 EUR
25+5.61 EUR
100+5.17 EUR
250+4.9 EUR
500+4.71 EUR
2450+4.32 EUR
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SP5744BBK1AVKU2R
SP5744BBK1AVKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/AK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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SP5746BHK1AMMH6R MPC5646C.pdf
SP5746BHK1AMMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BK0MLH6R MPC5604BC.pdf
SPC5602BK0MLH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 45
Part Status: Active
DigiKey Programmable: Not Verified
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775CHN/N208Z/MP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/BY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF775DHN/N208ZAMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 184-HVQFN (12x12)
Produkt ist nicht verfügbar
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QN9030HN/001Z QN9090(T)QN9030(T).pdf
QN9030HN/001Z
Hersteller: NXP USA Inc.
Description: QN9030 BLE SOC
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: Bluetooth
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11dBm
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Type: TxRx + MCU
Memory Size: 320kB Flash, 88kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -97dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G48AVLF
S9S12G48AVLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: CPU12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9030HN/001Y
QN9030HN/001Y
Hersteller: NXP USA Inc.
Description: QN9030 BLE SOC
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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TFA9894AUK/N1Z
Hersteller: NXP USA Inc.
Description: 5.6W/CLASS D/ I2S/TDM 10V BOOST
Packaging: Tape & Reel (TR)
Package / Case: 48-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.2W x 1 @ 4Ohm; 5.6W x 2 @ 8Ohm
Supplier Device Package: 48-WLCSP (2.51x3.55)
Part Status: Active
Produkt ist nicht verfügbar
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MC33PF8100CCESR2 PF8100_PF8200.pdf
MC33PF8100CCESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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OMA100X-SHLD-EVB A1006_Demo-Dev_Kit.pdf
Hersteller: NXP USA Inc.
Description: OMA100X-SHLD-EVB
Packaging: Bulk
Function: Arduino Shield
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: LPC11U37H
Platform: Arduino
Produkt ist nicht verfügbar
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TJA1049T/3/1Z TJA1049.pdf
TJA1049T/3/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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QN9090THN/001Z QN9090(T)QN9030(T).pdf
QN9090THN/001Z
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1000+6.19 EUR
Mindestbestellmenge: 1000 Stücke
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TEA18362T/2J TEA18362T.pdf
TEA18362T/2J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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SAF775CHV/N208Q/KY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08PL16CLC MC9S08PL4.pdf
MC9S08PL16CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 1240 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.8 EUR
10+2.82 EUR
25+2.58 EUR
100+2.31 EUR
250+2.18 EUR
500+2.11 EUR
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SPC5605BK0VLL4R
SPC5605BK0VLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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S9S12GN16BMTJ
S9S12GN16BMTJ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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FS32K116BRT0VLFR
FS32K116BRT0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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ASL5108SHNZ PB_ASL5xxxyHz.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRVR CTRLR PWM 36HVQFN
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 800mA
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA18362LT/2J TEA18362LT.pdf
TEA18362LT/2J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Power (Watts): 75 W
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 8-SO
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25kHz ~ 132.5kHz
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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