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MKM14Z128CHH5R MKM14Z128CHH5R NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 MCIMX233DJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR S9S08EL16F1VTJR NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.63 EUR
Mindestbestellmenge: 2
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SPC5606BK0MLL6R SPC5606BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R SPC5605BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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1+34.46 EUR
10+27.63 EUR
25+25.92 EUR
100+24.04 EUR
250+23.14 EUR
500+22.6 EUR
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PN5120A0ET/C2J PN5120A0ET/C2J NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3060 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.53 EUR
10+11.75 EUR
25+11.13 EUR
100+10.27 EUR
250+9.76 EUR
500+9.4 EUR
1000+9.06 EUR
Mindestbestellmenge: 2
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MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
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1+63.01 EUR
10+51.45 EUR
25+48.56 EUR
100+45.39 EUR
250+43.88 EUR
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MCIMX257CJM4AR2 MCIMX257CJM4AR2 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC845-BRK LPC845-BRK NXP USA Inc. LPC84x.pdf Description: MCUXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Part Status: Active
auf Bestellung 68 Stücke:
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2+10.88 EUR
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LPC54S016JET100E LPC54S016JET100E NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
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2+13.24 EUR
10+10.24 EUR
25+9.5 EUR
100+8.67 EUR
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LPC54S018-EVK LPC54S018-EVK NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: LPCXPRESSO LPC54S018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54S018
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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QN9080-001-M17AZ QN9080-001-M17AZ NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9080SIP-DK QN9080SIP-DK NXP USA Inc. QN9080-001-M17.pdf Description: QN9080SIP DEV KIT + DONGLE
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: QN908x
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1+216.18 EUR
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QN9080-001-M17AZ QN9080-001-M17AZ NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Cut Tape (CT)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM4DVTLZAA MIMX8MM4DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
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1+59.29 EUR
10+48.2 EUR
25+45.43 EUR
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MIMX8MM3DVTLZAA MIMX8MM3DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 94 Stücke:
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1+45.28 EUR
10+36.76 EUR
25+35.08 EUR
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MIMX8MM1DVTLZAA MIMX8MM1DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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10+42.82 EUR
25+40.34 EUR
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MIMX8MM1CVTKZAA MIMX8MM1CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 109 Stücke:
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10+38.79 EUR
25+36.57 EUR
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8MMINILPD4-EVK 8MMINILPD4-EVK NXP USA Inc. IMX8MMINIFS.pdf Description: I.MX 8M MINI EVAL BRD
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAA MIMX8MM6DVTLZAA NXP USA Inc. IMX8MMCEC.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 260 Stücke:
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1+55.74 EUR
10+45.35 EUR
25+42.76 EUR
152+39.24 EUR
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MIMX8MM6CVTKZAA MIMX8MM6CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 137 Stücke:
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1+50.72 EUR
10+41.15 EUR
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MIMX8MM5DVTLZAA MIMX8MM5DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 160 Stücke:
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1+45.04 EUR
10+36.41 EUR
25+34.25 EUR
152+31.33 EUR
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MIMX8MM5CVTKZAA MIMX8MM5CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 347 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.1 EUR
10+47.33 EUR
25+44.65 EUR
152+41 EUR
304+40.03 EUR
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TEA1999TK/2J TEA1999TK/2J NXP USA Inc. TEA1999TK.pdf Description: IC CTRLR SYNC RECT HVSON8
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1999TS/2H TEA1999TS/2H NXP USA Inc. TEA1999TS.pdf Description: IC CTRLR SYNC RECT TSOP6
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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TEA1993TS/1H TEA1993TS/1H NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Active
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
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TEA1999TK/2J TEA1999TK/2J NXP USA Inc. TEA1999TK.pdf Description: IC CTRLR SYNC RECT HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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250+0.74 EUR
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TEA1999TS/2H TEA1999TS/2H NXP USA Inc. TEA1999TS.pdf Description: IC CTRLR SYNC RECT TSOP6
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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LPC55S69-EVK LPC55S69-EVK NXP USA Inc. LPC55S6x_DS.pdf Description: LPCXPRESSO LPC55S6X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S6x
Platform: LPCXpresso™
Part Status: Active
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MKE14Z32VLF4 MKE14Z32VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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MKE14Z64VLF4 MKE14Z64VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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MKE16Z32VLF4 MKE16Z32VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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MKE16Z32VLD4 MKE16Z32VLD4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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MKE16Z64VLF4 MKE16Z64VLF4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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MKE16Z64VLD4 MKE16Z64VLD4 NXP USA Inc. KE1xZ64_Communicator.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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FRDM-KE16Z FRDM-KE16Z NXP USA Inc. KE1xZ64_Communicator.pdf Description: FREEDOM KE1XZ EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE1xZ
Platform: Freedom
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PCF7900VHN/C0L/UZ PCF7900VHN/C0L/UZ NXP USA Inc. 75017268.pdf Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7900NHN/C0K/UZ PCF7900NHN/C0K/UZ NXP USA Inc. 75017268.pdf Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1015CAF4A MIMXRT1015CAF4A NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1015DAF5A MIMXRT1015DAF5A NXP USA Inc. IMXRT1015CEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1015-EVK MIMXRT1015-EVK NXP USA Inc. IMXRT1015CEC.pdf Description: I.MX RT1015 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1015
Part Status: Active
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MIMXRT1062CVJ5A MIMXRT1062CVJ5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062DVJ6A MIMXRT1062DVJ6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVJ5A MIMXRT1061CVJ5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXH3670UK/A1Z NXH3670UK/A1Z NXP USA Inc. NXH3670UK.pdf Description: IC MCU BLE HEADPHONE AUDIO WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXH3670UK/A1Z NXH3670UK/A1Z NXP USA Inc. NXH3670UK.pdf Description: IC MCU BLE HEADPHONE AUDIO WLCSP
Packaging: Cut Tape (CT)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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25+17.06 EUR
100+15.36 EUR
250+14.08 EUR
500+12.8 EUR
1000+11.52 EUR
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NTS0304EUKZ NTS0304EUKZ NXP USA Inc. NTS0304E.pdf Description: 4-BIT VOLTAGE TRANSLATOR 12WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)
auf Bestellung 4000 Stücke:
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4000+1.06 EUR
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LPC55S66JBD100K LPC55S66JBD100K NXP USA Inc. LPC55S6XFS.PDF Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S69JEV98K LPC55S69JEV98K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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PCAL6534EVJ PCAL6534EVJ NXP USA Inc. PCAL6534.pdf Description: IC XPNDR 1MHZ I2C 42VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 42-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 42-VFBGA (2.6x3)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCAL6534EVJ PCAL6534EVJ NXP USA Inc. PCAL6534.pdf Description: IC XPNDR 1MHZ I2C 42VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 42-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 42-VFBGA (2.6x3)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4482 Stücke:
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4+4.44 EUR
10+3.32 EUR
25+3.04 EUR
100+2.74 EUR
250+2.59 EUR
500+2.5 EUR
1000+2.43 EUR
2500+2.35 EUR
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NX20P0408UKZ NX20P0408UKZ NXP USA Inc. NX20P0408.pdf Description: IC USB TVS D+/- PROTECTION WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 2
auf Bestellung 4000 Stücke:
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4000+1.1 EUR
Mindestbestellmenge: 4000
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SJA1124EVB SJA1124EVB NXP USA Inc. SJA1124EVB.pdf Description: SPI TO QUAD-LIN BRIDGE EVAL BRD
Packaging: Bulk
Function: LIN
Type: Interface
Utilized IC / Part: SJA1124
Supplied Contents: Board(s)
Primary Attributes: 4-Channel (Quad)
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
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Lieferzeit 10-14 Tag (e)
1+201.38 EUR
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KITFS85AEEVM KITFS85AEEVM NXP USA Inc. UM11193pdf.PDF Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: Graphical User Interface (GUI)
Contents: Board(s), Cable(s), Accessories
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1+792.23 EUR
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KITFS85SKTEVM KITFS85SKTEVM NXP USA Inc. UM11183pdf.PDF Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: Graphical User Interface (GUI)
Contents: Board(s), Cable(s), Accessories
auf Bestellung 1 Stücke:
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KITFS85FRDMEVM NXP USA Inc. UM11157.pdf Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: Graphical User Interface (GUI)
Contents: Board(s), Cable(s), Accessories
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1+594.16 EUR
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FRDMGD3100HBIEVM FRDMGD3100HBIEVM NXP USA Inc. FRDMGD3100HBIEVM.pdf Description: MC33GD3100 HALF-BRIDGE EVAL BRD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: KL1x, KL2x, MC33GD3100
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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1+566.58 EUR
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LPC54018J4MET180E LPC54018J4MET180E NXP USA Inc. LPC54018JxM-LPC54S018JxM.pdf Description: IC MCU 32BIT 4MB FLASH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 137
DigiKey Programmable: Not Verified
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1+19.62 EUR
10+15.4 EUR
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MKM14Z128CHH5R MKMxxZxxCxx5.pdf
MKM14Z128CHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 IMX233FS.pdf
MCIMX233DJM4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR MC9S08EL32.pdf
S9S08EL16F1VTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.63 EUR
Mindestbestellmenge: 2
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SPC5606BK0MLL6R MPC5606B.pdf
SPC5606BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R MPC5606B.pdf
SPC5605BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+34.46 EUR
10+27.63 EUR
25+25.92 EUR
100+24.04 EUR
250+23.14 EUR
500+22.6 EUR
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PN5120A0ET/C2J PN512.pdf
PN5120A0ET/C2J
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3060 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.53 EUR
10+11.75 EUR
25+11.13 EUR
100+10.27 EUR
250+9.76 EUR
500+9.4 EUR
1000+9.06 EUR
Mindestbestellmenge: 2
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MCIMX6S5EVM10ACR IMX6SDLAEC.pdf
MCIMX6S5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+63.01 EUR
10+51.45 EUR
25+48.56 EUR
100+45.39 EUR
250+43.88 EUR
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MCIMX257CJM4AR2 IMX25CEC.pdf
MCIMX257CJM4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC845-BRK LPC84x.pdf
LPC845-BRK
Hersteller: NXP USA Inc.
Description: MCUXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Part Status: Active
auf Bestellung 68 Stücke:
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Anzahl Preis
2+10.88 EUR
Mindestbestellmenge: 2
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LPC54S016JET100E LPC540XXMCUFAMFS.pdf
LPC54S016JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
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Anzahl Preis
2+13.24 EUR
10+10.24 EUR
25+9.5 EUR
100+8.67 EUR
Mindestbestellmenge: 2
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LPC54S018-EVK LPC540XXMCUFAMFS.pdf
LPC54S018-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54S018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54S018
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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QN9080-001-M17AZ QN9080-001-M17.pdf
QN9080-001-M17AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9080SIP-DK QN9080-001-M17.pdf
QN9080SIP-DK
Hersteller: NXP USA Inc.
Description: QN9080SIP DEV KIT + DONGLE
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: QN908x
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Anzahl Preis
1+216.18 EUR
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QN9080-001-M17AZ QN9080-001-M17.pdf
QN9080-001-M17AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Cut Tape (CT)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM4DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM4DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
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Anzahl Preis
1+59.29 EUR
10+48.2 EUR
25+45.43 EUR
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MIMX8MM3DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM3DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 94 Stücke:
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Anzahl Preis
1+45.28 EUR
10+36.76 EUR
25+35.08 EUR
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MIMX8MM1DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM1DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 82 Stücke:
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1+52.76 EUR
10+42.82 EUR
25+40.34 EUR
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MIMX8MM1CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM1CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 109 Stücke:
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1+47.66 EUR
10+38.79 EUR
25+36.57 EUR
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8MMINILPD4-EVK IMX8MMINIFS.pdf
8MMINILPD4-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8M MINI EVAL BRD
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAA IMX8MMCEC.pdf
MIMX8MM6DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+55.74 EUR
10+45.35 EUR
25+42.76 EUR
152+39.24 EUR
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MIMX8MM6CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM6CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+50.72 EUR
10+41.15 EUR
25+38.76 EUR
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MIMX8MM5DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM5DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+45.04 EUR
10+36.41 EUR
25+34.25 EUR
152+31.33 EUR
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MIMX8MM5CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM5CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 347 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.1 EUR
10+47.33 EUR
25+44.65 EUR
152+41 EUR
304+40.03 EUR
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TEA1999TK/2J TEA1999TK.pdf
TEA1999TK/2J
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT HVSON8
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1999TS/2H TEA1999TS.pdf
TEA1999TS/2H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT TSOP6
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.71 EUR
Mindestbestellmenge: 3000
Im Einkaufswagen  Stück im Wert von  UAH
TEA1993TS/1H TEA1993TS.pdf
TEA1993TS/1H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Active
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.91 EUR
500+0.87 EUR
1000+0.84 EUR
Mindestbestellmenge: 11
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TEA1999TK/2J TEA1999TK.pdf
TEA1999TK/2J
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 11880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.39 EUR
18+1 EUR
25+0.9 EUR
100+0.79 EUR
250+0.74 EUR
500+0.71 EUR
1000+0.68 EUR
2500+0.66 EUR
5000+0.64 EUR
Mindestbestellmenge: 13
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TEA1999TS/2H TEA1999TS.pdf
TEA1999TS/2H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT TSOP6
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
auf Bestellung 6482 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.5 EUR
17+1.08 EUR
25+0.98 EUR
100+0.86 EUR
250+0.8 EUR
500+0.77 EUR
1000+0.74 EUR
Mindestbestellmenge: 12
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LPC55S69-EVK LPC55S6x_DS.pdf
LPC55S69-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC55S6X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S6x
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.39 EUR
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MKE14Z32VLF4 KE1xZ64_Communicator.pdf
MKE14Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.65 EUR
10+5.19 EUR
80+4.26 EUR
500+4.17 EUR
1000+3.51 EUR
Mindestbestellmenge: 3
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MKE14Z64VLF4 KE1xZ64_Communicator.pdf
MKE14Z64VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.8 EUR
10+3.62 EUR
25+3.33 EUR
100+3 EUR
250+2.97 EUR
Mindestbestellmenge: 4
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MKE16Z32VLF4 KE1xZ64_Communicator.pdf
MKE16Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.96 EUR
10+3.08 EUR
Mindestbestellmenge: 5
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MKE16Z32VLD4 KE1xZ64_Communicator.pdf
MKE16Z32VLD4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 769 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+3.47 EUR
25+3.33 EUR
160+3.13 EUR
320+3.1 EUR
640+3.09 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
MKE16Z64VLF4 KE1xZ64_Communicator.pdf
MKE16Z64VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1245 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.33 EUR
Mindestbestellmenge: 6
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MKE16Z64VLD4 KE1xZ64_Communicator.pdf
MKE16Z64VLD4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.21 EUR
10+3.63 EUR
25+3.56 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-KE16Z KE1xZ64_Communicator.pdf
FRDM-KE16Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE1XZ EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE1xZ
Platform: Freedom
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+75.33 EUR
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PCF7900VHN/C0L/UZ 75017268.pdf
PCF7900VHN/C0L/UZ
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7900NHN/C0K/UZ 75017268.pdf
PCF7900NHN/C0K/UZ
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.77 EUR
10+4.27 EUR
25+3.84 EUR
100+3.5 EUR
250+3.16 EUR
500+2.83 EUR
1000+2.39 EUR
Mindestbestellmenge: 4
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MIMXRT1015CAF4A IMXRT1015IEC.pdf
MIMXRT1015CAF4A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1015DAF5A IMXRT1015CEC.pdf
MIMXRT1015DAF5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1015-EVK IMXRT1015CEC.pdf
MIMXRT1015-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1015 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1015
Part Status: Active
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+91.66 EUR
10+91.45 EUR
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MIMXRT1062CVJ5A IMXRT1060IEC.pdf
MIMXRT1062CVJ5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1062DVJ6A IMXRT1060CEC.pdf
MIMXRT1062DVJ6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVJ5A IMXRT1060IEC.pdf
MIMXRT1061CVJ5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXH3670UK/A1Z NXH3670UK.pdf
NXH3670UK/A1Z
Hersteller: NXP USA Inc.
Description: IC MCU BLE HEADPHONE AUDIO WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXH3670UK/A1Z NXH3670UK.pdf
NXH3670UK/A1Z
Hersteller: NXP USA Inc.
Description: IC MCU BLE HEADPHONE AUDIO WLCSP
Packaging: Cut Tape (CT)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1395 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.49 EUR
10+18.77 EUR
25+17.06 EUR
100+15.36 EUR
250+14.08 EUR
500+12.8 EUR
1000+11.52 EUR
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NTS0304EUKZ NTS0304E.pdf
NTS0304EUKZ
Hersteller: NXP USA Inc.
Description: 4-BIT VOLTAGE TRANSLATOR 12WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+1.06 EUR
Mindestbestellmenge: 4000
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LPC55S66JBD100K LPC55S6XFS.PDF
LPC55S66JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.71 EUR
10+6.5 EUR
Mindestbestellmenge: 3
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LPC55S69JEV98K LPC55S6x.pdf
LPC55S69JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
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PCAL6534EVJ PCAL6534.pdf
PCAL6534EVJ
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 42VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 42-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 42-VFBGA (2.6x3)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCAL6534EVJ PCAL6534.pdf
PCAL6534EVJ
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 42VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 42-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 42-VFBGA (2.6x3)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4482 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.44 EUR
10+3.32 EUR
25+3.04 EUR
100+2.74 EUR
250+2.59 EUR
500+2.5 EUR
1000+2.43 EUR
2500+2.35 EUR
Mindestbestellmenge: 4
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NX20P0408UKZ NX20P0408.pdf
NX20P0408UKZ
Hersteller: NXP USA Inc.
Description: IC USB TVS D+/- PROTECTION WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 2
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+1.1 EUR
Mindestbestellmenge: 4000
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SJA1124EVB SJA1124EVB.pdf
SJA1124EVB
Hersteller: NXP USA Inc.
Description: SPI TO QUAD-LIN BRIDGE EVAL BRD
Packaging: Bulk
Function: LIN
Type: Interface
Utilized IC / Part: SJA1124
Supplied Contents: Board(s)
Primary Attributes: 4-Channel (Quad)
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+201.38 EUR
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KITFS85AEEVM UM11193pdf.PDF
KITFS85AEEVM
Hersteller: NXP USA Inc.
Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: Graphical User Interface (GUI)
Contents: Board(s), Cable(s), Accessories
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+792.23 EUR
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KITFS85SKTEVM UM11183pdf.PDF
KITFS85SKTEVM
Hersteller: NXP USA Inc.
Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: Graphical User Interface (GUI)
Contents: Board(s), Cable(s), Accessories
auf Bestellung 1 Stücke:
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Anzahl Preis
1+955.64 EUR
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KITFS85FRDMEVM UM11157.pdf
Hersteller: NXP USA Inc.
Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: Graphical User Interface (GUI)
Contents: Board(s), Cable(s), Accessories
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+594.16 EUR
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FRDMGD3100HBIEVM FRDMGD3100HBIEVM.pdf
FRDMGD3100HBIEVM
Hersteller: NXP USA Inc.
Description: MC33GD3100 HALF-BRIDGE EVAL BRD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: KL1x, KL2x, MC33GD3100
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+566.58 EUR
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LPC54018J4MET180E LPC54018JxM-LPC54S018JxM.pdf
LPC54018J4MET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 137
DigiKey Programmable: Not Verified
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.62 EUR
10+15.4 EUR
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